CN204707345U - A kind of flexible circuit board - Google Patents
A kind of flexible circuit board Download PDFInfo
- Publication number
- CN204707345U CN204707345U CN201520483155.5U CN201520483155U CN204707345U CN 204707345 U CN204707345 U CN 204707345U CN 201520483155 U CN201520483155 U CN 201520483155U CN 204707345 U CN204707345 U CN 204707345U
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- circuit board
- carrier layer
- breach
- flexible circuit
- layer
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Abstract
The utility model relates to circuit board technology field, particularly relates to a kind of flexible circuit board.The utility model comprises the carrier layer of insulation, carrier layer is provided with the conductive layer formed by electric conducting material, and described carrier layer is provided with multiple spaced warp architecture.The utility model by arranging breach on a carrier layer, thus makes conductive layer bend in indentation, there, reaches the effect that circuit board is bending, easy to use.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of flexible circuit board.
Background technology
The circuit board of the general rigidity of the circuit board on current light fixture, arranges electronic component on circuit boards, as resistance, electric capacity, integrated circuit etc.; Electronic component is fixed on circuit board by soldering, and this kind of circuit board in use, can not change according to actual installation space, namely can not bend, thus have impact on its scope of application; At present in order to solve curvature of space problem, the general mode adopting the splicing of multiple circuit board, by arranging interface on circuit boards, connect with holding wire, this mode causes cost higher.
Utility model content
The purpose of this utility model is to solve the deficiencies in the prior art, provides a kind of flexible circuit board.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of flexible circuit board, comprise the carrier layer of insulation, carrier layer is provided with the conductive layer formed by electric conducting material, described carrier layer is provided with multiple spaced warp architecture.
Further, described warp architecture comprises setting breach on a carrier layer.
Further, described breach comprises the in-line breach of length direction perpendicular to carrier layer length direction.
Further, warp architecture comprises setting splayed breach on a carrier layer.
Again further, splayed breach is positioned at the both sides of in-line breach.
Further, described carrier layer is outside equipped with sealant.
Further, described conductive layer surface is provided with cured layer.
The beneficial effects of the utility model are: the utility model by arranging breach on a carrier layer, thus makes conductive layer bend in indentation, there, reach the effect that circuit board is bending, can adapt to multiple occasion, easy to use.
Accompanying drawing explanation
Fig. 1 is a kind of side-looking structural representation of the present utility model.
Fig. 2 is that one of the present utility model looks up structural representation.
Fig. 3 is a kind of structural representation of circuit board of the present utility model when bending.
Reference numeral is:
1---carrier layer 2---electronic component 3---conductive layer 4---warp architecture
41---splayed breach 42---connection female ends that in-line breach 5---connects male end 6---.
Embodiment
Below in conjunction with accompanying drawing 1 to 3, and embodiment is described further the utility model.
Embodiment: see Fig. 1 to Fig. 3.
A kind of flexible circuit board, comprise the carrier layer 1 of insulation, carrier layer 1 is provided with the conductive layer 3 formed by electric conducting material, described carrier layer 1 is provided with multiple spaced warp architecture 4.
Carrier layer 1 adopts hard material to make and forms substrate, carrier layer 1 is arranged conductive layer 3, thus form circuit, conductive layer 3 is provided with multiple electronic component 2 and installs station, can arrange corresponding electronic component 2 on conductive layer 3, electronic component 2 is connected to form circuit by conductive layer 3.Due to carrier layer 1 being provided with warp architecture 4, substrate can be made to bend by warp architecture 4.Connect for convenience of circuit, be respectively arranged with at the two ends of conductive layer 3 and connect male end 5 and be connected female end 6 two kinds of connectors; Connecting male end 5 to connect with being connected female end 6, forming loop circuit.
Further, described warp architecture 4 comprises the breach be arranged in carrier layer 1.
Conveniently circuit board bends, and carrier layer 1 arranges breach, and carrier layer 1 is cut off, and circuit board can bend in indentation, there.
Again further, described breach comprises the in-line breach 42 of length direction perpendicular to carrier layer 1 length direction.
In-line breach 42, makes circuit board relatively overturn in breach both sides, and circuit board doubling can be made to arrange.
Further, warp architecture 4 comprises the splayed breach 41 be arranged in carrier layer 1.
"eight" shape breach is set, carrier layer 1 can be made to carry out the bending of 90 degree, and the carrier layer 1 after bending is still in the same side.
Again further, splayed breach 41 is positioned at the both sides of in-line breach 42.
See Fig. 3, splayed breach 41 is arranged on the both sides of in-line breach 42, thus forms new warp architecture 4, preferably, splayed breach 41 is symmetrical set, and new warp architecture 4 can make carrier layer 1 turn; Multiple warp architecture 4, can make circuit board arrange ringwise.
Further, described carrier layer 1 is outside equipped with sealant.
Sealant carries out encapsulation process to carrier layer 1 and the conductive layer 3 that exposes, forms integral structure, avoids conductive layer 3 to expose by ectocine.Sealant can adopt the techniques such as plated film to make.
Further, described conductive layer 3 surface is provided with cured layer.
After conductive layer 3 arranges electronic component 2, then cured layer is set.Cured layer is conducive to electronic component 2 to be fixed.
Below be only the preferred embodiment of the application, equivalent technical solutions on this basis still falls into application protection range.
Claims (7)
1. a flexible circuit board, is characterized in that; Comprise the carrier layer of insulation, carrier layer is provided with the conductive layer formed by electric conducting material, described carrier layer is provided with multiple spaced warp architecture.
2. the flexible circuit board of one according to claim 1, is characterized in that; Described warp architecture comprises setting breach on a carrier layer.
3. the flexible circuit board of one according to claim 2, is characterized in that; Described breach comprises the in-line breach of length direction perpendicular to carrier layer length direction.
4. the flexible circuit board of one according to claim 3, is characterized in that; Warp architecture comprises setting splayed breach on a carrier layer.
5. the flexible circuit board of one according to claim 4, is characterized in that; Splayed breach is positioned at the both sides of in-line breach.
6. the flexible circuit board of one according to claim 1, is characterized in that; Described carrier layer is outside equipped with sealant.
7. the flexible circuit board of one according to claim 1, is characterized in that; Described conductive layer surface is provided with cured layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520483155.5U CN204707345U (en) | 2015-07-07 | 2015-07-07 | A kind of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520483155.5U CN204707345U (en) | 2015-07-07 | 2015-07-07 | A kind of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204707345U true CN204707345U (en) | 2015-10-14 |
Family
ID=54286934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520483155.5U Active CN204707345U (en) | 2015-07-07 | 2015-07-07 | A kind of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204707345U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107447125A (en) * | 2017-08-30 | 2017-12-08 | 太仓天润新材料科技有限公司 | The highly conductive environmental friendly material of one Albatra metal |
| CN110300488A (en) * | 2018-03-23 | 2019-10-01 | 法雷奥汽车内部控制（深圳）有限公司 | Hard circuit board and automobile lamp including the hard circuit board |
-
2015
- 2015-07-07 CN CN201520483155.5U patent/CN204707345U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107447125A (en) * | 2017-08-30 | 2017-12-08 | 太仓天润新材料科技有限公司 | The highly conductive environmental friendly material of one Albatra metal |
| CN110300488A (en) * | 2018-03-23 | 2019-10-01 | 法雷奥汽车内部控制（深圳）有限公司 | Hard circuit board and automobile lamp including the hard circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |