CN204991691U - CPU radiator - Google Patents
CPU radiator Download PDFInfo
- Publication number
- CN204991691U CN204991691U CN201520756341.1U CN201520756341U CN204991691U CN 204991691 U CN204991691 U CN 204991691U CN 201520756341 U CN201520756341 U CN 201520756341U CN 204991691 U CN204991691 U CN 204991691U
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- CN
- China
- Prior art keywords
- heat
- heat pipe
- pipe group
- base plate
- linear pattern
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the radiator field, specifically speaking is a CPU radiator, include the base plate and set up the heat radiation fins group that the parallel just array above the base plate set up, be equipped with crisscross spaced heat pipe group between base plate and the heat radiation fins group, heat pipe group is including sealing annular heat pipe group and linear type heat pipe group, it section just exposes left linkage segment and the right linkage segment at the air including being arranged in heat radiating section that base plate and heat radiation fins inter block be the level setting and heat absorption section respectively and connecting heat radiating section and heat absorption to seal annular heat pipe group, heat radiating section, heat absorption section, left linkage segment, right linkage segment integrated into one piece are hollow closed -loop column structure, base plate and heat radiation fins group are just connected to linear type heat pipe group perpendicular to base plate, closed annular heat pipe group and linear type heat pipe group are the even interval of intersection and arrange, the beneficial effects of the hand and wrist rehabilitation evaluation monitoring device are that, the utility model discloses a set up vertically and horizontally staggered's heat pipe group, greatly increased the heat transfer passageway, improved heat transfer efficiency.
Description
Technical field
The utility model belongs to radiator field, specifically refers to a kind of cpu heat.
Background technology
The CPU of desktop computer can produce amount of heat in operation, as drained not in time, fan can be caused to be damaged, therefore the quality of its heat radiation is related to the quality in computer life-span and computing, and normally used radiator, mainly be provided with a metal (being aluminium mostly) heat-radiating substrate, its top (with extruding or casting) is provided with several grooves and column fin, makes columnar structures have preferably cooling surface area; Above this fin, be folded with a fan again, make fan can brush heat radiation facing to radiating fin, between current heat radiator body and radiating fin, be provided with the heat pipe of connection more, current heat pipe entirety is in three sections, wherein end section is arranged in heat-radiating substrate, horizontally set, and stage casing passes from radiator, expose in atmosphere, top section is arranged in radiating fin, and this heat pipe is because of limited amount, and heat transfer path is few, therefore can not effectively conduct heat, heat transfer efficiency is lower.
Utility model content
The utility model, in order to overcome the deficiency of prior art, proposes the cpu heat that a kind of heat transfer efficiency is higher.
The utility model solves above-mentioned technical problem by following technical proposals.
A kind of cpu heat, comprise substrate and be arranged on the parallel of surface and the radiating fin group of array setting, the heat pipe heat at staggered interval is provided with between described substrate and radiating fin group, described heat pipe heat comprises closed ring heat pipe heat and linear pattern heat pipe heat, described closed ring heat pipe heat comprises and to lay respectively in substrate and radiating fin group in horizontally disposed endotherm section with heat release section and be connected endotherm section and heat release section and expose aerial left connection part and right connection part, described heat release section, endotherm section, left connection part, the one-body molded closed circular structure in hollow of right connection part, described linear pattern heat pipe heat is perpendicular to substrate and connection substrate and radiating fin group, described closed ring heat pipe heat and linear pattern heat pipe heat are in intersecting uniform intervals arrangement, described radiating fin group is provided with the space allowing described heat pipe heat to pass through.
More specifically, described closed ring heat pipe heat comprises 2 ~ 5 groups of closed circular heat pipes.
More specifically, described linear pattern heat pipe heat comprises 2 ~ 20 linear pattern heat pipes.
More specifically, described closed ring heat pipe heat comprises 4 groups of closed circular heat pipes.
More specifically, described linear pattern heat pipe heat comprises 15 linear pattern heat pipes.
More specifically, described substrate is the copper material component of rectangle.
The beneficial effects of the utility model are, the utility model, by arranging crisscross heat pipe heat, considerably increases heat transfer path, improves heat transfer efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation after the utility model decomposes.
Fig. 3 is front view of the present utility model.
Embodiment
The utility model preferred embodiment is provided, to describe the technical solution of the utility model in detail below in conjunction with accompanying drawing.
As Fig. 1 to Fig. 3, the present embodiment comprises substrate 1 and is arranged on parallel above substrate 1 and the radiating fin group 2 that arranges of array, the heat pipe heat at staggered interval is provided with between described substrate 1 and radiating fin group 2, described heat pipe heat comprises closed ring heat pipe heat 3 and linear pattern heat pipe heat 4, described closed ring heat pipe heat 3 comprises and to lay respectively in substrate 1 and radiating fin group 2 in horizontally disposed endotherm section 31 with heat release section 32 and be connected endotherm section 31 and heat release section 32 and expose aerial left connection part 34 and right connection part 33, described heat release section 32, endotherm section 31, left connection part 34, the one-body molded closed circular structure in hollow of right connection part 31, described linear pattern heat pipe heat 4 is perpendicular to substrate and connection substrate 1 and radiating fin group 2, described closed ring heat pipe heat 3 preferably includes 4 groups of closed circular heat pipes, described linear pattern heat pipe heat preferably includes 15 linear pattern heat pipes, described substrate is the copper material component of rectangle, described closed ring heat pipe heat 3 and linear pattern heat pipe heat 4 are in intersecting uniform intervals arrangement, described radiating fin group 2 is provided with the space 3 ' allowing described heat pipe heat to pass through.
Because substrate 1 and radiating fin group 2 are provided with crisscross heat pipe, considerably increase heat transfer path, improve heat transfer efficiency.
Although the foregoing describe embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection range of the present utility model is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present utility model and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection range of the present utility model.
Claims (6)
1. a cpu heat, it is characterized in that, comprise substrate and be arranged on the parallel of surface and the radiating fin group of array setting, the heat pipe heat at staggered interval is provided with between described substrate and radiating fin group, described heat pipe heat comprises closed ring heat pipe heat and linear pattern heat pipe heat, described closed ring heat pipe heat comprises and to lay respectively in substrate and radiating fin group in horizontally disposed endotherm section with heat release section and be connected endotherm section and heat release section and expose aerial left connection part and right connection part, described heat release section, endotherm section, left connection part, the one-body molded closed circular structure in hollow of right connection part, described linear pattern heat pipe heat is perpendicular to substrate and connection substrate and radiating fin group, described closed ring heat pipe heat and linear pattern heat pipe heat are in intersecting uniform intervals arrangement, described radiating fin group is provided with the space allowing described heat pipe heat to pass through.
2. cpu heat according to claim 1, is characterized in that, described closed ring heat pipe heat comprises 2 ~ 5 groups of closed circular heat pipes.
3. cpu heat according to claim 1, is characterized in that, described linear pattern heat pipe heat comprises 2 ~ 20 linear pattern heat pipes.
4. cpu heat according to claim 2, is characterized in that, described closed ring heat pipe heat comprises 4 groups of closed circular heat pipes.
5. cpu heat according to claim 3, is characterized in that, described linear pattern heat pipe heat comprises 15 linear pattern heat pipes.
6. cpu heat according to claim 1, is characterized in that, described substrate is the copper material component of rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520756341.1U CN204991691U (en) | 2015-09-28 | 2015-09-28 | CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520756341.1U CN204991691U (en) | 2015-09-28 | 2015-09-28 | CPU radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204991691U true CN204991691U (en) | 2016-01-20 |
Family
ID=55126030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520756341.1U Expired - Fee Related CN204991691U (en) | 2015-09-28 | 2015-09-28 | CPU radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204991691U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106052450A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Novel heat dissipating module with loop type heat pipe |
-
2015
- 2015-09-28 CN CN201520756341.1U patent/CN204991691U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106052450A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Novel heat dissipating module with loop type heat pipe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20170928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |