CN204929376U - There is not flexible LED double sided board that heavy copper was electroplated - Google Patents
There is not flexible LED double sided board that heavy copper was electroplated Download PDFInfo
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- CN204929376U CN204929376U CN201520479527.7U CN201520479527U CN204929376U CN 204929376 U CN204929376 U CN 204929376U CN 201520479527 U CN201520479527 U CN 201520479527U CN 204929376 U CN204929376 U CN 204929376U
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- hole
- colloid
- line layer
- solder mask
- copper
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Abstract
The utility model discloses a there is not flexible LED double sided board that heavy copper was electroplated, including first solder mask, second solder mask, third solder mask, the first line layer, the second line layer, first colloid, second colloid, third colloid, fourth colloid, tin cream, pad. The through -hole has all been seted up to first solder mask, first colloid, the first line layer, second colloid, second solder mask, third colloid, and in the second line layer part was buckled and is imbedded the through -hole, the tin cream was filled in the through -hole, and the first line layer, the second line layer switch on through the tin cream each other. This kind of structure has reduced the energy resource consumption of full processing procedure, has improved production efficiency, need not pass through heavy copper and electroplate, can not electroplate one deck copper again on original substrate copper face like traditional structure, leads to face copper bodiness, splits easily when buckling. This kind of structure can be buckled wantonly, according to customer service conditions around the dog -ear degree, guarantee the voltage stability of product quality and circular telegram to prevent the light decay.
Description
Technical field
The utility model relates to a kind of wiring board, particularly relate to a kind of nothing sink copper plating flexible LED double sided board.
Background technology
Traditional double-sided wiring board, needs through heavy copper electroplating technique, thus the line conduction of positive and negative.This kind of process sinks the double-sided wiring board of copper electroplating technology, needs to consume a large amount of electricity consumptions and with water, but also adds the discharge of waste gas, waste water, can not reach the requirement of environmental protection and energy saving very well.
In addition, this kind of traditional double-sided wiring board, due to the unsteadiness of heavy copper electroplating liquid medicine, thus causes the via on wiring board bad, and then cause via blast hole and bad quality hidden danger of conducting electricity, make the components and parts be electrically connected with wiring board produce light relaxation phenomenon.
Moreover this kind of traditional double-sided wiring board, needs re-plating one deck copper on original base material copper face, thus cause plate face copper to thicken, easily rupture during bending, bending property is poor, and then improves the fraction defective of product.
In addition, introducing a fine variety traditional double-sided wiring board, there is very big-difference in the coefficient of thermal expansion and contraction of its PI and copper, thus causing hole copper is easily by PI spalling, also likely causes the pad of the solder joint position of components and parts easy breach after subsides part, causes product bad phenomenon.
Utility model content
The purpose of this utility model overcomes weak point of the prior art, provides a kind of energy-conserving and environment-protective, prevents light decay, bending property is better, nothing that is improving product yield sinks the flexible LED double sided board that copper is electroplated.
The purpose of this utility model is achieved through the following technical solutions:
Nothing sink copper plating a flexible LED double sided board, comprising: the first solder mask, the second solder mask, the 3rd solder mask, first line layer, the second line layer, the first colloid, the second colloid, the 3rd colloid, the 4th colloid, tin cream, pad;
Described first solder mask, described first colloid, described first line layer, described second colloid, described second solder mask, described 3rd colloid, described second line layer, described 4th colloid, described 3rd solder mask are fitted and connected successively;
Described first solder mask offers the first through hole, described first colloid offers the second through hole, described first line layer offers third through-hole, described second colloid offers fourth hole, described second solder mask offers fifth hole, described 3rd colloid offers the 6th through hole;
Described first through hole, described second through hole, described third through-hole, described fourth hole, described fifth hole, described 6th through hole are mutually through;
Described second line layer part bends and is embedded in described third through-hole, described fourth hole, described fifth hole, described 6th through hole;
Described 4th colloid part bends and is embedded in the bent area of described second line layer, and described 3rd solder mask part bends and is embedded in the bent area of described 4th colloid;
Described tin cream is filled in described first through hole, described second through hole, described third through-hole, described fourth hole, described fifth hole, described 6th through hole;
Described first line layer, described second line layer are by described tin cream mutual conduction, and described pad is by described tin cream and described first line layer, described second line layer conducting.
Preferably, the diameter of described first through hole, described second through hole is identical, the diameter of described third through-hole, described fourth hole, described fifth hole, described 6th through hole is identical, and the diameter of described first through hole, described second through hole is greater than the diameter of described third through-hole, described fourth hole, described fifth hole, described 6th through hole.
Preferably, described first solder mask is PI.
Preferably, described second solder mask is PI.
Preferably, described 3rd solder mask is PI.
The flexible LED double sided board of the heavy copper plating of nothing is by carrying out punching to the first solder mask, the first colloid, first line layer, the second colloid, the second solder mask, the 3rd colloid, second line layer part bends and is embedded in third through-hole, fourth hole, fifth hole, the 6th through hole, and by tin cream by first line layer, the second line layer mutual conduction, thus formed without heavy copper plating.
This kind of structure, reduces the energy resource consumption of full processing procedure, improves production efficiency, does not need to electroplate through heavy copper, can not as traditional structure, and re-plating one deck copper on original base material copper face, causes plate face copper to thicken, easily rupture during bending.This kind of structure can bend arbitrarily, according to client's service condition around knuckle degree, ensures the voltage stability of product quality and energising, prevents light from decaying.
Accompanying drawing explanation
Fig. 1 is the structural representation of the flexible LED double sided board without heavy copper plating of the utility model one embodiment.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited thereto.
As shown in Figure 1, it is the structural representation of the flexible LED double sided board 10 without heavy copper plating of the utility model one embodiment.Flexible LED double sided board 10 without heavy copper plating comprises: the first solder mask 100, second solder mask 200, the 3rd solder mask 300, first line layer 400, second line layer 500, first colloid 600, second colloid 700, the 3rd colloid 800, the 4th colloid 900, tin cream 1000, pad 1100.
First solder mask 100, first colloid 600, first line layer 400, second colloid 700, second solder mask 200, the 3rd colloid 800, second line layer 500, the 4th colloid 900, the 3rd solder mask 300 are fitted and connected successively.
First solder mask 100 offers the first through hole 110, first colloid 600 offers the second through hole 610, first line layer 400 offers third through-hole 410, second colloid 700 offers fourth hole 710, second solder mask 200 offers fifth hole 210, the 3rd colloid 800 offers the 6th through hole 810.
First through hole 110, second through hole 610, third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810 are mutually through.
Second line layer 500 part bends and is embedded in third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810.
4th colloid 900 part bends and is embedded in the bent area of the second line layer 500, and the 3rd solder mask 300 part bends and is embedded in the bent area of the 4th colloid 900.
Tin cream 1000 is filled in the first through hole 110, second through hole 610, third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810.
First line layer 400, second line layer 500 is by tin cream 1000 mutual conduction, and pad 1100 is by tin cream 1000 and the conducting of first line layer 400, second line layer 500.
In the present embodiment, the diameter of the first through hole 110, second through hole 610 is identical, the diameter of third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810 is identical, and the diameter of the first through hole 110, second through hole 610 is greater than the diameter of third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810.This kind of design, better tin cream 1000 can be filled in the first through hole 110, second through hole 610, third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810 on the one hand, the turn-on effect between first line layer 400, second line layer 500 can be improved on the other hand.
In the present embodiment, the first solder mask 100 is PI (polyimides, Polyimide), and the second solder mask 200 is PI, and the 3rd solder mask 300 is PI.
Flexible LED double sided board 10 without heavy copper plating passes through to carry out punching to the first solder mask 100, first colloid 600, first line layer 400, second colloid 700, second solder mask 200, the 3rd colloid 800, second line layer 500 part bends and is embedded in third through-hole 410, fourth hole 710, fifth hole 210, the 6th through hole 810, and by tin cream 1000 by first line layer 400, second line layer 500 mutual conduction, thus formed without heavy copper plating.
This kind of structure, reduces the energy resource consumption of full processing procedure, improves production efficiency, does not need to electroplate through heavy copper, can not as traditional structure, and re-plating one deck copper on original base material copper face, causes plate face copper to thicken, easily rupture during bending.This kind of structure can bend arbitrarily, according to client's service condition around knuckle degree, ensures the voltage stability of product quality and energising, prevents light from decaying.
Above-described embodiment is the utility model preferably execution mode; but execution mode of the present utility model is not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present utility model and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection range of the present utility model.
Claims (5)
1. a nothing sinks the flexible LED double sided board of copper plating, it is characterized in that, comprising: the first solder mask, the second solder mask, the 3rd solder mask, first line layer, the second line layer, the first colloid, the second colloid, the 3rd colloid, the 4th colloid, tin cream, pad;
Described first solder mask, described first colloid, described first line layer, described second colloid, described second solder mask, described 3rd colloid, described second line layer, described 4th colloid, described 3rd solder mask are fitted and connected successively;
Described first solder mask offers the first through hole, described first colloid offers the second through hole, described first line layer offers third through-hole, described second colloid offers fourth hole, described second solder mask offers fifth hole, described 3rd colloid offers the 6th through hole;
Described first through hole, described second through hole, described third through-hole, described fourth hole, described fifth hole, described 6th through hole are mutually through;
Described second line layer part bends and is embedded in described third through-hole, described fourth hole, described fifth hole, described 6th through hole;
Described 4th colloid part bends and is embedded in the bent area of described second line layer, and described 3rd solder mask part bends and is embedded in the bent area of described 4th colloid;
Described tin cream is filled in described first through hole, described second through hole, described third through-hole, described fourth hole, described fifth hole, described 6th through hole;
Described first line layer, described second line layer are by described tin cream mutual conduction, and described pad is by described tin cream and described first line layer, described second line layer conducting.
2. nothing according to claim 1 sink copper plating flexible LED double sided board, it is characterized in that, the diameter of described first through hole, described second through hole is identical, the diameter of described third through-hole, described fourth hole, described fifth hole, described 6th through hole is identical, and the diameter of described first through hole, described second through hole is greater than the diameter of described third through-hole, described fourth hole, described fifth hole, described 6th through hole.
3. nothing according to claim 1 sink copper plating flexible LED double sided board, it is characterized in that, described first solder mask is PI.
4. nothing according to claim 1 sink copper plating flexible LED double sided board, it is characterized in that, described second solder mask is PI.
5. nothing according to claim 1 sink copper plating flexible LED double sided board, it is characterized in that, described 3rd solder mask is PI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520479527.7U CN204929376U (en) | 2015-07-02 | 2015-07-02 | There is not flexible LED double sided board that heavy copper was electroplated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520479527.7U CN204929376U (en) | 2015-07-02 | 2015-07-02 | There is not flexible LED double sided board that heavy copper was electroplated |
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| Publication Number | Publication Date |
|---|---|
| CN204929376U true CN204929376U (en) | 2015-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520479527.7U Active CN204929376U (en) | 2015-07-02 | 2015-07-02 | There is not flexible LED double sided board that heavy copper was electroplated |
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| Country | Link |
|---|---|
| CN (1) | CN204929376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
-
2015
- 2015-07-02 CN CN201520479527.7U patent/CN204929376U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990322A (en) * | 2018-08-16 | 2018-12-11 | 鹤山市得润电子科技有限公司 | A kind of double-sided PCB and its manufacturing method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |