CN204929424U - A suction nozzle structure for chip mounter - Google Patents

A suction nozzle structure for chip mounter Download PDF

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Publication number
CN204929424U
CN204929424U CN201520581933.4U CN201520581933U CN204929424U CN 204929424 U CN204929424 U CN 204929424U CN 201520581933 U CN201520581933 U CN 201520581933U CN 204929424 U CN204929424 U CN 204929424U
Authority
CN
China
Prior art keywords
suction nozzle
sleeve
connecting portion
nozzle body
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520581933.4U
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Chinese (zh)
Inventor
何添才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuangxin Automation Equipment Science And Technology (zhangzhou) Co Ltd
Original Assignee
Chuangxin Automation Equipment Science And Technology (zhangzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuangxin Automation Equipment Science And Technology (zhangzhou) Co Ltd filed Critical Chuangxin Automation Equipment Science And Technology (zhangzhou) Co Ltd
Priority to CN201520581933.4U priority Critical patent/CN204929424U/en
Application granted granted Critical
Publication of CN204929424U publication Critical patent/CN204929424U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a suction nozzle structure for chip mounter, it contains metal sleeve, is provided with the spring in the sleeve, and the suction nozzle body sets up in the sleeve, and this body and function of suction nozzle round pin is fixed on the sleeve, be provided with the guide way on the suction nozzle body, be provided with the air flue in the middle of suction nozzle body and the sleeve respectively, the suction nozzle body includes connecting portion that have hollow air flue, suction nozzle portion is installed to the one end of connecting portion, suction nozzle portion is equipped with the suction head that is used for the adsorption - core piece, the terminal surface shape of suction head is equipped with the platform of inhaling of outside salient for four bights square and the suction head terminal surface, inhale the bench be equipped with respectively with the hole is inhaled in the vacuum of gas circuit pipe connection, still be equipped with the restriction on the connecting portion the spacing platform of suction nozzle mounted position, the guide way sets up on the connecting portion, on the connecting portion and interval is provided with a plurality of annulars and leads the oil groove, the buckle that is used for the outside air supply pipeline of joint is installed on the sleeve top.

Description

For the nozzle structure of chip mounter
Technical field
The utility model relates to chip mounter spare and accessory parts field, is specifically related to the architecture advances of the nozzle portion of chip mounter.
Background technology
In prior art, the suction nozzle of pasting chip generally adopts the single hole suction nozzle of wolfram steel material, and during chip attachment, chip adsorbs and chip moved to corresponding position on pcb board and mounts by suction nozzle.
When carrying out the attachment of the surface mount elements such as MEMS chip, owing to the surface mount elements such as MEMS chip having diaphragm, when adsorbing chip, if the absorption position of sucker and diaphragm are too close or be directly drawn onto diaphragm, diaphragm breakage can be made; When adsorbing chip, the material due to suction nozzle is wolfram steel, and the hardness of wolfram steel is higher, therefore, in the process of absorption chip, often occur that chip bonding pad is by the phenomenon weighed wounded, above several phenomenon, capital makes the surface mount elements damages such as MEMS chip normally use, and causes a large amount of raw-material waste.
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of nozzle structure for chip mounter, and it can not damage surface mount elements when drawing surface mount elements, and can draw reliably.
The utility model solves the technical scheme that its technical problem adopts: for the nozzle structure of chip mounter, it is characterized in that: comprise metal sleeve, be provided with spring in sleeve, suction nozzle body is arranged in sleeve, and suction nozzle body pin is fixed on sleeve;
Described suction nozzle body is provided with gathering sill; Described gathering sill has two;
Air flue is respectively arranged with in the middle of described suction nozzle body and sleeve; The air flue of suction nozzle body and sleeve communicates;
Described suction nozzle body comprises the connecting portion that has the air flue of hollow, one end of described connecting portion is provided with nozzle section, described nozzle section is provided with the suction nozzle for adsorbing chip, the end surface shape of described suction nozzle is square and four bights of suction nozzle end face are provided with suction unit outwardly, described suction unit is respectively equipped with the vacuum sucking holes be connected with described gas path pipe; Described connecting portion is also provided with the limiting stand limiting described suction nozzle installation site;
Described gathering sill is arranged on described connecting portion, and described connecting portion is also arranged at intervals with multiple annular oil guide groove;
Described sleeve top is provided with the buckle for clamping external air source pipeline.
As a kind of preferred implementation of the present utility model, described suction nozzle is copper; The end face of described suction nozzle is set with suction nozzle apron, suction nozzle apron is rubber system.
As a kind of preferred implementation of the present utility model, the external peripheral surface of the connecting portion of described suction nozzle body is provided with electrodeposited coating, and described electrodeposited coating is double-decker, comprises the copper electrodeposited coating of internal layer and outer field black chromium electrodeposited coating.
The beneficial effects of the utility model are:
The shock-absorbing capacity that the utility model provides certain by arranging spring, provides certain air-tightness by oil guide groove, has the advantages such as reliability is high, good buffer effect, compact conformation, air-tightness are good, suction is large, cheap; The utility model, also further by arranging suction nozzle apron, improves air-tightness, increases suction;
The utility model is used for the nozzle structure of chip mounter when drawing the surface mount elements such as MEMS chip, the utility model is provided with vacuum sucking holes due to four bights at suction nozzle, suction nozzle only adsorbs the corner of chip, avoid the position of chip upper diaphragm, avoid and be adsorbed onto diaphragm and cause wafer damage, and bight is provided with the structure of boss, a umbilicate gap is defined between four boss, the position of chip upper diaphragm is in the gap between four boss, diaphragm communicates with atmospheric pressure all the time, avoid in adsorption process, because negative pressure is too large, make diaphragm impaired.
The utility model buffering course can realize reliably leading accurately by gathering sill and pin; Metal sleeve reliably can be connected with external air source tracheae by buckle by we.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of embodiment of the present utility model;
Fig. 2 is the structural representation of the right apparent direction of a kind of embodiment of the present utility model.
Description of reference numerals:
1-suction nozzle body, 2-sleeve, 3-spring, 4-buckle, 5-sells, 6-gathering sill, 7-air flue, 8-oil guide groove;
11-suction nozzle, 22-limiting stand; 111-suction unit, 112-vacuum sucking holes.
Embodiment
Below in conjunction with drawings and Examples, the utility model embodiment is described:
As depicted in figs. 1 and 2, it illustrates a kind of embodiment of the present utility model, as shown in the figure, the utility model is used for the nozzle structure of chip mounter, comprises metal sleeve 2, is provided with spring 3 in sleeve, suction nozzle body is arranged in sleeve, and suction nozzle body 1 pin 5 is fixed on sleeve;
As shown in the figure, described suction nozzle body is provided with gathering sill; Described gathering sill has two;
As shown in the figure, air flue 7 is respectively arranged with in the middle of described suction nozzle body and sleeve; The air flue of suction nozzle body and sleeve communicates;
As shown in the figure, described suction nozzle body comprises the connecting portion that has the air flue of hollow, one end of described connecting portion is provided with nozzle section, described nozzle section is provided with the suction nozzle 11 for adsorbing chip, the end surface shape of described suction nozzle is square and four bights of suction nozzle end face are provided with suction unit 111 outwardly, described suction unit is respectively equipped with the vacuum sucking holes 112 be connected with described gas path pipe; Described connecting portion is also provided with the limiting stand 22 limiting described suction nozzle installation site;
As shown in the figure, described gathering sill is arranged on described connecting portion, described connecting portion is also arranged at intervals with multiple annular oil guide groove 8;
As shown in the figure, described sleeve top is provided with the buckle 4 for clamping external air source pipeline.
Preferably, described suction nozzle is copper; The end face of described suction nozzle is set with suction nozzle apron, suction nozzle apron is rubber system.
Preferably, the external peripheral surface of the connecting portion of described suction nozzle body is provided with electrodeposited coating, and described electrodeposited coating is double-decker, comprises the copper electrodeposited coating of internal layer and outer field black chromium electrodeposited coating.
By reference to the accompanying drawings the utility model preferred implementation is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.
Do not depart from design of the present utility model and scope can make many other and change and remodeling.Should be appreciated that the utility model is not limited to specific execution mode, scope of the present utility model is defined by the following claims.

Claims (3)

1. for the nozzle structure of chip mounter, it is characterized in that: comprise metal sleeve, be provided with spring in sleeve, suction nozzle body is arranged in sleeve, and suction nozzle body pin is fixed on sleeve;
Described suction nozzle body is provided with gathering sill; Described gathering sill has two;
Air flue is respectively arranged with in the middle of described suction nozzle body and sleeve; The air flue of suction nozzle body and sleeve communicates;
Described suction nozzle body comprises the connecting portion that has the air flue of hollow, one end of described connecting portion is provided with nozzle section, described nozzle section is provided with the suction nozzle for adsorbing chip, the end surface shape of described suction nozzle is square and four bights of suction nozzle end face are provided with suction unit outwardly, described suction unit is respectively equipped with the vacuum sucking holes be connected with described gas path pipe; Described connecting portion is also provided with the limiting stand limiting described suction nozzle installation site;
Described gathering sill is arranged on described connecting portion, and described connecting portion is also arranged at intervals with multiple annular oil guide groove;
Described sleeve top is provided with the buckle for clamping external air source pipeline.
2., as claimed in claim 1 for the nozzle structure of chip mounter, it is characterized in that: described suction nozzle is copper; The end face of described suction nozzle is set with suction nozzle apron, suction nozzle apron is rubber system.
3., as claimed in claim 1 for the nozzle structure of chip mounter, it is characterized in that: the external peripheral surface of the connecting portion of described suction nozzle body is provided with electrodeposited coating, described electrodeposited coating is double-decker, comprises the copper electrodeposited coating of internal layer and outer field black chromium electrodeposited coating.
CN201520581933.4U 2015-08-05 2015-08-05 A suction nozzle structure for chip mounter Expired - Fee Related CN204929424U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520581933.4U CN204929424U (en) 2015-08-05 2015-08-05 A suction nozzle structure for chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520581933.4U CN204929424U (en) 2015-08-05 2015-08-05 A suction nozzle structure for chip mounter

Publications (1)

Publication Number Publication Date
CN204929424U true CN204929424U (en) 2015-12-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520581933.4U Expired - Fee Related CN204929424U (en) 2015-08-05 2015-08-05 A suction nozzle structure for chip mounter

Country Status (1)

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CN (1) CN204929424U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106272516A (en) * 2016-10-19 2017-01-04 深圳市艾励美特科技有限公司 Adsorption device
CN107381041A (en) * 2017-08-10 2017-11-24 珠海市运泰利自动化设备有限公司 A kind of precise vacuum suction nozzle body
CN107381040A (en) * 2017-08-10 2017-11-24 珠海市运泰利自动化设备有限公司 A kind of vacuum slot
CN108878195A (en) * 2018-08-01 2018-11-23 江苏传艺科技股份有限公司 Chip mounter suction nozzle
CN109041570A (en) * 2018-09-27 2018-12-18 黄金铭 A kind of chip mounter suction nozzle structure with dust reduction capability
CN109494181A (en) * 2018-11-12 2019-03-19 中国科学院长春光学精密机械与物理研究所 A kind of microchip shifts the manufacturing process of suction nozzle and transfer suction nozzle
CN109922608A (en) * 2019-05-07 2019-06-21 武汉辉天同康科技有限公司 A kind of PCBA automatic chip mounting production system
CN111710635A (en) * 2020-08-19 2020-09-25 深圳新益昌科技股份有限公司 Automatic crystal removing machine and crystal removing method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106272516A (en) * 2016-10-19 2017-01-04 深圳市艾励美特科技有限公司 Adsorption device
CN106272516B (en) * 2016-10-19 2020-01-14 深圳市艾励美特科技有限公司 Adsorption device
CN107381041A (en) * 2017-08-10 2017-11-24 珠海市运泰利自动化设备有限公司 A kind of precise vacuum suction nozzle body
CN107381040A (en) * 2017-08-10 2017-11-24 珠海市运泰利自动化设备有限公司 A kind of vacuum slot
CN108878195A (en) * 2018-08-01 2018-11-23 江苏传艺科技股份有限公司 Chip mounter suction nozzle
CN109041570A (en) * 2018-09-27 2018-12-18 黄金铭 A kind of chip mounter suction nozzle structure with dust reduction capability
CN109041570B (en) * 2018-09-27 2023-08-15 广州光轩电子有限公司 Chip mounter suction nozzle structure with dustproof function
CN109494181A (en) * 2018-11-12 2019-03-19 中国科学院长春光学精密机械与物理研究所 A kind of microchip shifts the manufacturing process of suction nozzle and transfer suction nozzle
CN109922608A (en) * 2019-05-07 2019-06-21 武汉辉天同康科技有限公司 A kind of PCBA automatic chip mounting production system
CN109922608B (en) * 2019-05-07 2020-09-25 武汉辉天同康科技有限公司 Automatic paster production system of PCBA
CN111710635A (en) * 2020-08-19 2020-09-25 深圳新益昌科技股份有限公司 Automatic crystal removing machine and crystal removing method
CN111710635B (en) * 2020-08-19 2020-11-20 深圳新益昌科技股份有限公司 Automatic crystal removing machine and crystal removing method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151230

Termination date: 20170805

CF01 Termination of patent right due to non-payment of annual fee