CN204885528U - Novel bonding wire cup - Google Patents
Novel bonding wire cup Download PDFInfo
- Publication number
- CN204885528U CN204885528U CN201520650711.3U CN201520650711U CN204885528U CN 204885528 U CN204885528 U CN 204885528U CN 201520650711 U CN201520650711 U CN 201520650711U CN 204885528 U CN204885528 U CN 204885528U
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- hole
- bonding wire
- sector
- internal diameter
- sector hole
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Abstract
The utility model discloses a novel bonding wire cup, comprising a main body, be equipped with the bonding wire hole in main, the bonding wire hole is the enclosed construction, the bonding wire hole divide into first sector hole and second sector hole, the external diameter of the internal diameter more than or equal to wire sinle silk of first sector hole, the external diameter of the internal diameter more than or equal to wire line skin of second sector hole, the internal diameter of first sector hole is less than the internal diameter of second sector hole, and the two handing -over department is the slope step. The one side in bonding wire hole is equipped with the through -hole. The utility model discloses a bonding wire cup adopts closed structure, is equipped with the through -hole in bonding wire hole one side and realizes soldering tin and fill, has not only guaranteed the reliability of contact, and has improved the durability of welding ends.
Description
Technical field
The utility model relates to welding technology field, is specifically related to a kind of novel bonding wire cup.
Background technology
Usual electric connector contact used is generally compression joint type or welded type; wherein welded-type contact element tail end is generally bonding wire cup structure; wire inserts bonding wire cup and welds at tail end; traditional bonding wire cup is half-cut-type structure; welding position is in unsettled naked state; in use can not get effective protection, easily breakage phenomenon occurs.In order to improve contact reliability between wire and bonding wire cup and durability, need a kind of new bonding wire cup structure.
Summary of the invention
The purpose of this utility model is: provide a kind of novel bonding wire cup structure, contact reliability is high, and durability is high.
The utility model is achieved through the following technical solutions: a kind of novel bonding wire cup, comprises main body, be provided with bonding wire hole in described master, and described bonding wire hole is enclosed construction, and the side in described bonding wire hole is provided with through hole.
As further preferred version of the present utility model, described through hole is circular, and its inwall is slope, and outer wall aperture, bonding wire hole is large, and inwall aperture is little.
As further preferred version of the present utility model, described bonding wire hole is divided into the first sector hole and the second sector hole, the internal diameter of described first sector hole is more than or equal to the external diameter of wire core, the internal diameter of described second sector hole is more than or equal to the external diameter of wire skin, the internal diameter of described first sector hole is less than the internal diameter of the second sector hole, and the two junction is slope step.
As further preferred version of the present utility model, described through hole is positioned on the first sector hole.
As further preferred version of the present utility model, the outer wall of described second sector hole is provided with heat-shrink tube.
Compared with prior art, the utility model has following beneficial effect:
One, bonding wire cup of the present utility model, adopt enclosed construction, be provided with in side, bonding wire hole through hole realize scolding tin fill, not only ensure that the reliability of contact, and improve the durability of welding ends.
Two, bonding wire cup of the present utility model, bonding wire hole adopts in the line suitcase of wire is rolled in by two sections of steps simultaneously.The outside of the second sector hole is provided with heat-shrink tube simultaneously, makes solder joint more solid and reliable.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, a kind of novel bonding wire cup, comprises main body 1, is provided with bonding wire hole 2 in described main body 1, and described bonding wire hole 2 is enclosed construction, is divided into two sections, is respectively the first sector hole 4 and the second sector hole 5.The internal diameter of described first sector hole 4 is less than the internal diameter of the second sector hole 5; The internal diameter of described first sector hole 4 is more than or equal to the external diameter of wire core, and the internal diameter of described second sector hole 5 is more than or equal to the external diameter of wire skin.The side of described second sector hole 5 is provided with through hole 3.Described through hole is circular, and its inwall is slope.The outer wall of described second sector hole 5 is provided with heat-shrink tube 6.
The core of wire inserts the first sector hole 4, and fill scolding tin in through hole and weld, wire suitcase is rolled in the second sector hole 5 simultaneously, is reinforced by heat-shrink tube 6 simultaneously.Welding is reliable, long service life.
Claims (5)
1. a novel bonding wire cup, comprise main body (1), be provided with bonding wire hole (2) in described main body (1), it is characterized in that: described bonding wire hole (2) is enclosed construction, the side of described bonding wire hole (2) is provided with through hole (3).
2. the novel bonding wire cup of one according to claim 1, is characterized in that: described through hole (3) is for circular, and its inwall is slope, and bonding wire hole (3) outer wall aperture is large, and inwall aperture is little.
3. the novel bonding wire cup of one according to claim 1, it is characterized in that: described bonding wire hole (2) is divided into the first sector hole (4) and the second sector hole (5), the internal diameter of described first sector hole (4) is more than or equal to the external diameter of wire core, the internal diameter of described second sector hole (5) is more than or equal to the external diameter of wire skin, the internal diameter of described first sector hole (4) is less than the internal diameter of the second sector hole (5), and the two junction is slope step.
4. the novel bonding wire cup of the one according to Claims 2 or 3, is characterized in that: described through hole (3) is positioned on the first sector hole (4).
5. the novel bonding wire cup of one according to claim 3, is characterized in that: the outer wall of described second sector hole (5) is provided with heat-shrink tube (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520650711.3U CN204885528U (en) | 2015-08-26 | 2015-08-26 | Novel bonding wire cup |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520650711.3U CN204885528U (en) | 2015-08-26 | 2015-08-26 | Novel bonding wire cup |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885528U true CN204885528U (en) | 2015-12-16 |
Family
ID=54829865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520650711.3U Active CN204885528U (en) | 2015-08-26 | 2015-08-26 | Novel bonding wire cup |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885528U (en) |
-
2015
- 2015-08-26 CN CN201520650711.3U patent/CN204885528U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |