CN204836794U - Golden finger circuit board - Google Patents
Golden finger circuit board Download PDFInfo
- Publication number
- CN204836794U CN204836794U CN201520519076.5U CN201520519076U CN204836794U CN 204836794 U CN204836794 U CN 204836794U CN 201520519076 U CN201520519076 U CN 201520519076U CN 204836794 U CN204836794 U CN 204836794U
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- Prior art keywords
- golden finger
- circuit board
- breach
- sheet
- finger circuit
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Abstract
The utility model provides a golden finger circuit board, includes the base plate and locates a plurality of golden finger piece on the base plate, the golden finger piece reaches with two including the tip that is located the length direction both ends the both sides limit that the tip is do not connected, the golden finger piece the side is equipped with the breach. Above -mentioned golden finger circuit board sets up the breach through the side at the golden finger piece and can flow in the breach owing to soldering tin, during the welding, has increased the area of contact that golden finger piece and printed circuit board went up soldering tin to effectively avoid rosin joint, vacation the unfavorable condition such as to weld, improved the joint strength of golden finger circuit board with printed circuit board, and breach adsorbable soldering tin still, owing to the reason of adhesive force, soldering tin is difficult to the diffusion to avoided piling the short circuit that tin caused, improved the welding yield.
Description
Technical field
The utility model relates to field of circuit boards, particularly relates to a kind of golden finger circuit board.
Background technology
Golden finger (connectingfinger) is the link on memory bar and between memory bank, and all signals are all transmitted by golden finger.Golden finger is made up of numerous flavous conductive contact blade, because its surface gold-plating and conductive contact blade arrangement are as finger-shaped, so be called " golden finger ".Golden finger is actually and is covered with one deck gold again by special process in copper-clad plate, because the non-oxidizability of gold is extremely strong, and conductibility is also very strong.But because the price of gold costliness, " golden finger " of the equipment such as present mainboard, internal memory and video card is nearly all the tin material adopted.All data flow of internal memory processing unit, electron stream are exchanged by the contact of golden finger and memory bank and PC system just, and it is the I/O mouth of internal memory, and therefore its manufacture craft and quality seem quite important for Memory linkage.
Refer to Fig. 1, it is the structural representation of golden finger circuit board in prior art.Golden finger circuit board 11 comprises substrate 12 and is located at the golden finger sheet 13 on substrate 12, golden finger sheet 13 offers circular hole 14, in order to the intensity of guarantee fund's finger circuits plate, ear position 15 is equipped with in the both sides of the golden finger sheet at circular hole place, it is made to be greater than the width at non-hole place at the width at circular hole place, like this when welding with printed circuit board (PCB), tin is easily piled in ear position, circular hole both sides, two golden finger sheet conductings are caused to cause short circuit, and it is less to connect tin between circular hole place and printed circuit board (PCB), produce line and often feed back rosin joint or dry joint situation, cause circuit signal not conducting, welding quality is poor, failure welding rate is higher, have a strong impact on the quality of product, reduce the reliability of product.
Utility model content
Based on this, for the problems referred to above, be necessary to provide a kind of golden finger circuit board, this golden finger circuit board can increase upper tin area during welding, avoids the bad phenomenon such as rosin joint, dry joint, is conducive to improving welding yield.
A kind of golden finger circuit board, comprise substrate and be located at several golden finger sheets on described substrate, each described golden finger sheet comprises the end being positioned at length direction two ends and the dual-side be connected respectively with two described ends, and the described side of described golden finger sheet is provided with breach.
Wherein in an embodiment, described golden finger sheet two described in side be equipped with described breach, the described breach of adjacent described side staggers setting.
Wherein in an embodiment, side described in each is provided with at least two described breach, and two described breach intervals are arranged.
Wherein in an embodiment, size and the shape of described breach are identical.
Wherein in an embodiment, described breach is semicircular indentations.
Wherein in an embodiment, the radius of described semicircular indentations is not more than 1/3 of the described tip lengths of described golden finger sheet.
Wherein in an embodiment, described golden finger sheet one described in end be provided with described semicircular indentations.
Wherein in an embodiment, described golden finger circuit board comprises solder side and the contact-making surface with the opposing setting of described solder side, some described golden finger sheets are distributed on described solder side and described contact-making surface, and the length of the described side of the described golden finger sheet on described contact-making surface is greater than the length of the described side of the described golden finger sheet of described solder side.
Above-mentioned golden finger circuit board, by arranging breach at the side of golden finger sheet, because scolding tin can flow in breach, during welding, increase the contact area of scolding tin on golden finger sheet and printed circuit board (PCB), namely go up tin area to increase, thus effectively prevent the unfavorable condition such as rosin joint, dry joint, improve the bonding strength of golden finger circuit board and printed circuit board (PCB); And breach also adsorbable scolding tin, due to adhesive force, scolding tin is not easy diffusion, thus avoids, because heap tin causes short circuit, improve welding yield.
In addition, above-mentioned golden finger circuit board, length due to the side of the golden finger sheet on contact-making surface is greater than the length of the side of the golden finger sheet of solder side, the bonding area of itself and printed circuit board (PCB) can be increased, improve the fastness that both connect, avoid and occur the phenomenons such as welding comes off when falling, improve reliability and the life of product of assembled product.
Accompanying drawing explanation
Fig. 1 is the structural representation of golden finger circuit board in prior art;
Fig. 2 is the structural representation of golden finger circuit board in the utility model one embodiment;
Fig. 3 is the structural representation in golden finger welding circuit board face in another embodiment of the utility model;
Fig. 4 is the structural representation in the golden finger circuit board contacts face shown in Fig. 3.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar improvement without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public concrete enforcement.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in specification of the present utility model herein just in order to describe concrete execution mode, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 2, golden finger circuit board 10, comprise substrate 100 and be located at several golden finger sheets 200 on substrate 100, each golden finger sheet 200 comprises the end 210 being positioned at length direction two ends and the dual-side 220 be connected respectively with both ends 210, and the side 220 of golden finger sheet 200 is provided with breach 221.By the side 220 at golden finger sheet 200, breach 221 is set, according to hydromechanical principle, scolding tin can flow in breach 221, during welding, the contact area of scolding tin on golden finger sheet 200 and printed circuit board (PCB) can be increased, namely go up tin area to increase, thus effectively prevent the unfavorable condition such as rosin joint, dry joint, improve the bonding strength of golden finger circuit board 10 and printed circuit board (PCB); And breach 221 also adsorbable scolding tin, due to adhesive force, scolding tin is not easy diffusion, thus avoids the short circuit of piling tin and causing, and improves welding yield.
In order to increase upper tin area further, improve the bonding strength with printed circuit board (PCB), refer to Fig. 2, the dual-side 220 of golden finger sheet 200 is equipped with breach 221.And usually can bend due to golden finger circuit board 10; golden finger sheet fracture on it; the breach 221 of same golden finger sheet 200 dual-side 220 staggers setting; make the line of centres of each breach 221 not on the same line; like this; the intensity of golden finger circuit board 10 can be improved, prevent it from rupturing when stressed.Preferably, the breach 221 of the adjacent side 220 of adjacent golden finger sheet 200 staggers setting, and like this, when can prevent welding, adjacent golden finger sheet 200 connects and causes short circuit.
In the present embodiment, refer to Fig. 2, each side 220 is provided with at least two breach 221, and two breach 221 intervals are arranged, and can increase upper tin area further, improve bonding strength, and the layout of breach 221 is comparatively even, be conducive to the intensity improving golden finger circuit board 10.
For the ease of production and processing, refer to Fig. 2, size and the shape of breach 221 are identical.Due to the most applicable liquid flow of semicircle, tension force is maximum, and the effect of absorption scolding tin is best, and preferably, breach 221 is semicircular indentations 221.And due to the area of breach 221 excessive time, can reduce the intensity of golden finger circuit board 10, easily rupture, in the present embodiment, the radius of semicircular indentations 221 is not more than 1/3 of end 210 length of golden finger sheet 200.Concrete, end 210 length of golden finger sheet 200 is 0.45mm, and the radius of semicircular indentations 221 is 0.13mm, has both contributed to the intensity keeping golden finger circuit board 10, and can also ensure higher bonding strength simultaneously.
Preferably, an end 210 of golden finger sheet 200 is also provided with semicircular indentations 221, increases upper tin area further, improves the reliability of golden finger circuit board 10.
Refer to Fig. 3 and Fig. 4, golden finger circuit board 10 comprises solder side 20 and the contact-making surface 30 with the opposing setting of solder side 20, some golden finger sheets 200 are distributed on solder side 20 and contact-making surface 30, and the length d2 of the side 220 of the golden finger sheet 200 on contact-making surface 30 is greater than the length d1 of the side 220 of the golden finger sheet 200 of solder side 20.Contact-making surface 30 is for contacting with printed circuit board (PCB).One side larger for the length of the side 220 of golden finger sheet 200 is used for contacting with printed circuit board (PCB), the bonding area of itself and printed circuit board (PCB) can be increased, improve the fastness that both connect, avoid and occur the phenomenons such as welding comes off when falling, improve reliability and the life of product of assembled product.
In the present embodiment, please continue to refer to Fig. 3 and Fig. 4, the length d1 of the side 220 of the golden finger sheet 200 of solder side 20 is 1.6mm, and the length d2 of the side 220 of the golden finger sheet 200 on contact-making surface 30 is 2.0mm.
Preferably, golden finger circuit board 10 is flexible PCB (FlexiblePrintedCircuit, FPC), such as, golden finger circuit board 10 is that backlight FPC and/or main FPC, backlight FPC are mainly used in the line terminal of LED to extract, and then welds with main FPC, and welded with printed circuit board (PCB) by main FPC, make the electric current of printed circuit board (PCB) make it luminous by LED.It is mainly used in the products such as mobile phone, notebook computer, PDA (PersonalDigitalAssistant, personal digital assistant), digital camera, LCM (LiquidCrystalModule, liquid crystal display screen).
Above-mentioned golden finger circuit board 10, by the side 220 at golden finger sheet 200, breach 221 is set, because scolding tin can flow in breach 221, during welding, increase the contact area of scolding tin on golden finger sheet 200 and printed circuit board (PCB), namely go up tin area to increase, effectively prevent the unfavorable condition such as rosin joint, dry joint, improve the bonding strength of golden finger circuit board 10 and printed circuit board (PCB); And breach 221 also adsorbable scolding tin, due to adhesive force, scolding tin is not easy diffusion, thus avoids the short circuit of piling tin and causing, and improves welding yield.
In addition, above-mentioned golden finger circuit board 10, length due to the side 220 of the golden finger sheet 200 on contact-making surface is greater than the length of the side 220 of the golden finger sheet 200 of solder side, the bonding area of itself and printed circuit board (PCB) can be increased, improve the fastness that both connect, avoid and occur the phenomenons such as welding comes off when falling, improve reliability and the life of product of assembled product.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (8)
1. a golden finger circuit board, it is characterized in that, comprise substrate and be located at several golden finger sheets on described substrate, each described golden finger sheet comprises the end being positioned at length direction two ends and the dual-side be connected respectively with two described ends, and the described side of described golden finger sheet is provided with breach.
2. golden finger circuit board according to claim 1, is characterized in that, described golden finger sheet two described in side be equipped with described breach, the described breach of adjacent described side staggers setting.
3. golden finger circuit board according to claim 2, is characterized in that, side described in each is provided with at least two described breach, and two described breach intervals are arranged.
4. golden finger circuit board according to claim 3, is characterized in that, size and the shape of described breach are identical.
5. golden finger circuit board according to claim 4, is characterized in that, described breach is semicircular indentations.
6. golden finger circuit board according to claim 5, is characterized in that, the radius of described semicircular indentations is not more than 1/3 of the described tip lengths of described golden finger sheet.
7. golden finger circuit board according to claim 5, is characterized in that, described golden finger sheet one described in end be provided with described semicircular indentations.
8. golden finger circuit board according to claim 1, it is characterized in that, described golden finger circuit board comprises solder side and the contact-making surface with the opposing setting of described solder side, some described golden finger sheets are distributed on described solder side and described contact-making surface, and the length of the described side of the described golden finger sheet on described contact-making surface is greater than the length of the described side of the described golden finger sheet of described solder side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520519076.5U CN204836794U (en) | 2015-07-16 | 2015-07-16 | Golden finger circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520519076.5U CN204836794U (en) | 2015-07-16 | 2015-07-16 | Golden finger circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204836794U true CN204836794U (en) | 2015-12-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520519076.5U Expired - Fee Related CN204836794U (en) | 2015-07-16 | 2015-07-16 | Golden finger circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204836794U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106078074A (en) * | 2016-08-14 | 2016-11-09 | 大连新钢液压管件有限公司 | A kind of automotive air intake welding point |
| CN110012602A (en) * | 2019-05-20 | 2019-07-12 | 无锡市方舟科技电子有限公司 | A kind of back-sticked type charactron and its attaching method |
-
2015
- 2015-07-16 CN CN201520519076.5U patent/CN204836794U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106078074A (en) * | 2016-08-14 | 2016-11-09 | 大连新钢液压管件有限公司 | A kind of automotive air intake welding point |
| CN110012602A (en) * | 2019-05-20 | 2019-07-12 | 无锡市方舟科技电子有限公司 | A kind of back-sticked type charactron and its attaching method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 516000 Guangdong province Huizhou Zhongkai hi tech Development Zone No. 23 District Patentee after: CHINA DISPLAY OPTOELECTRONICS TECHNOLOGY (HUIZHOU) Co.,Ltd. Address before: 516000 Guangdong province Huizhou Zhongkai hi tech Development Zone No. 23 District Patentee before: TCL DISPLAY TECHNOLOGY (HUIZHOU) Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 |