CN204886895U - Sound table syntonizer chip and packaging structure thereof - Google Patents
Sound table syntonizer chip and packaging structure thereof Download PDFInfo
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- CN204886895U CN204886895U CN201520658575.2U CN201520658575U CN204886895U CN 204886895 U CN204886895 U CN 204886895U CN 201520658575 U CN201520658575 U CN 201520658575U CN 204886895 U CN204886895 U CN 204886895U
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Abstract
The utility model provides a sound table syntonizer chip and packaging structure thereof relates to surface acoustic wave technical field. A piezoelectric substrate that sound table syntonizer chip includes the cuboid and an interdigital transducer and reflection grating array that on locates the piezoelectric substrate, the reflection grating array for two both sides of just locating interdigital transducer respectively, still includes incoming signal electrode and output signal electrode at least, incoming signal electrode and output signal electrode are " L " shape, packaging structure includes base, base metal column and elargol, the base metal column sets up in the both ends of base, the top position of base metal column is located to the elargol, sound table syntonizer chip is fixed in on the base metal column through the elargol. The utility model has the advantages of with low costs, the packaging efficiency is high.
Description
Technical field
The utility model relates to surface acoustic wave techniques field, specifically refers to a kind of sound table resonator chip and encapsulating structure thereof.
Background technology
SAW (Surface Acoustic Wave) device utilizes surface acoustic wave to carry out the device of simulation process to the signal of telecommunication.SAW (Surface Acoustic Wave) resonator is on interdigital transducer both sides, places the reflecting grating array of discontinuous construction metal band respectively.Each grating array by hundreds of or thousands of wide and intervals respectively for the metal band of λ/4 forms.This is a kind of distributed feedback structure.Although sound wave reflects very little on each metal band, all reflected signals are all be added with synchronizing frequency and homophase, thus make sound wave form resonator close to all reflecting.SAW (Surface Acoustic Wave) resonator, compared with bulk wave crystal resonator, has the advantage of resonant frequency high (can reach gigahertz (GHZ) level) and vibration resistance.
SAW (Surface Acoustic Wave) resonator is widely used in car door remote control switch, inner capture system, data link, tire pressure monitoring system, wireless security system, the reading of wireless bar code, Wireless Keyboard, wireless mouse, wireless operating bar, in the civilian consumer electronics product such as remote control lamp switch, domestic annual consumption is at about tens, and consumption is huge.SAW (Surface Acoustic Wave) resonator mainly contains two class wrapper forms at present, metal pin encapsulation and the encapsulation of LTCC ceramic paster.Wherein metal pin encapsulation price is low, can not be used for automatic chip mounting and produce, be mainly used in low-end consumer market; LTCC ceramic packaging price is relatively high, for high-end consumption markets such as automotive electronics.No matter be metallic packaging or LTCC ceramic packaging, be all be applied to civilian consumption market, consumption is huge, and the lasting reduction of price is the continuous demand of industry development.Sound table resonator chip also tool has greatly improved space.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to propose a kind of cost is low, packaging efficiency is high sound table resonator chip and encapsulating structure thereof.
To achieve these goals, the technical scheme taked of the utility model is as follows:
The utility model proposes a kind of sound table resonator chip, comprise the piezoelectric substrate of cuboid and the interdigital transducer be located on piezoelectric substrate and reflecting grating array, described reflecting grating array is at least two and is located at the both sides of interdigital transducer respectively, it is characterized in that: also comprise input signal electrode and output signal electrode, described input signal electrode and output signal electrode L-shaped, described input signal electrode and output signal electrode are located at two diagonal angle places of described piezoelectric substrate respectively and the both sides of input signal electrode and output signal electrode are parallel to the both sides of piezoelectric substrate respectively, longer one end of described input signal electrode is connected to the side of interdigital transducer, longer one end of described output signal electrode is connected to the opposite side of interdigital transducer.
The utility model also proposes a kind of encapsulating structure of sound table resonator chip, comprise sound table resonator chip, wherein, described sound table resonator chip is above-mentioned a kind of sound table resonator chip, also comprise base, base metal post and elargol, described base metal post is arranged at the two ends of base, the tip position of base metal post is located at by described elargol, described sound table resonator chip is fixed on base metal post by elargol, and described base metal post is supported in the comparatively minor face of input signal electrode and output signal electrode respectively.
The beneficial effects of the utility model: the structure of the utility model to sound table resonator chip redesigns, traditional input being located at the relative both sides of chip respectively and output signal electrode are designed to " L " shape, to make input and output signal electrode, there is the one side being parallel to the other both sides of chip, encapsulate in the metal shell of the HC-49S that this structural design makes sound table resonator chip that anti-mode of pasting can be adopted to commonly use at existing crystal oscillator, shell cost reduces 60%; In addition, abandoned the conventional silk pressing technique of sound table industry in encapsulation link, the elargol of employing crystal oscillator is counter pastes technique, and in packaging efficiency, have great raising, packaging cost reduces to a great extent, has great economic benefit.
Accompanying drawing explanation
1. Fig. 1 is the structural representation of conventional sound table resonator chip of the prior art;
2. Fig. 2 is the structural representation of a kind of sound table of the utility model resonator chip;
3. Fig. 3 is the encapsulation front view of sound table resonator chip of the prior art;
4. Fig. 4 is the encapsulation vertical view of sound table resonator chip of the prior art;
5. Fig. 5 is the encapsulation front view of a kind of sound table of the utility model resonator chip;
6. Fig. 6 is the encapsulation vertical view of a kind of sound table of the utility model resonator chip.
Wherein, 1-interdigital transducer, 2-reflecting grating array, 3-input signal electrode, 4-output signal electrode, 5-sound table resonator chip, 6-base, 7-base metal post, 8-elargol, 9-silk pressing.
Embodiment
For making the technical solution of the utility model, advantage and object clearly, below in conjunction with the accompanying drawing in the utility model embodiment, the technical solution of the utility model is described further, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiment.Based on embodiment of the present utility model, those of ordinary skill in the art belongs to the scope that the utility model claim contains not making other embodiment obtained under any creative work prerequisite.
As shown in Figure 1, the input of sound table resonator chip of the prior art and output signal electrode are set in parallel in the both sides of chip respectively and are connected with the interdigital transducer being in medium position.With reference to Fig. 2, the utility model proposes a kind of sound table resonator chip, comprise the piezoelectric substrate of cuboid and the interdigital transducer 1 be located on piezoelectric substrate and reflecting grating array 2, described reflecting grating array 2 is at least two and is located at the both sides of interdigital transducer 1 respectively, certain the utility model also comprises input signal electrode 3 and output signal electrode 4, difference from prior art is: above-mentioned input signal electrode 3 and output signal electrode 4 L-shaped, input signal electrode 3 and output signal electrode 4 are located at two diagonal angle places of described piezoelectric substrate respectively and the both sides of input signal electrode 3 and output signal electrode 4 are parallel to the both sides of piezoelectric substrate respectively, longer one end of input signal electrode 3 is connected to the side of interdigital transducer 1, longer one end of described output signal electrode 4 is connected to the opposite side of interdigital transducer 1.Encapsulate in the metal shell of the HC-49S adopting the chip of said structure form can make sound table resonator chip that anti-mode of pasting can be adopted to commonly use at existing crystal oscillator, shell cost reduces 60%.
Be the usual packaging technology to sound table resonator chip in prior art as shown in Figure 3-4, above-mentioned packaging technology adopts traditional silk pressing technique, and this technology utilization base and silk pressing 9 pairs of sound table resonator chips encapsulate, and flow process is comparatively complicated and cost is higher.With reference to Fig. 5-6, the utility model also proposed a kind of encapsulating structure for the sound table resonator chip of above-mentioned redesign, comprise base 6, base metal post 7 and elargol 8, described base metal post 7 is arranged at the two ends of base 6, the tip position of base metal post 7 is located at by described elargol 8, described sound table resonator chip 5 is fixed on base metal post 7 by elargol 8, and described base metal post 7 is supported in the comparatively minor face of input signal electrode 3 and output signal electrode 4 respectively.Encapsulate in the metal shell of the HC-49S that this encapsulating structure adopts anti-mode of pasting to commonly use at existing crystal oscillator, shell cost reduces 60%; In addition, abandoned the conventional silk pressing technique of sound table industry in encapsulation link, the elargol of employing crystal oscillator is counter pastes technique, and in packaging efficiency, have great raising, packaging cost reduces to a great extent, has great economic benefit.
The above; be only embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; change can be expected easily or replace, all should be encompassed within protection range of the present utility model.Therefore, protection range of the present utility model should described be as the criterion with the protection range of claim.
Claims (2)
1. a sound table resonator chip, comprise the piezoelectric substrate of cuboid and the interdigital transducer (1) be located on piezoelectric substrate and reflecting grating array (2), described reflecting grating array (2) is at least two and is located at the both sides of interdigital transducer (1) respectively, it is characterized in that: also comprise input signal electrode (3) and output signal electrode (4), described input signal electrode (3) and output signal electrode (4) L-shaped, described input signal electrode (3) and output signal electrode (4) are located at two diagonal angle places of described piezoelectric substrate respectively and the both sides of input signal electrode (3) and output signal electrode (4) are parallel to the both sides of piezoelectric substrate respectively, longer one end of described input signal electrode (3) is connected to the side of interdigital transducer (1), longer one end of described output signal electrode (4) is connected to the opposite side of interdigital transducer (1).
2. the encapsulating structure of a sound table resonator chip, comprise sound table resonator chip (5), it is characterized in that, described sound table resonator chip (5) is a kind of sound table resonator chip according to claim 1, also comprise base (6), base metal post (7) and elargol (8), described base metal post (7) is arranged at the two ends of base (6), the tip position of base metal post (7) is located at by described elargol (8), described sound table resonator chip (5) is fixed on base metal post (7) by elargol (8), described base metal post (7) is supported in the comparatively minor face of input signal electrode (3) and output signal electrode (4) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520658575.2U CN204886895U (en) | 2015-08-28 | 2015-08-28 | Sound table syntonizer chip and packaging structure thereof |
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| CN201520658575.2U CN204886895U (en) | 2015-08-28 | 2015-08-28 | Sound table syntonizer chip and packaging structure thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108365833A (en) * | 2016-12-05 | 2018-08-03 | 深圳华远微电科技有限公司 | A kind of SAW resonator and its encapsulating structure |
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2015
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108365833A (en) * | 2016-12-05 | 2018-08-03 | 深圳华远微电科技有限公司 | A kind of SAW resonator and its encapsulating structure |
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| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" |
Address after: No. 101, 201, 301, 401, building 2, phase I, intelligent manufacturing industrial park, high tech Zone, Wuxing District, Huzhou City, Zhejiang Province, 313000 Patentee after: Zhejiang Huayuan Micro Electronics Technology Co.,Ltd. Address before: 518000 floor 1 and 3, building e, No. 5, Zhuangcun Road, xiner community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HUAYUAN MICRO ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CP03 | "change of name, title or address" |