CN204962339U - Inflatable LED Bulb - Google Patents
Inflatable LED Bulb Download PDFInfo
- Publication number
- CN204962339U CN204962339U CN201520595383.1U CN201520595383U CN204962339U CN 204962339 U CN204962339 U CN 204962339U CN 201520595383 U CN201520595383 U CN 201520595383U CN 204962339 U CN204962339 U CN 204962339U
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- CN
- China
- Prior art keywords
- filament assembly
- led bulb
- wire
- led
- cavity
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- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to an aerify LED bulb. The inflatable LED bulb comprises a bulb shell, a support and a filament assembly; a cavity is formed in the bulb shell, and heat-conducting gas is filled in the cavity; the bracket is fixedly arranged in the cavity; the filament assembly is located the cavity, and the filament assembly includes LED and the wire of SMD or CSP encapsulation, and the quantity of LED and wire is a plurality of, and LED and wire are connected in turn and are formed the chain form, and filament assembly's both ends fixed connection is on the support. The LED is directly connected with the metal wire without being connected with a PCB, so that soldering flux is not needed, the heat conducting gas can be prevented from being polluted, and the light attenuation phenomenon is prevented. Because the PCB and the metal wire are not required to be connected, the manufacturing process is simple, the PCB and the solder are saved, and the production cost is greatly reduced.
Description
Technical field
The utility model relates to the technical field of light fixture, particularly relates to a kind of inflation LED bulb.
Background technology
The light source assembly of general LED bulb comprises LED and PCB (PrintedCircuitBoard, printed circuit board), and LED is arranged on PCB by paster or plug-in unit, and is connected with PCB circuit.The scaling powder used in traditional paster and plug-in unit technique can remain on light source assembly, and residual scaling powder, in the airtight cavity volatilization of LED bulb, can pollute the gas in LED bulb, easily cause light decay.
Utility model content
Based on this, be necessary the problem easily causing light decay for LED bulb, a kind of inflation LED bulb is provided.
A kind of inflation LED bulb, comprises cell-shell, support and filament assembly;
Described cell-shell inside offers cavity, is filled with heat-conducting gas in described cavity;
Described support is fixedly installed in described cavity;
Described filament assembly is positioned at described cavity, described filament assembly comprises LED and the wire of SMD or CSP encapsulation, described LED and described quantity wiry are multiple, and described LED and described wire are alternately connected to form chain, and the two ends of described filament assembly are fixedly connected with on the bracket.
Wherein in an embodiment, described LED is connected with described wire.
Wherein in an embodiment, also comprise lamp holder, described lamp holder to be arranged on described cell-shell and to be positioned at outside described cavity.
Wherein in an embodiment, the outer wall of described lamp holder be provided with connecting thread or connect bayonet lock.
Wherein in an embodiment, also comprise circuit board, described circuit board is positioned at described lamp holder, and described circuit board is electrically connected with described filament assembly.
Wherein in an embodiment, also comprise connection wire, at least part of described connection wire is positioned at described support, and described circuit board and described filament assembly are electrically connected by described connection wire.
Wherein in an embodiment, described support sinters with described cell-shell and is connected.
Wherein in an embodiment, described support comprises base portion and support portion;
Described base portion is connected with described cell-shell;
One end of described support portion is fixedly connected on described base portion, and the other end of described support portion is fixedly connected with described filament assembly.
Wherein in an embodiment, described filament assembly is bent to U-shaped.
Wherein in an embodiment, the quantity of described filament assembly is multiple, and multiple described filament assembly intersects mutually, and has gap between multiple described filament assembly.
Above-mentioned inflation LED bulb, LED, without the need to connection PCB, is directly connected with wire, does not therefore need scaling powder, heat-conducting gas therefore can be avoided contaminated, prevent light decay phenomenon.Due to without the need to using PCB to be connected with wire, making manufacturing process simple, saving PCB and solder, greatly reduce production cost.Meanwhile, the LED reliability of SMD or CSP encapsulation is high, shock resistance is strong.The LED of independent encapsulation connects on the metal filament, and structure is more reliable, can improve yields.Because wire is bent and sizing, therefore can carry out bending shaping to filament assembly as required, full optic angle can be realized luminous, and be not easy in process to damage, reduce difficulty of processing, improve the qualification rate of product.
Accompanying drawing explanation
Fig. 1 is the stereogram inflating LED bulb in an embodiment;
Fig. 2 is the partial sectional view of the LED bulb of inflation shown in Fig. 1;
Fig. 3 is the stereogram inflating LED bulb in another embodiment;
Fig. 4 is the partial sectional view of the LED bulb of inflation shown in Fig. 3;
Fig. 5 is the stereogram inflating LED bulb in another embodiment;
Fig. 6 is the partial sectional view of the LED bulb of inflation shown in Fig. 5;
Fig. 7 is the stereogram inflating LED bulb in another embodiment;
Fig. 8 is the partial sectional view of the LED bulb of inflation shown in Fig. 7.
Detailed description of the invention
For the ease of understanding the utility model, below with reference to relevant drawings, inflation LED bulb is described more fully.The first-selected embodiment of inflation LED bulb is given in accompanying drawing.But inflation LED bulb can realize in many different forms, is not limited to embodiment described herein.On the contrary, the object of these embodiments is provided to be make the disclosure to inflating LED bulb more comprehensively thorough.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of term used herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As depicted in figs. 1 and 2, the inflation LED bulb 10 of an embodiment comprises cell-shell 100, support 200 and filament assembly 300.Cell-shell 100 inside offers cavity 120, is filled with heat-conducting gas in cavity 120, and heat-conducting gas can dispel the heat to filament assembly 300 better, to improve the service life of LED bulb 10.Heat-conducting gas can comprise hydrogen, helium and neon, and heat-conducting gas can be the mist of above both or three, also can be the mists of above three kinds of mists with other gases.
Support 200 is fixedly installed in cavity 120.In one embodiment, support 200 sinters with cell-shell 100 and is connected, and the two is sintered into one, and processing is simple, is connected firmly.Filament assembly 300 is positioned at cavity 120, filament assembly 300 comprise SMD or CSP encapsulation LED320 and wire 340, SMD be the abbreviation of SurfaceMountedDevices, refer to surface mount device.CSP is the abbreviation of ChipScalePackage, refers to wafer-level package.The quantity of LED320 and wire 340 is multiple, and LED320 and wire 340 are alternately connected to form chain, and in one embodiment, LED320 is connected by welding manner with wire 340.The two ends of filament assembly 300 are fixedly connected on support 200.
The inflation LED bulb 10, LED320 of the present embodiment, without the need to connection PCB, is directly connected with wire 340, LED320 can be connected by welding manner with wire 340, therefore do not need scaling powder, heat-conducting gas therefore can be avoided contaminated, prevent light decay phenomenon.Due to without the need to using PCB to be connected with wire 340, making manufacturing process simple, saving PCB and solder, greatly reduce production cost.Meanwhile, the LED320 reliability of SMD or CSP encapsulation is high, shock resistance is strong.The LED320 of independent encapsulation is connected on wire 340, and structure is more reliable, can improve yields.Because wire 340 is bent and sizing, therefore can carry out bending shaping to filament assembly 300 as required, full optic angle can be realized luminous, and be not easy in process to damage, reduce difficulty of processing, improve the qualification rate of product.
Inflation LED bulb 10 also comprises lamp holder 400 and circuit board 500, and lamp holder 400 to be arranged on cell-shell 100 and to be positioned at outside cavity 120.Circuit board 500 is positioned at lamp holder 400, and circuit board 500 is electrically connected with filament assembly 300.Wherein in an embodiment, inflation LED bulb 10 can also comprise and connect wire 600, and connect wire 600 at least partly and be positioned at support 200, circuit board 500 is electrically connected by being connected wire 600 with filament assembly 300.In the embodiment shown in Fig. 1, Fig. 2, support 200 is stretched out in the end connecting wire 600, is connected with the wire 340 of filament assembly 300 end, improves the reliability connected.
In the embodiment shown in Fig. 1, Fig. 2, the outer wall of lamp holder 400 is provided with connecting thread 420, the Connection Block being connected LED bulb 10 is provided with hickey, lamp holder 400 is connected with Connection Block by connecting thread 420 interface.It should be noted that, lamp holder 400 and the connected mode of the Connection Block being connected LED bulb 10 are not limited by hickey and connect, and also can be connected by the standard interface of engaging interface or other types.Simultaneously see Fig. 3, Fig. 4, in another embodiment, the outer wall of lamp holder 400 is provided with connection bayonet lock 440.Connect bayonet lock 440 for being connected with the bayonet socket of Connection Block.
See Fig. 1 to Fig. 4, wherein in an embodiment, filament assembly 300 is bent to U-shaped.The two ends of filament assembly 300 are connected with support 200 respectively, and the distance between the two ends of U-shaped filament assembly 300 is closer, and convenient setting in support 200 connects wire 600, and the structure of support 200 is simple, convenient processing.Further, in one embodiment, the quantity of filament assembly 300 is multiple, and multiple filament assembly 300 intersects mutually, and has gap between multiple filament assembly 300.Between multiple filament assembly 300, there is gap, be beneficial to heat radiation.And multiple filament assembly 300 intersects mutually, LED320 can be made to be evenly distributed, and then make evenly luminous.
Simultaneously see Fig. 5, Fig. 6, in another embodiment, support 200 comprises base portion 220 and support portion 240.Base portion 220 is connected with cell-shell 100.One end of support portion 240 is fixedly connected on base portion 220, and the other end of support portion 240 is fixedly connected with filament assembly 300.The effect of filament supports assembly 300 is played in support portion 240, makes the structure of filament assembly 300 more firm.Filament assembly 300 can be multiple, and filament assembly 300 can be straight shape, and one end is connected on base portion 220, and the other end is connected on support portion 240.Filament assembly 300 also can take the shape of the letter U, and two ends are all arranged on base portion 220, or two ends are all arranged on support portion 240.Connection wire 600 can stretch out away from the end of base portion 200 from support portion 240 and be connected with filament assembly 300, and connection wire 600 also can stretch out from base portion 200 and be connected with filament assembly 300.
In the embodiment shown in Fig. 5, Fig. 6, the outer wall of lamp holder 400 is provided with connecting thread 420, lamp holder 400 is connected with the hickey of Connection Block by connecting thread 420 interface.Simultaneously see Fig. 7, Fig. 8, in another embodiment, the outer wall of lamp holder 400 is provided with and connects bayonet lock 440, lamp holder 400 is connected with the bayonet socket of Connection Block by connecting bayonet lock 440.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. inflate a LED bulb, it is characterized in that, comprise cell-shell, support and filament assembly;
Described cell-shell inside offers cavity, is filled with heat-conducting gas in described cavity;
Described support is fixedly installed in described cavity;
Described filament assembly is positioned at described cavity, described filament assembly comprises LED and the wire of SMD or CSP encapsulation, described LED and described quantity wiry are multiple, and described LED and described wire are alternately connected to form chain, and the two ends of described filament assembly are fixedly connected with on the bracket.
2. inflation LED bulb according to claim 1, is characterized in that, described LED is connected with described wire.
3. inflation LED bulb according to claim 1, is characterized in that, also comprise lamp holder, and described lamp holder to be arranged on described cell-shell and to be positioned at outside described cavity.
4. inflation LED bulb according to claim 3, is characterized in that, the outer wall of described lamp holder is provided with connecting thread or connects bayonet lock.
5. inflation LED bulb according to claim 3, is characterized in that, also comprise circuit board, and described circuit board is positioned at described lamp holder, and described circuit board is electrically connected with described filament assembly.
6. inflation LED bulb according to claim 5, is characterized in that, also comprises connection wire, and at least part of described connection wire is positioned at described support, and described circuit board and described filament assembly are electrically connected by described connection wire.
7. inflation LED bulb according to claim 1, is characterized in that, described support sinters with described cell-shell and is connected.
8. inflation LED bulb according to claim 1, is characterized in that, described support comprises base portion and support portion;
Described base portion is connected with described cell-shell;
One end of described support portion is fixedly connected on described base portion, and the other end of described support portion is fixedly connected with described filament assembly.
9. inflation LED bulb according to claim 1, is characterized in that, described filament assembly is bent to U-shaped.
10. inflation LED bulb according to claim 9, is characterized in that, the quantity of described filament assembly is multiple, and multiple described filament assembly intersects mutually, and has gap between multiple described filament assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520595383.1U CN204962339U (en) | 2015-08-07 | 2015-08-07 | Inflatable LED Bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520595383.1U CN204962339U (en) | 2015-08-07 | 2015-08-07 | Inflatable LED Bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204962339U true CN204962339U (en) | 2016-01-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520595383.1U Active CN204962339U (en) | 2015-08-07 | 2015-08-07 | Inflatable LED Bulb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204962339U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051509A (en) * | 2016-05-31 | 2016-10-26 | 厦门蓝水电子有限公司 | Method for gas filling for LED filament bulb |
| CN106168337A (en) * | 2016-05-13 | 2016-11-30 | 李博 | Ball-coupling type LED illuminator and manufacture method |
| CN106439531A (en) * | 2015-08-07 | 2017-02-22 | 深圳市裕富照明有限公司 | Inflatable LED Bulb |
| CN107339622A (en) * | 2017-09-07 | 2017-11-10 | 李立新 | A kind of full cover Large-angle emission LED lamp bubble |
-
2015
- 2015-08-07 CN CN201520595383.1U patent/CN204962339U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106439531A (en) * | 2015-08-07 | 2017-02-22 | 深圳市裕富照明有限公司 | Inflatable LED Bulb |
| CN106168337A (en) * | 2016-05-13 | 2016-11-30 | 李博 | Ball-coupling type LED illuminator and manufacture method |
| CN106051509A (en) * | 2016-05-31 | 2016-10-26 | 厦门蓝水电子有限公司 | Method for gas filling for LED filament bulb |
| CN107339622A (en) * | 2017-09-07 | 2017-11-10 | 李立新 | A kind of full cover Large-angle emission LED lamp bubble |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |