CN204759454U - Optics fingerprint sensor - Google Patents
Optics fingerprint sensor Download PDFInfo
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- CN204759454U CN204759454U CN201520517475.8U CN201520517475U CN204759454U CN 204759454 U CN204759454 U CN 204759454U CN 201520517475 U CN201520517475 U CN 201520517475U CN 204759454 U CN204759454 U CN 204759454U
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Abstract
The utility model provides an optics fingerprint sensor, includes: the base plate, the pel array is located on the substrate surface, the chip is located on the substrate surface, the district is bound to the flexble printed circuit board, is located on the substrate surface, the pel array is located the chip with the flexble printed circuit board is bound between the district. Optics fingerprint sensor's structural performance improves.
Description
Technical field
The utility model relates to optical finger print identification field, particularly relates to a kind of optical fingerprint sensor.
Background technology
Fingerprint imaging recognition technology is the fingerprint image being collected human body by fingerprint sensor, then compares with the existing fingerprint imaging information in system, whether carrys out correct judgment, and then realize the technology of identification.Due to the convenience that it uses, and the uniqueness of somatic fingerprint, fingerprint identification technology is widely used in every field.The gate control system and the consumer product area such as PC and mobile phone etc. of the such as field of safety check such as public security bureau and customs, building.The implementation of fingerprint imaging technique has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Comparatively speaking, optical image technology imaging effect is relatively better, and equipment cost is relatively low.
As shown in Figure 1, existing optical fingerprint sensor module is made up of backlight 1, optical fingerprint sensor 2, protective seam 3 and shell etc.When gathering fingerprint image, human body finger 4 is positioned on protective seam 3; (in Fig. 1, each arrow upwards represents emergent light 11 to the emergent light 11 of backlight 1, the unified mark of whole arrow is comprised with dotted line circle in figure) through optical fingerprint sensor 2 and protective seam 3, occur to reflect and transmission at the contact interface of human body finger 4 with protective seam 3; Reflected light 12 (in Fig. 1, each downward arrow represents that comprising the unification of whole arrow with dotted line circle in reflected light 12, figure marks), through protective seam 3, is irradiated on optical fingerprint sensor 2; The chip (not shown) of optical fingerprint sensor 2 inside carries out opto-electronic conversion and signal transacting, realizes the collection of fingerprint image.Because human body finger 4 and the contact portion feature of optical fingerprint sensor 3 reflect the fingerprint characteristic of human body, and the feature of this contact portion directly can affect the feature of reflected light 12, therefore, the image that optical fingerprint sensor 2 collects directly reflects the feature of somatic fingerprint.
The content of more associated optical fingerprint sensors can be the Chinese utility model patent of CN203405831U with reference to publication number.
In existing optical fingerprint sensor module, the structural design of optical fingerprint sensor haves much room for improvement.
Utility model content
The problem that the utility model solves is to provide a kind of optical fingerprint sensor, to improve the structural behaviour of optical fingerprint sensor.
For solving the problem, the utility model provides a kind of optical fingerprint sensor, comprising:
Substrate;
Pel array, is positioned on described substrate surface;
Chip, is positioned on described substrate surface;
Flexible printed circuit board binding district, is positioned on described substrate surface;
Described pel array is between described chip and described flexible printed circuit board binding district.
Optionally, also comprise connecting line, be positioned on described substrate surface, described chip is electrically connected to described flexible printed circuit board binding district by described connecting line; On described substrate surface, described chip is positioned on the left of described pel array, and described flexible printed circuit board binding district is positioned on the right side of described pel array, and described connecting line is through one of them side of the upper side and lower side of described pel array.
Optionally, the driving circuit be positioned on described substrate surface is also comprised; On described substrate surface, described driving circuit is positioned at one of them side of the upper side and lower side of described pel array, and has at least a described connecting line to pass through from described driving circuit.
Optionally, described driving circuit comprises multiple shift unit, and each shift unit comprises multiple transistor, and have at least a described connecting line from described shift unit at least one described in pass through above transistor.
Optionally, described connecting line above described transistor is arranged in simultaneously as the light shield layer of described driving circuit.
Optionally, the described connecting line be positioned at above described transistor comprise power and ground at least one of them.
Optionally, the materials and structures of described connecting line is identical with the materials and structures of conductive layer at least part of in described driving circuit.
Optionally, the material of described connecting line is Mo, Al or ITO; Described connecting line is single layer structure or sandwich construction.
Optionally, the thickness range of described connecting line is 0.1 μm to 5 μm.
Optionally, described optical fingerprint sensor also comprises connecting line and driving circuit, is all positioned on described substrate surface; On described substrate surface, described chip is positioned on the left of described pel array, described flexible printed circuit board binding district is positioned on the right side of described pel array, and described driving circuit is positioned at upside or the downside of described pel array, and described pel array is between described connecting line and described driving circuit.
Compared with prior art, the technical solution of the utility model has the following advantages:
In the technical solution of the utility model, pel array is arranged between chip and flexible printed circuit board binding district, namely chip and flexible printed circuit board binding district lay respectively at pel array both sides, therefore, on the substrate surface of whole optical fingerprint sensor, the area discrepancy of pel array both sides reduces, pel array both sides almost symmetry, therefore when designing the assembling of whole module, when not increasing one-piece construction size, assembling difficulty can be made to reduce, and reduce the design difficulty of follow-up corresponding protecting sheathing, improve the reliability after module group assembling, prevent modular structure from occurring defect because both sides are seriously inharmonious, and the outward appearance of respective optical fingerprint sensor module can be made more regular attractive in appearance.
Accompanying drawing explanation
The structural representation of the existing a kind of optical fingerprint sensor module of Fig. 1;
Fig. 2 is the vertical view of existing optical fingerprint sensor;
The diagrammatic cross-section that Fig. 3 obtains along A-A dot-and-dash line cutting in Fig. 2 for optical fingerprint sensor shown in Fig. 2;
Fig. 4 is the vertical view of the optical fingerprint sensor that the utility model embodiment provides;
The diagrammatic cross-section that Fig. 5 obtains along B-B dot-and-dash line cutting in Fig. 4 for optical fingerprint sensor shown in Fig. 4;
Fig. 6 is pixel array region schematic diagram in optical fingerprint sensor shown in Fig. 4;
Fig. 7 is a kind of circuit frame structural drawing of driving circuit in Fig. 4;
Fig. 8 is the clock signal figure of each level line and signal wire;
Fig. 9 is that the one of the unit of basic displacement shown in Fig. 7 realizes structure;
Figure 10 is in the unit of basic displacement shown in Fig. 7, the cross-sectional view of transistor T4 and electric capacity C2;
Figure 11 is in another embodiment of the utility model, the cross-sectional view of transistor T4 and electric capacity C2.
Embodiment
The structural representation of existing optical fingerprint sensor incorporated by reference to referring to figs. 2 and 3, wherein Fig. 2 is the vertical view of optical fingerprint sensor, the diagrammatic cross-section that Fig. 3 obtains along A-A dot-and-dash line cutting in Fig. 2 for optical fingerprint sensor shown in Fig. 2.Optical fingerprint sensor comprises glass substrate 20, and pel array 21 on glass substrate 20 and peripheral circuit.Peripheral circuit region comprises driving circuit 24, and signal reads chip 22 and flexible printed circuit board 23.Pel array 21 is for the reception of optical signalling, conversion and temporary.Described peripheral circuit region also comprises flexible printed circuit board binding district 230, (each connecting line does not draw in figure 3 for pel array 21, connecting line between chip 22 and flexible printed circuit board 23, each connecting line comprises the connecting line of pel array 21 to driving circuit 24, pel array 21 binds the connecting line in district to chip 22, chip 22 binds the connecting line of district to flexible printed circuit board binding district 230, and driving circuit 24 is to the connecting line in flexible printed circuit board binding district).
But in existing optical fingerprint sensor, chip 22 and flexible printed circuit board binding district 230 are arranged on the same side of pel array 21, how in Fig. 3, they are arranged on the right side of pel array 21.In this case, when product design, the periphery, left side that there will be pel array 21 is narrower, and the situation that right side peripheral is wider, pel array 21 left and right sides is asymmetric, and this asymmetric design is to the assembling of whole module, and the reliability of module, all can there is adverse effect, such as, can cause the reliability existing defects of module, also follow-up shelling machine difficulty can be caused simultaneously to increase, and affect the attractive in appearance of product.
For this reason, the utility model provides a kind of new optical fingerprint sensor, pel array is arranged between chip and flexible printed circuit board binding district, namely chip and flexible printed circuit board binding district lay respectively at pel array both sides, therefore, on the substrate surface of whole optical fingerprint sensor, the area discrepancy of pel array both sides reduces, pel array both sides almost symmetry, therefore when designing the assembling of whole module, when not increasing one-piece construction size, assembling difficulty can be made to reduce, and reduce the design difficulty of follow-up corresponding protecting sheathing, improve the reliability after module group assembling, prevent modular structure from occurring defect because both sides are seriously inharmonious, and the outward appearance of respective optical fingerprint sensor module can be made more regular attractive in appearance.
For enabling above-mentioned purpose of the present utility model, feature and advantage more become apparent, and are described in detail specific embodiment of the utility model below in conjunction with accompanying drawing.
The utility model embodiment provides a kind of optical fingerprint sensor, incorporated by reference to reference to figure 4 and Fig. 5, the wherein vertical view of optical fingerprint sensor that provides for the present embodiment of Fig. 4, the diagrammatic cross-section that Fig. 5 obtains along B-B dot-and-dash line cutting in Fig. 4 for optical fingerprint sensor shown in Fig. 4.Described optical fingerprint sensor comprises substrate 30, and pel array 31 on substrate 30 and peripheral circuit.Described peripheral circuit region comprises driving circuit 34, chip 32 and flexible printed circuit board 33 (FlexiblePrintedCircuit, FPC).Pel array 31 is for the reception of optical signalling, conversion and temporary.Chip 32 is for the reading of signal, and flexible printed circuit board 33 is for being electrically connected optical fingerprint sensor with disposal system.
Described peripheral circuit region also comprises the line (not shown) of pel array 31 to driving circuit 34, pel array 31 pel array 31 binds district to chip 32, and (chip 32 is bound district and is positioned between chip and substrate 30, do not show separately in Fig. 4 and Fig. 5) line (not shown), driving circuit 34 is to the line (not shown) in flexible printed circuit board binding district 330.
Described peripheral circuit region also comprises chip 32 and binds the connecting line of district to flexible printed circuit board binding district 330, and that is, chip 32 and flexible printed circuit board are bound between district 330 and be electrically connected by connecting line.Show some connecting lines in Fig. 4, described connecting line comprises the first connecting line 35, second connecting line 36 and the 3rd connecting line 37.Wherein, the first connecting line 35 and the second connecting line 36 are positioned on the upside of pel array 31, and the 3rd connecting line 37 is positioned on the downside of pel array 31.
In summary, the optical fingerprint sensor that the present embodiment provides comprises substrate 30, pel array 31, chip 32, flexible printed circuit board 33, and the flexible printed circuit board binding district 330 of correspondence.Wherein, pel array 31, chip 32, flexible printed circuit board 33 and flexible printed circuit board binding district 330 is all positioned at substrate 30 on the surface.And, in the present embodiment, pel array 31 is between chip 32 and flexible printed circuit board binding district 330, alternatively, pel array 31 is between chip 32 and flexible printed circuit board 33, further, between chip 32 and flexible printed circuit board binding district 330, there is connecting line, and between other structure, there is line.
In the present embodiment, as shown in Figure 4, because pel array 31 is between chip 32 and flexible printed circuit board binding district 330, therefore, in this case, the substrate 30 of whole optical fingerprint sensor on the surface, reduce with the area discrepancy on right side on the left of pel array 31, pel array 31 left and right sides almost symmetry, therefore when designing the assembling of whole module, when not increasing one-piece construction size, assembling difficulty can be made to reduce, and reduce the design difficulty of follow-up corresponding protecting sheathing (not shown), improve the reliability after module group assembling, prevent modular structure from occurring defect because both sides are seriously inharmonious, and the outward appearance of respective optical fingerprint sensor module can be made more regular attractive in appearance.
In the present embodiment, substrate 30 has the maximum apparent surface of two areas usually, above-mentioned each structure be formed in substrate 30 one of them on the surface.The surface of another maximum area of substrate 30 can as the back side (back side be relative face, the surface of substrate 30 shown in Fig. 4, i.e. the lower surface of substrate 30 in Fig. 5), and the described back side is relative with the backlight of whole optical fingerprint sensor module.
In the present embodiment, above-mentioned each structure is usually the smaller the better at the surperficial occupied area of substrate 30.But, in fact due to resistance sizes, chip 32 physical size size, flexible printed circuit board 33, and the reason such as the technological limits restriction of chip technique and film technique on glass on glass, the area that above-mentioned each structure takies on substrate 30 is usually at more than 1mm2, and the area size of such as certain structures can be 1mm × 10mm.
In the present embodiment, substrate 30 can be made for transparent material, and concrete material can be unorganic glass or organic glass, also can be other transparent organic resin, can also be quartz plate.
In the present embodiment, pel array 31 can adopt amorphous silicon film transistor (amorphousSiliconThinFilmTransistor, a-SiTFT) technique, low-temperature polysilicon film transistor (LowTemperaturePolySiliconThinFilmTransistor, LTPSTFT) semiconductor process techniques such as technique or oxide semiconductor thin-film transistor (OxideSemiconductorThinFilmTransistor, OTFT) technique makes.
In the present embodiment, chip 32 can by " chip is technique (ChipOnGlass, COG) on glass " binding (Bonding) on substrate 30.Flexible printed circuit board 33 can be tied on substrate 30 by " film is technique (FilmOnGlass, FOG) on glass ".Binding refers to be connected on corresponding substrate by anisotropic conductive film (AnisotropicConductiveFilm, ACF) by chip or circuit board, and realization is electrically connected and machinery is fixed.
It should be noted that, flexible printed circuit board binding district 330 is positioned at substrate 30 on the surface, for the region of the pin of each connecting line and flexible printed circuit board 33 being carried out binding.
In the present embodiment, at substrate 30 on the surface, chip 32 is positioned on the left of pel array 31, and flexible printed circuit board binding district is positioned on the right side of pel array 31.Further, chip 32 is electrically connected to flexible printed circuit board binding district 330 by many connecting lines, and these connecting lines comprise the first connecting line 35, second connecting line 36 and the 3rd connecting line 37.Wherein, at substrate 30 on the surface, the first connecting line 35 and the second connecting line 36 are positioned on the upside of pel array 31, and at substrate 30 on the surface, the 3rd connecting line 37 is positioned on the downside of pel array 31.In other embodiment, the first connecting line 35, second connecting line 36 and the 3rd connecting line 37 also all can be positioned at upside or the downside of pel array 31.
In the present embodiment, the exit that the first connecting line 35 and the second connecting line 36 are drawn from chip 32 combines, and the link that the first connecting line 35 and the second connecting line 36 are connected to flexible printed circuit board binding district 330 also combines.In other embodiment, the first connecting line 35 and the second connecting line 36 also can be completely independent.
It should be noted that, in other embodiment, at substrate 30 on the surface, for connecting in whole connecting lines in flexible printed circuit board binding district of chip 32, both can only through the upside of pel array 31, also can only through the downside of pel array 31.
In the present embodiment, driving circuit 34 is only positioned at the upside of pel array 31.Further, in the present embodiment, have connecting line process from driving circuit 34 at least, as shown in Figure 4, the second connecting line 36 passes through from driving circuit 34.It should be noted that, described connecting line passes through and refers to that described connecting line is overlapping at least partly with driving circuit 34 in top plan view shown in Fig. 4 from driving circuit 34.
In the present embodiment, due to the second connecting line 36 and through overdrive circuit 34, therefore, second connecting line 36 can not take the region on the upside of pel array 31, namely the setting of the second connecting line 36 can not increase the size of substrate 30, that is second connecting line 36 size of whole optical fingerprint sensor can not be made to increase, therefore, when whole connecting line is all through overdrive circuit 34, can to ensure that the size of optical fingerprint sensor keeps less, and the optical fingerprint sensor of reduced size is normally desired by product design.
It should be noted that, in other embodiment, driving circuit can be positioned at one of them side of the upper side and lower side of pel array, and such as, driving circuit also only can be positioned at the downside of pel array, or is positioned at the upper side and lower side of pel array simultaneously.Accordingly, in other embodiment, chip to flexible printed circuit board binding district between connecting line can with driving circuit process, also can not pass through from driving circuit.
It should be noted that, in other embodiment, driving circuit is also all positioned on substrate surface.On the surface of the substrate, chip is positioned on the left of pel array, flexible printed circuit board binding district is positioned on the right side of pel array, now, driving circuit can be positioned at the upside of pel array or the wherein side of downside, and now pel array is between connecting line and driving circuit, that is, now connecting line without driving circuit.
Please refer to Fig. 6, Fig. 6 shows the structural representation of pel array 31 region in optical fingerprint sensor, it should be noted that, relation up and down in Fig. 6 is slightly different from Fig. 4, such as, in Fig. 6, display driver circuit 34 is on the right side on substrate 30 surface, and in Fig. 4 display driver circuit in the upside on substrate 30 surface.This is because relation is up and down relative, Fig. 6 can be considered it is the structural representation obtained after the structure in Fig. 4 being rotated to an angle.
As shown in Figure 6, pel array 31 can comprise the multiple pixels (mark) in ranks shape array arrangement, and the row and column at described pixel place limited by the drive wire 311 of many first axis and the data line 312 of many second axis.Each described pixel comprises Signal-controlled switch 313 and photoelectric conversion unit 314, and described pixel also comprises transparent region (mark), described transparent region can pass through light, and corresponding backlight can by described transparent region through described optical fingerprint sensor.That is; in whole pel array 31 region; except drive wire 311, data line 312, Signal-controlled switch 313 and photoelectric conversion unit 314; also comprise transparent region; described transparent region is used for the emergent light of optical fingerprint sensor die set light source (not shown) through optical fingerprint sensor; to enter corresponding protective seam, wherein, described protective layer used in the face contact (can with reference to figure 1 corresponding contents) of finger.
In the present embodiment, Signal-controlled switch 313 is for the reading line by line of control both optical signal, and photoelectric conversion unit 314 is for the acceptance of optical signalling, conversion and temporary.Drive wire 311 is connected to driving circuit 34, is controlled the unlatching line by line of pel array 31 by driving circuit 34.Data line 312 is connected to the binding district of chip 32, so that each row picture element signal is input to chip 32, and by the amplification of chip 32 settling signal and analog-to-digital conversion (AnalogDigitalConverter, ADC).The input signal of chip 32 and output signal, and the power supply of chip 32 is connected to flexible printed circuit board binding district 330 by the corresponding connecting line of optical fingerprint sensor, flexible printed circuit board 33 is for providing corresponding input information and output signal for chip 32, and power, flexible printed circuit board 33 is also for being electrically connected to the input signal of driving circuit 34 and confession in respective external circuit system.
Please refer to Fig. 7, show wherein a kind of circuit frame structural drawing of driving circuit 34.Driving circuit 34 comprises multiple basic displacement unit 341 and forms, and represents basic displacement unit 341 in Fig. 7 by solid line boxes and dashed rectangle.Wherein, solid line boxes can represent the actual basic displacement unit 341 being produced on pel array 31, and dashed rectangle can represent abridged basic displacement unit 341.Each basic displacement unit 341 all has output terminal, these output terminals are respectively output terminal G1, output terminal Gn, output terminal Gn+1 ... output terminal Gm, these output terminals are connected to a wherein drive wire 311 respectively, i.e. a total m output unit (described output unit is described shift unit), m output unit one_to_one corresponding drives m bar drive wire, wherein n and m is positive integer, and n is less than m, and m can be more than or equal to 3.Meanwhile, all basic displacement unit 341 are all connected to low level line VL (VoltageLow), high level line VH (VoltageHigh), the first clock cable CLK (Clock), second clock signal wire CLKB (ClockB), reseting signal line RST (reset), the first line trigger signal STV (StimulateVoltage) and the second line trigger signal STVB (StimulateVoltageB).Wherein low level line VL and high level line VH is connected respectively to supply voltage, and on the first clock cable CLK and second clock signal wire CLKB, the signal of transmission is pulsed clock signal, and reseting signal line RST transmits reset signal.
Incorporated by reference to reference to figure 7 and Fig. 8, Fig. 8 being the signal that above-mentioned each level line and signal wire transmit in section sometime chronologically, i.e. clock signal figure.In the present embodiment, the output signal of each basic displacement unit 341 is for while driving pixel driver line 311, also for closing the output of closing a basic displacement unit 341 and the output exciting next basic displacement unit 341, thus realize displacement (depositing) effect.Meanwhile, initial basic displacement unit 341 starts generation output signal by the trigger pip on the first line trigger signal STV, by the trigger pip of the second line trigger signal STVB, closes the output of last basic displacement unit 341.In addition, the output of last basic displacement unit 341 also can be closed by the signal on reseting signal line RST.By said process, each output signal is exported in order successively at each basic displacement unit 341 of driving circuit 34, thus the start signal of pel array 31 is transported to each drive wire in order successively, realize the unlatching line by line of pel array 31.
The one that Fig. 9 shows basic displacement unit 341 realizes structure, and basic displacement unit 341 can be made up of to 9 transistors such as transistor T9 and 2 electric capacity (electric capacity C1 and C2) transistor T1.Namely driving circuit 34 comprises multiple shift unit, and each shift unit comprises multiple transistor, shows the electrical block diagram of one of them shift unit in Fig. 9.
In the present embodiment, transistor T1 is to transistor T9, and electric capacity C1 and electric capacity C2 can complete making in the same time of other element manufacturing of optical fingerprint sensor.Transistor T1 to transistor T9 adopts a-SiTFT technique to make, and also can be adopt LTPSTFT technique to make, and can also be adopt OTFT technique to make.
Please refer to Figure 10, Figure 10 shows in one of them basic displacement unit 341 of driving circuit 34, the cross-sectional view of transistor T4 and electric capacity C2, and described cross-sectional view also show the cross-section structure of gauge tap 313 in pel array 31.Known in conjunction with structure shown in Figure 10, the manufacturing process of driving circuit 34 can be: first on substrate 30, make the first conductive layer 301, first conductive layer 301 is as the grid (not marking separately) of drive wire 311, gauge tap 313 and transistor T4, and first battery lead plate of electric capacity C2 (not marking separately), wherein first battery lead plate of electric capacity C2 and the grid of transistor T4 are integrated connection.The grid of gauge tap 313 is connected with drive wire 311 (please refer to Fig. 7); Then the first insulation course 302 is made as dielectric layer; Then the semiconductor layer 303 of gauge tap 313 and transistor T4 is made; Then the second conductive layer 304 is made, as drain electrode and the source electrode of gauge tap 313 and transistor T4, and second battery lead plate of electric capacity C2; The simultaneously leakage of transistor T4 or source electrode are connected with second battery lead plate of electric capacity C2, and are connected with drive wire 311 by corresponding via hole (not shown); Constituting channel region (not shown) between the drain electrode of transistor T4 and source electrode; Then make the second insulation course 305 and protect said structure; Then make raceway groove light shield layer 306, light shield layer 306 is placed in the top of channel region, and area is greater than channel region, and light shield layer 306, for blocking channel region, avoids the incident illumination in top to be mapped on channel region; Finally make protective seam 307 and cover said structure, and play the effect of planarization and insulation protection.
It should be noted that, in basic displacement unit 341, other 8 transistors (transistor T1 is to transistor T9) and 1 electric capacity (C2) are also made by similar structure and manufacturing process.
In Figure 10, in basic displacement unit 341, each 9 transistors all need to utilize light shield layer 306 to shelter from the channel region between the drain electrode of each transistor and source electrode.
In order to prevent electrostatic accumulation, electrostatic breakdown occurs, and each light shield layer 306 can link together, and is then connected to a set potential.Such as, the light shield layer 306 of all crystals pipe in driving circuit 34 can be connected and all arrive low level line VL, also the light shield layer 306 of all crystals pipe in driving circuit 34 can be connected and all arrive high level line VH.In other embodiment, can also the light shield layer 306 of all crystals pipe in driving circuit 34 be connected on the public electrode of photoelectric conversion unit 314 of pel array 31, the light shield layer 306 of 9 of each basic displacement unit 341 transistor can also be linked together separately, then be connected on corresponding output line 311.
In the present embodiment, before mention, have connecting line process from driving circuit 34 at least, as shown in Figure 4, the second connecting line 36 passes through from driving circuit 34.Further, the present embodiment arranges and has at least a connecting line to pass through above at least one transistor of shift unit.Known in conjunction with the content before and after the present embodiment, in the present embodiment, arrange the second connecting line 36 from process above at least one transistor of shift unit, this set can utilize the second connecting line 36 to carry out shading, and corresponding transistor is protected.And, further, the present embodiment directly arranges and is arranged in connecting line above transistor simultaneously as the light shield layer 306 of driving circuit 34, that is, in the present embodiment, light shield layer 306 is multiplexed with a part (a wherein part for the second connecting line is made up of light shield layer 306 in other words) for the second connecting line 36, thus saves corresponding manufacture craft and make material.
In the present embodiment, select further using the described connecting line that is positioned at above transistor as power and ground at least one of them.When described connecting line is as light shield layer 306, because light shield layer 306 Area comparison is large, therefore, the width of connecting line is usually comparatively large, and now, connecting line resistance is less.And the requirement of power and ground to be resistance more low better, therefore, when adopting light shield layer 306 as power and ground, power and ground resistance can be made to reduce, performance raising.Be more importantly, when light shield layer 306 is as power and ground, the connecting lines such as power and ground are overlapping with driving circuit, and more multiposition region need not be taken, therefore, in the surface of whole substrate 30, the area being positioned at pel array 31 the upper side and lower side need not increase, namely the size of whole optical fingerprint sensor can not be increased, and the effect reached desired by the product design of the size of optical fingerprint sensor less normally optical fingerprint sensor.In addition, the light blocking layer on all crystals pipe can be connect together as a wherein connecting line that at least partially, also can be divided into a several connecting lines part separately, the utility model is not construed as limiting this.
It should be noted that, in other embodiment, light shield layer 306 also may be used for other connecting line, and such as various types of signal line, is specifically as follows digital signal input line, digital signal output line, simulating signal input line and analog signal output line etc.
It should be noted that, incorporated by reference to reference Figure 10, in other embodiment, the materials and structures of described connecting line is identical with the materials and structures of conductive layer at least part of in driving circuit 34.The materials and structures of such as described connecting line is identical with the materials and structures of the first conductive layer 301, or the materials and structures of connecting line is identical with the materials and structures of the second conductive layer 304.Now, the processing step of making first conductive layer 301 or the second conductive layer 304 can be utilized to make connecting line simultaneously, thus save processing step, reduce costs.Now, the material of described connecting line can be Mo, Al or ITO (tin indium oxide).Described connecting line can be single layer structure or sandwich construction.
In the present embodiment, the thickness range of connecting line is 0.1 μm to 5 μm.From actual demand, the thickness of connecting line is larger, and resistance is less, and its conducting transmission effect is better.But, consider that connecting line cannot make too thick by actual fabrication technique, otherwise connecting line can be caused to occur problems such as breaking or peel off, therefore, the thickness range of connecting line is controlled to be 0.1 μm to 5 μm.
Please refer to Figure 11, when Figure 11 shows another embodiment, in one of them basic displacement unit 341 of driving circuit 34, the cross-sectional view of transistor T4 and electric capacity C2.See from Figure 11, in other embodiment, described connecting line also can not be multiplexing with light shield layer 306, but be arranged on above each transistor as independent structural sheet 308, and the material of structural sheet 308 can be metal or metallic compound.Now, the corresponding connecting line be made up of structural sheet 308 still can be designed to have interception, and can be arranged on above each light shield layer 306 further, as shown in figure 11.Now, the thickness of described connecting line can be suitably large than light shield layer 306, to reduce resistance.
Although the utility model discloses as above, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can make various changes or modifications, and therefore protection domain of the present utility model should be as the criterion with claim limited range.
Claims (10)
1. an optical fingerprint sensor, comprising:
Substrate;
Pel array, is positioned on described substrate surface;
Chip, is positioned on described substrate surface;
Flexible printed circuit board binding district, is positioned on described substrate surface;
It is characterized in that, described pel array is between described chip and described flexible printed circuit board binding district.
2. optical fingerprint sensor as claimed in claim 1, is characterized in that, also comprise connecting line, be positioned on described substrate surface, and described chip is electrically connected to described flexible printed circuit board binding district by described connecting line; On described substrate surface, described chip is positioned on the left of described pel array, and described flexible printed circuit board binding district is positioned on the right side of described pel array, and described connecting line is through one of them side of the upper side and lower side of described pel array.
3. optical fingerprint sensor as claimed in claim 2, is characterized in that, also comprise the driving circuit be positioned on described substrate surface; On described substrate surface, described driving circuit is positioned at one of them side of the upper side and lower side of described pel array, and has at least a described connecting line to pass through from described driving circuit.
4. optical fingerprint sensor as claimed in claim 3, it is characterized in that, described driving circuit comprises multiple shift unit, and each shift unit comprises multiple transistor, and have at least a described connecting line from described shift unit at least one described in pass through above transistor.
5. optical fingerprint sensor as claimed in claim 4, is characterized in that, is arranged in described connecting line above described transistor simultaneously as the light shield layer of described driving circuit.
6. optical fingerprint sensor as claimed in claim 4, is characterized in that, the described connecting line be positioned at above described transistor comprise power and ground at least one of them.
7. optical fingerprint sensor as claimed in claim 3, it is characterized in that, the materials and structures of described connecting line is identical with the materials and structures of conductive layer at least part of in described driving circuit.
8. optical fingerprint sensor as claimed in claim 2, it is characterized in that, the material of described connecting line is Mo, Al or ITO; Described connecting line is single layer structure or sandwich construction.
9. optical fingerprint sensor as claimed in claim 2, it is characterized in that, the thickness range of described connecting line is 0.1 μm to 5 μm.
10. optical fingerprint sensor as claimed in claim 1, is characterized in that, also comprise connecting line and driving circuit, be all positioned on described substrate surface; On described substrate surface, described chip is positioned on the left of described pel array, described flexible printed circuit board binding district is positioned on the right side of described pel array, and described driving circuit is positioned at upside or the downside of described pel array, and described pel array is between described connecting line and described driving circuit.
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| CN201520517475.8U CN204759454U (en) | 2015-07-16 | 2015-07-16 | Optics fingerprint sensor |
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| CN201520517475.8U CN204759454U (en) | 2015-07-16 | 2015-07-16 | Optics fingerprint sensor |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105608445A (en) * | 2016-01-29 | 2016-05-25 | 上海箩箕技术有限公司 | Optical fingerprint sensor, and manufacturing method and fingerprint acquisition method thereof |
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