CN204668293U - Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment - Google Patents
Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment Download PDFInfo
- Publication number
- CN204668293U CN204668293U CN201520353408.7U CN201520353408U CN204668293U CN 204668293 U CN204668293 U CN 204668293U CN 201520353408 U CN201520353408 U CN 201520353408U CN 204668293 U CN204668293 U CN 204668293U
- Authority
- CN
- China
- Prior art keywords
- radiator
- chip
- heat
- ore deposit
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000005855 radiation Effects 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520353408.7U CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520353408.7U CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204668293U true CN204668293U (en) | 2015-09-23 |
Family
ID=54138649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520353408.7U Ceased CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204668293U (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
CN108323114A (en) * | 2018-02-14 | 2018-07-24 | 北京比特大陆科技有限公司 | Circuit board with effect of symmetrical heat radiation structure and computing device |
CN108415320A (en) * | 2018-02-13 | 2018-08-17 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digit coin dig mine machine |
CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
CN110324956A (en) * | 2018-03-30 | 2019-10-11 | 广州市信宏洗衣机械有限公司 | A kind of radiator of multilayer circuit board |
US11425839B2 (en) | 2017-05-18 | 2022-08-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
-
2015
- 2015-05-27 CN CN201520353408.7U patent/CN204668293U/en not_active Ceased
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11425839B2 (en) | 2017-05-18 | 2022-08-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
US11882669B2 (en) | 2017-05-18 | 2024-01-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
WO2019072161A1 (en) * | 2017-10-10 | 2019-04-18 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
US11152278B2 (en) | 2017-10-10 | 2021-10-19 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
CN108415320A (en) * | 2018-02-13 | 2018-08-17 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digit coin dig mine machine |
CN108415320B (en) * | 2018-02-13 | 2021-06-29 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digital coin ore digging machine |
CN108323114A (en) * | 2018-02-14 | 2018-07-24 | 北京比特大陆科技有限公司 | Circuit board with effect of symmetrical heat radiation structure and computing device |
CN108323114B (en) * | 2018-02-14 | 2024-06-25 | 北京比特大陆科技有限公司 | Circuit board with symmetrical heat dissipation structure and computing equipment |
WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
CN110324956B (en) * | 2018-03-30 | 2022-05-20 | 广州市信宏洗衣机械有限公司 | Heat radiator for multilayer circuit board |
CN110324956A (en) * | 2018-03-30 | 2019-10-11 | 广州市信宏洗衣机械有限公司 | A kind of radiator of multilayer circuit board |
CN108594975B (en) * | 2018-07-12 | 2023-11-21 | 常州天能博智能***科技有限公司 | Operation board card heat radiation structure |
CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204668293U (en) | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment | |
CN104813760A (en) | Heat radiation assembly and electric device | |
CN102130018A (en) | Chip radiation method, and related device and system | |
CN101221588B (en) | Radiation design method in PCB design | |
CN1423838A (en) | Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor | |
CN101359604A (en) | Method, apparatus and system for strengthening chip cooling | |
CN203748105U (en) | Double-face circuit board | |
CN203596971U (en) | Circuit board having heat dissipation function | |
CN203896645U (en) | Servo amplifier | |
CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
CN203040009U (en) | High heat conducting circuit board | |
CN203482490U (en) | Printed circuit board (PCB) | |
CN103747610A (en) | PCB thermal pad | |
CN203086910U (en) | A copper pipe heat conducting structure | |
CN206452607U (en) | A kind of PCB printed circuit boards with heat sinking function | |
CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
CN212163149U (en) | Diversion heat dissipation complex structure | |
CN201174855Y (en) | Radiator assembly | |
CN206366736U (en) | A kind of new mainboard structure of IGBT inversion submerged arc welding machines | |
CN211150541U (en) | Power device packaging structure and module power supply | |
CN210042368U (en) | High heat conduction circuit board | |
CN102056402A (en) | Printed circuit board with cooling-prevention grooves and manufacturing method thereof | |
CN204425783U (en) | The pcb board of automobile instrument power circuit | |
CN105101647A (en) | Manufacturing method of heat dissipation PCB (printed circuit board) | |
CN202841681U (en) | Printed circuit board (PCB) possessing heat dissipation function |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161216 Address after: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital 2 Patentee after: Zhan Ketuan Address before: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee before: BEIJING BITMAIN TECHNOLOGY CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital 2 Patentee before: Zhan Ketuan |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170510 Address after: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital three layer 301 Patentee after: Feng Feng Technology (Beijing) Co., Ltd. Address before: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee before: BEIJING BITMAIN TECHNOLOGY CO., LTD. |
|
CB03 | Change of inventor or designer information |
Inventor after: Zhan Ketuan Inventor after: Jiang Zhengxin Inventor after: Cheng Wenjie Inventor after: Liu Jinsuo Inventor before: Zhan Ketuan Inventor before: Jiang Zhengxin Inventor before: Cheng Wenjie Inventor before: Liu Jinsuo Inventor before: Zhong Rui |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170911 Address after: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital three layer 301 Patentee before: Feng Feng Technology (Beijing) Co., Ltd. |
|
TR01 | Transfer of patent right | ||
IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20180724 Decision number of declaring invalidation: 36685 Granted publication date: 20150923 |
|
IW01 | Full invalidation of patent right |