CN204887694U - Preimpregnation sandwich body reaches printed circuit board by its preparation for printed circuit board - Google Patents
Preimpregnation sandwich body reaches printed circuit board by its preparation for printed circuit board Download PDFInfo
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- CN204887694U CN204887694U CN201520391192.3U CN201520391192U CN204887694U CN 204887694 U CN204887694 U CN 204887694U CN 201520391192 U CN201520391192 U CN 201520391192U CN 204887694 U CN204887694 U CN 204887694U
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Abstract
The utility model relates to a preimpregnation sandwich body for the printed circuit board, its structure from the top down be perhaps a plurality of (resin layer + reinforced materials layer with the reinforced materials DK the same or close resin layer the same or close with reinforced materials DK) core of core + 1 in proper order, the core is band wire way figure was made to circuit substrate (copper -clad plate) after the etching a panel.
Description
Technical field
The utility model relates to technical field of electronic materials, relate to a kind of use in printed circuit board preimpregnation sandwich structure body, be specifically related to a kind of microscopic uniformity and isotropic use in printed circuit board preimpregnation sandwich structure body, relate more specifically to the use in printed circuit board preimpregnation sandwich structure body that a kind of dielectric constant difference on warp-wise and broadwise is little.
Background technology
In recent years, along with electronic product is to multi-functional, miniaturized future development, the circuit board used towards multiple stratification, wiring densification and the future development of Signal transmissions high speed, to circuit substrate---metal-clad laminate, the combination property as copper-clad plate is had higher requirement.Specifically, the dielectric constant (Dk) of medium and dielectric loss (Df) are the important indicators affecting signaling rate and signal quality.For transmission speed, the dielectric constant values of dielectric material is lower, and the transmission speed of signal is faster; For signal integrity, due to the dielectric loss characteristics of material, signal is made to produce loss in transmitting procedure, and sharply increase along with transmission frequency and length of transmission line increase, for base material, signal integrity is main relevant with the surface roughness of Copper Foil conductor with the dielectric loss of dielectric material, the dielectric loss of dielectric material is lower, the loss of signal is less, particularly in high-frequency, particularly outstanding in long link transmission situation.
Meanwhile, along with the development of information communication device high performance, multifunction and networking, at cloud computing, large data age, message transmission rate will become more and more higher, more and more sooner.Message transmission rate rises to 10Gbps by traditional 5Gbps, what is more 25Gbps, and when message transmission rate is more and more higher, the transmission wavelength of digital signal is shorter and shorter.When transmission rate is lower, because the transmission wavelength of digital signal is longer, the integrality impact of signal time delay on signal is less; But when transmission rate is higher than 10Gbps, signal time delay becomes the problem that in high-speed transmission link, must be considered.
As one of the carrier of communication device transfers signal---copper clad laminate plays a key effect at Signal transmissions, the laminate sheet material as transmission medium determines the quality of Signal transmissions.At present, copper clad laminate material generally uses electronic-grade glass fiber cloth as reinforcing material, soaks with thermosetting resin, obtains through oven dry, lamination, hot pressing.Reinforcing material (as glass fabric) is done because using braided material, textile sheet exists because of the reason of braiding and the cross node of braided fiber cross section, makes dielectric in circuit substrate (as glass ingredient) be not uniform distribution.
Solve this problem, fundamentally need obtained homogeneous in the in-plane direction dielectric material, main technological means comprises the fibrillation degree that (1) strengthens glass fabric; (2) form membrane reinforcing material is adopted to replace fiber woven material; (3) reinforcing material that dielectric constant is lower is adopted, as glass fiber with low dielectric constant cloth.Although glass fabric is become further evenly by the mode of fibrillation, but due to basketry and the structure thereof of glass fabric, can only accomplish evenly at weft direction at present, non-fibrillation fiber cloth that only can be relatively traditional in warp direction is looser, cannot accomplish complete fibrillation, homogenizing, this glass fabric also just caused cannot reach uniformity completely in the in-plane direction; By adopting form difficulty when manufacturability is implemented of film very large: operability is poor, and the associativity of resin is poor, easy layering; By adopting glass fiber with low dielectric constant cloth, the dielectric constant of reinforcing material can be reduced to a certain extent, but or strengthen with the low-k resin combination difference used at present, the homogeneity of dielectric constant at in-plane cannot be met.
Up to now, in order to adapt to the technical requirement of high-speed communication to copper clad laminate material, those skilled in the art are devoted to by various technological means, reduce its dielectric constant and dielectric loss, generally realized by two aspects: traditional epoxy resin is replaced with modified epoxy, cyanate ester resin, bimaleimide resin, polyphenylene oxide resin, hydrocarbon resin, and thermoplastic polytetrafluoroethylene, liquid crystalline resin etc., these resin materials itself have very low dielectric constant and dielectric loss characteristics, more excellent high-speed transfer characteristic can be provided.In addition, also dielectric constant and the dielectric loss of copper clad laminate material can be reduced by changing reinforcing material, because existing general reinforcing material is electronic-grade glass fiber cloth (E type glass-fiber-fabric), dielectric constant own is 6.2 ~ 6.6, the dielectric constant of the resin portion used of comparing is high a lot, the Dk that such manufacture obtains copper clad laminate material is generally between 3.5 ~ 4.5, in order to the dielectric constant of further lower layer laminate material, industry technology personnel it is also proposed and adopt glass fiber with low dielectric constant cloth to substitute conditional electronic grade fiberglass cloth, because glass fiber with low dielectric constant cloth Dk is 4.4 ~ 4.6, significantly can reduce the dielectric constant of whole laminate sheet material, effectively can improve the transmission rate of signal, in addition, because its dielectric loss (Df) value is also lower than electronic-grade glass fiber cloth, also the loss improving signals transmission is conducive to, improve significantly because signal transmission rate and frequency rise the problems of Signal Integrity brought.
According to front described known, copper clad laminate material comprises two neccessary compositions: resin combination and reinforcing material.Be not difficult to find out from microstructure, the copper clad laminate material be made up of resin combination and reinforcing material is due to the inhomogeneities of braiding structure in microstructure of reinforcing material, result at the local Dk of warp and weft interweaving very high, there is the local Dk of warp thread or weft yarn higher, and do not have the local Dk of yarn low, this uneven microscopic differences that result in the dielectric constant of dielectric layer.
The transmission time of signal is determined by transmission speed and transmission range, when transmission range is identical, the dielectric constant of transmission speed and transmission medium is inversely proportional to, due to the microscopic differences of the dielectric constant of the medium of surrounding corresponding to transmission line, directly results in the Time Inconsistency of signal from issuing side to receiving terminal, cause not mating of signal, instant prolongation of effect should.Signal time delay is divided into warp-wise signal time delay and broadwise signal time delay, signal time delay when warp-wise signal time delay refers to that transmission line connects up in circuit substrate warp direction, signal time delay when broadwise signal time delay refers to that transmission line connects up on circuit substrate weft direction.
In sum, along with improving constantly of message transmission rate, delay problem become one for Signal transmissions in high-speed link must faced by problem, the generation of time delay can be reduced at present to a certain extent by some design meanses, but rolling up of cost can be brought, so, how from dielectric material, improve dielectric material---the microscopic uniformity of laminated sheet, fundamentally solve signal time delay problem, become an important technological problems of high-speed material technical research.
But as was noted, due to the architectural characteristic of current reinforcing material, result in the inhomogeneities of the in-plane of laminate sheet material, cause the dielectric constant of laminate sheet material in microstructure and dielectric loss to be anisotropic, and on same plane direction, different local microcosmic also has huge difference.In High-speed Digital Circuit Design process, engineer takes various measure and solves problems of Signal Integrity, and the method utilizing differential lines transmitting high speed digital signal is exactly one of them.The advantages such as differential lines is in the pcb coupling strip line or coupled microstrip line, and be strange mould transmission means when signal transmits above, therefore differential signal has strong interference immunity, easy coupling.Along with the raising that people require the rate of information throughput of digital circuit, the differential transfer mode of signal will obtain applying more and more widely, differential lines main advantage has: antijamming capability is strong, can effectively suppress electromagnetic interference, sequential registration etc., so use differential lines transmit high-speed signals, on the one hand to of great advantage in the signal integrity of PCB system and low-power consumption etc., also requirements at the higher level are proposed to PCB design level on the other hand.
Chinese patent CN102548200A discloses a kind of circuit substrate, comprise the glass-film forming rough layer through surface roughening process, the metal forming laying respectively at the resin bonding layer on the rough layer of described glass-film both sides and be positioned at outside resin bonding layer, described glass-film, resin bonding layer and metal forming are combined by compacting.Glass-film is easily broken when compacting; And the surface roughening treatment process trouble of glass-film, and be difficult to control, the isotropic feature of glass-film can be destroyed to a certain extent after roughening process simultaneously; In addition, technique and the conventional copper-clad plate production technology of the production of use glass-film are different, need to carry out scrap build and adjustment.
European patent EP 1140373A is first with the solution impregnation glass-fiber-fabric containing curable resin with relatively low solid content, again by the solution impregnation containing curable resin with relatively high solid content after drying, finally be cured again, by reducing the solids content of resin solution, increase solvent, reduce viscosity, object improves the permeability of resin, reduce void count in prepreg and cured article, and how to reduce Dk and solve signal time delay problem not mentioned.
Chinese patent CN101494949A carries out fibrillation or flaky process to glass cloth before being disclosed in the upper glue process of glass cloth, then to be immersed in epoxy resin adhesive liquid and obtained insulation material layer after drying, reduce the loss of signal of copper clad foil substrate, improve signal velocity and reduce production cost.
The quartz glass cloth (preferred fibrillation) that the closeness of Chinese patent CN101570640B disclosure quartz glass fibre is sparse is base material, impregnation dielectric loss be less than 0.003 compositions of thermosetting resin prepare prepreg, be applied to high frequency material to while ensureing dielectric constant, improve processing characteristics.
Chinese patent CN201410016714 discloses a kind of method of the bonding sheet for the preparation of forming circuit substrate, comprise the following steps: (1) prepares preliminary treatment glue, its dielectric constant (Dk) is identical with the Dk of reinforcing material used or close; (2) described reinforcing material is carried out pre-impregnation in described preliminary treatment glue, then dry out solvent, obtain pretreated reinforcing material; (3) described preliminary treatment reinforcing material is carried out main impregnation, then dry out solvent, obtained bonding sheet.The program effectively can solve the signal time delay problem in circuit substrate in-plane and warp-wise and broadwise, but needs to carry out twice impregnation, and technique is more complicated, and the substance level of control of bonding sheet is general, and the thickness evenness of institute's throttle circuit substrate is general.
Signal time delay problem in current urgent need in-plane and warp-wise and broadwise is solved, and the printed circuit board that technique is simple, sheet metal thickness uniformity is good.
Utility model content
The utility model provides a kind of use in printed circuit board preimpregnation sandwich structure body, and the printed circuit board using this structure to produce.The printed circuit board using this preimpregnation sandwich structure system to become has excellent dielectric property, its warp-wise and broadwise dielectric constant very little in difference, achieve dielectric constant microcosmic consistency, and technique is simple, sheet metal thickness uniformity is effectively improved.
One of the utility model object is to provide a kind of use in printed circuit board preimpregnation sandwich structure body, its structure is followed successively by central layer+1 from top to bottom or multiple (resin bed+layers of reinforcement identical or close with reinforcing material DK+resin bed) identical or close with reinforcing material DK+central layer is formed, and described central layer is the sheet material that circuit substrate (copper-clad plate) makes band line pattern after etching.
In one embodiment, described reinforcing material is the electronic-grade glass fiber cloth of circuit board use, glass fibre non-woven, aramid fiber or other organic fiber woven cloth.
In one embodiment, described core thickness is 0.03mm to 3.0mm.
In one embodiment, the described resin bed identical or close with reinforcing material DK comprises one or more in epoxy-resin systems, cyanate ester resin system, polyphenylene oxide resin system, polybutadiene system, polybutadiene and styrene copolymer resin system, polyflon system, Polybenzoxazine resin system, polyimides system, containing silicone resin system, bismaleimide resin system, polymerizable mesogenic objects system, bismaleimide-triazine resin system, thermoplastic resin system; Preferably, described resin bed also comprises filler, described filler be selected from silicon dioxide, aluminium oxide, titanium dioxide, barium titanate, strontium titanates, magnesium titanate, calcium titanate, barium strontium titanate, lead titanates, glass dust one or more.
In one embodiment, thickness=1.01 ~ 1.5 of the gross thickness/reinforcing material of the resin bed of the described resin bed+layers of reinforcement identical or close with reinforcing material DK+identical or close with reinforcing material DK; Preferably, thickness=1.05 ~ 1.2 of the gross thickness/reinforcing material of the resin bed of the described resin bed+layers of reinforcement identical or close with reinforcing material DK+identical or close with reinforcing material DK.
In one embodiment, described reinforcing material is E type glass-fiber-fabric, and its DK is 6.2 ~ 6.6.
In one embodiment, described reinforcing material is NE type glass-fiber-fabric, and its DK is 4.4 ~ 4.6.
Two of the purpose of this utility model is to provide the printed circuit board become by above-mentioned preimpregnation sandwich structure system, and preimpregnation sandwich structure body described in one or more is carried out folded combo conjunction, then hot pressing is carried out in the folded combination prepared, makes the production of printed circuit board.
The beneficial effects of the utility model are: the printed circuit board using this preimpregnation sandwich structure system to become has excellent dielectric property, its warp-wise and broadwise dielectric constant very little in difference, achieve dielectric constant microcosmic consistency, and manufacturing process is simple.
Accompanying drawing explanation
Fig. 1 is the structural representation of preimpregnation sandwich structure body of the present invention.
1, reinforcing material; 2, resin bed; 3, core.
Embodiment
The utility model provides a kind of preimpregnation sandwich structure body used for printed circuit board, and the printed circuit board using this structure to produce.The printed circuit board using this preimpregnation sandwich structure system to become has excellent dielectric property, its warp-wise and broadwise dielectric constant very little in difference, achieve dielectric constant microcosmic consistency, and technique is simple.
One of the utility model object is to provide a kind of preimpregnation sandwich structure body, its structure is followed successively by from top to bottom and is made up of central layer+1 or multiple (resin bed+layers of reinforcement identical or close with reinforcing material DK+resin bed) identical or close with reinforcing material DK+central layer, and described central layer refers to that circuit substrate (copper-clad plate) makes the sheet material of band line pattern after etching.
For achieving the above object, adopt following technical scheme:
(1) prepare resin combination composition glue liquid, make the resin combination DK after this glue heat treatment close with this reinforcing material or identical;
(2) reinforcing material is carried out impregnation in described glue, then dry out solvent, obtain prepreg;
(3) alternatively, multiple described prepreg is superposed;
(4) central layer is covered with in the prepreg both sides of prepreg or superposition.
In some embodiments, described glue is the glue that resin combination is dissolved in organic or inorganic solvent and obtains; This resin combination is thermoplastic resin composition or compositions of thermosetting resin; Preferably, described glue also comprises filler.
The resin bed that its DK described is identical or close with reinforcing material DK refers to; The dielectric constant (Dk) of the resin bed obtained after heat treatment after reinforcing material dipping glue is in the scope of Dk ± 10% of reinforcing material, and preferably, the Dk of described resin bed is in the scope of Dk ± 5% of reinforcing material.
Described heat treatment determines according to the characteristic of resin combination, if this resin combination is thermoplastic resin composition, then heat treatment refers to and this glue is added heat abstraction solvent; If this resin combination is compositions of thermosetting resin, then after heat treatment refers to and glue is added heat abstraction solvent, then be cured reaction.
In described preimpregnation sandwich structure body, thickness=1.01 ~ 1.5 of the gross thickness/reinforcing material of the resin bed of the described resin bed+layers of reinforcement identical or close with reinforcing material DK+identical or close with reinforcing material DK.Preferably, thickness=1.05 ~ 1.2 of the gross thickness/reinforcing material of the resin bed of the described resin bed+layers of reinforcement identical or close with reinforcing material DK+identical or close with reinforcing material DK.
In some preferred embodiments, described resin combination comprises resin and curing agent, and wherein resin is selected from one or more in epoxy resin, cyanate ester resin, polyphenylene oxide resin, polybutadiene, polybutadiene and styrene copolymer resin, polyflon, Polybenzoxazine resin, polyimides, containing silicone resin, bimaleimide resin, liquid crystal polymer, bismaleimide-triazine resin, thermoplastic resin; Described curing agent be selected from phenolic curing agent, amine curing agent, macromolecule acid anhydride type curing agent, active ester, radical initiator one or more; Preferably, described resin bed also comprises filler, described filler be selected from silicon dioxide, aluminium oxide, titanium dioxide, barium titanate, strontium titanates, magnesium titanate, calcium titanate, barium strontium titanate, lead titanates, glass dust one or more.
In some preferred embodiments, described central layer refers to that circuit substrate (copper-clad plate) is after etching, and make the sheet material of band line pattern, thickness is 0.03mm to 3.0mm.；
In some preferred embodiments, described reinforcing material is the electronic-grade glass fiber cloth of circuit board use, glass fibre non-woven, aramid fiber or other organic fiber woven cloth; More preferably, described reinforcing material is electronic-grade glass fiber cloth.
In other preferred embodiments, described glass-fiber-fabric is E type glass-fiber-fabric, and its Dk (10GHz) is 6.2 ~ 6.6.
In other preferred embodiment, described glass-fiber-fabric is NE type glass-fiber-fabric, and its Dk (10GHz) is 4.4 ~ 4.6.
Two of the purpose of this utility model is to provide the printed circuit board according to being prepared by this preimpregnation sandwich structure body.
Above-mentioned preimpregnation sandwich structure body is directly used in the production of printed circuit board.
The utility model Dk used refers to dielectric constant, by the value of SPDR method test under 10GHz frequency.
The utility model glass-fiber-fabric used refers to glass fabric, be called for short glass-fiber-fabric, glass-fiber-fabric comprises the types such as E type glass-fiber-fabric, NE type glass-fiber-fabric, S type glass-fiber-fabric, D type glass-fiber-fabric, the glass-fiber-fabric of every type can be divided into again 7628,2116,1080,106,1037,1078,2112,3313,1500 equal-specification models, those skilled in the art know, when glass-fiber-fabric is applied in circuit substrate field, its Main Function is the reinforcing material as circuit substrate.
Prepreg alleged by this utility model obtains through heat treatment after being flooded in resin combination composition glue liquid by reinforcing material, and its structure is the resin bed of resin bed+layers of reinforcement identical or close with reinforcing material DK+identical or close with reinforcing material DK.
The technical solution of the utility model is further illustrated below by embodiment.
Embodiment 1:
Preimpregnation sandwich structure body: (reinforcing material is E type 1080 glass-fiber-fabric to central layer+prepreg, and its Dk is 6.6; Resin system is epoxy systems, and its Dk is 6.5)+central layer;
The printed circuit board mode of production (4 laminate): central layer+4* prepreg+central layer
Embodiment 2:
Preimpregnation sandwich structure body: (reinforcing material is NE type 2116 glass-fiber-fabric to central layer+prepreg, and its Dk is 4.6; Resin system is cyanate system, and its Dk is 4.4)+central layer
The printed circuit board mode of production (5 laminate): central layer+5* prepreg+central layer+cyanate prepreg (NE type 2116 glass-fiber-fabric)+Copper Foil
Embodiment 3:
Preimpregnation sandwich structure body: (reinforcing material is E type 50 nonwoven fabrics to central layer+prepreg, and to be 6.6 be its Dk; Resin system is epoxy systems, and its Dk is 6.5)+central layer
The printed circuit board mode of production (4 laminate): central layer+4* prepreg+central layer
Comparative example 1:
Preimpregnation sandwich structure body: (reinforcing material is E type 1080 glass-fiber-fabric to central layer+prepreg, and its Dk is 6.6; Resin system is epoxy systems, and its Dk is 3.8)+central layer;
The printed circuit board mode of production (4 laminate): central layer+4* prepreg+central layer
Resin bed DK in comparative example 1 in epoxy prepreg is 3.8, and the resin bed in embodiment 1 is 6.5, and other are identical with embodiment 1; Compared with embodiment 1, signal time delay phenomenon is obvious.
Comparative example 2:
(reinforcing material is E type 1080 glass-fiber-fabric to prepreg, and its Dk is 6.6; Resin system is epoxy systems, and its Dk is 6.5) the obtained structure of secondary dipping (epoxy systems)
The printed circuit board mode of production (4 laminate): central layer+prepreg secondary dipping structure+central layer
Resin bed DK in comparative example 2 in epoxy prepreg is 6.5, then impregnation resin is epoxy systems; Compared with embodiment 1, this technique also can obviously improve signal time delay problem, but need by prepreg impregnation again, and then dry also semi-solid preparation and make dipstick, technique is more complicated.
Below describe know-why of the present utility model in conjunction with specific embodiments, these describe just in order to explain principle of the present utility model, can not be interpreted as the restriction to the utility model protection range by any way.Based on explaining herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within protection range of the present utility model.
Claims (10)
1. a use in printed circuit board preimpregnation sandwich structure body, its structure is followed successively by central layer (1) from top to bottom; 1 or multiple by the layer (2) being followed successively by the resin bed identical or close with reinforcing material DK, layers of reinforcement, the resin bed identical or close with reinforcing material DK are formed; Central layer (3), described central layer is the sheet material that circuit substrate makes band line pattern after etching.
2. preimpregnation sandwich structure body as claimed in claim 1, is characterized in that, described reinforcing material is the electronic-grade glass fiber cloth of circuit board use, glass fibre non-woven or aramid fiber.
3. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described core thickness is 0.03mm to 3.0mm.
4. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, the described resin bed identical or close with reinforcing material DK comprises the one in epoxy-resin systems, cyanate ester resin system, polyphenylene oxide resin system, polybutadiene system, polybutadiene and styrene copolymer resin system, polyflon system, Polybenzoxazine resin system, polyimides system, containing silicone resin system, bismaleimide resin system, polymerizable mesogenic objects system, bismaleimide-triazine resin system, thermoplastic resin system.
5. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described resin bed also comprises filler, and described filler is selected from the one in silicon dioxide, aluminium oxide, titanium dioxide, barium titanate, strontium titanates, magnesium titanate, calcium titanate, barium strontium titanate, lead titanates, glass dust.
6. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described by being followed successively by the resin bed identical or close with reinforcing material DK, thickness=1.01 ~ 1.5 of the gross thickness/layers of reinforcement of layer that layers of reinforcement, the resin bed identical or close with reinforcing material DK are formed.
7. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described by being followed successively by the resin bed identical or close with reinforcing material DK, thickness=1.05 ~ 1.2 of the gross thickness/layers of reinforcement of layer that layers of reinforcement, the resin bed identical or close with reinforcing material DK are formed.
8. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described reinforcing material is E type glass-fiber-fabric, and its Dk under 10GHz is 6.2 ~ 6.6.
9. preimpregnation sandwich structure body as claimed in claim 1, it is characterized in that, described reinforcing material is NE type glass-fiber-fabric, and its Dk under 10GHz is 4.4 ~ 4.6.
10. a printed circuit board (PCB), is characterized in that, it is combined by multiple preimpregnation sandwich structure bodies according to any one of claim 1-9 that 1 or folded is joined.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253289A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳Tcl数字技术有限公司 | Circuit board and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253289A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳Tcl数字技术有限公司 | Circuit board and display device |
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