CN204991656U - Formula power semiconductor module testing anchor clamps cut straightly - Google Patents
Formula power semiconductor module testing anchor clamps cut straightly Download PDFInfo
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- CN204991656U CN204991656U CN201520729150.6U CN201520729150U CN204991656U CN 204991656 U CN204991656 U CN 204991656U CN 201520729150 U CN201520729150 U CN 201520729150U CN 204991656 U CN204991656 U CN 204991656U
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Abstract
The utility model relates to a formula power semiconductor module testing anchor clamps cut straightly comprises following part: an upper fixed plate, bracing piece, bottom plate constitution essential gate -type square frame structure are equipped with the triaxial cylinder on the bottom plate, be fixed with the module elevating platform on the triaxial cylinder, are equipped with the locating plate on the module elevating platform, are equipped with the tested module on the module elevating platform, and the tested module up -and -down motion is lifted to the module elevating platform, and the last electrode clamp that is equipped with of an upper fixed plate tightly reaches signal sampler structure assembly. The utility model discloses can be directed against the characteristics that cut straightly formula module conducting strip perpendicular to bottom plate and arrange, it is tight with each electrode clamp of module through the springiness contaction electrode on the motion messenger anchor clamps of anchor clamps, reach reliable contact to test, can avoid module electrode damage, have pressure drop test and high -pressure testing capabilities under the tested module of the carrying on heavy current.
Description
Technical field
The utility model relates to a kind of test fixture for the conventional electrical quantity exfactory inspection of direct insertion power semiconductor modular, the feature that can arrange perpendicular to base plate for direct insertion module conducting strip, by the motion of fixture, each electrode of module is clamped by the Elastic Contact electrode on fixture, reach reliable contacts, and test.This fixture also can to the conducting strip module parallel with base plate before its electrode bending namely semi-finished product time carry out production process in the middle of test, to improve the recall rate of substandard product.
Background technology
At present in power semiconductor application, the range of application of module is more and more extensive, and module profile is various, and the arrangement form with regard to electrode mainly contains the large class of the conducting strip module parallel with the base plate module vertical with base plate with conducting strip two.Module testing fixture in the past, mainly for the module that conducting strip is parallel with base plate, adopts test probe or testing conductive post to carry out voltage and current test; And the module that conducting strip is vertical with base plate, inserted sheet, screw or welding manner is normally adopted to connect wire in actual use, but do not allow to cause damage to module electrodes surface in module dispatches from the factory test process, and big current and height withstand voltage be often to survey project, usually adopted test probe contact modules top of electrodes end face to test for the module that electric current is less in the past, but top of electrodes end face often only has 1mm left and right thickness, therefore be suitable only for small area analysis test, spark phenomenon can be occurred because conductive area is too small when electric current is larger.In order to solve this test bottleneck, we devise direct insertion power semiconductor modular test fixture.
Utility model content
The purpose of this utility model be to provide a kind of meet direct insertion power semiconductor modular big current dispatch from the factory test needs direct insertion power semiconductor modular test fixture, can high-current test be carried out, can directly carry out tested module voltage sample function; Can meet module voltage-withstand test, fixture must contact reliably in testing, can not cause damage to module vertical electrode plate simultaneously.
Technical solution of the present utility model is as follows: direct insertion power semiconductor modular test fixture, comprises upper mounted plate (1), support bar (2), location-plate (4), module lifting platform (5), base plate (6), three axle cylinders (7), electrode clamping and sample of signal mechanism assembly; Module lifting platform (5) is provided with tested module (3); Upper mounted plate (1), support bar (2), base plate (6) form basic gate-type frame structure, base plate (6) is provided with three axle cylinders (7), three axle cylinders (7) are fixed with module lifting platform (5), module lifting platform (5) moves up and down for lifting tested module (3), module lifting platform (5) is provided with location-plate (4), for the location of tested module, upper mounted plate (1) is provided with electrode clamping and sample of signal mechanism assembly.
Electrode clamping and sample of signal mechanism assembly, by limited support lead (8), test electrode baffle (9), electrode isolation plate (10), torsionspring fixed head (11), back-moving spring (12), the fixing card (13) of torsionspring, wedge contact electrode (14), test signal draws probe (15), elastic conducting electroplax (16), big current extraction electrode (17), torsionspring (18), stroke screw (19), flexibility test electrode (20), locating ring (21) forms, two limited support leads (8) are fixed on electrode isolation plate (10) by screw thread, sampling electrode baffle (9) is fixed with under electrode isolation plate (10), torsionspring fixed head (11) is fixed on electrode isolation plate (10), two stroke screws (19) are fixed on electrode isolation plate (10) by screw thread, and tighten location through after upper mounted plate (1) by double nut is counter, thus electrode isolation plate (10) and each fixing part are connected thereon with upper mounted plate (1) as moveable portion, two back-moving springs (12) are enclosed within two stroke screws (19), in the position of respective modules vertical electrode sheet, torsionspring fixed head (11) has the two piece rectangular grooves parallel with vertical electrode sheet, the length of groove is corresponding with width and elastic conducting electroplax (16), two elastic conducting electroplaxs (16) are through rectangular groove, and relative position is processed with inwardly horizontal bending in the middle of two elastic conducting electroplaxs (16), bending, across on rectangular groove, makes elastic conducting electroplax (16) be positioned on torsionspring fixed head (11), in the middle of two elastic conducting electroplaxs (16), torsionspring (18) is installed, the spring wire at torsionspring (18) two ends through the rectangular groove on torsionspring fixed head (11), and presses closer in elastic conducting electroplax (16) lower inside, the fixing card (13) of torsionspring is fixed on torsionspring fixed head (11) through torsionspring (18) axle center, flexibility test electrode (20) upper end is through torsionspring fixed head (11) aims at its little translot passed through, and lower end edge elastic conducting electroplax (16) outside extends under the square groove that test electrode baffle (9) processes along place, test signal is drawn probe (15) and is fixed on upper mounted plate (1), and test signal is drawn probe (15) telescopic lower end and is connected by soldering with flexibility test electrode (20) upper end, the upper terminated wires that measuring-signal draws probe (15) by test signal is drawn.
The lower end of flexibility test electrode (20) studs with silver contact.
The position corresponding at each vertical electrode sheet of upper mounted plate (1) is processed with square groove, in copper wedge contact electrode (14) is embedded in, and fixed by brass screw and upper mounted plate (1), big current extraction electrode (17) is fixed on the upper end of brass screw; Bar shaped isolation channel is processed with between the upper adjacent electrode of torsionspring fixed head (11).
Designed by the utility model, well solve direct insertion power semiconductor modular big current dispatch from the factory test problem, also can be applicable to the middle test of the conducting strip module parallel with base plate before the non-bending of electrode, can more early reject defective module, improve conforming product rate of finally dispatching from the factory.
The electrode of the utility model design clamps and sample of signal assembly mechanism in addition, and the adapter that can be processed into separately for direct insertion module is applied on module synthesis testboard, the range of application of extension module combined test stand.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model release condition.
Fig. 2 is the structural representation of the utility model clamped condition.
Fig. 3 is the utility model release condition close-up schematic view.
Fig. 4 is the utility model clamped condition close-up schematic view.
Embodiment
1, designing points of the present utility model
1) overall construction design
The basic overall structure of this fixture is gate-type frame structure, and main part is: upper mounted plate 1, support bar 2, base plate 6 and three axle cylinders 7; Base plate 6 fixes two support bars 2 by screw thread, and upper mounted plate 1 is fixed on two support bars 2 by nut, forms gate-type frame structure; Three axle cylinders 7 are arranged on base plate 6, and three axle cylinders 7 are fixed with module lifting platform 5, move up and down for lifting tested module 3; Module lifting platform 5 is provided with location-plate 4, and location-plate 4 can be changed according to the profile of tested module 3, ensures that the electrode position of module is accurate; Whole electrode clamping and sample of signal mechanism assembly are positioned on upper mounted plate 1.
2) electrode clamping and the design of sample of signal mechanism assembly
Key point of the present utility model is electrode clamping and the design of sample of signal mechanism assembly, fixes card 13, wedge contact electrode 14, test signal draw probe 15, elastic conducting electroplax 16, big current extraction pole 17, torsionspring 18, stroke screw 19, flexibility test electrode 20, locating ring more than 21 part form by limited support lead 8, test electrode baffle 9, electrode isolation plate 10, torsionspring fixed head 11, back-moving spring 12, torsionspring.
Because direct insertion module vertical electrode generally has many, the clamping of its electrode and signal measurement require the same, therefore only carry out structure for the clamping of an electrode and illustrate.
Two limited support leads 8 are fixed on electrode isolation plate 10 by screw thread, are fixed with sampling electrode baffle 9 10 times at electrode isolation plate, and torsionspring fixed head 11 is fixed on electrode isolation plate 10; Two stroke screws 19 are fixed on electrode isolation plate 10 by screw thread, and tighten location through after upper mounted plate 1 by double nut is counter, thus electrode isolation plate 10 and each fixing thereon part are connected with upper mounted plate 1 as moveable portion; Two back-moving springs 12 are enclosed within two stroke screws 19; In the position of respective modules vertical electrode sheet, torsionspring fixed head 11 has the two piece rectangular grooves parallel with vertical electrode sheet, the length of groove is corresponding with broadband and elastic conducting electroplax 16; Two elastic conducting electroplaxs 16 are through rectangular groove, and two middle relative positions of elastic conducting electroplax 16 are processed with inwardly horizontal bending, and bending, across on rectangular groove, makes elastic conducting electroplax 16 be positioned on torsionspring fixed head 11; In the middle of two elastic conducting electroplaxs 16, be provided with torsionspring 18, the spring wire at torsionspring 18 two ends through the rectangular groove on torsionspring fixed head 11, and presses closer in elastic conducting electroplax 16 lower inside; Torsionspring is fixed card 13 and is fixed on torsionspring fixed head 11 through torsionspring 18 axle center; The position corresponding at each vertical electrode sheet of upper mounted plate 1 is processed with square groove, and in copper wedge contact electrode 14 is embedded in, and fixed by brass screw and upper mounted plate 1, big current extraction electrode 17 is fixed on the upper end of brass screw; Flexibility test electrode 20 upper end aims at its little translot passed through through on torsionspring fixed head 11, and under extending to the square groove of test electrode baffle 9 processing outside lower end edge elastic conducting electroplax 16, edge is located, and the lower end of flexibility test electrode 20 studs with silver contact; Test signal is drawn probe 15 and is fixed on upper mounted plate 1, and test signal is drawn the telescopic lower end of probe 15 and is connected by soldering with flexibility test electrode 20 upper end; The upper terminated wires that measuring-signal draws probe 15 by test signal is drawn.
2. key technology operation principle
1) electrode clamping operation principle
Direct insertion module vertical electrode is required to make electrode produce cut equivalent damage in testing, but in order to be required again to make test electrode and module vertical electrode close contact by big current, these two kinds require conflicting, and how to solve is the key of this jig Design.
Release condition: see Fig. 1 and Fig. 3, when cylinder is in bottom, element does not contact with clamping electrode, and under the effect of two back-moving springs 12, based on electrode isolation plate 10, the slided up and down part of plate is in bottom.The relative elastic conducting electroplax 16 of two of each test electrode is under the effect of torsionspring 18, and its underpart is opened to both sides.On elastic conducting electroplax 16, the square groove of processing is lower large little cone tank, and the angle that two elastic conducting electroplax 16 bottoms can be made to open is comparatively large, so that module vertical electrode sheet enters.Now wedge contact electrode 14 and two elastic conducting electroplax 16 tops depart from.
Clamped condition: see Fig. 2 and Fig. 4, when cylinder operation elect tested module 3 move upward to make location-plate 4 touch limited support lead 8 time, based on electrode isolation plate 10, the slided up and down part of plate moves upward along limited support lead 8, now tested module vertical electrode sheet has entered in the middle of two elastic conducting electroplaxs 16, and relative position is fixed up and down, can avoid because upper and lower relative motion produces cut to electrode slice.Along with cylinder moves upward, after two elastic conducting electroplax 16 tops contact with wedge contact electrode 14, under wedge effect, two elastic conducting electroplax 16 tops are outwards strutted, under lever principle effect, the bottom of two elastic conducting electroplaxs 16 is tightened up, tested module vertical electrode sheet clamping the most at last, when making locating ring 21 touch upper mounted plate 1 when moving upward, clamping movement stops, and ensures that clamping force is in the scope required.After tested module vertical electrode sheet is clamped, test can be started, big current enters inside chip by big current extraction electrode 17 → bronze gong nail → wedge contact electrode 14 → elastic conducting electroplax 16 → tested module vertical electrode sheet, thus realizes not damaging the high-current test under survey module vertical electrode sheet condition.
2) sample of signal operation principle
Main purpose for power semiconductor modular high-current test is the on-state voltage drop of measuring component, and the sampling point position of pressure drop signal is very important, if conducting heavy current extremely on sampling, can by conductive electrode pressure drop take out, cause test result bigger than normal.Need separately to arrange voltage sampling path for this reason, and require sampling point as far as possible near the root of module vertical electrode, so that Measurement accuracy.
Specific works process is as follows:
In release condition: see Fig. 1 and Fig. 3; one of them elastic conducting electroplax 16 outer fix of each test bit arranges a flexibility test electrode 20; under the effect of torsionspring 18; two relative elastic conducting electroplax 16 bottoms are opened to both sides; one of them is to extrapolation flexibility test electrode 20; along place under the square groove making the lower end of flexibility test electrode 20 process near test electrode baffle 9; module vertical electrode can be facilitated to enter, and the square groove that test electrode baffle 9 is processed in addition can protect the lower end of flexibility test electrode 20.
Clamped condition: see Fig. 2 and Fig. 4, along with cylinder moves upward, after two elastic conducting electroplax 16 tops contact with wedge contact electrode 14, two elastic conducting electroplax 16 bottoms are gradually near the electrode of tested module, because flexibility test electrode 20 is longer, therefore first the lower end silver contact of flexibility test electrode 20 touches tested module electrode roots, and then flexibility test electrode 20 stops mobile, and then disengaging flexibility test electrode 20 is continued to tighten up in elastic conducting electroplax 16 lower end; Along with module continues to move upward, test signal is drawn probe 15 and is shunk the stopping until whole system puts in place.Such voltage measurement sampled signal is drawn probe 15 → extraction wire by tested module vertical electrode sheet → flexibility test electrode 20 → test signal and is measured.
3) design of dielectric voltage withstand
Power semiconductor modular is also needed to carry out high voltage test; therefore this fixture must carry out the design of dielectric voltage withstand aspect; the main method adopting isolation and increase insulation distance; first on upper mounted plate 1, electrode isolation plate 10 and test electrode baffle 9, square or taper square groove is processed with; each test electrode conductive part is inlayed wherein, makes each electrode isolation.Torsionspring fixed head 11 adopts the scheme of fluting to increase insulation distance between adjacent electrode, well solve dielectric voltage withstand between each electrode through above measure.
3. actual effect
This fixture has completed model machine assembling at present, and practical effect is good, module electrodes sheet no marking phenomenon, test current is maximum is the single sinusoidal half-wave current of 1500A by peak value, conducting strip and module electrodes sheet are without spark phenomenon, and test voltage can reach 3000V direct current, without punch-through.For electric conduction electrode-plate and the larger module of overall dimension, can the size of corresponding increase elastic conducting electroplax and interelectrode distance, can further improve through-flow and ability that is proof voltage.
4. conclusion
Designed by the utility model, well solve direct insertion power semiconductor modular big current dispatch from the factory test problem, also can be applicable to the middle test of the conducting strip module parallel with base plate before the non-bending of electrode, can more early reject defective module, improve conforming product rate of finally dispatching from the factory.
The electrode of the utility model design clamps and sample of signal assembly mechanism in addition, and the adapter that can be processed into separately for direct insertion module is applied on module synthesis testboard, improves the range of application of extension module combined test stand.
Claims (4)
1. direct insertion power semiconductor modular test fixture, comprises upper mounted plate (1), support bar (2), location-plate (4), module lifting platform (5), base plate (6), three axle cylinders (7), electrode clamping and sample of signal mechanism assembly; Module lifting platform (5) is provided with tested module (3); It is characterized in that: upper mounted plate (1), support bar (2), base plate (6) form basic gate-type frame structure, base plate (6) is provided with three axle cylinders (7), three axle cylinders (7) are fixed with module lifting platform (5), module lifting platform (5) moves up and down for lifting tested module (3), module lifting platform (5) is provided with location-plate (4), for the location of tested module, upper mounted plate (1) is provided with electrode clamping and sample of signal mechanism assembly.
2. direct insertion power semiconductor modular test fixture as claimed in claim 1, it is characterized in that: electrode clamping and sample of signal mechanism assembly, by limited support lead (8), test electrode baffle (9), electrode isolation plate (10), torsionspring fixed head (11), back-moving spring (12), the fixing card (13) of torsionspring, wedge contact electrode (14), test signal draws probe (15), elastic conducting electroplax (16), big current extraction electrode (17), torsionspring (18), stroke screw (19), flexibility test electrode (20), locating ring (21) forms, two limited support leads (8) are fixed on electrode isolation plate (10) by screw thread, sampling electrode baffle (9) is fixed with under electrode isolation plate (10), torsionspring fixed head (11) is fixed on electrode isolation plate (10), two stroke screws (19) are fixed on electrode isolation plate (10) by screw thread, and tighten location through after upper mounted plate (1) by double nut is counter, thus electrode isolation plate (10) and each fixing part are connected thereon with upper mounted plate (1) as moveable portion, two back-moving springs (12) are enclosed within two stroke screws (19), in the position of respective modules vertical electrode sheet, torsionspring fixed head (11) has the two piece rectangular grooves parallel with vertical electrode sheet, the length of groove is corresponding with width and elastic conducting electroplax (16), two elastic conducting electroplaxs (16) are through rectangular groove, and relative position is processed with inwardly horizontal bending in the middle of two elastic conducting electroplaxs (16), bending, across on rectangular groove, makes elastic conducting electroplax (16) be positioned on torsionspring fixed head (11), in the middle of two elastic conducting electroplaxs (16), torsionspring (18) is installed, the spring wire at torsionspring (18) two ends through the rectangular groove on torsionspring fixed head (11), and presses closer in elastic conducting electroplax (16) lower inside, the fixing card (13) of torsionspring is fixed on torsionspring fixed head (11) through torsionspring (18) axle center, flexibility test electrode (20) upper end is through torsionspring fixed head (11) aims at its little translot passed through, and lower end edge elastic conducting electroplax (16) outside extends under the square groove that test electrode baffle (9) processes along place, test signal is drawn probe (15) and is fixed on upper mounted plate (1), and test signal is drawn probe (15) telescopic lower end and is connected by soldering with flexibility test electrode (20) upper end, the upper terminated wires that measuring-signal draws probe (15) by test signal is drawn.
3. direct insertion power semiconductor modular test fixture as claimed in claim 1, is characterized in that: the lower end of flexibility test electrode (20) studs with silver contact.
4. direct insertion power semiconductor modular test fixture as claimed in claim 1, it is characterized in that: the position corresponding at each vertical electrode sheet of upper mounted plate (1) is processed with square groove, in copper wedge contact electrode (14) is embedded in, and fixed by brass screw and upper mounted plate (1), big current extraction electrode (17) is fixed on the upper end of brass screw; Bar shaped isolation channel is processed with between the upper adjacent electrode of torsionspring fixed head (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520729150.6U CN204991656U (en) | 2015-09-18 | 2015-09-18 | Formula power semiconductor module testing anchor clamps cut straightly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520729150.6U CN204991656U (en) | 2015-09-18 | 2015-09-18 | Formula power semiconductor module testing anchor clamps cut straightly |
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| Publication Number | Publication Date |
|---|---|
| CN204991656U true CN204991656U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520729150.6U Withdrawn - After Issue CN204991656U (en) | 2015-09-18 | 2015-09-18 | Formula power semiconductor module testing anchor clamps cut straightly |
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| Country | Link |
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| CN (1) | CN204991656U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118791A (en) * | 2015-09-18 | 2015-12-02 | 西安派瑞功率半导体变流技术有限公司 | Directly-inserted power semiconductor module test clamp |
| CN106405274A (en) * | 2016-08-25 | 2017-02-15 | 深圳振华富电子有限公司 | Aging test device for electronic component |
| CN107422155A (en) * | 2017-05-09 | 2017-12-01 | 长沙天恒测控技术有限公司 | Current element measurement attachment structure |
-
2015
- 2015-09-18 CN CN201520729150.6U patent/CN204991656U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118791A (en) * | 2015-09-18 | 2015-12-02 | 西安派瑞功率半导体变流技术有限公司 | Directly-inserted power semiconductor module test clamp |
| CN105118791B (en) * | 2015-09-18 | 2018-04-10 | 西安派瑞功率半导体变流技术股份有限公司 | Direct insertion power semiconductor modular test fixture |
| CN106405274A (en) * | 2016-08-25 | 2017-02-15 | 深圳振华富电子有限公司 | Aging test device for electronic component |
| CN106405274B (en) * | 2016-08-25 | 2023-12-29 | 深圳振华富电子有限公司 | Electronic element aging testing device |
| CN107422155A (en) * | 2017-05-09 | 2017-12-01 | 长沙天恒测控技术有限公司 | Current element measurement attachment structure |
| CN107422155B (en) * | 2017-05-09 | 2019-12-03 | 长沙天恒测控技术有限公司 | Current element measurement connection structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 710077 two east section of Jin Industry Road, hi tech Zone, Shaanxi, Xi'an Patentee after: Xi'an Pairui power semiconductor converter technology Limited by Share Ltd Address before: 710077 No. two, No. 13, Jin Industry Zone, Xi'an hi tech Zone, Shaanxi Patentee before: XI'AN PERI POWER SEMICONDUCTOR CONVERTER TECHNOLOGY CO., LTD. |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20160120 Effective date of abandoning: 20180410 |
|
| AV01 | Patent right actively abandoned |