CN204885173U - Diode for automobile engine - Google Patents
Diode for automobile engine Download PDFInfo
- Publication number
- CN204885173U CN204885173U CN201520488609.8U CN201520488609U CN204885173U CN 204885173 U CN204885173 U CN 204885173U CN 201520488609 U CN201520488609 U CN 201520488609U CN 204885173 U CN204885173 U CN 204885173U
- Authority
- CN
- China
- Prior art keywords
- chip
- base
- protective sheath
- firm banking
- protective sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a diode for automobile engine, including the tube socket, the chip, the lead wire, sealed glue, the tube socket includes unable adjustment base, the chip holds in the palm, the chip base, the chip protective sheath, unable adjustment base centre of a circle department is located to the chip base, the chip holds in the palm and locates on the chip base, the chip is located the chip through soldering tin and is held in the palm interior center department, the lead wire is located on the chip through soldering tin, the chip protective sheath is located on the unable adjustment base, and it is peripheral to lie in the chip support, integrated into one piece is equipped with the base epitaxy on the outer circumference of unable adjustment base, the base is extended and highly is less than chip pedestal height, sealed glue is located in the chip protective sheath, and flush with chip protective sheath edge. The utility model discloses a base extends and highly to be less than chip pedestal height, after the rectifier heating panel of impressing is accomplished to the encapsulating, the bearing stress that has avoided producing is direct radially transmit the chip on, protected the chip, trapezoidal chip protective sheath makes the encapsulating effect more substantial, and when the encapsulating was accomplished, the chip protective sheath also possessed the fixed of chip and guard action.
Description
Technical field
The utility model relates to field of machining, particularly relates to a kind of automobile engine diode.
Background technology
At present, automobile engine pressing type rectifier diode is straight wire rectifier diode, and the rectifier usually diode being assemblied in automobile current generator uses, and its lead-in wire welds with rectifier bracket.But when diode and rectifier heating panel assemble, be adopted by diode the form of interference fit base portion to be squeezed in the hole of rectifier heating panel, this extruding force is larger by the impact of the factor such as bore dia size, rectifier heating panel hardness of diode base groove diameter dimension, diode base hardness, rectifier heating panel.Therefore, the extrusion stress produced when diode press-in rectifier heating panel may be delivered on chip, causes chip rupture, thus causes whole defective rectifier, generator cisco unity malfunction.In addition, in use, because temperature in enging cabin is higher and with vibrations, chip holder can not effective protect IC, usually causes chip very easily impaired.
Therefore, based on these problems, providing a kind of encapsulating convenient, avoiding a kind of automobile engine diode of defective chip when assembling with rectifier heating panel to have important practical significance.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides the automobile engine diode of a kind of encapsulating convenience, protect IC.
The utility model solves its technical problem and takes following technical scheme to realize:
A kind of automobile engine diode, comprise base, chip, lead-in wire, fluid sealant, it is characterized in that: described base comprises firm banking, chip holder, chip pad, chip protective sleeve, described chip pad is located at described firm banking circle centre position, described chip holder is located in described chip pad, described chip is located at the center in described chip holder by scolding tin, described lead-in wire is located on described chip by scolding tin, described chip protective sleeve is located on described firm banking, and it is peripheral to be positioned at described chip holder, one-body moldedly on described firm banking excircle be provided with base extension, described base extension height is lower than described chip pad height, described fluid sealant is located in described chip protective sleeve, and flush with described chip protective sleeve edge.
Further, described firm banking outer surface is provided with axial thread.
Further, described firm banking lower surface is provided with annular projection.
Further, described chip protective sleeve cross section is wide at the top and narrow at the bottom trapezoidal.
Advantage of the present utility model and good effect are:
(1) base extension height of the present utility model is lower than chip pad height, and after encapsulating completes press-in rectifier heating panel, the direct radial direction of extrusion stress avoiding generation is delivered on chip, protects chip.
(2) the utility model is by adopting trapezoidal chip protective sleeve; make during encapsulating, chip perfusion to be more prone to; garbage collection district can be formed between base extension and chip protective sleeve; encapsulating effect is more substantial; when encapsulating completes, chip protective sleeve also possesses the fixing of chip and protective effect.
Accompanying drawing explanation
Fig. 1 is the front view of the utility model structure.
Fig. 2 is the vertical view of the utility model structure.
Fig. 3 be A-A in Fig. 2 to cutaway view.
Fig. 4 is the upward view of the utility model structure.
Wherein:
1, base 2, chip 3, lead-in wire
4, fluid sealant 5, firm banking 6, chip holder
7, chip pad 8, chip protective sleeve 9, base extension
10, axial thread 11, projection
Embodiment
Below in conjunction with accompanying drawing, the utility model embodiment is further described:
As Fig. 1, 2, 3, shown in 4, a kind of automobile engine diode described in the utility model, comprise base 1, chip 2, lead-in wire 3, fluid sealant 4, described base 1 comprises firm banking 5, chip holder 6, chip pad 7, chip protective sleeve 8, described firm banking 5 outer surface is provided with axial thread 10, described chip pad 7 is located at described firm banking 5 circle centre position, described chip holder 6 is located in described chip pad 7, described chip 2 is located at the center in described chip holder 6 by scolding tin, described lead-in wire 3 is located on described chip 2 by scolding tin, described chip protective sleeve 8 is located on described firm banking 5, and it is peripheral to be positioned at described chip holder 6, described chip protective sleeve 8 cross section is wide at the top and narrow at the bottom trapezoidal, one-body moldedly on described firm banking 5 excircle be provided with base extension 9, described base extension 9 height is lower than described chip pad 7 height, described fluid sealant 4 is located in described chip protective sleeve 8, and flush with described chip protective sleeve 8 edge, described firm banking 5 lower surface is provided with annular projection 11.
The utility model is in the middle of use, to when in trapezoidal chip protective sleeve, encapsulating completes, unnecessary fluid sealant can flow in the space that base extension and chip protective sleeve formed, and makes encapsulating more abundant, when encapsulating completes, trapezoidal chip protective sleeve also possesses the fixing of chip and protective effect; Meanwhile, base extension height is lower than chip pad height, and after being filled press-in rectifier heating panel, the direct radial direction of extrusion stress avoiding generation is delivered on chip, protects chip.
Above an embodiment of the present utility model has been described in detail, but described content being only preferred embodiment of the present utility model, can not being considered to for limiting practical range of the present utility model.All equalizations done according to the utility model application range change and improve, and all should still belong within patent covering scope of the present utility model.
Claims (4)
1. an automobile engine diode, comprise base, chip, lead-in wire, fluid sealant, it is characterized in that: described base comprises firm banking, chip holder, chip pad, chip protective sleeve, described chip pad is located at described firm banking circle centre position, described chip holder is located in described chip pad, described chip is located at the center in described chip holder by scolding tin, described lead-in wire is located on described chip by scolding tin, described chip protective sleeve is located on described firm banking, and it is peripheral to be positioned at described chip holder, one-body moldedly on described firm banking excircle be provided with base extension, described base extension height is lower than described chip pad height, described fluid sealant is located in described chip protective sleeve, and flush with described chip protective sleeve edge.
2. a kind of automobile engine diode according to claim 1, is characterized in that: described firm banking outer surface is provided with axial thread.
3. a kind of automobile engine diode according to claim 1, is characterized in that: described firm banking lower surface is provided with annular projection.
4. a kind of automobile engine diode according to claim 1, is characterized in that: described chip protective sleeve cross section is wide at the top and narrow at the bottom trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520488609.8U CN204885173U (en) | 2015-07-09 | 2015-07-09 | Diode for automobile engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520488609.8U CN204885173U (en) | 2015-07-09 | 2015-07-09 | Diode for automobile engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204885173U true CN204885173U (en) | 2015-12-16 |
Family
ID=54829514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520488609.8U Expired - Fee Related CN204885173U (en) | 2015-07-09 | 2015-07-09 | Diode for automobile engine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204885173U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817599A (en) * | 2019-03-14 | 2019-05-28 | 山东省半导体研究所 | A kind of diode and its alkali washing process with novel nickel plating lead frame |
| CN112351641A (en) * | 2020-10-19 | 2021-02-09 | 珠海格力电器股份有限公司 | Electrical box for improving poor heat dissipation of heat dissipation module and encapsulation method |
-
2015
- 2015-07-09 CN CN201520488609.8U patent/CN204885173U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817599A (en) * | 2019-03-14 | 2019-05-28 | 山东省半导体研究所 | A kind of diode and its alkali washing process with novel nickel plating lead frame |
| CN109817599B (en) * | 2019-03-14 | 2024-05-10 | 山东省半导体研究所 | Diode with novel nickel-plated lead frame and alkaline washing process thereof |
| CN112351641A (en) * | 2020-10-19 | 2021-02-09 | 珠海格力电器股份有限公司 | Electrical box for improving poor heat dissipation of heat dissipation module and encapsulation method |
| CN112351641B (en) * | 2020-10-19 | 2022-01-28 | 珠海格力电器股份有限公司 | Electrical box for improving poor heat dissipation of heat dissipation module and encapsulation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20180709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |