CN204706767U - There is the semiconductor laser cooling system of measuring ability - Google Patents
There is the semiconductor laser cooling system of measuring ability Download PDFInfo
- Publication number
- CN204706767U CN204706767U CN201520348612.XU CN201520348612U CN204706767U CN 204706767 U CN204706767 U CN 204706767U CN 201520348612 U CN201520348612 U CN 201520348612U CN 204706767 U CN204706767 U CN 204706767U
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- hole
- water
- semiconductor laser
- cooling system
- refrigerating fluid
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- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor laser cooling system with measuring ability, relate to field of semiconductor lasers.Set temperature transducer and/or flow sensor and/or conductivity sensor in the refrigerating fluid passage of semiconductor laser cooling system, described conductivity sensor is connected with alarm.Temperature sensor is used for monitoring temperature when refrigerating fluid passes in and out, and then calculates temperature difference, further judges refrigeration.Flow sensor transducer, in order to test the flow of refrigerating fluid, equally also can open monitoring refrigeration.Conductivity sensor is connected with alarm, and when conductivity is less than its set point, alarm can automatic alarm.
Description
Technical field
The utility model relates to field of semiconductor lasers, especially a kind of semiconductor laser cooling system with measuring ability
Background technology
Semiconductor laser, also known as laser diode, is with the laser of semi-conducting material as operation material.Its volume is little, the life-span is long, and the mode of simple Injection Current can be adopted to come its operating voltage of pumping and electric current and integrated circuit is compatible, thus can single-chip integration with it.And can directly carry out current-modulation to obtain the Laser output of High Speed Modulation by the frequency up to GHz.Due to these advantages, it is widely used.But semiconductor laser operationally, semiconductor laser chip can produce a large amount of heats, if do not carried out cooling process to it, will soon burn out.Prior art with arranging the heat sink temperature reducing semiconductor laser chip, but is also nowhere near; And the heat generating components of semiconductor laser is not only semiconductor laser chip, also have guide-lighting crystal, its temperature is operationally also very high, but in prior art, does not well provide device or equipment that one effectively can be reduced guide-lighting crystal temperature effect.And, if unlatching laser when also not having sufficient cooling fluid in a cooling system rashly, be easy to laser to burn out.
In view of this, special proposition the utility model.
Utility model content
The purpose of this utility model is to propose a kind of system can carrying out effective cooling to semiconductor laser chip and guide-lighting crystal.
For achieving the above object, following technical scheme is provided:
There is the semiconductor laser cooling system of measuring ability, it is characterized in that, set temperature transducer and/or flow sensor and/or conductivity sensor in the refrigerating fluid passage of semiconductor laser cooling system.Temperature sensor is used for monitoring temperature when refrigerating fluid passes in and out, and then calculates temperature difference, further judges refrigeration.Flow sensor transducer, in order to test the flow of refrigerating fluid, equally also can open monitoring refrigeration.Conductivity sensor is connected with alarm, and when conductivity is less than its set point, alarm can automatic alarm.
Preferably, described flow sensor is arranged on refrigerating fluid passage near exit.When laser is before start work, need first in refrigerating fluid passage, to pass into refrigerating fluid, when flow sensor record refrigerating fluid passage have enough refrigerating fluids by time just laser can be started shooting, avoid not having in the refrigerating fluid passage in laser to start shooting during refrigerating fluid, burn out equipment.
Further, described temperature sensor comprises the first temperature sensor and the second temperature sensor, and described first temperature sensor is arranged on refrigerating fluid passage near import department, and described second temperature sensor is arranged on refrigerating fluid passage near exit.Two temperature sensors, one in import department, one in exit, the temperature difference recorded can judge refrigeration more accurately.
Preferably, described refrigerating fluid passage comprises the waterway in the heat sink refrigerating fluid passage of grand passage and water flowing block; Refrigerating fluid enters from the refrigerating fluid passage end that grand passage is heat sink, and the other end flows out; The cooling fluid flowed out from the refrigerating fluid passage that grand passage is heat sink is connected with cooling fluid water tank by the water flowing block around guide-lighting crystal shell.Semiconductor laser in the course of the work, semiconductor laser chip and guide-lighting crystal can produce very high temperature, they will be burnt out if do not carried out cooling process to them, the heat that semiconductor laser chip and guide-lighting crystal produce can effectively be taken away by this cooling system, reduce its temperature, enable semiconductor laser chip and the stable operation of guide-lighting crystal.
Further, also comprise thermoelectric semiconductor refrigerator, the refrigeration end of described thermoelectric semiconductor refrigerator is near guide-lighting crystal shell, and the hot junction of described thermoelectric semiconductor refrigerator is near the outer wall of described water flowing block.
Preferably, described water flowing block is made up of the water board that two block structures are identical, described water board is rectangular slab, and the middle part of its one side is provided with groove, and the two ends of described groove are communicated with away from arranging reeded one side with rectangular slab by two through holes vertical with groove length direction; Two pieces of water boards arrange reeded one side relatively, and are fixedly connected with by two pieces of water boards by steady pin, and the groove on two pieces of water boards forms a waterway.
Further, also comprise inlet supporter of water, be provided with the first through hole in the middle part of described inlet supporter of water, described inlet supporter of water bottom is provided with the second through hole, the axis of described first through hole and the axes normal of the second through hole; Described inlet supporter of water bottom is provided with the 3rd hole, the described axis in the 3rd hole and the axis being parallel of the first through hole; Second through hole is communicated with outside inlet supporter of water by described 3rd hole, and the refrigerating fluid passage inlet that described first through hole is heat sink with grand passage is communicated with, the water flowing channel connection on described second through hole and water flowing block, and described 3rd hole is connected with cooling fluid water tank; Described first temperature sensor is arranged in the first through hole, and described second temperature sensor is arranged in the 3rd hole.
Further, also comprise backwater support, described backwater mid-stent is provided with the 4th hole, and described backwater support bottom is provided with the 5th hole, the axis in described 4th hole and the axes normal in the 5th hole; Described backwater mid-stent is provided with the 6th hole, the axes normal in the axis in described 6th hole and the axis in the 4th hole and the 5th hole; 4th hole is communicated with the 5th hole by described 6th hole, and the refrigerating fluid passage liquid outlet that described 4th hole is heat sink with grand passage is communicated with, the water flowing channel connection on described 5th hole and water flowing block; Three-temperature sensor is provided with in 4th hole (31).
Further, on described guide-lighting crystal shell, and thermoelectric semiconductor refrigerator place is provided with the 4th temperature sensor.
Accompanying drawing explanation
Fig. 1 is the semiconductor laser cooling system structure schematic diagram that the utility model has measuring ability;
Fig. 2 is bucket water plate structure schematic diagram;
Fig. 3 is inlet supporter of water structural representation;
Fig. 4 is backwater supporting structure schematic diagram.
Wherein: 1, water flowing block, 2, inlet supporter of water, 3, backwater support, 4, guide-lighting crystal shell;
11, groove, the 21, first through hole, the 22, second through hole, the 23, the 3rd hole, the 31, the 4th hole, the 32, the 5th hole.
Embodiment
Below in conjunction with accompanying drawing, a most preferred embodiment of the present utility model is described further, to help understanding content of the present utility model.
As shown in figs. 1 and 4, there is the semiconductor laser cooling system of measuring ability, comprise inlet supporter of water 2, in the middle part of described inlet supporter of water 2, be provided with the first through hole 21, described inlet supporter of water 2 bottom is provided with the second through hole 22, the axis of described first through hole 21 and the axes normal of the second through hole 22; Described inlet supporter of water 2 bottom is provided with the 3rd hole 23, the axis in described 3rd hole 23 and the axis being parallel of the first through hole 21; Second through hole 22 is communicated with outside inlet supporter of water 2 by described 3rd hole 23, and the refrigerating fluid passage inlet that described first through hole 21 is heat sink with grand passage is communicated with, and described 3rd hole 23 is connected with cooling fluid water tank.First temperature sensor is arranged in the first through hole 21; Second temperature sensor and flow sensor are arranged in the 3rd hole 23.
Be provided with the 4th hole 31 in the middle part of backwater support 3, described backwater support 3 bottom is provided with the 5th hole 32, the axis in described 4th hole 31 and the axes normal in the 5th hole 32; The 6th hole is provided with, the axes normal in the axis in described 6th hole and the axis in the 4th hole 31 and the 5th hole 32 in the middle part of described backwater support 3; 4th hole 31 is communicated with the 5th hole 32 by described 6th hole, and the refrigerating fluid passage liquid outlet that grand passage is heat sink is communicated with the 4th hole 31; Three-temperature sensor is provided with in 4th hole (31).
Water flowing block 1 is made up of the water board that two block structures are identical, described water board is rectangular slab, the middle part of its one side is provided with groove 11, and the two ends of described groove 11 are communicated with away from the one side being provided with groove 11 with rectangular slab by two through holes vertical with groove 11 length direction; Two pieces of water boards are provided with the one side of groove 11 relatively, and are fixedly connected with by two pieces of water boards by steady pin, and the groove 11 on two pieces of water boards forms a waterway.Described 5th hole 32 is communicated with one end of the water flowing passage on water flowing block 1, and the other end of water flowing passage is communicated with the second through hole 22.
Symmetrical parallel setting before and after two groups of water flowing blocks 1, guide-lighting crystal shell is arranged between them; Conductivity sensor can arrange cooling fluid in a cooling system ducted any position of process, only otherwise affecting it normally works, be preferably arranged on outside the 3rd hole 23.Due to conductivity sensor with metal near time can affect its work, inlet supporter of water 2, backwater support 3 and water flowing block 1 are all made of metal, and the pipeline that the 3rd hole 23 is connected with cooling fluid water tank can be made up of nonmetal, therefore conductivity sensor is arranged on outside the 3rd hole 23 and can opens test cooling fluid conductivity, also can not be subject to the interference of other metallic articles.
Thermoelectric semiconductor refrigerator, the refrigeration end of described thermoelectric semiconductor refrigerator is near guide-lighting crystal shell, and the hot junction of described thermoelectric semiconductor refrigerator is near the outer wall of described water flowing block.On guide-lighting crystal shell, and thermoelectric semiconductor refrigerator place is provided with the 4th temperature sensor.
Specific works mode
Cooling fluid enters the heat sink refrigerating fluid passage of grand passage from the first through hole 21 inlet supporter of water 2, the 4th hole of backwater support 3 is entered from the refrigerating fluid passage other end cooling fluid out that grand passage is heat sink, and then enter in two water flowing blocks 1 respectively by the three-port structure of the 5th hole 32 and the 6th hole composition, again from the three-port structure that the second through hole 22 other end inflow inlet supporter of water 2 of water flowing block 1 and the 3rd hole form, finally enter cooling fluid water tank.In this process, can effectively cool semiconductor laser chip and the guide-lighting crystal shell 4 be arranged between two water flowing blocks 1 (guide-lighting crystal shell 4 is cooled, also just equals to cool to guide-lighting crystal).Temperature sensor, flow sensor and conductivity sensor moment test.
Claims (9)
1. there is the semiconductor laser cooling system of measuring ability, it is characterized in that, set temperature transducer and/or flow sensor and/or conductivity sensor in the refrigerating fluid passage of semiconductor laser cooling system.
2. have the semiconductor laser cooling system of measuring ability as claimed in claim 1, it is characterized in that, described flow sensor is arranged on refrigerating fluid passage near exit.
3. there is the semiconductor laser cooling system of measuring ability as claimed in claim 1, it is characterized in that, described temperature sensor comprises the first temperature sensor and the second temperature sensor, described first temperature sensor is arranged on refrigerating fluid passage near import department, and described second temperature sensor is arranged on refrigerating fluid passage near exit.
4. have the semiconductor laser cooling system of measuring ability as claimed in claim 3, it is characterized in that, described refrigerating fluid passage comprises the waterway in the heat sink refrigerating fluid passage of grand passage and water flowing block; Refrigerating fluid enters from the refrigerating fluid passage end that grand passage is heat sink, and the other end flows out; The cooling fluid flowed out from the refrigerating fluid passage that grand passage is heat sink is connected with cooling fluid water tank by the water flowing block around guide-lighting crystal shell.
5. there is the semiconductor laser cooling system of measuring ability as claimed in claim 4, it is characterized in that, also comprise thermoelectric semiconductor refrigerator, the refrigeration end of described thermoelectric semiconductor refrigerator is near guide-lighting crystal shell, and the hot junction of described thermoelectric semiconductor refrigerator is near the outer wall of described water flowing block.
6. there is the semiconductor laser cooling system of measuring ability as claimed in claim 4, it is characterized in that, described water flowing block (1) is made up of the water board that two block structures are identical, described water board is rectangular slab, the middle part of its one side is provided with groove (11), and the two ends of described groove (11) are communicated with away from the one side being provided with groove (11) with rectangular slab by two through holes vertical with groove (11) length direction; Two pieces of water boards are provided with the one side of groove (11) relatively, and are fixedly connected with by two pieces of water boards by steady pin, and the groove (11) on two pieces of water boards forms a waterway.
7. there is the semiconductor laser cooling system of measuring ability as claimed in claim 4, it is characterized in that, also comprise inlet supporter of water (2), described inlet supporter of water (2) middle part is provided with the first through hole (21), described inlet supporter of water (2) bottom is provided with the second through hole (22), the axis of described first through hole (21) and the axes normal of the second through hole (22); Described inlet supporter of water (2) bottom is provided with the 3rd hole (23), the described axis in the 3rd hole (23) and the axis being parallel of the first through hole (21); Second through hole (22) is communicated with inlet supporter of water (2) outside by described 3rd hole (23), the refrigerating fluid passage inlet that described first through hole (21) is heat sink with grand passage is communicated with, described second through hole (22) and the water flowing channel connection on water flowing block (1), described 3rd hole (23) is connected with cooling fluid water tank; Described first temperature sensor is arranged in the first through hole (21), and described second temperature sensor is arranged in the 3rd hole (23).
8. there is the semiconductor laser cooling system of measuring ability as claimed in claim 4, it is characterized in that, also comprise backwater support (3), described backwater support (3) middle part is provided with the 4th hole (31), described backwater support (3) bottom is provided with the 5th hole (32), the axis in described 4th hole (31) and the axes normal in the 5th hole (32); Described backwater support (3) middle part is provided with the 6th hole, the axes normal in the axis in described 6th hole and the axis in the 4th hole (31) and the 5th hole (32); 4th hole (31) is communicated with the 5th hole (32) by described 6th hole, the refrigerating fluid passage liquid outlet that described 4th hole (31) is heat sink with grand passage is communicated with, described 5th hole (32) and the water flowing channel connection on water flowing block (1); Three-temperature sensor is provided with in 4th hole (31).
9. there is the semiconductor laser cooling system of measuring ability as claimed in claim 5, it is characterized in that, on described guide-lighting crystal shell, and thermoelectric semiconductor refrigerator place is provided with the 4th temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520348612.XU CN204706767U (en) | 2015-05-26 | 2015-05-26 | There is the semiconductor laser cooling system of measuring ability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520348612.XU CN204706767U (en) | 2015-05-26 | 2015-05-26 | There is the semiconductor laser cooling system of measuring ability |
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| Publication Number | Publication Date |
|---|---|
| CN204706767U true CN204706767U (en) | 2015-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520348612.XU Expired - Fee Related CN204706767U (en) | 2015-05-26 | 2015-05-26 | There is the semiconductor laser cooling system of measuring ability |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106654812A (en) * | 2015-11-02 | 2017-05-10 | 中国兵器装备研究院 | High power optical fiber laser key point protection device |
| CN108247170A (en) * | 2016-12-28 | 2018-07-06 | 上海朗仕电子设备有限公司 | A kind of maintaining prior-warning device for water-cooled scaling powder collector |
-
2015
- 2015-05-26 CN CN201520348612.XU patent/CN204706767U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106654812A (en) * | 2015-11-02 | 2017-05-10 | 中国兵器装备研究院 | High power optical fiber laser key point protection device |
| CN108247170A (en) * | 2016-12-28 | 2018-07-06 | 上海朗仕电子设备有限公司 | A kind of maintaining prior-warning device for water-cooled scaling powder collector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151014 |