CN204800102U - Melt solder pot - Google Patents
Melt solder pot Download PDFInfo
- Publication number
- CN204800102U CN204800102U CN201520420554.7U CN201520420554U CN204800102U CN 204800102 U CN204800102 U CN 204800102U CN 201520420554 U CN201520420554 U CN 201520420554U CN 204800102 U CN204800102 U CN 204800102U
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- Prior art keywords
- pot body
- casing
- housing
- heat
- pot
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Abstract
The utility model provides a melt solder pot, includes the casing and sets up heating coil layer, switch and the heating power regulation gear on the casing that its main technical characteristics lies in: the casing on be equipped with the heating panel, the heating panel is connected through the screw with the casing and leave the heat dissipation clearance between heating panel and the casing, has seted up the through -hole on heating panel and the casing, the assembly of the pot body is in the through -hole, the bottom of the pot body that the casing corresponds is provided with a pot body backup pad, is equipped with a pot body fixed plate in the backup pad, is equipped with the fastening heat -conducting plate between the pot body and the pot body fixed plate, fastening heat -conducting plate inside is provided with insulating heat transfer layer, is equipped with the heating coil layer in the insulating heat transfer layer, casing and heating panel leave enough heat dissipation clearances and be provided with the louvre simultaneously on the casings to prevent to arouse that the casing is overheated, heating coil layer outside is equipped with insulating heat transfer layer and fastening heat -conducting plate respectively, has prevented the electric shock risk promptly, and it is even to make the pot body be heated again.
Description
Technical field
The utility model relates to melting field, particularly a kind of solder pot.
Background technology
In known technical field, solder pot have volume little, easily put, adopt special circuit, thermoregulation range large, automatically can keep constant temperature, accuracy is high, power consumption is little, energy-conservation, the advantage such as quick heating, long service life, solder pot pot courage is all generally have high-quality titanium plate to make, and has the characteristics such as corrosion resistance, acid-resisting, Non-Dewetting.Solder pot is widely used in the aspects such as transformer, coil pin are zinc-plated, the production line of electronic transformer, electric wire.Traditional solder pot crucible structure that is general and common lab is similar, need the mode of open firing by external or electric heating tube in drier, due to extreme temperatures, at present solder pot on the market its to take and placement exists hidden danger, how the structure of interior heating is reasonably set and realizes the important topic that quick heat radiating and isolated heat transfer become product.
Utility model content
For the deficiencies in the prior art, the utility model aims to provide a kind of solder pot, has structure simple, homogeneous heating, the feature of good heat dissipation.
To achieve these goals, the utility model adopts following technical scheme:
A kind of solder pot, comprise housing and be arranged on the heater wire ring layer on housing, power switch and heating power regulation stall, heater wire ring layer is connected with power switch and heating power regulation stall by circuit board, hull outside is provided with power interface, its technical characteristics is: described housing is provided with heat sink, heat sink and housing are connected by screw and leave gap of dispelling the heat between heat sink and housing, heat sink and housing offer through hole, pot body is assemblied in through hole, the bottom of the pot body that housing is corresponding is provided with a pot body gripper shoe, gripper shoe is provided with a pot body fixed head, fastening heat-conducting plate is provided with between pot body and pot body fixed head, fastening heat-conducting plate inside is provided with thermal insulation layer, heater wire ring layer is provided with in thermal insulation layer.
Described a kind of solder pot, its principal character is also: the gap between described heat sink and housing is preferably 2-12mm.
Described a kind of solder pot, its principal character is also: the outer of described pot body is bent downwardly, and is convenient to be fastened on heat sink.
Described a kind of solder pot, its principal character is also: the sidewall of described housing is provided with ventilating heat dissipating hole.
The beneficial effects of the utility model are:
Housing and heat sink leave gap of enough dispelling the heat and on housing, are provided with louvre simultaneously, thus prevent from causing housing overheated; Heater wire ring layer outside is respectively equipped with thermal insulation layer and fastening heat-conducting plate, namely prevents electric shock risk, makes again a pot body be heated evenly.
Accompanying drawing explanation
Fig. 1 is assembly structure schematic diagram of the present utility model;
Fig. 2 is that the A-A of Fig. 1 is to sectional structure schematic diagram;
Fig. 3 is the left TV structure schematic diagram of Fig. 1;
Fig. 4 is casing assembling structure schematic diagram.
Detailed description of the invention
Below with reference to accompanying drawing, the utility model will be further described, it should be noted that, the present embodiment, premised on the technical program, give detailed embodiment and concrete operating process, but protection domain of the present utility model is not limited to the present embodiment.
As Fig. 1, 2, 3, shown in 4, a kind of solder pot, comprise housing 2 and be arranged on the heater wire ring layer 12 on housing 2, power switch 8 and heating power regulation stall 9, heater wire ring layer 12 is connected with power switch 8 and heating power regulation stall 9 by circuit board, housing 2 outside is provided with power interface 10, its technical characteristics is: described housing 2 is provided with heat sink 7, heat sink 7 and housing 2 are connected by screw 6 and leave gap of dispelling the heat between heat sink 7 and housing 2, heat sink 7 and housing 2 offer through hole, pot body 1 is assemblied in through hole, the bottom of the pot body 1 of housing 2 correspondence is provided with a pot body gripper shoe 5, gripper shoe 5 is provided with a pot body fixed head 4, fastening heat-conducting plate 3 is provided with between pot body 1 and pot body fixed head 4, fastening heat-conducting plate 3 inside is provided with thermal insulation layer 13, heater wire ring layer 12 is provided with in thermal insulation layer 13.
Gap between heat sink 7 and housing 2 is preferably 2-12mm.
The outer of pot body 1 is bent downwardly, and is convenient to be fastened on heat sink 7.
The sidewall of housing 2 is provided with ventilating heat dissipating hole 11.
The utility model, owing to being provided with heat sink 7 and leaving gap of enough dispelling the heat, can not cause housing 2 overheated; Heater wire ring layer 12 outside is respectively equipped with thermal insulation layer 13 and fastening heat-conducting plate 3, namely prevents electric shock risk, makes again pot body 1 be heated evenly.
For a person skilled in the art, according to above technical scheme and design, various corresponding change and distortion can be provided, and all these change and distortion all should be included within the protection domain of the utility model claim.
Claims (3)
1. a solder pot, comprise housing (2) and be arranged on the heater wire ring layer (12) on housing (2), power switch (8) and heating power regulation stall (9), heater wire ring layer (12) is connected with power switch (8) and heating power regulation stall (9) by circuit board, housing (2) outside is provided with power interface (10), its technical characteristics is: described housing (2) is provided with heat sink (7), heat sink (7) and housing (2) are connected by screw (6) and leave gap of dispelling the heat between heat sink (7) and housing (2), heat sink (7) and housing (2) offer through hole, pot body (1) is assemblied in through hole, the bottom of the pot body (1) that housing (2) is corresponding is provided with a pot body gripper shoe (5), gripper shoe (5) is provided with a pot body fixed head (4), fastening heat-conducting plate (3) is provided with between pot body (1) and pot body fixed head (4), fastening heat-conducting plate (3) inside is provided with thermal insulation layer (13), heater wire ring layer (12) is provided with in thermal insulation layer (13).
2. a kind of solder pot according to claim 1, its principal character is also: the gap between heat sink (7) and housing (2) is preferably 2-12mm.
3. a kind of solder pot according to claim 1, its principal character is also: the outer of pot body (1) is bent downwardly, and is convenient to be fastened on heat sink (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520420554.7U CN204800102U (en) | 2015-06-18 | 2015-06-18 | Melt solder pot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520420554.7U CN204800102U (en) | 2015-06-18 | 2015-06-18 | Melt solder pot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204800102U true CN204800102U (en) | 2015-11-25 |
Family
ID=54584993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520420554.7U Expired - Fee Related CN204800102U (en) | 2015-06-18 | 2015-06-18 | Melt solder pot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204800102U (en) |
-
2015
- 2015-06-18 CN CN201520420554.7U patent/CN204800102U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20180618 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |