CN204997993U - Semiconductor refrigerator of 3D printer - Google Patents
Semiconductor refrigerator of 3D printer Download PDFInfo
- Publication number
- CN204997993U CN204997993U CN201520056888.0U CN201520056888U CN204997993U CN 204997993 U CN204997993 U CN 204997993U CN 201520056888 U CN201520056888 U CN 201520056888U CN 204997993 U CN204997993 U CN 204997993U
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- fin
- fan
- semiconductor
- printer
- refrigeration
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Abstract
The utility model discloses a semiconductor refrigerator of 3D printer disposes in need possess the 3D printer of cooling design technology, include: semiconductor refrigeration piece, fin, lead cool air hose, fan, plastics housing, its characterized in that: serving in the refrigeration of semiconductor refrigeration piece and hugging closely the fin, the fan is fixed in one side of fin, and the plastic housing shell is enclosed jointly by fan and plastics housing and become to separate the temperature cavity on the fin, separates the refrigeration end that the temperature cavity surrounds the semiconductor refrigeration piece, leads the cool air hose and connects the plastics housing, leads the cool air hose and separate temperature cavity air current communicating with each other. The utility model discloses the air conditioning of serving the production to semiconductor refrigeration piece refrigeration extrudees into leads the cool air hose, blow to the hot melt material, the ordinary cooling method who has replaced the fan to blow has realized the quick cold solid function of hot melt material that makes 3D print.
Description
Technical field
The present invention relates to a kind of field of 3D printing technique, more particularly, relates to a kind of 3D printer processes device utilizing electronic semi-conductor's refrigeration end refrigeration.
Background technology
Current 3D printer, when increasing material and manufacturing, after heat hot melt material or laser sintered material, general tree material installs cooling device additional, or simple fan is dried to target object, because in 3D printer casing, heat own is higher, especially FDM increases material mode type, the target item printed is caused to cool in a long time, make target item before not cooling completely, the fluid behaviour be easy to because of high-temperature material produces distortion and dimensional discrepancy, and causes the accurate-size not reaching setting of target item.
Summary of the invention
the technical problem that invention will solve
The semiconductor cooling device of a kind of 3D printer of the present invention, utilize the cold air that the refrigeration end of electronic semi-conductor's cooling piece produces, carry out quick cold solid to the hot melt material that printhead is extruded, solve current 3D printer when increasing material and printing, because the fluid behaviour of high-temperature material produces distortion and dimensional discrepancy, the problem not reaching the accurate-size of setting of target item.
technical scheme
For achieving the above object, the invention provides following technical scheme.
A kind of semiconductor cooling device of 3D printer, comprise: semiconductor chilling plate, fin, conduction cooling airduct, fan, plastic shell, it is characterized in that: in the refrigeration end of semiconductor chilling plate, be close to fin, fan is fixed on the side of fin, on a heat sink, jointly surround thermal insulation cavity by fan and plastic shell, thermal insulation cavity surrounds the refrigeration end of semiconductor chilling plate to plastic shell cover, conduction cooling airduct connects plastic shell, and conduction cooling airduct and thermal insulation cavity air-flow communicate.
Described semiconductor chilling plate is that the cold air using one end of its refrigeration to produce carrys out cooling refrigeration.
Described fin, is the metal fin of heat-conducting type, is close to semiconductor chilling plate, establishes one direction many conduits in fin, the unidirectional cold wind of convenient derivation.
Described conduction cooling airduct, is connected on plastic shell, the cold air that fan produces the refrigeration end of electronic semi-conductor's cooling piece, squeezes into conduction cooling airduct.
The cold air utilizing the refrigeration end of electronic semi-conductor's cooling piece to produce, produces better refrigeration, carries out quick cold solid to the hot melt material that printhead is extruded.The refrigeration end of semiconductor chilling plate, after energising refrigeration, produces the temperature of less than 0 °, makes rapidly fin also be in less than 0 ° temperature.The air of fan extruding, freezes into cold air through fin, then is pressed in conduction cooling airduct, until air outlet, cool target item.
beneficial effect
Adopt technical scheme provided by the invention, compared with existing known technology, there is following remarkable result.
Jointly surround thermal insulation cavity by fan, case, effectively ensure inner cold air not conduct by the hot gas in the external world.
After cooled piece of air tentatively freezes, enter in conduction cooling airduct through fan extruding, the temperature of air outlet cold air is reduced greatly, the article refrigeration to 3D prints is improved greatly.
Accompanying drawing explanation
Fig. 1 is the 3D printing equipment sectional view of semiconductor refrigerating of the present invention.
1-semiconductor chilling plate, 2-fin, 4-conduction cooling airduct, 5-fan, 6-plastic shell, 7-air outlet.
Detailed description of the invention
For understanding content of the present invention further, the present invention is described in detail by reference to the accompanying drawings.
A kind of semiconductor cooling device of 3D printer, comprise: semiconductor chilling plate 1, fin 2, conduction cooling airduct 4, fan 5, plastic shell 6, it is characterized in that: in the refrigeration end of semiconductor chilling plate 1, be close to fin 2, fan 5 is fixed on the side of fin 2, plastic shell 6 is enclosed within fin 2, thermal insulation cavity is jointly surrounded by fan 5 and plastic shell 6, thermal insulation cavity surrounds the refrigeration end of semiconductor chilling plate 1, conduction cooling airduct 4 connects plastic shell 6, and conduction cooling airduct 4 and thermal insulation cavity air-flow communicate.
Described semiconductor chilling plate 1 is that the cold air using one end of its refrigeration to produce carrys out cooling refrigeration.
Described fin 2, is the metal fin of heat-conducting type, is close to semiconductor chilling plate 1, establishes one direction many conduits in fin 2, the unidirectional cold wind of convenient derivation.
Described conduction cooling airduct 4, is connected on plastic shell 6, and the cold air that fan 5 produces the refrigeration end of semiconductor chilling plate 1 squeezes into conduction cooling airduct 4.
Below in conjunction with embodiment, the invention will be further described.
Utilize the cold air that the refrigeration end of electronic semi-conductor's cooling piece 1 produces, and adopt the design extending and strengthen cold and hot conductive contacts area, produce better refrigeration, carry out quick cold solid to the hot melt material that printhead is extruded.
The refrigeration end of semiconductor chilling plate 1, after energising refrigeration, produces the temperature of less than 0 °, makes rapidly fin 2 also be in less than 0 ° temperature, the air that fan 5 extrudes, freezes into cold air through fin 2, then is pressed in conduction cooling airduct 4, until air outlet 7, target item is cooled.
Below be schematically described the present invention and embodiment thereof, this description does not have restricted, and shown in accompanying drawing is also one of embodiments of the present invention, and actual structure and application are not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, without creatively designing the frame mode similar to this technical scheme and embodiment, all should protection scope of the present invention be belonged to.
Claims (2)
1. the semiconductor cooling device of a 3D printer, comprise: semiconductor chilling plate, fin, conduction cooling airduct, fan, plastic shell, it is characterized in that: in the refrigeration end of semiconductor chilling plate, be close to fin, fan is fixed on the side of fin, on a heat sink, jointly surround thermal insulation cavity by fan and plastic shell, thermal insulation cavity surrounds the refrigeration end of semiconductor chilling plate to plastic shell cover, conduction cooling airduct connects plastic shell, and conduction cooling airduct and thermal insulation cavity air-flow communicate.
2. the semiconductor cooling device of a kind of 3D printer according to claim 1, it is characterized in that: described fin, be the metal fin of heat-conducting type, be close to semiconductor chilling plate, one direction many conduits are established, the unidirectional cold wind of convenient derivation in fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520056888.0U CN204997993U (en) | 2015-01-27 | 2015-01-27 | Semiconductor refrigerator of 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520056888.0U CN204997993U (en) | 2015-01-27 | 2015-01-27 | Semiconductor refrigerator of 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204997993U true CN204997993U (en) | 2016-01-27 |
Family
ID=55154898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520056888.0U Expired - Fee Related CN204997993U (en) | 2015-01-27 | 2015-01-27 | Semiconductor refrigerator of 3D printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204997993U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791360A (en) * | 2017-10-20 | 2018-03-13 | 龙泉市金宏瓷业有限公司 | A kind of composite ceramic 3D printer discharging controlling device |
| CN109283819A (en) * | 2018-11-15 | 2019-01-29 | 习水县西科电脑科技有限公司 | A kind of duplicator exhaust apparatus |
| CN113524670A (en) * | 2021-07-15 | 2021-10-22 | 深圳市纵维立方科技有限公司 | Print head module and printer |
-
2015
- 2015-01-27 CN CN201520056888.0U patent/CN204997993U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791360A (en) * | 2017-10-20 | 2018-03-13 | 龙泉市金宏瓷业有限公司 | A kind of composite ceramic 3D printer discharging controlling device |
| CN107791360B (en) * | 2017-10-20 | 2019-08-27 | 龙泉市金宏瓷业有限公司 | A kind of composite ceramic 3D printer discharging controlling device |
| CN109283819A (en) * | 2018-11-15 | 2019-01-29 | 习水县西科电脑科技有限公司 | A kind of duplicator exhaust apparatus |
| CN113524670A (en) * | 2021-07-15 | 2021-10-22 | 深圳市纵维立方科技有限公司 | Print head module and printer |
| CN113524670B (en) * | 2021-07-15 | 2022-08-23 | 深圳市纵维立方科技有限公司 | Print head module and printer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20180127 |