CN204810807U - Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof - Google Patents
Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof Download PDFInfo
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- CN204810807U CN204810807U CN201520576733.XU CN201520576733U CN204810807U CN 204810807 U CN204810807 U CN 204810807U CN 201520576733 U CN201520576733 U CN 201520576733U CN 204810807 U CN204810807 U CN 204810807U
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Abstract
The utility model belongs to the technical field of the circuit board, concretely relates to electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof, including polyimide substrate layer, copper foil layer and absorbing material layer, the absorbing material layer is direct attached to on the copper foil layer. The utility model is not only simple in structure, need not isolation layer, gauge control below 0.1mm, the flex life is not influenced. And need not ground connection, need not to consider earthing position, no antenna effect. Absorb simultaneously and come from outside electromagnetic interference to influence FPC signal transmission. Can realize that single channel 25Gbps signal well transmits. The application that can extensively be used for high speed communication and the high -speed transmitting data of other needs.
Description
Technical field
The utility model belongs to wiring board techniques field, especially a kind of electromagnetic shielding copper-clad plate and the application in high speed FPC wiring board thereof.
Background technology
Along with development that is scientific and technical and electronics industry, various electronic apparatus application is increasing, and electromagenetic wave radiation has become a kind of new social effects of pollution.The electromagnetic interference (EMI) that electromagenetic wave radiation causes not only can affect the normal operation of each electronic equipment, along with improving constantly of communication speed, electromagnetic interference also gets more and more on the impact that electronic electric equipment normally works, according to estimates, the economic loss that the whole world causes because of the work of electromagnetic interference influence equipment every year reaches 500,000,000 dollars.
Scientific research confirms, people is in electromagenetic wave radiation environment for a long time, will have a strong impact on healthy.Therefore, electromangnetic spectrum just seems particularly important.FPC wiring board is as the carrier of high speed signal, and in today that speed improves constantly, its electromagnetic interference susceptibility also progressively promotes.Traditional electromagnetic shielding mode is shown in Fig. 1, adopt silver conductor film or slurry, except there being polyimide substrate layer 1, also need with insulating barrier 3, signal copper wire layer 2 and silver conductor screen 4 to be isolated, add flaggy thickness, cause FPC to be difficult to bending, or flex life declines, need ground wire and screen conducting simultaneously, conduction position and density choose more complicated, easily cause the bad or antenna effect of shielding.
Utility model content
In order to solve the problem, the purpose of this utility model is to provide a kind of electromagnetic shielding copper-clad plate and the application in high speed FPC wiring board thereof; This high speed FPC wiring board effectively can prevent electromagnetic interference, meanwhile, without the need to signals layer and absorbing material being isolated, ensures that FPC thickness does not increase, flex life is unaffected, also can not cause antenna effect without the need to ground connection.
The utility model is achieved through the following technical solutions:
A kind of electromagnetic shielding copper-clad plate, described in comprise the absorbing material layer, copper foil layer and the polyimide substrate layer that stack gradually, the thickness≤0.1mm of described copper-clad plate.
Preferably, described electromagnetic shielding copper-clad plate comprises the first absorbing material layer, the first copper foil layer, polyimide substrate layer, the second copper foil layer and the second absorbing material layer that stack gradually.The wherein magnetic material of the preferred TDK of absorbing material layer.
Preferably, be also at least provided with the hole that connects breakover element between described first copper foil layer and the second copper foil layer, one end, described hole and the first copper foil layer offset, and the other end offsets through described polyimide substrate layer and the second copper foil layer.
A kind of high speed FPC wiring board, is characterized in that, requires the different circuit of etching and obtain by described electromagnetic shielding copper-clad plate according to difference.Certainly exposed copper outer surface can also cover the conductive layer that one deck prevents it to be oxidized, such as nickel adds gold, or other coatings.
The utility model comprises polyimide substrate layer, copper foil layer and absorbing material layer, and absorbing material layer is attached directly on copper foil layer.Hinge structure, the utility model not only structure is simple, and without the need to separator, obtained FPC THICKNESS CONTROL is at below 0.1mm, and flex life is unaffected.And without the need to ground connection, without the need to considering earthing position, without antenna effect.By absorbing material, the electromagnetic wave from interiors of products can be absorbed, in order to avoid impact peripheral devices work, simultaneously stability from the Electromagnetic Interference of outside, in order to avoid affect FPC Signal transmissions.Single channel 25Gbps signal good transmission can be realized.High speed communication can be widely used in and other need the application of high speed transmission data.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art,
Fig. 2 is structural representation of the present utility model.
Embodiment
Below in conjunction with embodiment, the utility model is described in further detail, understands the utility model to help those skilled in the art.
A kind of high speed FPC wiring board, electromagnetic shielding copper-clad plate requires the different circuit of etching according to difference and obtains.Electromagnetic shielding copper-clad plate, comprises the first absorbing material layer 31, first copper foil layer 21, polyimide substrate layer 11, second copper foil layer 22 and the second absorbing material layer 32 that stack gradually.The preferred rolled copper foil of copper foil layer, be also at least provided with the hole 4 that connects breakover element between the first copper foil layer and the second copper foil layer, described one end, hole 4 and the first copper foil layer 21 offset, and the other end offsets through described polyimide base material 11 layers and the second copper foil layer 22.This hole 4 can arrange multiple according to actual needs, and it is except the signal between conducting first copper foil layer 21 and the second copper foil layer 22, also can be connected with electronic component in the place needed simultaneously.As required, this hole 4 can only through first absorbing material layer 31, first copper foil layer 21, polyimide substrate layer 11 and the second copper foil layer 22, also can only through first copper foil layer 21, polyimide substrate layer 11, second copper foil layer 22 and the second absorbing material layer 32.Still can through first absorbing material layer 31, first copper foil layer 21, polyimide substrate layer 11, second copper foil layer 22 and the second absorbing material layer 32.
The utility model is by techniques such as development, exposure, etchings, and adopt modified epoxy as interlayer pressure and material, vacuum pressing-combining forms.
Above-described embodiment, just preferred embodiment of the present utility model, not be used for limiting the utility model practical range, therefore all equivalences done with the feature described in the utility model claim and principle change or modify, and all should be included within the utility model right.
Claims (4)
1. an electromagnetic shielding copper-clad plate, is characterized in that, described electromagnetic shielding copper-clad plate comprises the absorbing material layer, copper foil layer and the polyimide substrate layer that stack gradually, the thickness≤0.1mm of described copper-clad plate.
2. electromagnetic shielding copper-clad plate as claimed in claim 1, is characterized in that, described electromagnetic shielding copper-clad plate comprises the first absorbing material layer, the first copper foil layer, polyimide substrate layer, the second copper foil layer and the second absorbing material layer that stack gradually.
3. electromagnetic shielding copper-clad plate as claimed in claim 2, it is characterized in that, also at least be provided with the hole that connects breakover element between described first copper foil layer and the second copper foil layer, one end, described hole and the first copper foil layer offset, and the other end offsets through described polyimide substrate layer and the second copper foil layer.
4. the application of electromagnetic shielding copper-clad plate in high speed FPC wiring board, is characterized in that, requires the different circuit of etching and obtain by the electromagnetic shielding copper-clad plate in claim 1-3 described in any one according to difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520576733.XU CN204810807U (en) | 2015-07-31 | 2015-07-31 | Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520576733.XU CN204810807U (en) | 2015-07-31 | 2015-07-31 | Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810807U true CN204810807U (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520576733.XU Active CN204810807U (en) | 2015-07-31 | 2015-07-31 | Electromagnetic shield copper -clad plate and application in high -speed FPC circuit board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204810807U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407626A (en) * | 2015-12-02 | 2016-03-16 | 浙江九通电子科技有限公司 | Embedded diode antenna plate of polyimide foam substrate and production technology of embedded diode antenna plate |
| CN109413975A (en) * | 2018-11-05 | 2019-03-01 | 深圳市睿晖新材料有限公司 | A kind of frequency electromagnetic waves shielding material |
| CN112531304A (en) * | 2020-10-22 | 2021-03-19 | 北京无线电测量研究所 | Ferrite switch assembly cascade feed network and forming method thereof |
| US11224121B2 (en) | 2018-03-16 | 2022-01-11 | Huawei Technologies Co., Ltd. | Assembly for electro-magnetic interference shielding and method |
-
2015
- 2015-07-31 CN CN201520576733.XU patent/CN204810807U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407626A (en) * | 2015-12-02 | 2016-03-16 | 浙江九通电子科技有限公司 | Embedded diode antenna plate of polyimide foam substrate and production technology of embedded diode antenna plate |
| CN105407626B (en) * | 2015-12-02 | 2018-03-20 | 浙江九通电子科技有限公司 | Polyimides foamed substrate embedded type diode antenna plate and its production technology |
| US11224121B2 (en) | 2018-03-16 | 2022-01-11 | Huawei Technologies Co., Ltd. | Assembly for electro-magnetic interference shielding and method |
| CN109413975A (en) * | 2018-11-05 | 2019-03-01 | 深圳市睿晖新材料有限公司 | A kind of frequency electromagnetic waves shielding material |
| CN112531304A (en) * | 2020-10-22 | 2021-03-19 | 北京无线电测量研究所 | Ferrite switch assembly cascade feed network and forming method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |