CN204696099U - A kind of Intelligent Power Module fin and Intelligent Power Module - Google Patents
A kind of Intelligent Power Module fin and Intelligent Power Module Download PDFInfo
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- CN204696099U CN204696099U CN201520475347.1U CN201520475347U CN204696099U CN 204696099 U CN204696099 U CN 204696099U CN 201520475347 U CN201520475347 U CN 201520475347U CN 204696099 U CN204696099 U CN 204696099U
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Abstract
The utility model discloses a kind of Intelligent Power Module fin and Intelligent Power Module, comprise metal level and insulating radiation layer, described insulating radiation layer comprises the hardened layer be formed on described metal level and the following layer be formed on described hardened layer.Fin of the present utility model is formed with hardened layer and following layer on the metal layer, improves insulating properties relative to traditional product, is convenient to the attachment of electronic devices and components simultaneously.
Description
Technical field
The utility model relates generally to a kind of Intelligent Power Module fin and Intelligent Power Module.
Background technology
The intelligent power module (Intelligent Power Module) be born in recent years is a highly integrated power drive device, can be used as variable-frequency speed-regulating controller, be applied in weaving loom, injection molding machine, convertible frequency air-conditioner, washing machine, refrigerator, electric automobile, radar servo system etc.The use of IPM substantially increases the operating efficiency of electronic and electrical equipment, also reduces energy consumption simultaneously.IPM inside is integrated with logic, control, detection and protective circuit; be easy to use; not only reduce volume and the development time of system; also greatly strengthen the possibility of system; adapting to the developing direction of current power device---modularization, Composite and power integrated circuit (PIC), obtain in field of power electronics and apply more and more widely.But a large amount of heat that the power model that integrated level is more and more higher produces when working also has become to affect its operating efficiency and Long Service Life principal element.
Although also have use fin in prior art in Intelligent Power Module, the thermal insulation layer of traditional fin is single layer structure, and insulation property are limited.Conductive coefficient≤the 2W/MK of usual fin, does not reach the requirement-conductive coefficient >=2.5W/MK of IPM for high heat conduction.And traditional technique need electronic unit to be directly welded on fin (as cover copper aluminium base, cover copper ceramic substrate etc.), it is cumbersome that dress pastes processing.
Summary of the invention
Technical problem to be solved in the utility model overcomes the deficiencies in the prior art, provides a kind of and have high insulation property and be convenient to the fin of surface-pasted Intelligent Power Module and have the Intelligent Power Module of this fin.
For solving above technical problem, the utility model adopts following technical scheme:
A kind of Intelligent Power Module fin, comprise metal level and insulating radiation layer, described insulating radiation layer comprises the hardened layer be formed on described metal level and the following layer be formed on described hardened layer.
Described thermal insulation layer has the surface then performance after high electric insulating quality and preheating.
Described hardened layer and following layer are all primarily of thermosetting polymer and heat filling composition, wherein, polymer can be the mixed and modified body of one or more in mylar, polyurethane, alkyd resins, epoxy resin, acrylic resin, silica column, phenoxy resin; Heat filling can be aluminium oxide, aluminium nitride, boron nitride, the diamond (being again diamond like carbon DLC(Diamond-like carbon) of conductive coefficient >=10W/MK), the mixture of one or more in carborundum.
Further, the thickness of described hardened layer is 0.01mm ~ 0.4mm; The thickness of described following layer is 0.01mm ~ 0.4mm.
Further, described metal level is the one in metallic aluminium, aluminium alloy, metallic copper, copper alloy.
Further, the thickness of described metal level is 0.01mm ~ 5mm.
Further, the resin solidification rate of described hardened layer is greater than 80%.
Further, the resin solidification rate of described following layer is less than 70%.
A kind of Intelligent Power Module, comprises described fin.
Further, described Intelligent Power Module also comprises the electronic devices and components be affixed on by hot pressing on described following layer, for encapsulating the potting resin layer of described fin and described electronic devices and components.
Further, after the encapsulation of described potting resin layer, the resin solidification rate of described hardened layer and described following layer is more than 90%
Due to the enforcement of technique scheme, the utility model compared with prior art tool has the following advantages:
Insulating radiation layer on fin of the present utility model comprises hardened layer and following layer, surface mount performance after making this insulating radiation layer have high electric insulating quality and preheating, improve insulating properties relative to traditional product, be convenient to the attachment of the electronic unit of Intelligent Power Module simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of fin of the present utility model;
In figure: 1, metal level; 2, hardened layer; 3, following layer.
Embodiment
Below in conjunction with Figure of description, the utility model is further described.
The heat dissipation problem of existing Intelligent Power Module, all electronic unit is welded on traditional heat-dissipating sheet, be unfavorable for insulation like this and fill subsides technique loaded down with trivial details, for solving the problem of above-mentioned heat radiation, the utility model adopts and is mounted on the insulating heat-conduction material of high heat conduction by the electronic unit of easily heating in Intelligent Power Module, in order to electronic unit can be sticked on heat-conducting insulation material, need to use existing heat conductive insulating to have again the material of adherence.
The utility model provides a kind of Intelligent Power Module fin for this reason, and comprise metal level 1 and insulating radiation layer, insulating radiation layer has high electrical insulation properties.
Insulating radiation layer comprises the hardened layer 2 be formed on metal level 1 and the following layer 3 be formed on hardened layer 2.
The thickness of hardened layer 2 is 0.01mm ~ 0.4mm; The thickness of following layer 3 is 0.01mm ~ 0.4mm.
Hardened layer 2 and following layer 3 are all primarily of thermosetting polymer and heat filling composition, wherein, polymer can be the mixed and modified body of one or more in mylar, polyurethane, alkyd resins, epoxy resin, acrylic resin, silica column, phenoxy resin; Heat filling can be aluminium oxide, aluminium nitride, boron nitride, diamond (being again diamond like carbon DLC(Diamond-like carbon)), the mixture of one or more in carborundum.
The metal level 1 of fin of the present utility model is the one in metallic aluminium, aluminium alloy, metallic copper, copper alloy.
The thickness of metal level 1 is 0.01mm ~ 5mm.
Fin of the present utility model is after high temperature preheating, and following layer 3 shows certain viscosity, can directly be affixed on following layer by some electronic devices and components (as diode, the IGBI etc.) hot pressing of Intelligent Power Module, then encapsulate.
Fin of the present utility model is before without High-temperature Packaging, the resin solidification rate of hardened layer 2 is greater than 80%, and the resin solidification rate of following layer 3 is less than 70%, after encapsulation, the resin solidification rate of the hardened layer 2 of insulating radiation layer is more than 90%, and the resin solidification rate of following layer 3 is also more than 90%.All more than 50% (weight ratio), the addition of the heat filling used in the following layer 3 of insulating radiation layer all more than 50% (weight ratio) for the addition of the heat filling used in the hardened layer 2 of insulating radiation layer.
Fin of the present utility model, because insulating radiation layer belongs to laminated construction, there is high electrical insulation properties, the following layer 3 of insulating radiation layer is after uniform temperature preheating, there is adherence, be easy to the attachment of electronic devices and components, instead of traditional technique of welding attachment on heat sink material, reduce because of high-temperature soldering the heat injury that electronic devices and components produce.Insulating radiation layer after High-temperature Packaging can complete crosslinking curing, therefore has long-term high-fire resistance energy.
Above the utility model is described in detail; its object is to allow the personage being familiar with this art can understand content of the present utility model and be implemented; protection range of the present utility model can not be limited with this; all equivalences done according to Spirit Essence of the present utility model change or modify, and all should be encompassed in protection range of the present utility model.
Claims (10)
1. an Intelligent Power Module fin, comprises metal level and insulating radiation layer, it is characterized in that: described insulating radiation layer comprises the hardened layer be formed on described metal level and the following layer be formed on described hardened layer.
2. Intelligent Power Module fin according to claim 1, is characterized in that: the thickness of described hardened layer is 0.01mm ~ 0.4mm.
3. Intelligent Power Module fin according to claim 1 and 2, is characterized in that: the thickness of described following layer is 0.01mm ~ 0.4mm.
4. Intelligent Power Module fin according to claim 1, is characterized in that: described metal level is the one in metallic aluminium, aluminium alloy, metallic copper, copper alloy.
5. the Intelligent Power Module fin according to claim 1 or 4, is characterized in that: the thickness of described metal level is 0.01mm ~ 5mm.
6. Intelligent Power Module fin according to claim 1, is characterized in that: the resin solidification rate of described hardened layer is greater than 80%.
7. Intelligent Power Module fin according to claim 1, is characterized in that: the resin solidification rate of described following layer is less than 70%.
8. an Intelligent Power Module, is characterized in that: comprise the fin according to any one of claim 1 to 7.
9. Intelligent Power Module according to claim 8, is characterized in that: described Intelligent Power Module also comprises the electronic devices and components be affixed on by hot pressing on described following layer, for encapsulating the potting resin layer of described fin and described electronic devices and components.
10. Intelligent Power Module according to claim 9, is characterized in that: after the encapsulation of described potting resin layer, the resin solidification rate of described hardened layer and described following layer is more than 90%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520475347.1U CN204696099U (en) | 2015-07-03 | 2015-07-03 | A kind of Intelligent Power Module fin and Intelligent Power Module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520475347.1U CN204696099U (en) | 2015-07-03 | 2015-07-03 | A kind of Intelligent Power Module fin and Intelligent Power Module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204696099U true CN204696099U (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520475347.1U Active CN204696099U (en) | 2015-07-03 | 2015-07-03 | A kind of Intelligent Power Module fin and Intelligent Power Module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI713831B (en) * | 2018-02-06 | 2020-12-21 | 台達電子企業管理（上海）有限公司 | Power conversion device |
-
2015
- 2015-07-03 CN CN201520475347.1U patent/CN204696099U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI713831B (en) * | 2018-02-06 | 2020-12-21 | 台達電子企業管理（上海）有限公司 | Power conversion device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215200, Wujiang economic and Technological Development Zone, Wujiang District, Jiangsu, Suzhou Province, No. 369, Hong Kong Road, Tianjin Road Patentee after: Suzhou competition application technology Limited by Share Ltd Address before: 215200, Wujiang economic and Technological Development Zone, Wujiang District, Jiangsu, Suzhou Province, No. 369, Hong Kong Road, Tianjin Road Patentee before: Suzhou Saiwu Application Technology Co., Ltd. |