CN204771016U - Automatic winding displacement welding machine - Google Patents

Automatic winding displacement welding machine Download PDF

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Publication number
CN204771016U
CN204771016U CN201520394801.0U CN201520394801U CN204771016U CN 204771016 U CN204771016 U CN 204771016U CN 201520394801 U CN201520394801 U CN 201520394801U CN 204771016 U CN204771016 U CN 204771016U
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guide rail
rosin
bonding machine
fixture
detent mechanism
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CN201520394801.0U
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Chinese (zh)
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叶梗楠
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Huizhou xiwensi Technology Co., Ltd
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Huizhou Sevenus Electronic Technology Co Ltd
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Abstract

The utility model discloses an automatic winding displacement welding machine, including first guide rail, anchor clamps, anchor clamps are used for centre gripping printed circuit board, and anchor clamps can be followed first guide rail slides, the welding machine, the welding machine is neighbouring first guide rail, and the welding machine is located the top of anchor clamps, power unit, power unit is used for promoting anchor clamps are followed first guide rail slides, a positioning mechanism, a positioning mechanism set up in in the first guide rail, be used for blockking the anchor clamps motion, wherein, a positioning mechanism with the welding machine is corresponding, and a positioning mechanism with power unit and welding machine are connected. In this way, the utility model discloses can brush rosin, automatic weld to printed circuit board's automation, need not to want artifical the participation, automated procedures are higher, work efficiency is higher.

Description

A kind of automatic winding displacement bonding machine
Technical field
The utility model relates to welding technology field, particularly a kind of winding displacement automatic winding displacement bonding machine.
Background technology
Printed circuit board (PCB) is integrated with various electric elements, need to use winding displacement connect to carry out connection between circuit board, the bond technology of current winding displacement is low due to its processing cost, welds firmly to be widely adopted.But current bonding machine will paste line, bonding wire, the operations such as inspection divide operation, after operation is separated, existence repeatedly repeats operation of taking, and exist and repeat action waste in man-hour of taking, and product does not weld after posting winding displacement, easily cause displacement, therefore in producing, procedure quality is lower.
Winding displacement welding uses bonding machine usually, wherein, the workflow of bonding machine is: to be manually placed into by the printed circuit board (PCB) producing tin point on fixture and to use the locating dowel auxiliary para of fixture to install smooth, recycle positioner location and installation on a printed circuit to need the winding displacement of welding and utilize the gum at winding displacement back to paste to fix, after positioning welding object, hand brush rosin cream or rosin liquid are as auxiliary solder flux, then manually opened bonding machine, the welding interval of bonding machine divides 3 stages, 1) namely warm-up phase rises to 180 DEG C from room temperature, completes in usual 3 seconds; 2) welding stage and temperature rise to 285 DEG C from 180 DEG C, intensification is completed in 2 seconds, and maintaining welding in 3 seconds, the scolding tin in the soldering tip high-temperature digestion board pads of welding stage bonding machine is to liquid and to carry out welding along winding displacement and circuit loop wetting, and formation is welded to connect; 3) namely cooling section temperature is reduced to room temperature from 285 DEG C, completes in 2 seconds, and after completing cooling, soldering tip is upwards promoted to elemental height, and fixture moves, and operator takes out product, and whole welding action completes.
In sum, need manual hand manipulation's bonding machine to weld printed circuit board (PCB), and place circuit board, paste the operation such as winding displacement, brush rosin liquid and also need manual work, inefficiency.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of automatic winding displacement bonding machine, and can weld winding displacement operation to printed circuit board (PCB) and realize automatic brush rosin, automatic welding, need not manually participate in, automated procedures are higher, operating efficiency is higher.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of automatic winding displacement bonding machine, comprise the first guide rail; Fixture, described fixture is used for clamping printed circuit board, and described fixture can along described first slide; Actuating unit, described actuating unit is for promoting described fixture along described first slide; Bonding machine, contiguous described first guide rail of described bonding machine, and described bonding machine is positioned at the top of described fixture; First detent mechanism, described first detent mechanism is arranged in described first guide rail, and described first detent mechanism is connected with described actuating unit and bonding machine, wherein, described first detent mechanism is corresponding with described bonding machine, and described first detent mechanism is used for locating described fixture in described clamp movement to during the below of described bonding machine.
Wherein, described automatic winding displacement bonding machine also comprises rosin liquid coating machine and the second detent mechanism; Contiguous described first guide rail of described rosin liquid coating machine, and described rosin liquid coating machine is positioned at the top of described fixture; Described second detent mechanism is arranged in described first guide rail, and described second detent mechanism is connected with described actuating unit and rosin liquid coating machine, wherein, described second detent mechanism is corresponding with rosin liquid coating machine, and described second detent mechanism is used for locating described fixture in described clamp movement to during the below of described rosin liquid coating machine.
Wherein, described rosin liquid coating machine comprises: base, contiguous described first guide rail of described base, and described base is arranged at rosin groove, and described rosin groove is for loading rosin liquid; Telescoping mechanism, described telescoping mechanism comprises telescoping mechanism body and telescopic arm, described telescoping mechanism body is fixed on described base, and described telescopic arm is fixed on described telescoping mechanism body, and described telescopic arm is positioned at the top of described rosin groove and the first guide rail; Rotating mechanism, described rotating mechanism is fixed on described telescopic arm; Sweep bar, described in sweep bar one end be fixed on described rotating mechanism, and described in sweep bar the other end be provided with hairbrush.
Wherein, described rosin liquid coating machine also comprises rosin case, carrier pipe and switch; Described rosin case is fixed on described base, and described rosin case is positioned at the top of described rosin groove; One end of described carrier pipe connects described rosin case, and the other end inserts in described rosin groove; Described switch-linear hybrid is on described carrier pipe.
Wherein, described rosin liquid coating machine comprises liquid level inductor, and described liquid level inductor is fixed in described rosin groove, and described liquid level inductor is connected with described switch.
Wherein, described switch is magnetic valve.
Wherein, described fixture is provided with multiple clamping position, wherein, and a described corresponding printed circuit board (PCB) in clamping position; Described rotating mechanism and to sweep bar be multiple, and described rotating mechanism and sweep bar one_to_one corresponding; The quantity of described bonding machine is multiple.
Wherein, described automatic winding displacement bonding machine also comprises the second guide rail, the first transfer mechanism and the second transfer mechanism; Described first transfer mechanism is connected with one end of the first guide rail and the second guide rail respectively, and described first transfer mechanism is used for described fixture to move to the second guide rail from the first guide rail; Described second transfer mechanism is connected with the other end of the first guide rail and the second guide rail respectively, and described second transfer mechanism is used for described fixture to move to the first guide rail from described second guide rail; Described actuating unit is also for promoting fixture along described second slide.
Wherein, described automatic winding displacement bonding machine also comprises the 3rd detent mechanism, and described 3rd detent mechanism is arranged on described second guide rail, and described 3rd detent mechanism is connected with described actuating unit.
Wherein, described first detent mechanism, the second detent mechanism and the 3rd detent mechanism are cylinder.
The beneficial effects of the utility model are: the situation being different from prior art, fixture for clamping printed circuit board is positioned over the first guide rail by the utility model, fixture is driven to slide along the first rail by actuating unit, when fixture slides into the below of bonding machine, first detent mechanism stops clamp movement, bonding machine welds the printed circuit board (PCB) be positioned on fixture, and after welding completes, fixture continues to motion, the below that next fixture enters bonding machine is welded, realize the automation of printed circuit board (PCB) welding, need not manually participate in, operating efficiency is higher.
Accompanying drawing explanation
Fig. 1 is the top view of the utility model automatic winding displacement bonding machine embodiment;
Fig. 2 is the side view of the utility model automatic winding displacement bonding machine embodiment.
Detailed description of the invention
For the ease of understanding the utility model, below in conjunction with the drawings and specific embodiments, the utility model is described in detail.It should be noted that, when element is stated " being fixed on " another element, it can directly on another element or can there is one or more element placed in the middle therebetween.When an element is stated " connection " another element, it can be directly connected to another element or can there is one or more element placed in the middle therebetween.The term " vertical " that this description uses, " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology of using of this description and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in description of the present utility model in this description just in order to describe concrete embodiment is not for limiting the utility model.The term "and/or" that this description uses comprises arbitrary and all combinations of one or more relevant Listed Items.
Refer to figure, automatic winding displacement bonding machine 20 comprises the first guide rail 21, fixture 22, bonding machine 23, actuating unit (not shown) and the first detent mechanism 24.
Fixture 22 is for clamping printed circuit board, and fixture 22 can slide along the first guide rail 21.Contiguous first guide rail 21 of bonding machine 23, and bonding machine 23 is positioned at the top of fixture 22.Actuating unit slides along the first guide rail 21 for promoting fixture 22, first detent mechanism 24 is arranged in the first guide rail 21, and the first detent mechanism 24 is connected with actuating unit and bonding machine 23, wherein, first detent mechanism 24 is corresponding with bonding machine 23, and the first detent mechanism 24 is for the positioning fixture 22 when fixture 22 moves to the below of bonding machine 23.It should be noted that: the first detent mechanism 24 positioning fixture 22 refer to fixture 22 move a certain position time, the first detent mechanism 24 stationary fixture 22, can not travel forward to make fixture 22.The know-why of the automatic welding in present embodiment is: when fixture 22 moves to the first detent mechanism 24 along the first guide rail 21, first detent mechanism 24 detects fixture 22, and stop that fixture 22 continues to move fortune forward, bonding machine 23 welds the printed circuit board (PCB) be positioned on fixture 22, and after welding completes, first detent mechanism 24 unclamps, no longer stop fixture 22, actuating unit continues to promote fixture 22 and travels forward, realize the automatic welding to printed circuit board (PCB), do not need artificial participation, operating efficiency is higher.
Automatic winding displacement bonding machine 20 also comprises rosin liquid coating machine 25 and the second detent mechanism 26.Contiguous first guide rail 21 of rosin liquid coating machine 25, and rosin liquid coating machine 25 is positioned at the top of fixture 22.Second detent mechanism is arranged in the first guide rail, and described second detent mechanism 26 is connected with described actuating unit and rosin liquid coating machine 25, wherein, second detent mechanism 26 is corresponding with rosin liquid coating machine 25, and the second detent mechanism 26 is for the positioning fixture 22 when described fixture 22 moves to the below of rosin liquid coating machine 25.It should be noted that: the second detent mechanism 26 positioning fixture 22 refer to fixture 22 move a position time, the second detent mechanism 26 stationary fixture 22, can not travel forward to make fixture 22.The know-why of the automatic brush rosin liquid in present embodiment is: when fixture 22 moves to the second detent mechanism 26 along the first guide rail 21, second detent mechanism 26 detects fixture 22, and stop that fixture 22 continues to move fortune forward, rosin liquid coating machine 25 is to the printed circuit scrubbing brush rosin liquid be positioned on fixture 22, and after rosin liquid brushing completes, second detent mechanism 26 unclamps, no longer stop fixture 22, actuating unit continues to promote fixture 22 and travels forward, realize the automatic painting rosin liquid to printed circuit board (PCB), do not need artificial participation, operating efficiency is higher.
It should be noted that: in order to improve printed circuit board (PCB) when welding, scolding tin can firmly weld on a printed circuit, usually coats rosin liquid at the pad of printed circuit board (PCB), and then weld, therefore, in the present embodiment, preferably, bonding machine 23 is positioned at the front of rosin liquid coating machine 25 along fixture 22 direction of motion, specifically, when fixture 22 slides along the first guide rail 21, first by rosin liquid coating machine 25, again by bonding machine 23, realize first brush rosin and weld again; Certainly, also can arrange two rosin liquid coating machines 25, bonding machine 23 is arranged between two rosin coating machines, realizes coating rosin liquid before and after welding.
Rosin liquid coating machine 25 comprises base 251, telescoping mechanism 252, rotating mechanism 253 and sweeps bar 254.Contiguous first guide rail 21 of base 251, and base 251 is arranged at rosin groove, rosin groove is for loading rosin liquid.Telescoping mechanism 252 comprises telescoping mechanism body and telescopic arm, and telescoping mechanism body is fixed on base 251, and telescopic arm is fixed on telescoping mechanism body, and telescopic arm is positioned at the top of rosin groove and the first guide rail 21.Rotating mechanism 253 is fixed on telescopic arm, and rotating mechanism 253 is fixed in the one end of sweeping bar 254, and the other end sweeping bar 254 is provided with hairbrush.Telescopic arm, when flexible, realize sweeping bar 254 and switches between fixture 22 and rosin groove.Rosin liquid coating machine 25 to the detailed process of printed circuit board (PCB) brushing rosin liquid on fixture 22 is: telescopic arm shrinks, make to sweep the top that bar 254 is recycled to rosin groove, rotating mechanism 253 rotates, and makes hairbrush insert rosin groove, draw rosin liquid, then rotating mechanism 253 rotates lifting first hairbrush.Telescopic arm stretches out, make to sweep the top that bar 254 stretches out the printed circuit board (PCB) being positioned at fixture 22, rotating mechanism 253 driving is swept bar 254 and is rotated, rosin liquid is brushed to printed circuit board (PCB) to make hairbrush, or, rotating mechanism 253 drives to sweep after bar 254 rotates predetermined angular and stops, and printed circuit board (PCB) is after hairbrush, and hairbrush brushes rosin liquid toward printed circuit board (PCB).
Add rosin liquid conveniently to rosin groove, rosin liquid coating machine 25 also comprises rosin case (sign), carrier pipe (sign) and switch (sign).Rosin case is fixed on base 251, and rosin case is positioned at the top of rosin groove, and one end of carrier pipe connects rosin case, and the other end inserts in rosin groove, and switch-linear hybrid is on carrier pipe.Rosin case is for loading rosin liquid, and the spatial accommodation of rosin case is much larger than the spatial accommodation of rosin groove, when not having rosin liquid in rosin groove, opens switch, and the rosin liquid in rosin case flows in rosin groove along carrier pipe, convenient to rosin groove interpolation rosin liquid.
In order to realize adding rosin liquid from trend rosin groove, rosin liquid coating machine also comprises liquid level inductor (sign), and the first liquid level inductor is fixed in rosin groove, and liquid level inductor is connected with switch.When liquid level inductor detects that rosin liquid in rosin groove is lower than the first predetermined altitude, gauge tap is opened, and the rosin liquid detected in rosin groove when liquid level inductor reaches the second predetermined altitude, and gauge tap cuts out.In the present embodiment, switch is preferably magnetic valve.
Further, automatic winding displacement bonding machine 20 also comprises the second guide rail 36, first transfer mechanism 27 and the second transfer mechanism 28.First transfer mechanism 27 is connected with one end of the first guide rail 21 and the second guide rail 36 respectively, first transfer mechanism 27 is for moving to the second guide rail 36 by fixture 22 from the first guide rail 21, second transfer mechanism 28 is connected with the other end of the first guide rail 21 and the second guide rail 36 respectively, second transfer mechanism 28 is for moving to the first guide rail 21 by fixture 22 from the second guide rail 36, actuating unit also slides along the second guide rail 36 for promoting fixture 22, thus realizes fixture 22 and can circulate in the first guide rail 21 and the second guide rail 36.
Automatic winding displacement bonding machine 20 also comprises the 3rd detent mechanism (not shown) and the 4th detent mechanism, and the 3rd detent mechanism is arranged on the second guide rail 36, and the 3rd detent mechanism is connected with actuating unit.When fixture 22 moves to the 3rd detent mechanism along the second guide rail 36,3rd detent mechanism detects fixture 22, and stop that fixture 22 continues to move fortune forward, staff takes off from fixture 22 printed circuit board (PCB) welded, printed circuit board (PCB) new is again arranged on fixture 22, continues to weld new printed circuit board (PCB).4th detent mechanism is arranged on the first guide rail or the second guide rail, when clamp movement is to the 4th detent mechanism, 4th detent mechanism positioning fixture, staff can carry out subsides winding displacement to the printed circuit board (PCB) on fixture, certainly, fixture can be provided with location assistant strip, pastes winding displacement to facilitate staff.
What deserves to be explained is: in the present embodiment, fixture 22 is provided with multiple clamping position, wherein, a corresponding printed circuit board (PCB) in clamping position, rotating mechanism 253 and sweep bar 254 for multiple, and rotating mechanism 253 and sweep bar 254 one_to_one corresponding, the quantity of bonding machine 23 is multiple, to realize carrying out brush rosin liquid and welding to multiple printed circuit board (PCB) simultaneously, increase work efficiency.
In the utility model embodiment, fixture for clamping printed circuit board is positioned over the first guide rail, fixture is driven to slide along the first rail by actuating unit, when fixture slides into the below of bonding machine, first detent mechanism 24 stops clamp movement, bonding machine welds the printed circuit board (PCB) be positioned on fixture, and after welding completes, fixture continues to motion, the below that next fixture enters bonding machine is welded, and realizes the automation of printed circuit board (PCB) welding, need not manually participate in, automated procedures are higher, and operating efficiency is higher.
It should be noted that, preferably embodiment of the present utility model is given in description of the present utility model and accompanying drawing thereof, but, the utility model can be realized by many different forms, be not limited to the embodiment described by this description, these embodiments not as the extra restriction to the utility model content, provide the object of these embodiments be make the understanding of disclosure of the present utility model more comprehensively thorough.Further, above-mentioned each technical characteristic continues combination mutually, is formed not at above-named various embodiment, is all considered as the scope that the utility model description is recorded; Further, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to the utility model claims.

Claims (10)

1. an automatic winding displacement bonding machine, is characterized in that, comprising:
First guide rail;
Fixture, described fixture is used for clamping printed circuit board, and described fixture can along described first slide;
Actuating unit, described actuating unit is for promoting described fixture along described first slide;
Bonding machine, contiguous described first guide rail of described bonding machine, and described bonding machine is positioned at the top of described fixture;
First detent mechanism, described first detent mechanism is arranged in described first guide rail, and described first detent mechanism is connected with described actuating unit and bonding machine, wherein, described first detent mechanism is corresponding with described bonding machine, and described first detent mechanism is used for locating described fixture in described clamp movement to during the below of described bonding machine.
2. described automatic winding displacement bonding machine according to claim 1, is characterized in that,
Described automatic winding displacement bonding machine also comprises rosin liquid coating machine and the second detent mechanism;
Contiguous described first guide rail of described rosin liquid coating machine, and described rosin liquid coating machine is positioned at the top of described fixture;
Described second detent mechanism is arranged in described first guide rail, and described second detent mechanism is connected with described actuating unit and rosin liquid coating machine, wherein, described second detent mechanism is corresponding with rosin liquid coating machine, and described second detent mechanism is used for locating described fixture in described clamp movement to during the below of described rosin liquid coating machine.
3. described automatic winding displacement bonding machine according to claim 2, is characterized in that,
Described rosin liquid coating machine comprises:
Base, contiguous described first guide rail of described base, and described base is arranged at rosin groove, described rosin groove is for loading rosin liquid;
Telescoping mechanism, described telescoping mechanism comprises telescoping mechanism body and telescopic arm, described telescoping mechanism body is fixed on described base, and described telescopic arm is fixed on described telescoping mechanism body, and described telescopic arm is positioned at the top of described rosin groove and the first guide rail;
Rotating mechanism, described rotating mechanism is fixed on described telescopic arm;
Sweep bar, described in sweep bar one end be fixed on described rotating mechanism, and described in sweep bar the other end be provided with hairbrush.
4. automatic winding displacement bonding machine according to claim 3, is characterized in that,
Described rosin liquid coating machine also comprises rosin case, carrier pipe and switch;
Described rosin case is fixed on described base, and described rosin case is positioned at the top of described rosin groove;
One end of described carrier pipe connects described rosin case, and the other end inserts in described rosin groove;
Described switch-linear hybrid is on described carrier pipe.
5. automatic winding displacement bonding machine according to claim 4, is characterized in that,
Described rosin liquid coating machine comprises liquid level inductor, and described liquid level inductor is fixed on above described rosin groove, and described liquid level inductor is connected with described switch.
6. automatic winding displacement bonding machine according to claim 5, is characterized in that,
Described switch is magnetic valve.
7. automatic winding displacement bonding machine according to claim 3, is characterized in that,
Described fixture is provided with multiple clamping position, wherein, and a described corresponding printed circuit board (PCB) in clamping position;
Described rotating mechanism and to sweep bar be multiple, and described rotating mechanism and sweep bar one_to_one corresponding;
The quantity of described bonding machine is multiple.
8. described automatic winding displacement bonding machine according to claim 2, is characterized in that,
Described automatic winding displacement bonding machine also comprises the second guide rail, the first transfer mechanism and the second transfer mechanism;
Described first transfer mechanism is connected with one end of the first guide rail and the second guide rail respectively, and described first transfer mechanism is used for described fixture to move to the second guide rail from the first guide rail;
Described second transfer mechanism is connected with the other end of the first guide rail and the second guide rail respectively, and described second transfer mechanism is used for described fixture to move to the first guide rail from described second guide rail;
Described actuating unit is also for promoting fixture along described second slide.
9. described automatic winding displacement bonding machine according to claim 8, is characterized in that,
Described automatic winding displacement bonding machine also comprises the 3rd detent mechanism, and described 3rd detent mechanism is arranged on described second guide rail, and described 3rd detent mechanism is connected with described actuating unit.
10. described automatic winding displacement bonding machine according to claim 1, is characterized in that,
Described first detent mechanism, the second detent mechanism and the 3rd detent mechanism are cylinder.
CN201520394801.0U 2015-06-09 2015-06-09 Automatic winding displacement welding machine Active CN204771016U (en)

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CN201520394801.0U CN204771016U (en) 2015-06-09 2015-06-09 Automatic winding displacement welding machine

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019140842A1 (en) * 2018-01-19 2019-07-25 深圳市海目星激光智能装备股份有限公司 Rosin recycling system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019140842A1 (en) * 2018-01-19 2019-07-25 深圳市海目星激光智能装备股份有限公司 Rosin recycling system

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Effective date of registration: 20170222

Address after: 516006 Guangdong province Huizhou City Zhongkai high tech Zone District No. 32 building third layer A

Patentee after: Huizhou City West Evans Industrial Co. Ltd.

Address before: 516006 Guangdong province Huizhou City Zhongkai high tech Zone District No. 32 Building fourth layer A

Patentee before: HUIZHOU SEVENUS ELECTRONIC TECHNOLOGY CO., LTD.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: No.3, Hua'an Road, No.32 community, Zhongkai high tech Zone, Huizhou City, Guangdong Province

Patentee after: Huizhou xiwensi Technology Co., Ltd

Address before: 516006 the third floor of building a, No.32 community, Zhongkai high tech Zone, Huizhou City, Guangdong Province

Patentee before: HUIZHOU SEVENUS INDUSTRIAL Co.,Ltd.