CN204922605U - High -power LED lamp - Google Patents

High -power LED lamp Download PDF

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Publication number
CN204922605U
CN204922605U CN201520705315.6U CN201520705315U CN204922605U CN 204922605 U CN204922605 U CN 204922605U CN 201520705315 U CN201520705315 U CN 201520705315U CN 204922605 U CN204922605 U CN 204922605U
Authority
CN
China
Prior art keywords
led
heat
circuit board
printed circuit
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520705315.6U
Other languages
Chinese (zh)
Inventor
冯鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHAANXI GOLDEN NEST SOLAR ENERGY CO Ltd
Original Assignee
SHAANXI GOLDEN NEST SOLAR ENERGY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHAANXI GOLDEN NEST SOLAR ENERGY CO Ltd filed Critical SHAANXI GOLDEN NEST SOLAR ENERGY CO Ltd
Priority to CN201520705315.6U priority Critical patent/CN204922605U/en
Application granted granted Critical
Publication of CN204922605U publication Critical patent/CN204922605U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model aims at providing a high -power LED lamp, including a radiating basal plate, the radiator unit that sets up in radiating basal plate dorsal part one end, radiator unit and radiating basal plate cast structure as an organic whole, it has LED printed circuit board openly to bond at radiating basal plate, the last several LED lamp fixing seat that is fixed with of LED printed circuit board disposes corresponding LED lamp on the LED lamp fixing seat, connecting plug -in components, for radiating basal plate some, distributing in radiating basal plate's the left and right sides, the welding has bonding conductor on connecting plug -in components, and the dorsal part one end and the LED printed circuit board of conductor are connected, and the front of conductor is provided with electrically conductive.

Description

A kind of high-powered LED lamp
Technical field
The utility model relates to LED technical field, particularly a kind of high-powered LED lamp.
Background technology
The prior art relevant with the application, multiple LED chip is normally passed through heat sink welding aluminium base by its fitting structure, and aluminium base and lamp radiator housing are integrally connected reach heat radiation object, two electrodes of LED chip realize being interconnected by multiple pellet electrode that welding substrate is arranged.This light fixture is owing to being subject to the restriction of radiating condition, volume is general larger, the integrated super-high-power LED of multi-chip of current employing due to its caloric value many, heat sink, substrate and this traditional packaged type thermal resistance of housing radiator large, radiator traditional after making light fixture can not meet the needs of heat radiation at all, cause great power LED unstable properties, and then can not extensive use.
Utility model content
The purpose of this utility model is to provide a kind of high-powered LED lamp, comprises
One heat-radiating substrate,
Be arranged on the radiating subassembly of heat-radiating substrate dorsal part one end, described radiating subassembly and heat-radiating substrate are integrated cast structure, are bonded with LED printed circuit board (PCB) in heat-radiating substrate front; LED printed circuit board (PCB) is fixed with several LED mount pad, LED mount pad is configured with corresponding LED;
Connect plug-in unit, be a part for heat-radiating substrate, be distributed in the left and right sides of heat-radiating substrate, connection plug-in unit is welded with bonding conductor, and dorsal part one end of conductor is connected with LED printed circuit board (PCB), and the front of conductor is provided with conductive bit.
Preferably, described radiating subassembly is made up of some U-shaped fin, is provided with gap between each fin.
Preferably, described LED mount pad runs through LED printed circuit board (PCB) by screw and heat-radiating substrate is fixed, and is provided with the binding post connecting LED printed circuit board (PCB) bottom LED mount pad.
Preferably, described radiating subassembly and heat-radiating substrate are that aluminum material is cast and formed.
The technical program beneficial effect be:
1, radiating subassembly and heat-radiating substrate adopt aluminum material, and multiple thermal resistance has been isolated in the connection of aluminium base and aluminium radiator fin, thus, effectively improve heat-sinking capability, reach good radiating effect; Heat-conducting effect is very good, effectively solves the integrated and heat dissipation problem of high-powered LED lamp.
2, aluminium radiator fin is arranged to U-shaped structure, is provided with certain gap between each fin, is conducive to better heat radiation.
3, do not adopt electrode approach, the mode of being conducted electricity by sensing, contribute to reducing the heating being energized and bringing.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is elaborated.
With reference to Fig. 1, the title of all parts and being labeled as: heat-radiating substrate 1, LED mount pad 2, fin 3, LED 4, conductive bit 5 and connect plug-in unit 6.
The technical scheme adopted is that a kind of high-powered LED lamp, comprises
One heat-radiating substrate 1,
Be arranged on the radiating subassembly of heat-radiating substrate 1 dorsal part one end, described radiating subassembly and heat-radiating substrate 1 are integrated cast structure, are bonded with LED printed circuit board (PCB) in heat-radiating substrate front; LED printed circuit board (PCB) is fixed with several LED mount pad 2, LED mount pad 2 is configured with corresponding LED 4;
Connect plug-in unit 6, be a part for heat-radiating substrate 1, be distributed in the left and right sides of heat-radiating substrate 1, connection plug-in unit 1 is welded with bonding conductor, and dorsal part one end of conductor is connected with LED printed circuit board (PCB), and the front of conductor is provided with conductive bit 5.
With reference to Fig. 1, described radiating subassembly is made up of some U-shaped fin 3, is provided with the gap of 5 ~ 10mm, is beneficial to heat radiation between each fin 3, exemplaryly in Fig. 1 depict 4 LED mount pads 2, also comprise more or less lamp mount pad 2, its quantity is determined by the manufacture demand of reality, and unification is formed by casting mould integrally casting, manufacture simple, wherein, in order to better form heat radiation, fin 3 quantity under preferred lamp mount pad 2 is not less than 12.

Claims (3)

1. a high-powered LED lamp, is characterized in that: comprise
One heat-radiating substrate,
Be arranged on the radiating subassembly of heat-radiating substrate dorsal part one end, described radiating subassembly and heat-radiating substrate are integrated cast structure, are bonded with LED printed circuit board (PCB) in heat-radiating substrate front; LED printed circuit board (PCB) is fixed with several LED mount pad, LED mount pad is configured with corresponding LED;
Connect plug-in unit, be a part for heat-radiating substrate, be distributed in the left and right sides of heat-radiating substrate, connection plug-in unit is welded with bonding conductor, and dorsal part one end of conductor is connected with LED printed circuit board (PCB), and the front of conductor is provided with conductive bit.
2. a kind of high-powered LED lamp according to claim 1, is characterized in that: described radiating subassembly is made up of some U-shaped fin, is provided with gap between each fin.
3. a kind of high-powered LED lamp according to claim 1, is characterized in that: described LED mount pad runs through LED printed circuit board (PCB) by screw and heat-radiating substrate is fixed, and is provided with the binding post connecting LED printed circuit board (PCB) bottom LED mount pad.
CN201520705315.6U 2015-09-14 2015-09-14 High -power LED lamp Expired - Fee Related CN204922605U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520705315.6U CN204922605U (en) 2015-09-14 2015-09-14 High -power LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520705315.6U CN204922605U (en) 2015-09-14 2015-09-14 High -power LED lamp

Publications (1)

Publication Number Publication Date
CN204922605U true CN204922605U (en) 2015-12-30

Family

ID=54971730

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520705315.6U Expired - Fee Related CN204922605U (en) 2015-09-14 2015-09-14 High -power LED lamp

Country Status (1)

Country Link
CN (1) CN204922605U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151230

Termination date: 20170914