CN204946679U - High frequency inductor - Google Patents
High frequency inductor Download PDFInfo
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- CN204946679U CN204946679U CN201520621092.5U CN201520621092U CN204946679U CN 204946679 U CN204946679 U CN 204946679U CN 201520621092 U CN201520621092 U CN 201520621092U CN 204946679 U CN204946679 U CN 204946679U
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- main body
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- inductor
- high frequency
- contoured surface
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Abstract
The utility model provides a high-frequency inductor contains: a main body and a first coil. The body has a contour surface, the contour surface of the body includes a first side edge and a second side edge which are oppositely arranged, and is made of a non-magnetic material and is integrated. The first coil is disposed on the main body and includes a plurality of top sections, a plurality of longitudinal sections, and a plurality of bottom sections. The top section, the longitudinal section and the bottom section are arranged at intervals along a first direction from the first side edge to the second side edge of the main body. The top section and the bottom section are respectively arranged on a top surface area and a bottom surface area of the profile surface of the main body, and each top section is electrically connected with each bottom section in sequence along the first direction through two opposite end edges of two adjacent longitudinal sections. Therefore, the body has higher structural strength, and can avoid the problems of electrothermal effect and the like caused by non-ohmic contact or impedance increase.
Description
Technical field
The utility model relates to a kind of inductor, particularly relates to a kind of inductor in high frequency.
Background technology
Current inductor on the market, mainly can be divided into diaphragm type (thinfilm), lamination type (multilayer) and Wound-rotor type (wirewound).As a kind of lamination type inductance device (not shown) disclosed in Taiwan TWI430300 certificate number patent of invention case (hereinafter referred to as front case 1), it comprises multiple insulating barrier and multiple coil patterning layer, and described insulating barrier and described coil patterning layer are alternating with each otherly stacked forming, its by described insulating barrier stacked on top of each other and described coil patterning layer to define a main body and a coil of this lamination type inductance device respectively.
In detail, the lamination type inductance device of this front case 1 is sputtered on each insulating barrier by each coil patterning layer correspondence; Wherein, each coil patterning layer that each insulating barrier is coated with, 1+7/8 only around an axis of this lamination type inductance device encloses, and each coil patterning layer is still needed in one inner end and one outer end and is placed into the electric conductor of its perforation by the inner end being positioned at each coil patterning layer of the insulating barrier corresponding to it and two perforations and two of outer end, come respectively with its below insulating barrier on the inner end of coil patterning layer and the outer end conducting of coil patterning layer on the insulating barrier of top.In addition, to be respectively coated with the production process of the insulating barrier of coil patterning layer, it all needs through three road programs such as plating coil patterning layer program, perforation program, end winding conducting programs.In other words, when this lamination type inductance device coil needed for the number of turn up to 10 circle time, the manufacture method of this lamination type inductance device then needs alternatively stackedly to reach the insulating barrier that six layers are coated with each coil patterning layer, and total program also nearly 18 roads.Therefore, the production process of front case 1 is quite loaded down with trivial details.
In order to the main body simplifying lamination type inductance device further forms program, Taiwan TW201440090A early stage publication number patent of invention case (hereinafter referred to as front case 2) is then disclosed another kind of lamination type inductance device 1 (see Fig. 1) and manufacture method (see Fig. 2 to Fig. 7) thereof.The manufacture method of this lamination type inductance device 1, comprise following steps: (A) be sequentially lamination crimping one first circuit pottery master slice 110, second circuit pottery master slice 120, tertiary circuit pottery master slice 130 from bottom to top, and one the 4th circuit pottery master slice 140 (as shown in Figure 2); (B) make a surface be coated with the film carrier 150 of a pad electrode (bondingpad) 1501 array (array), one first predetermined circuit patterns 1120 array towards this first circuit pottery master slice 110 arranges (as shown in Figure 3); (C) this pad electrode 1501 array be transferred to the first predetermined circuit patterns 1120 array on this first circuit pottery master slice 110 thus form one first circuit pattern 112 array (as shown in Figure 4); (D) this film carrier 150 (as shown in Figure 5) is peeled off; (E) described circuit pottery master slice 110,120,130,140 is sintered to form an assembly substrate 100 (as shown in Figure 6); And (F) bestows delineation with a delineation tool 160 to this assembly substrate 100, make this assembly substrate 100 be divided into multiple laminate 10, and make the first circuit pattern 112 array in assembly substrate 100 be divided into multiple first circuit pattern 112 and form lamination type inductance device 1 as shown in Figure 1.
As shown in Figure 1, this lamination type inductance device 1 depicted through this step (F) from bottom to top sequentially comprises: one first circuit potsherd 11, second circuit potsherd 12, tertiary circuit potsherd 13, and one the 4th circuit potsherd 14.This first circuit potsherd 11 has a nonmagnetic material 111, and this is configured at the first circuit pattern 112 in the nonmagnetic material 111 of this first circuit potsherd 11.This second circuit potsherd 12 and this tertiary circuit potsherd 13 have a magnetic 121,131 respectively, and one is configured at second circuit pattern 122 in its magnetic 121,131 and tertiary circuit pattern 132 respectively.4th circuit potsherd 14 has a nonmagnetic material 141, and one is configured at the 4th circuit pattern 142 in the nonmagnetic material 141 of the 4th circuit potsherd 14.
This lamination type inductance device 1 utilizes the circuit pattern 112,122,132,142 of described circuit potsherd 11,12,13,14 jointly to be formed the coil around formula in.But, in detail, front in this step of execution (A), be respectively sequentially to multiple ceramic master slice (not shown) perforation to form multiple through hole in each ceramic master slice, to fill electroconductive paste to form multiple electric conductor in each through hole, and coating electroconductive paste, to form the multiprogrammings such as each circuit pattern 112,122,132,142, just can obtain each circuit pottery master slice 110,120,130,140 on each ceramic master slice.In addition, after the delineation of the sintering processes and this step (F) that execute this step (E), just can obtain the appearance of the laminate 10 of each lamination type inductance device 1.
With regard to processing procedure face, form this interior coil around formula need stick with paste to form each circuit pattern 112,122,132,142 program by the applying conductive through the electroconductive paste program that fills in the perforation program in four roads, four roads, four roads, with together with the 13 road programs such as sintering processes of step (E), although the program of front case 2 slightly comparatively this front case 1 simplify; But total program of this front case 2 also reaches 13 roads, quite loaded down with trivial details, the time cost expended needed for manufacturing is caused to promote.With regard to practical application face because laminate 10 be through storehouse sinter described circuit pottery master slice 110,120,130,140 and after bestowing delineation acquired by, make this lamination type inductance device 1 volume also along with raising, and be unfavorable for the layout that is routed on circuit board.In addition, be made up of the circuit pattern 112,122,132,142 of each circuit potsherd 11,12,13,14 because this is interior around formula coil, discrete interface between each circuit pattern 112,122,132,142 easily produces Fei Aomushi contact (non-ohmiccontact) or increases impedance and produce extra electrocaloric effect (Joule-heating), is neither beneficial to the running of inductor.
Known through above-mentioned explanation, simplify the manufacture method of inductor with while reducing cost of manufacture, and the problem that the impedance solving inductor is too high, be the person skilled of this technical field a difficult problem to be broken through.
Summary of the invention
The purpose of this utility model is to provide a kind of inductor in high frequency.
Inductor in high frequency of the present utility model comprises: a main body and one first coil.This main body has a contoured surface, and the contoured surface of this main body comprises one first lateral margin and one second lateral margin of contrary setting.This main body is made up of a nonmagnetic substance, and be integrated (unity) person.This first coil is arranged at this main body, and comprises multiple top section, multiple vertical portions section, and multiple bottom stage.Described top section, described vertical portion section and described bottom stage be along one from this first lateral margin of this main body towards the first direction spaced-apart relation of this second lateral margin.Described top section and described bottom stage are an end face district and a bottom surface district of the contoured surface being arranged at this main body respectively, and each top section be by the opposite end edge of its adjacent two vertical portions sections along this first direction to be sequentially electrically connected with each bottom stage.
Inductor in high frequency of the present utility model, this main body also has two rows and is divided into a forward area of the contoured surface of its main body and the groove of a back panel, each row's groove is along this first direction spaced-apart relation, and extend to this bottom surface district from this end face district of the contoured surface of this main body, and this two rows groove caves in opposite directions from this forward area of the contoured surface of this main body and this back panel respectively, each vertical portion section of this first coil is placed in each groove.
Inductor in high frequency of the present utility model, this main body also has two row's perforation, each row's perforation is along this first direction spaced-apart relation, and described perforation is this end face district and this bottom surface district of the contoured surface running through this main body respectively, and each vertical portion section of this first coil is placed in each perforation.
Inductor in high frequency of the present utility model, also comprise an insulating barrier and one second coil, on the contoured surface that this insulating barrier is covered in this main body and this first coil, this second coil is then arranged on this insulating barrier with outside this end face district of the contoured surface around this main body, this bottom surface district, a forward area and a back panel.
Inductor in high frequency of the present utility model, this nonmagnetic substance is a material based on silicon or a metal material.
The beneficial effects of the utility model are, the utility model inductor in high frequency and mass production method thereof, be directly etch this substrate preshaped go out structural strength high and in each main body of integrative-structure, and on the contoured surface of each main body, form each first precursor layer, so that each first precursor layer further on each contoured surface of spatially state to plate out each first coil, with regard to aspect of performance, structural strength is higher and do not have Fei Aomushi contact or increase impedance and produce the problems such as electrocaloric effect, with regard to processing procedure and cost aspect, time cost is reduced because production process simplifies.
Accompanying drawing explanation
Of the present utility model other feature and effect, clearly present in reference to graphic execution mode, wherein:
Fig. 1 is a three-dimensional exploded view, illustrates by a kind of lamination type inductance device disclosed in Taiwan TW201440090A early stage publication number patent of invention case;
Fig. 2 is a sectional view, and a step (A) of the manufacture method of this lamination type inductance device is described;
Fig. 3 is a sectional view, and a step (B) of the manufacture method of this lamination type inductance device is described;
Fig. 4 is a sectional view, and a step (C) of the manufacture method of this lamination type inductance device is described;
Fig. 5 is a sectional view, and a step (D) of the manufacture method of this lamination type inductance device is described;
Fig. 6 is a sectional view, and a step (E) of the manufacture method of this lamination type inductance device is described;
Fig. 7 is a sectional view, and a step (F) of the manufacture method of this lamination type inductance device is described;
Fig. 8 is a schematic perspective view, and one first embodiment of the utility model inductor in high frequency is described;
Fig. 9 is a schematic perspective view, and one second embodiment of the utility model inductor in high frequency is described;
Figure 10 is a schematic perspective view, and one the 3rd embodiment of the utility model inductor in high frequency is described;
Figure 11 is a schematic perspective view, and one the 4th embodiment of the utility model inductor in high frequency is described;
Figure 12 be one along Figure 11 straight line X II-X II acquired by cross-sectional schematic;
Figure 13 is a schematic top plan view, illustrate the utility model inductor in high frequency the step (a) of one first embodiment of mass production method;
Figure 14 be one along Figure 13 straight line X IV-X IV acquired by cross-sectional schematic;
Figure 15 is a schematic top plan view, and a step (b) of the first embodiment of this mass production method is described;
Figure 16 be one along Figure 15 straight line X VI-X VI acquired by cross-sectional schematic;
Figure 17 is a schematic top plan view, and a step (c) of the first embodiment of this mass production method is described;
Figure 18 is a schematic perspective view, and a step (d) of the first embodiment of this mass production method is described;
Figure 19 is a schematic perspective view, and a step (e) of the first embodiment of this mass production method is described;
Figure 20 is a schematic perspective view, and a step (f) of the first embodiment of this mass production method is described;
Figure 21 is a schematic perspective view, and a step (h) of the first embodiment of this mass production method is described;
Figure 22 is a schematic top plan view, and a step (g) of the first embodiment of this mass production method is described;
Figure 23 is a schematic top plan view, and a step (a) of one second embodiment of the mass production method of the utility model inductor in high frequency is described;
Figure 24 is a schematic top plan view, and a step (a) of one the 3rd embodiment of the mass production method of the utility model inductor in high frequency is described;
Figure 25 is a schematic perspective view, and a step (i1) of one the 4th embodiment of the mass production method of the utility model inductor in high frequency is described;
Figure 26 is a schematic perspective view, and a step (i2) of the 4th embodiment of this mass production method is described;
Figure 27 is a schematic perspective view, and a step (i3) of the 4th embodiment of this mass production method is described;
Figure 28 is a schematic perspective view, and a step (i4) of the 4th embodiment of this mass production method is described.
Embodiment
Before the utility model is described in detail, should be noted that in the following description content, similar element represents with identical numbering.
Consult Fig. 8, one first embodiment of the utility model inductor in high frequency 2, comprise main body 21 and one first coil 23.
This main body 21 has a contoured surface 210, and the contoured surface 210 of this main body 21 comprises contrary one first lateral margin 211 and one second lateral margin 212 arranged.This main body 21 is made up of a nonmagnetic substance, and the person of being integrated.
This first coil 23 is arranged at this main body 21, and comprises multiple top section 231, multiple vertical portions section 232, and multiple bottom stage 233.Described top section 231, described vertical portion section 232 and described bottom stage 233 be along one from this first lateral margin 211 of this main body 21 towards the first direction X spaced-apart relation of this second lateral margin 212.Described top section 231 and described bottom stage 233 are end face district 2101 and bottom surface districts 2102 for the contoured surface 210 being arranged at this main body 21 respectively, and each top section 231 is sequentially electrically connected along this first direction X and each bottom stage 233 by the opposite end edge of its two adjacent vertical portion sections 232.
More specifically, in this first embodiment of the utility model, the contoured surface 210 of this main body 21 is jointly defined by this end face district 2101 of this main body 21 as shown in Figure 8, this forward area, right flank district of left surface district of bottom surface district 2102, one 2103, one 2104, one 2105 and a back panel 2106 to form.Again, in this first embodiment of the utility model, the described top section 231 of this first coil 23, described vertical portion section 232 are as shown in Figure 8 with described bottom stage 233, press from both sides a bearing of trend being less than or equal to 90 degree along one with this first direction respectively to extend, and the described vertical portion section 232 of this first coil 23 is arranged at this forward area 2105 and this back panel 2106 respectively; That is, the first coil 23 of this first embodiment of the utility model inductor in high frequency is an externally-wound type coil.In addition, this main body 21 is made up of this nonmagnetic substance, and the main body 21 of this first embodiment is structure as a whole.Preferably, this nonmagnetic substance is a material based on silicon or a metal material.More preferably, quartz (quartz), Silicon Wafer (siliconwafer), carborundum (SiC) or silicon nitride (Si should be can be by the material based on silicon
3n
4).Premenstrual state bright known, this main body 21 person of being integrated, so that the overall construction intensity of the main body 21 of this inductor in high frequency 2 is high, as the lamination type inductance device 1 shown in Fig. 1, there is the problem of undercapacity between described circuit potsherd 11,12,13,14 adjacent interfaces.In addition, this first coil 23 is also structure as a whole, and can not produce Fei Aomushi contact, or increase impedance thus produce extra electrocaloric effect between each circuit pattern 112,122,132,142 as shown in Figure 1 because of Discontinuous Interface.
Integrate the above-mentioned detailed description of this first embodiment of the utility model, simply, the utility model, in one person recited above, is be defined as integrative-structure.In addition, so-called integrative-structure, refer to that this main body 21 obtains via etching one bulk (bulkmatter) is formed thereby, so that this main body 21 structural strength is high, and there is not the problem of splitting in inside.This bulk can be the bulk of a tabular, e.g., and quartz base plate (quartzwafer).
Need supplementary notes herein, the utility model inductor in high frequency 2 mainly carrys out mass production by the processing procedure of MEMS (micro electro mechanical system) (MEMS); Therefore, the apparent size of the main body 21 of inductor in high frequency 2 that the utility model completes through MEMS processing procedure is between 0.2mm × 0.1mm × 0.1mm to 0.6mm × 0.3mm × 0.3mm.Preferably, this apparent size is between 0.2mm × 0.1mm × 0.1mm to 0.4mm × 0.2mm × 0.2mm.About the relevant mass production method of the utility model inductor in high frequency 2, then explanation after holding.
Consult Fig. 9, one second embodiment of the utility model inductor in high frequency 2, is approximately identical to this first embodiment, and its difference is in and also has two rows in, this main body 21 and be divided into the forward area 2105 of the contoured surface 210 of its main body 21 and the groove 213 of back panel 2106.Each row's groove 213 is along this first direction X spaced-apart relation, and extend to this bottom surface district 2102 from this end face district 2101 of the contoured surface 210 of this main body 21, and this two rows groove 213 caves in opposite directions from this forward area 2105 of the contoured surface 210 of this main body 21 with this back panel 2106 respectively.The each vertical portion section 232 of this first coil 23 is placed in each groove 213; That is, the first coil 23 of this second embodiment of the utility model inductor in high frequency is also an externally-wound type coil.
Consult Figure 10, one the 3rd embodiment of the utility model inductor in high frequency 2, is approximately identical to this first embodiment, its difference be in, this main body 21 also has two rows and bores a hole 214.Each row's perforation 214 is along this first direction X spaced-apart relation.Described perforation 214 is this end face district 2101 and this bottom surface district 2102 of the contoured surface 210 running through this main body 21 respectively.The each vertical portion section 232 of this first coil 23 is placed in each perforation 214; That is, the first coil 23 of the 3rd embodiment of the utility model inductor in high frequency is around formula coil in one.
Consult Figure 11 and Figure 12, one the 4th embodiment of the utility model inductor in high frequency 2, is approximately identical to this first embodiment, its difference be in, the 4th embodiment also comprises insulating barrier 24 and one second coil 25.This insulating barrier 24 is covered in the contoured surface 210 of this main body 21 with on this first coil 23.This second coil 25 is arranged on this insulating barrier 24, with this end face district 2101 of the contoured surface 210 around this main body 21, this bottom surface district 2102, this forward area 2105 with outside this back panel 2106, this first coil 23 and this second coil 25 is made jointly to form the structure of core double-layer coil (concentriccoilwinding) altogether.Explain for two-layer coil 23,25 in Figure 12, but not as limit, can according to practical application, alternately plating insulating barrier and coil are to form the structure of common core lattice coil.
In detail, this first coil 23 of each embodiment of the utility model inductor in high frequency 2 and this second coil 25 of the 4th embodiment are owing to being formed by galvanoplastic (electroplating) or electroless plating method (electrolessplating), so the utility model inductor in high frequency 2 also comprise first precursor layer 4 (Figure 19) and be arranged under this first coil 23 be arranged at this second coil 25 under the second precursor layer 7 (Figure 27), detailed manufacture method hold after explanation.
Consult Figure 13 to Figure 22, one first embodiment of the mass production method of the utility model inductor in high frequency 2, be the inductor in high frequency 2 producing the first embodiment as shown in Figure 8 with MEMS processing procedure, it sequentially comprises a step (a), a step (b), a step (c), a step (d), a step (e), a step (f), a step (h) and a step (g).
Consult Figure 13 and Figure 14, this step (a) respectively forms the first photoresist layer 3 that has a predetermined pattern 31 on a upper surface 201 and a lower surface 202 of a substrate 20.Each predetermined pattern 31 has the upper surface 201 of this substrate 20 of a covering and the array of lower surface 202, each array has multiple face shaping 310, and each face shaping 310 sequentially has base portion 311, two bridge part 312 and the body 313 be connected to each other along this first direction X.The body 313 of described face shaping 310 is the second direction Y spaced-apart relation pressing from both sides a predetermined angular along this first direction X or one and this first direction X, and the base portion 311 of described face shaping 310 is connected to each other along this first direction X or this second direction Y.
In this first embodiment of the utility model mass production method, this substrate 20 is made up of this nonmagnetic substance, and this predetermined angular explains for 90 degree, but not as limit; The described face shaping 310 of each first photoresist layer 3 is as shown in figure 13, and along this first direction X spaced-apart relation, and the described face shaping 310 of the predetermined pattern 31 of described first photoresist layer 3 is self aligning; The body 313 of described face shaping 310 is along this second direction Y spaced-apart relation, and the base portion 311 of described face shaping 310 is connected to each other along this second direction Y; One width of the bridge part 312 of each face shaping 310 successively decreases along this first direction X, and the described bridge part 312 of each face shaping 310 is intervally installed along this second direction Y; Be formed at the upper surface 201 of this substrate 20 and be formed with a breach 3121 with each bridge part 312 of each face shaping 310 of the first photoresist layer 3 of lower surface 202 in its body 313 place contiguous, and each breach 3121 caves in along this second direction Y from a periphery of its bridge part 312, disconnect each other with each body 313 to make each bridge part 312.
Consult Figure 15 and Figure 16, this step (b) etches this substrate 20, be removed to make the substrate 20 be exposed to outside the array of the predetermined pattern 31 of described first photoresist layer 3, and thus form multiple pedestal 200, connecting portion 22 that multiple correspondence is connected to each pedestal 200, and multiple main body 21 as shown in Figure 8.Each pedestal 200 has a contoured surface 203,220 respectively with each connecting portion 22.The contoured surface 203 of each pedestal 200 comprises contrary one first lateral margin 204 and one second lateral margin 205 arranged, and the contoured surface 220 of each connecting portion 22 comprises contrary first end 221 and one second end 222 arranged.The first end 221 of each connecting portion 22 and the second end 222 are first lateral margins 211 being connected respectively the second lateral margin 205 in each pedestal 200 and each main body 21, are contoured surfaces 203 that correspondence is connected the contoured surface 210 in each main body 21 and each pedestal 200 to make the contoured surface 220 of each connecting portion 22.In addition, second end 222 of each connecting portion 22 of this step (b) is formed with two grooves 2221, the wherein one (upper grooves 2221 see being shown in Figure 16) of this two groove 2221 of each connecting portion 22 extends towards one bottom surface district from an end face district of its contoured surface 220, and the wherein another one of this two groove 2221 of each connecting portion 22 (lower grooves 2221 see being shown in Figure 16) extends to towards its end face district from the bottom surface district of its contoured surface 220, and this two groove 2221 of each connecting portion 22 caves in along this second direction Y from its contoured surface 220.
It should be noted that, this first embodiment of the utility model mass production method all has this breach 3121 for the bridge part 312 of the face shaping 310 of this two first photoresist layer 3 to explain, but be not limited to this.When the bridge part 312 that this first embodiment of the utility model mass production method is the face shaping 310 of the wherein one of this two first photoresist layer 3 has this breach 3121, the second end 222 of each connecting portion 22 of this step (b) can be made only to be formed with single groove 2221, and the groove 2221 of each connecting portion 22 of this step (b) is from both the end face district of its contoured surface 220 and bottom surface district wherein one, towards both the end face district of its contoured surface 220 and bottom surface district, wherein another one extends.
What be worth supplementary notes herein is; when being selected from this material based on silicon when forming the nonmagnetic substance of this substrate 20; in order to strengthen protected effect when etching further, the utility model mass production method also comprises one in the front step of this step (a) (a ').This step (a ') forms a coat of metal (not shown) to being less than on the upper surface 201 of this substrate 20 or lower surface 202, and the photoresist layer 3 of this step (a) is formed on this coat of metal.In this first embodiment of the utility model mass production method; this step (a ') be form this coat of metal (not shown) respectively on the upper surface 201 and lower surface 202 of this substrate 20, and each photoresist layer 3 of this step (a) is formed in each coat of metal (not shown).
Consult Figure 16 again and coordinate and consult Figure 17, this step (c) removes described first photoresist layer 3.In detail, this first embodiment of the utility model mass production method is after removing described first photoresist layer 3, pedestal 200 array, connecting portion 22 array and main body 21 array that are shaped as shown in figure 17, and described pedestal 200 is connected to each other along this second direction Y, described main body 21 is intervally installed along this second direction Y.
Consult Figure 18, this step (d) is on the contoured surface 210 of each main body 21, form one first precursor layer (precursorlayer) 4 (Figure 18 only shows single main body 21 with single the first precursor layer 4 for example explains).
Consult Figure 19, this step (e) forms one second photoresist layer 5 in described first precursor layer 4, and this second photoresist layer 5 has the line pattern district 51 that multiple correspondence exposes a regional area 41 of each first precursor layer 4.Similarly, Figure 19 also only shows a regional area 41 of single the first precursor layer 4 with a line pattern district 51 of this second photoresist layer 5 for example explains.
Consult Figure 19 again and coordinate and consult Figure 20, this step (f) is coated with a first metal layer 6 in each first precursor layer 4, with formation one the first coil 23 as shown in Figure 8 on this regional area 41 of each first precursor layer 4.Similarly, Figure 19 and Figure 20 also only shows single the first precursor layer 4 with single the first metal layer 6 for example explains.Need to further illustrate, if when this nonmagnetic substance is this metal material herein; Such as, copper (Cu), before the first precursor layer 4 forming step of implementation step (d), still need an electrical insulation layer (insulator) on each main body 21 plating in advance, the first coil 23 formed to prevent this step (f) produces the problem of short circuit because directly contacting this metal material.
Preferably, each first precursor layer 4 of this step (d) is an active material layer (activelayer) containing platinum (Pt), palladium (Pd), gold (Au), the silver catalytic metal source such as (Ag) or copper, or a conductivity crystal seed layer (conductiveseedlayer) containing chromium (Cr), nickel (Ni), titanium (Ti), tungsten (W) or molybdenum (Mo).Need remark additionally, when each first precursor layer 4 of this step (d) is a conductivity crystal seed layer, each the first metal layer 6 of this step (f) is this regional area 41 being formed at each first precursor layer 4 with galvanoplastic; When each first precursor layer 4 of this step (d) is this active material layer, each the first metal layer 6 of this step (f) is formed on this regional area 41 of each first precursor layer 4 with electroless plating method.In this first embodiment of the utility model mass production method, each first precursor layer 4 of this step (d) is this conductivity crystal seed layer, and this step (f) on this regional area 41 of each first precursor layer 4, forms each first coil 23 with galvanoplastic.
Need further illustrate, in order to make the utility model inductor in high frequency 2 by surface mount technology (surface-mounttechnology; SMT) then in a circuit board (not shown), after this step (f), a step (j1), a step (j2) and a step (j3) can sequentially also be comprised.This step (j1) is that formation one precursor layer (not shown) is on each first coil 23 and each main body 21.This step (j2) be formation one photoresist layer (not shown) in the described precursor layer of this step (j1), and the photoresist layer of this step (j2) has multipair termination electrode pattern area (not shown).Each end electrodes pattern area is the left surface district 2103 and the right flank district 2104 that lay respectively at each main body 21, exposes left surface district 2103 and the right flank district 2014 of each main body 21 with local.This step (j3) is plating one metal level in each precursor layer, thus correspondence forms each end electrodes (not shown) in each precursor layer.
Consult Figure 21 and coordinate and consult Figure 19 and Figure 20, this step (h) be remove this second photoresist layer 5 and each first precursor layer 4 the remaining area that covers by each line pattern district 51 of this second photoresist layer 5, thus in each main body 21, leave each first coil 23.It is worth mentioning that, causing short circuit or open circuit to protect this first coil 23 to avoid by external factor interference, after completing steps (h), an insulating protective layer (not shown) can also be formed in each main body 21 with on each first coil 23.
Consult Figure 22, this step (g) from top to bottom or from bottom to top bestows an external force respectively in described connecting portion 22 place, second end 222 of each connecting portion 22 is ruptured from the first lateral margin 211 of each main body 21, thus makes each main body 21 depart from from each connecting portion 22 going out inductor in high frequency 2 as shown in Figure 8 with volume production.In this first embodiment of the utility model mass production method, before this step (g), complete this step (h) for example to explain, but this step (h) also can perform after this step (g), is not limited with the present embodiment.Detailed description through aforementioned mass production method is known, be positioned at the breach 3121 at bridge part 312 place of the face shaping 310 of each first photoresist layer 3, be used to make this substrate 20 after the etching performing step (b), the groove 2221 of each connecting portion 22 as shown in Figure 17 can be formed, and the groove 2221 be shown in Figure 17, its object is then make this mass production method in time performing this step (g), to be conducive to by this external force fracture to reach the effectiveness of mass production.It is worth mentioning that, each groove 2221 also can after this step (b) be shaped each connecting portion 22, more another to cut (scriber) or etching mode is formed on each connecting portion 22.
One second embodiment of the mass production method of the utility model inductor in high frequency 2 carrys out with MEMS processing procedure the inductor in high frequency 2 that volume production goes out the second embodiment as shown in Figure 9, its mass production method is be same as this first embodiment haply, do not exist together is be, as shown in figure 23, each face shaping 310 of each first photoresist layer 3 has the breach 3131 that two rows are divided into a periphery of its body 313, and this two rows breach 3131 of each body 313 caves in opposite directions from the periphery of its body 313.Therefore, this second embodiment of the utility model mass production method is after the etching step having implemented this step (b), each body 313 of each first photoresist layer 3 this two row breach 3131 can make each main body 21 correspondence be shaped as shown in Figure 9 this two row groove 213, so that each first precursor layer 4 that this step (d) is formed also can cover this two rows groove 213, and be in this externally-wound type coil having implemented this step (f) each first coil 23 formed afterwards.
One the 3rd embodiment of the mass production method of the utility model inductor in high frequency 2 carrys out with MEMS processing procedure the inductor in high frequency 2 that volume production goes out the 3rd embodiment as shown in Figure 10, its mass production method is be same as this first embodiment haply, do not exist together is be, as shown in figure 24, each face shaping 310 of each first photoresist layer 3 has the hole 3132 that two rows are divided into its body 313, and this two rounds hole 3132 of each body 313 is along this first direction X spaced-apart relation.Therefore, 3rd embodiment of the present utility model is after the etching step having implemented this step (b), this two rows perforation 214 that this two rounds hole 3132 of each body 313 of described first photoresist layer 3 can make each main body 21 correspondence be shaped as shown in Figure 10, so that each first precursor layer 4 of being formed of this step (d) also overlay defining can go out two row's inner ring surfaces of this two rows perforation 214, and is be that this is interior around formula coil having implemented this step (f) each first coil 23 formed afterwards.
Consult Figure 25 to Figure 28, one the 4th embodiment of the mass production method of the utility model inductor in high frequency 2 carrys out with MEMS processing procedure the inductor in high frequency 2 that volume production goes out the 4th embodiment as shown in Figure 11 and Figure 12, its mass production method is be same as this first embodiment haply, difference is, after this step (h), also sequentially comprise a step (i1), a step (i2), a step (i3), and a step (i4).
Ginseng Figure 25, this step (i1) forms an insulating barrier 24 on the contoured surface 210 and each first coil 23 of each main body 21.Ginseng Figure 26, this step (i2) forms one second precursor layer 7 on each insulating barrier 24.Consult Figure 27, this step (i3) forms one the 3rd photoresist layer 8 in described second precursor layer 7, and the 3rd photoresist layer 8 has the line pattern district 81 that multiple correspondence exposes a regional area 71 of each second precursor layer 7.Consult Figure 27 again and coordinate and consult Figure 28, this step (i4) is coated with one second metal level 9 in each second precursor layer 7, to form one second coil 25 on this regional area 71 of each second precursor layer 7, thus obtain the structure of the double-layer coil as shown in Figure 11 and Figure 12.Finally, remove again the 3rd photoresist layer 8 and each second precursor layer 7 the remaining area that covers by each line pattern district 81 of the 3rd photoresist layer 8, thus on each insulating barrier 24, leave each second coil 25, the inductor in high frequency 2 as shown in Figure 11 and Figure 12 can be obtained.It should be noted that, Figure 25 to Figure 28 all only demonstrates single line pattern district 81 of the contoured surface 210 of single main body 21, single individual second precursor layer 7, this second photoresist layer 8, with single the second metal level 9 for example explains.In the 4th embodiment of the utility model mass production method, this step (i2) and the execution mode of this step (i4) are according to this first embodiment, no longer add to repeat in this.
Each embodiment through the mass production method of above-mentioned the utility model inductor in high frequency 2 describes in detail known, the utility model only to need by this step (a), to six road steps such as this steps (f), can form out externally-wound type or interior the first coil 23 around formula.Without the need to such as the same case 2, still need perforation program through four roads, the electroconductive paste program that fills in four roads, the applying conductive in four roads is stuck with paste to form each circuit pattern 112,122,132,142 program, with together with the 13 road programs such as sintering processes of step (E), just can form this interior coil around formula.With regard to processing procedure aspect, mass production method program simplification of the present utility model; With regard to cost aspect, mass production method of the present utility model can reduce the time cost expended needed on processing procedure because of program simplification.
Moreover the inductor in high frequency 2 of each embodiment of the utility model to be directly shaped through the step (b) of above-mentioned mass production method by this substrate 20 by MEMS processing procedure the body 21 of each inductor in high frequency 2.Specifically, each main body 21 is structure as a whole, so that the overall construction intensity of the main body 21 of each inductor in high frequency 2 is high, as the lamination type inductance device 1 shown in Fig. 1, there is the problem of undercapacity between described circuit potsherd 11,12,13,14 adjacent interfaces.In addition, first coil 23 and second coil 25 of the inductor in high frequency 2 of each embodiment of the utility model are also structure as a whole, Fei Aomushi contact can not be produced because of non-continuous face between each circuit pattern 112,122,132,142 as shown in Figure 1, or increase impedance thus produce extra electrocaloric effect.
In sum, the utility model inductor in high frequency 2 be by MEMS processing procedure directly to this substrate 20 be etched with preshaped go out structural strength high and in each main body 21 of integrative-structure, and on the contoured surface 210 of each main body 21, form each first precursor layer 4, each externally-wound type or interior the first coil 23 around formula is plated out with plating/or chemistry in each first precursor layer 4 further on each contoured surface 210 of spatially state, with regard to the aspect of performance of inductor, structural strength is high and not easily produce problems of excessive heat, with regard to processing procedure and cost aspect, time cost is reduced because production process simplifies, so really can the purpose of this utility model be reached.
The above, be only embodiment of the present utility model, when can not limit the scope of the utility model enforcement with this, namely all simple equivalences done according to the utility model claims and description change and modify, and all still belong to the scope that the utility model is contained.
Claims (5)
1. an inductor in high frequency, is characterized in that: comprise:
One main body, has a contoured surface, and the contoured surface of this main body comprises one first lateral margin and one second lateral margin of contrary setting, and this main body is made up of a nonmagnetic substance, and the person of being integrated; And
One first coil, be arranged at this main body and comprise multiple top section, multiple vertical portions section, and multiple bottom stage, described top section, described vertical portion section and described bottom stage be along one from this first lateral margin of this main body towards the first direction spaced-apart relation of this second lateral margin, described top section and described bottom stage are an end face district and a bottom surface district of the contoured surface being arranged at this main body respectively, and each top section is sequentially electrically connected along this first direction and each bottom stage by the opposite end edge of its two adjacent vertical portion sections.
2. inductor in high frequency as claimed in claim 1, it is characterized in that: this main body also has two rows and is divided into a forward area of the contoured surface of its main body and the groove of a back panel, each row's groove is along this first direction spaced-apart relation, and extend to this bottom surface district from this end face district of the contoured surface of this main body, and this two rows groove caves in opposite directions from this forward area of the contoured surface of this main body and this back panel respectively, each vertical portion section of this first coil is placed in each groove.
3. inductor in high frequency as claimed in claim 1, it is characterized in that: this main body also has two row's perforation, each row's perforation is along this first direction spaced-apart relation, described perforation is this end face district and this bottom surface district of the contoured surface running through this main body respectively, and each vertical portion section of this first coil is placed in each perforation.
4. inductor in high frequency as claimed in claim 1, it is characterized in that: also comprise an insulating barrier and one second coil, on the contoured surface that this insulating barrier is covered in this main body and this first coil, this second coil is then arranged on this insulating barrier with outside this end face district of the contoured surface around this main body, this bottom surface district, a forward area and a back panel.
5. the inductor in high frequency as described in claim as arbitrary in Claims 1-4, is characterized in that: this nonmagnetic substance is a material based on silicon or a metal material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104210225 | 2015-06-25 | ||
| TW104210225U TWM511110U (en) | 2015-06-25 | 2015-06-25 | High frequency inductor |
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| Publication Number | Publication Date |
|---|---|
| CN204946679U true CN204946679U (en) | 2016-01-06 |
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| TW (1) | TWM511110U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328358A (en) * | 2015-06-25 | 2017-01-11 | 威华微机电股份有限公司 | High-frequency inductor and mass production method thereof |
-
2015
- 2015-06-25 TW TW104210225U patent/TWM511110U/en not_active IP Right Cessation
- 2015-08-18 CN CN201520621092.5U patent/CN204946679U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328358A (en) * | 2015-06-25 | 2017-01-11 | 威华微机电股份有限公司 | High-frequency inductor and mass production method thereof |
| CN106328358B (en) * | 2015-06-25 | 2018-05-18 | 威华微机电股份有限公司 | Mass production method of high-frequency inductor |
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| Publication number | Publication date |
|---|---|
| TWM511110U (en) | 2015-10-21 |
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Effective date of registration: 20190604 Address after: Taichung City, Taiwan, China Patentee after: SIWARD CRYSTAL TECHNOLOGY CO.,LTD. Address before: Miao Lixian Patentee before: WAFER MEMS CO.,LTD. |
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