CN204928997U - Sunken mechanism and camera module of camera module - Google Patents
Sunken mechanism and camera module of camera module Download PDFInfo
- Publication number
- CN204928997U CN204928997U CN201520656249.8U CN201520656249U CN204928997U CN 204928997 U CN204928997 U CN 204928997U CN 201520656249 U CN201520656249 U CN 201520656249U CN 204928997 U CN204928997 U CN 204928997U
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- camera module
- wiring board
- driving chip
- imageing sensor
- pcb layer
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Abstract
The utility model relates to a camera equipment technical field provides a sunken mechanism and camera module of camera module, the camera module includes circuit board and driver chip, the circuit board is equipped with image sensor near one side subsides of camera lens, image sensor is close to one side of camera lens be equipped with with image sensor becomes the light filter of certain distance, the periphery of light filter is equipped with to be fixed base support on the circuit board, the circuit board is located image sensor with region between the base support is equipped with handles the counter bore that forms by windowing, set up in the counter bore driver chip's subsides dress PAD from having reduced the distance between driver chip and the light filter, avoids again bumping with the light filter simultaneously, greatly reduced the height of whole camera module.
Description
Technical field
The utility model belongs to picture pick-up device technical field, particularly relates to a kind of depression mechanism and camera module of camera module.
Background technology
The thickness of the handheld terminal based on mobile phone is more and more thinner, develops into present tens even several millimeters by original tens millimeters.For the thickness that matching with mobile phone is more and more thinner, the camera module height of interior of mobile phone is more and more lower, but for the camera module of auto-focusing (AF), because the parts of its inside all have certain altitude, for reducing the whole height of module, generally start with from the structure in camera module.
The imageing sensor being mounted on the PCB the superiors and the driving chip for CD-ROM drive motor is provided with in camera module, wherein, the height of the aspect ratio imageing sensor of driving chip wants high, the upper surface of driving chip can not encounter the lower surface of filter, avoid colliding, therefore, the setting of driving chip constrains the reduction degree of the height of whole camera module.
Utility model content
The purpose of this utility model is the depression mechanism providing a kind of camera module, the height being intended to the aspect ratio imageing sensor solving driving chip in prior art wants high, the upper surface of driving chip can not encounter the lower surface of filter, avoid colliding, therefore, the setting of driving chip constrains the problem of the reduction degree of the height of whole camera module.
The utility model realizes like this, a kind of camera module depression mechanism, described camera module depression mechanism comprises wiring board and driving chip, described wiring board is pasted with imageing sensor near the side of camera lens, described imageing sensor is provided with the filter becoming certain distance with described imageing sensor near the side of described camera lens, the periphery of described filter is provided with the base support be fixed on described wiring board, the region of described wiring board between described imageing sensor and described base support is provided with the counterbore formed by process of windowing, the attachment PAD of described driving chip is set in described counterbore.
As a kind of improved plan, described wiring board is provided with first line flaggy, the second pcb layer and tertiary circuit flaggy successively, and described first line flaggy is near described imageing sensor.
As a kind of improved plan, the degree of depth of described counterbore extends to described second pcb layer, and the attachment PAD of described driving chip is arranged on the surface of described second pcb layer.
As a kind of improved plan, the degree of depth of described counterbore extends to described tertiary circuit flaggy, and the attachment PAD of described driving chip is arranged on the surface of described tertiary circuit flaggy.
As a kind of improved plan, described wiring board is also provided with the 4th pcb layer, and described 4th pcb layer is arranged on the side of described tertiary circuit flaggy away from described imageing sensor.
As a kind of improved plan, the degree of depth of described counterbore extends to described 4th pcb layer, and the attachment PAD of described driving chip is arranged on the surface of described 4th pcb layer.
As a kind of improved plan, the depression mechanism of described camera module also comprises the memory be arranged in described counterbore.
Another object of the present utility model is to provide a kind of camera module comprising the depression mechanism of camera module.
Because camera module comprises wiring board and driving chip, described wiring board is pasted with imageing sensor near the side of camera lens, described imageing sensor is provided with the filter becoming certain distance with described imageing sensor near the side of described camera lens, the periphery of described filter is provided with the base support be fixed on described wiring board, the region of described wiring board between described imageing sensor and described base support is provided with the counterbore formed by process of windowing, the attachment PAD of described driving chip is set in described counterbore, from the distance reduced between driving chip and filter, avoid again colliding with filter simultaneously, greatly reduce the height of whole camera module.
Accompanying drawing explanation
Fig. 1 is the structural representation of the depression mechanism of the camera module that the utility model provides;
Fig. 2 to Fig. 4 is the scheme of installation of the driving chip that the utility model provides;
Wherein, 1-wiring board, 2-driving chip, 3-camera lens, 4-imageing sensor, 5-filter, 6-base support, 7-counterbore, 8-first line flaggy, 9-second pcb layer, 10-tertiary circuit flaggy, 11-the 4th pcb layer.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structural representation of the depression mechanism of the camera module that the utility model provides, and for convenience of explanation, only gives the part relevant to the utility model in figure.
The depression mechanism of camera module comprises wiring board 1 and driving chip 2, wiring board 1 is pasted with imageing sensor 4 near the side of camera lens 3, imageing sensor 4 is provided with the filter 5 with imageing sensor 4 one-tenth certain distance near the side of camera lens 3, the periphery of filter 5 is provided with the base support 6 be fixed on wiring board 1, the region of wiring board 1 between imageing sensor 4 and base support 6 is provided with the counterbore 7 formed by process of windowing, and arranges the attachment PAD of driving chip 2 in counterbore 7.
Wherein, as can be seen from Figure 1, as long as be set in internal layer by the set-up mode of driving chip 2 on wiring board 1 by surface, the connection of remaining holding wire etc. are constant, the distance between driving chip 2 and filter 5 can be diminished.
In the utility model, as shown in Figure 2, wiring board 1 is provided with first line flaggy 8, second pcb layer 9 and tertiary circuit flaggy 10 successively, and first line flaggy 8 is near imageing sensor 4, and namely this wiring board is three-decker, under this structure:
The degree of depth of above-mentioned counterbore 7 extends to the second pcb layer 9, and the attachment PAD of driving chip 2 is arranged on the surface of the second pcb layer 9.
Certainly, as shown in Figure 3, also the degree of depth of counterbore 7 can be extended to tertiary circuit flaggy 10, the attachment PAD of driving chip 2 is arranged on the surface of tertiary circuit flaggy 10.
In the utility model, above-mentioned wiring board 1 is also provided with the 4th pcb layer 11, and as shown in Figure 4, the 4th pcb layer 11 is arranged on the side of tertiary circuit flaggy 10 away from imageing sensor 4, wherein:
The degree of depth of counterbore 7 extends to the 4th pcb layer 11, and the attachment PAD of driving chip 2 is arranged on the surface of the 4th pcb layer 11.
Wherein, above-mentioned Fig. 2 to Fig. 4 only provides wherein a kind of implementation, does not repeat them here.
In the utility model, be originally arranged on the memory (unmarked in figure) on wiring board 1, also the same with above-mentioned driving chip 2, arrange in this counterbore 7, solve the contact of memory and filter, reduce the height of whole camera module;
Wherein, this memory is EPROM, and arranging of this memory can be arranged side by side with driving chip 2, can certainly adopt other modes, not repeat them here.
In the utility model, the depression mechanism of above-mentioned camera module is a part of structure of camera module, and this camera module can also comprise camera lens 3, support and miscellaneous part, does not repeat them here.
In the utility model, camera module comprises wiring board 1 and driving chip 2, wiring board 1 is pasted with imageing sensor 4 near the side of camera lens 3, imageing sensor 4 is provided with the filter 5 with imageing sensor 4 one-tenth certain distance near the side of camera lens 3, the periphery of filter 5 is provided with the base support 6 be fixed on wiring board 1, filter 5 is fixed on the side of base support 6 near wiring board 1, the region of wiring board 1 between imageing sensor 4 and base support 6 is provided with the counterbore 7 formed by process of windowing, the attachment PAD of driving chip 2 is set in counterbore 7, from the distance reduced between driving chip 2 and filter 5, avoid again colliding with filter 5 simultaneously, greatly reduce the height of whole camera module.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (8)
1. the depression mechanism of a camera module, it is characterized in that, the depression mechanism of described camera module comprises wiring board and driving chip, described wiring board is pasted with imageing sensor near the side of camera lens, described imageing sensor is provided with the filter becoming certain distance with described imageing sensor near the side of described camera lens, the periphery of described filter is provided with the base support be fixed on described wiring board, the region of described wiring board between described imageing sensor and described base support is provided with the counterbore formed by process of windowing, the attachment PAD of described driving chip is set in described counterbore.
2. the depression mechanism of camera module according to claim 1, is characterized in that, described wiring board is provided with first line flaggy, the second pcb layer and tertiary circuit flaggy successively, and described first line flaggy is near described imageing sensor.
3. the depression mechanism of camera module according to claim 2, is characterized in that, the degree of depth of described counterbore extends to described second pcb layer, and the attachment PAD of described driving chip is arranged on the surface of described second pcb layer.
4. the depression mechanism of camera module according to claim 2, is characterized in that, the degree of depth of described counterbore extends to described tertiary circuit flaggy, and the attachment PAD of described driving chip is arranged on the surface of described tertiary circuit flaggy.
5. the depression mechanism of camera module according to claim 2, is characterized in that, described wiring board is also provided with the 4th pcb layer, and described 4th pcb layer is arranged on the side of described tertiary circuit flaggy away from described imageing sensor.
6. the depression mechanism of camera module according to claim 5, is characterized in that, the degree of depth of described counterbore extends to described 4th pcb layer, and the attachment PAD of described driving chip is arranged on the surface of described 4th pcb layer.
7. the depression mechanism of camera module according to claim 1, is characterized in that, the depression mechanism of described camera module also comprises the memory be arranged in described counterbore.
8. one kind comprises the camera module of the depression mechanism of camera module according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520656249.8U CN204928997U (en) | 2015-08-27 | 2015-08-27 | Sunken mechanism and camera module of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520656249.8U CN204928997U (en) | 2015-08-27 | 2015-08-27 | Sunken mechanism and camera module of camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204928997U true CN204928997U (en) | 2015-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520656249.8U Active CN204928997U (en) | 2015-08-27 | 2015-08-27 | Sunken mechanism and camera module of camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204928997U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019179353A1 (en) * | 2018-03-20 | 2019-09-26 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN112217982A (en) * | 2020-12-08 | 2021-01-12 | 武汉仟目激光有限公司 | Compact TOF camera module for 3D sensing |
| CN114125185A (en) * | 2020-08-25 | 2022-03-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
-
2015
- 2015-08-27 CN CN201520656249.8U patent/CN204928997U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019179353A1 (en) * | 2018-03-20 | 2019-09-26 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| US11272088B2 (en) | 2018-03-20 | 2022-03-08 | Vivo Mobile Communication Co., Ltd. | Camera module and mobile terminal |
| CN114125185A (en) * | 2020-08-25 | 2022-03-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112217982A (en) * | 2020-12-08 | 2021-01-12 | 武汉仟目激光有限公司 | Compact TOF camera module for 3D sensing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201020 Address after: 261031 north of Yuqing street, east of Dongming Road, high tech Zone, Weifang City, Shandong Province (Room 502, Geer electronic office building) Patentee after: GoerTek Optical Technology Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |