CN204977298U - Chip carrier clamping structure and semiconductor plastic envelope mould of semiconductor plastic envelope mould - Google Patents
Chip carrier clamping structure and semiconductor plastic envelope mould of semiconductor plastic envelope mould Download PDFInfo
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- CN204977298U CN204977298U CN201520600758.9U CN201520600758U CN204977298U CN 204977298 U CN204977298 U CN 204977298U CN 201520600758 U CN201520600758 U CN 201520600758U CN 204977298 U CN204977298 U CN 204977298U
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- release link
- ejector retainner
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- pin
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Abstract
The utility model discloses a chip carrier clamping structure of semiconductor plastic envelope mould, its characterized in that: lower the loose core needle of chip carrier clamping structure including set up loose core needle and bed die on last mould in of semiconductor plastic envelope mould to and urging means, on loose core the needle and loose core the needle under with and set up in pairs, arbitrary chip carrier in the mould all is equipped with and carries out the centre gripping to it more than a pair of or a pair of on the needle needle of loosing core under with of loosing core, urging means is including the last mould spring and the last core pulling oil cylinder that are used for controlling the needle action of loosing core to and be used for control loose core down the lower mould spring and core pulling oil cylinder down of needle action, it all installs on the press with lower core pulling oil cylinder to go up core pulling oil cylinder. A semiconductor plastic envelope mould is still disclosed. The utility model discloses can prevent at the injecting glue in -process that the chip carrier from producing the slope, improves the finished product qualification rate.
Description
Technical field
The utility model relates to semiconductor plastic package die technical field, specifically a kind of chip carrier clamp structure of semiconductor plastic package die and the technology of semiconductor plastic package die.
Background technology
General IC encapsulating mould ejecting mechanism is after packaging is accomplished, relies on ejector retainner plate in press power backform tool, thus promotes goods to release, due in injecting glue process, the chip carrier of interiors of products is not fixed, therefore very easily produces inclination, percent defective is caused to increase, waste raw material.
Utility model content
The purpose of this utility model is to provide a kind of chip carrier that prevents in injecting glue process and produces, and improves chip carrier clamp structure and the semiconductor plastic package die of the semiconductor plastic package die of product qualified rate.
The utility model is realized by following technical proposals:
A kind of chip carrier clamp structure of semiconductor plastic package die, it is characterized in that: the chip carrier clamp structure of described semiconductor plastic package die comprise be arranged on mold on to loose core pin of loosing core under in pin and bed die, and force application mechanism, loose core on described pin with under pin of loosing core arrange in pairs, arbitrary chip carrier in described mould be equipped with a pair or more of to its clamp described on loose core pin with under to loose core pin, described force application mechanism comprise for the pin action that controls to loose core patrix spring and on to loose core oil cylinder, and for the pin action that controls down to loose core counterdie spring and under to loose core oil cylinder, loose core on described oil cylinder with under oil cylinder of loosing core be installed on press.
A kind of semiconductor plastic package die, it is characterized in that: described semiconductor plastic package die is made up of patrix and counterdie, patrix to comprise on upper plate, upper diaphragm capsule, connecting screw, pressure-bearing post, first release link in release link, second, upper ejector retainner plate, upper thimble clamping plate and on to loose core pin, counterdie comprises lower shoe, lower diaphragm capsule, connecting screw, pressure-bearing post, lower ejector retainner plate, first time release link, second time release link, lower thimble clamping plate and under to loose core pin, wherein go up between ejector retainner plate and upper plate and patrix spring and upper scotch are installed, upper ejector retainner plate is provided with patrix spring mounting hole, patrix spring fitting is in patrix spring mounting hole, on pin of loosing core be movably arranged on thimble clamping plate, the stub end of pin of loosing core on each is compressed by upper ejector retainner plate and upper thimble clamping plate are fixedly connected with screw between upper ejector retainner plate, pressure-bearing post is installed between upper diaphragm capsule and upper plate and pressure-bearing post passes ejector retainner plate and upper thimble clamping plate, between upper diaphragm capsule and upper plate, also connecting screw is installed, release link on first, on second, release link is equipped with stub end and is arranged on a sidepiece of thimble clamping plate, release link on first, on second, the stub end of release link is all connected with upper ejector retainner plate, release link on first, on second, the little head end of release link is located in the pilot hole of the corresponding sidepiece setting of diaphragm capsule, wherein descend between ejector retainner plate and lower shoe and lower scotch is installed, under pin of loosing core be movably arranged on lower thimble clamping plate, the stub end of pin of loosing core under each is compressed by lower ejector retainner plate and between lower thimble clamping plate with lower ejector retainner plate, screw is fixedly connected with, counterdie spring is located between lower diaphragm capsule and lower thimble clamping plate, lower thimble clamping plate are provided with counterdie spring fitting through hole, counterdie spring fitting is in counterdie spring fitting through hole, lower pressure-bearing post is installed between diaphragm capsule and lower shoe and pressure-bearing post through lower ejector retainner plate and lower thimble clamping plate, also connecting screw is installed between diaphragm capsule and lower shoe down, second time release link is provided with stub end and is arranged on the side of lower thimble clamping plate, the stub end of second time release link is connected with lower ejector retainner plate, the little head end of second time release link is located in the pilot hole of lower diaphragm capsule side setting, in the opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, lower diaphragm capsule opposite side is equipped with the pilot hole of first time release link, lower ejector retainner plate is provided with projection and inserts in lower shoe, one end of first time release link and depart from end face and be provided with a circle convex edge, lower shoe is provided with the convex edge vestibule matched with the convex edge in first time release link, through hole is provided with at the bottom of the chamber of convex edge vestibule, the convex edge of first time release link is arranged in the vestibule of convex edge, the other end of first time release link inserts the described opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, in the pilot hole of first time release link that lower diaphragm capsule opposite side is arranged, on described first, the center line of release link overlaps with the center line of first time release link, upper ejector retainner plate and upper thimble clamping plate move drive looses core and carry out clamping and ejecting goods for carrier, loose core under lower ejector retainner plate and lower thimble clamping plate move drive and carry out clamping and ejecting goods for carrier.
The utility model compared with prior art has the following advantages:
The utility model die strip core-pulling function, is namely had more one group of core-pulling mechanism during design, like this in injecting glue process, is clamped the chip carrier of interiors of products by pin of loosing core, therefore can effectively prevent it from tilting; When injecting glue will complete, pin of loosing core will bounce back, and pin hole fills up by injecting glue, obtains the finished product that qualification rate is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of the chip carrier clamp structure of the utility model semiconductor plastic package die.
Detailed description of the invention
Below the utility model is further described.
As Fig. 1, the chip carrier clamp structure of the utility model semiconductor plastic package die, comprise be arranged on mold on to loose core pin of loosing core under in pin and bed die, and force application mechanism, loose core on described pin with under pin of loosing core arrange in pairs, arbitrary chip carrier in wherein said mould be equipped with a pair or more of to its clamp described on loose core pin with under to loose core pin, force application mechanism comprise for the pin action that controls to loose core patrix spring and on to loose core oil cylinder, and for the pin action that controls down to loose core counterdie spring and under to loose core oil cylinder, loose core on described oil cylinder with under oil cylinder of loosing core be installed on press.
Connecting screw 1 is illustrated in Fig. 1, connecting screw 2, pressure-bearing post 3, pressure-bearing post 4, upper scotch 5, lower scotch 6, upper plate 7, lower shoe 8, upper ejector retainner plate 9, lower ejector retainner plate 10, upper thimble clamping plate 11, lower thimble clamping plate 12, upper diaphragm capsule 13, lower diaphragm capsule 14, release link 15 on first, first time release link 16, release link 17 on second, second time release link 18, on to loose core pin 19, under to loose core pin 20, on to loose core oil cylinder 21, under to loose core oil cylinder 22, patrix spring 23, counterdie spring 24, press spring 25, press pressure axle 26 and chip carrier 27, press and injection machine.
As Fig. 1, the utility model semiconductor plastic package die is made up of patrix and counterdie, patrix to comprise on upper plate 7, upper diaphragm capsule 13, connecting screw 1, pressure-bearing post 3, first release link 17 in release link 15, second, upper ejector retainner plate 9, upper thimble clamping plate 11 and on to loose core pin 19; Counterdie comprise lower shoe 8, lower diaphragm capsule 14, connecting screw 2, pressure-bearing post 4, lower ejector retainner plate 10, first time release link 16, second time release link 18, lower thimble clamping plate 12 and under to loose core pin 20.
Part of the upper die: be provided with patrix spring 23 and upper scotch 5 between upper ejector retainner plate and upper plate, upper ejector retainner plate is provided with patrix spring mounting hole, patrix spring fitting is in patrix spring mounting hole, on pin of loosing core be movably arranged on thimble clamping plate, the stub end of pin of loosing core on each is compressed by upper ejector retainner plate and upper thimble clamping plate are fixedly connected with screw between upper ejector retainner plate, pressure-bearing post is installed between upper diaphragm capsule and upper plate and pressure-bearing post passes ejector retainner plate and upper thimble clamping plate, between upper diaphragm capsule and upper plate, also connecting screw is installed, release link on first, on second, release link is equipped with stub end and is arranged on a sidepiece of thimble clamping plate, release link on first, on second, the stub end of release link is all connected with upper ejector retainner plate, release link on first, on second, the little head end of release link is located in the pilot hole of the corresponding sidepiece setting of diaphragm capsule.
Part of the lower die: be provided with lower scotch 6 between lower ejector retainner plate and lower shoe, under pin of loosing core be movably arranged on lower thimble clamping plate, the stub end of pin of loosing core under each is compressed by lower ejector retainner plate and between lower thimble clamping plate with lower ejector retainner plate, screw is fixedly connected with, counterdie spring 24 is located between lower diaphragm capsule and lower thimble clamping plate, lower thimble clamping plate are provided with counterdie spring fitting through hole, counterdie spring fitting is in counterdie spring fitting through hole, lower pressure-bearing post is installed between diaphragm capsule and lower shoe and pressure-bearing post through lower ejector retainner plate and lower thimble clamping plate, also connecting screw is installed between diaphragm capsule and lower shoe down, second time release link is provided with stub end and is arranged on the side of lower thimble clamping plate, the stub end of second time release link is connected with lower ejector retainner plate, the little head end of second time release link is located in the pilot hole of lower diaphragm capsule side setting, in the opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, lower diaphragm capsule opposite side is equipped with the pilot hole of first time release link, lower ejector retainner plate is provided with projection and inserts in lower shoe, one end of first time release link and depart from end face and be provided with a circle convex edge, lower shoe is provided with the convex edge vestibule matched with the convex edge in first time release link, through hole is provided with at the bottom of the chamber of convex edge vestibule, the convex edge of first time release link is arranged in the vestibule of convex edge, the other end of first time release link inserts the described opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, in the pilot hole of first time release link that lower diaphragm capsule opposite side is arranged.
Wherein the center line of release link overlaps with the center line of first time release link on first, upper ejector retainner plate and upper thimble clamping plate move drive looses core and carry out clamping and ejecting goods for carrier, loose core to carry out clamping and ejecting goods for carrier under lower ejector retainner plate and lower thimble clamping plate move drive.
As shown in Figure 1, after matched moulds, pin of above loosing core is clamped chip carrier by patrix spring, under loose core to loose core under pin the passes through promotion of oil cylinder chip carrier is clamped; When injecting glue completes soon, under to loose core oil cylinder release, under pin of loosing core retract, cylinder action of above loosing core, pin of above loosing core is released until injecting glue completes; After die sinking, pin that the promotion of patrix spring is loosed core ejects goods, and counterdie, by pin of loosing core under the promotion of press push rod, ejects goods.Oil cylinder 21 of loosing core on shown in figure applies pressure to 16, first time release link 16 power transmission of first time release link to release link 15 on first; Under oil cylinder 22 pairs of lower shoes 8 of loosing core exert a force.
Claims (2)
1. the chip carrier clamp structure of a semiconductor plastic package die, it is characterized in that: the chip carrier clamp structure of described semiconductor plastic package die comprise be arranged on mold on to loose core pin of loosing core under in pin and bed die, and force application mechanism, loose core on described pin with under pin of loosing core arrange in pairs, arbitrary chip carrier in described mould be equipped with a pair or more of to its clamp described on loose core pin with under to loose core pin, described force application mechanism comprise for the pin action that controls to loose core patrix spring and on to loose core oil cylinder, and for the pin action that controls down to loose core counterdie spring and under to loose core oil cylinder, loose core on described oil cylinder with under oil cylinder of loosing core be installed on press.
2. a semiconductor plastic package die, it is characterized in that: described semiconductor plastic package die is made up of patrix and counterdie, patrix to comprise on upper plate, upper diaphragm capsule, connecting screw, pressure-bearing post, first release link in release link, second, upper ejector retainner plate, upper thimble clamping plate and on to loose core pin; Counterdie comprise lower shoe, lower diaphragm capsule, connecting screw, pressure-bearing post, lower ejector retainner plate, first time release link, second time release link, lower thimble clamping plate and under to loose core pin,
Wherein go up between ejector retainner plate and upper plate and patrix spring and upper scotch are installed, upper ejector retainner plate is provided with patrix spring mounting hole, patrix spring fitting is in patrix spring mounting hole, on pin of loosing core be movably arranged on thimble clamping plate, the stub end of pin of loosing core on each is compressed by upper ejector retainner plate and upper thimble clamping plate are fixedly connected with screw between upper ejector retainner plate, pressure-bearing post is installed between upper diaphragm capsule and upper plate and pressure-bearing post passes ejector retainner plate and upper thimble clamping plate, between upper diaphragm capsule and upper plate, also connecting screw is installed, release link on first, on second, release link is equipped with stub end and is arranged on a sidepiece of thimble clamping plate, release link on first, on second, the stub end of release link is all connected with upper ejector retainner plate, release link on first, on second, the little head end of release link is located in the pilot hole of the corresponding sidepiece setting of diaphragm capsule,
Wherein descend between ejector retainner plate and lower shoe and lower scotch is installed, under pin of loosing core be movably arranged on lower thimble clamping plate, the stub end of pin of loosing core under each is compressed by lower ejector retainner plate and between lower thimble clamping plate with lower ejector retainner plate, screw is fixedly connected with, counterdie spring is located between lower diaphragm capsule and lower thimble clamping plate, lower thimble clamping plate are provided with counterdie spring fitting through hole, counterdie spring fitting is in counterdie spring fitting through hole, lower pressure-bearing post is installed between diaphragm capsule and lower shoe and pressure-bearing post through lower ejector retainner plate and lower thimble clamping plate, also connecting screw is installed between diaphragm capsule and lower shoe down, second time release link is provided with stub end and is arranged on the side of lower thimble clamping plate, the stub end of second time release link is connected with lower ejector retainner plate, the little head end of second time release link is located in the pilot hole of lower diaphragm capsule side setting, in the opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, lower diaphragm capsule opposite side is equipped with the pilot hole of first time release link, lower ejector retainner plate is provided with projection and inserts in lower shoe, one end of first time release link and depart from end face and be provided with a circle convex edge, lower shoe is provided with the convex edge vestibule matched with the convex edge in first time release link, through hole is provided with at the bottom of the chamber of convex edge vestibule, the convex edge of first time release link is arranged in the vestibule of convex edge, the other end of first time release link inserts the described opposite side of lower thimble clamping plate and the respective side of lower ejector retainner plate, in the pilot hole of first time release link that lower diaphragm capsule opposite side is arranged,
On described first, the center line of release link overlaps with the center line of first time release link, upper ejector retainner plate and upper thimble clamping plate move drive looses core and carry out clamping and ejecting goods for carrier, loose core to carry out clamping and ejecting goods for carrier under lower ejector retainner plate and lower thimble clamping plate move drive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520600758.9U CN204977298U (en) | 2015-08-11 | 2015-08-11 | Chip carrier clamping structure and semiconductor plastic envelope mould of semiconductor plastic envelope mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520600758.9U CN204977298U (en) | 2015-08-11 | 2015-08-11 | Chip carrier clamping structure and semiconductor plastic envelope mould of semiconductor plastic envelope mould |
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| Publication Number | Publication Date |
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| CN204977298U true CN204977298U (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520600758.9U Active CN204977298U (en) | 2015-08-11 | 2015-08-11 | Chip carrier clamping structure and semiconductor plastic envelope mould of semiconductor plastic envelope mould |
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| CN (1) | CN204977298U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774059A (en) * | 2018-12-17 | 2019-05-21 | 河南平高通用电气有限公司 | A kind of waste material material-receiving device and the molding machine using the device |
| CN111216322A (en) * | 2020-03-03 | 2020-06-02 | 王弯 | Injection mold |
-
2015
- 2015-08-11 CN CN201520600758.9U patent/CN204977298U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109774059A (en) * | 2018-12-17 | 2019-05-21 | 河南平高通用电气有限公司 | A kind of waste material material-receiving device and the molding machine using the device |
| CN111216322A (en) * | 2020-03-03 | 2020-06-02 | 王弯 | Injection mold |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |