CN204668293U - Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment - Google Patents
Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment Download PDFInfo
- Publication number
- CN204668293U CN204668293U CN201520353408.7U CN201520353408U CN204668293U CN 204668293 U CN204668293 U CN 204668293U CN 201520353408 U CN201520353408 U CN 201520353408U CN 204668293 U CN204668293 U CN 204668293U
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- Prior art keywords
- radiator
- chip
- heat
- ore deposit
- printed circuit
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- 230000005855 radiation Effects 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of chip heat radiator, virtual digit coin digs ore deposit machine and electronic equipment, relate to technical field of heat dissipation, wherein said chip heat radiator comprises: be welded on the chip in printed circuit board (PCB) front, the first radiator and the second radiator, described first radiator is connected with chip top and dispels the heat, and described second radiator is connected with described printed circuit back and chip bottom corresponding part and dispels the heat.The utility model embodiment technical problem to be solved is to provide a kind of chip heat radiator, effectively improves the radiating efficiency of chip, and then promotes the useful life of chip.
Description
Technical field
The utility model relates to technical field of heat dissipation, particularly relates to a kind of chip heat radiator, virtual digit coin digs ore deposit machine and electronic equipment.
Background technology
In the use procedure of electronic equipment, printed circuit board (PCB) (Printed Circuit Board, be called for short PCB) the upper chip arranged operationally can produce a large amount of heats, can cause chip and this chip to electronic equipment shell between form heat spot.
Specific in the machine of virtual digit coin ore deposit, chip is the evolution of heat in use, ensure the normal work of ore deposit movement sheet, and the heat that just must be produced in time distributes.Otherwise, under the condition that heat dispersal situations is insufficient, allow ore deposit machine continue to work under the condition of high temperature, ore deposit machine cisco unity malfunction or internal short circuits will be caused, even burn chip.Along with improving constantly of power calculated by ore deposit machine, heat generation density is also driven high, and also more comes also high to the requirement of heat dispersion.
Therefore, the technical problem needing those skilled in the art urgently to solve at present is exactly: how innovatively can propose a kind of effective chip cooling scheme, to meet the more demands in practical application.
Utility model content
The utility model embodiment technical problem to be solved is to provide a kind of chip heat radiator, virtual digit coin digs ore deposit machine and electronic equipment, effectively improves the heat radiation of chip bottom.
In order to solve the problem, the utility model discloses a kind of chip heat radiator, comprise: be welded on the chip in printed circuit board (PCB) front, the first radiator and the second radiator, described first radiator is connected with chip top and dispels the heat, and described second radiator is connected with described printed circuit back and chip bottom corresponding part and dispels the heat.
Preferably, described first radiator and or the second radiator are heat radiation gear piece.
Preferably, described first radiator and the mode that chip top connects are that the bonding or screw of heat-conducting glue is twisted and connect.
Preferably, described second radiator and the mode that described printed circuit back and chip bottom corresponding part connect for weld or heat-conducting glue bonding.
Preferably, described first radiator and or the second radiator adopt the good metal or metal alloy of thermal conductivity to make.
The utility model also disclosed a kind of virtual digit coin and digs ore deposit machine, comprises cabinet, is positioned at the control board of cabinet inside, the operation board be connected with control board and for the said chip heat abstractor for chip cooling on operation board.
Preferably, described operation board is one or more.
Preferably, described virtual digit coin digs ore deposit machine and also comprises electric fan, and described electric fan is positioned at cabinet both sides.
The utility model also disclosed a kind of electronic equipment, comprises the chip on shell, printed circuit board (PCB), described printed circuit board (PCB) and above-mentioned chip heat radiator.
Compared with prior art, the utility model embodiment comprises following advantage:
The scheme that the utility model provides is by connecting the first radiator at chip top, the second radiator is connected with chip bottom corresponding part in printed circuit back, while chip top heat dissipation, a part of transfer of heat is outside to printed circuit board (PCB), the radiating efficiency of the chip of effective raising, and then the useful life effectively promoting chip.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of chip heat radiator of the present utility model;
Fig. 2 is the structural representation that a kind of virtual digit coin of the present utility model digs ore deposit machine;
Fig. 3 is the structured flowchart of a kind of electronic equipment of the present utility model.
Embodiment
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment one
Introduce a kind of chip heat radiator that the utility model embodiment provides in detail.
With reference to Fig. 1, show the structural representation of a kind of chip heat radiator of the present utility model, be welded on chip 101, first radiator 102 and second radiator 103 in printed circuit board (PCB) front, described first radiator 102 is connected with chip 101 top and dispels the heat, and described second radiator 103 is connected with corresponding part bottom described printed circuit back and chip 101 and dispels the heat.
In actual applications, in order to the first radiator and or the second fansink designs can be " comb " shape of diffuse transmission type by increasing heat radiation area, or the shape of heat radiation gear piece.Certainly various rule or irregular shape can also be designed to faster and better help chip cooling according to practical application request.
In realization, the first radiator and the mode that chip top connects are that the bonding or screw of heat-conducting glue is twisted and connect.Second radiator and the mode that described printed circuit back and chip bottom corresponding part connect for weld or heat-conducting glue bonding.
First radiator and or the second radiator adopt the good metal or metal alloy of thermal conductivity to make.Usually aluminium, copper, aluminium alloy or copper alloy etc. is adopted to make in embody rule.
Connect at chip top while the first radiator carries out dispelling the heat, be connected the second radiator in printed circuit back with chip bottom corresponding part, the partial heat that chip produces transferred to printed circuit board (PCB) outside, greatly improves the radiating efficiency of chip.
Embodiment two
A kind of virtual digit coin that introducing the utility model embodiment in detail provides digs ore deposit machine.
See Fig. 2, show the structural representation that a kind of virtual digit coin of the present utility model digs ore deposit machine, specifically comprise cabinet 201, be positioned at the control board 202 of cabinet 201 inside, the operation board 203 be connected with control board 202 and for the chip heat radiator 204 for chip cooling on operation board.In actual applications, it is higher that ore deposit machine operation board calculates power, and the heat that chip produces is higher, and for this situation, the chip on chip heat radiator 204 pairs of operation boards 203 dispels the heat.For avoiding repetition, the present embodiment highlights the chip heat radiator 204 dispelled the heat to one single chip on operation board 203.The chip top being welded on printed circuit board (PCB) front is connected with the first radiator 2041 dispels the heat, and printed circuit back is connected the second radiator 2042 and dispels the heat with chip bottom corresponding part.
In actual applications, in order to the first radiator 2041 He or the second radiator 2042 can be designed to " comb " shape of diffuse transmission type by increasing heat radiation area, or the shape of heat radiation gear piece.Certainly various rule or irregular shape can also be designed to faster and better help chip cooling according to practical application request.
In specific implementation, the first radiator 2041 and chip top by heat-conducting glue bonding or screw twist the mode connect and connect heat radiation.Second radiator 2042 connects heat radiation with described printed circuit back and chip bottom corresponding part by the mode of welding or heat-conducting glue is bonding.
First radiator 2041 and or the second radiator 2042 adopt the good metal or metal alloy of thermal conductivity to make.Usually the good metal or metal alloy of the thermal conductivity such as aluminium, copper, aluminium alloy or copper alloy is adopted to make in embody rule.
Top like this by digging ore deposit machine operation board chip at virtual digit coin connects while the first radiator 2041 carries out dispelling the heat, the second radiator 2042 is connected with chip bottom corresponding part in printed circuit back, the partial heat that chip on operation board 203 produces is transferred to printed circuit board (PCB) outside, greatly improves the radiating efficiency of chip.
Certainly, in the application of reality, virtual digit coin digs the operation board often more than a piece in the machine of ore deposit, and the chip on each operation board also comprises multiple usually, for avoiding repeating, and can with reference to the structure of said chip heat abstractor to the heat radiation of each chip.
Preferably, virtual digit coin digs ore deposit machine and also comprises electric fan, and described electric fan is positioned at cabinet both sides, the heat dug with virtual digit coin in the machine of ore deposit that can be faster and better, effectively ensures that virtual digit coin digs the normal work of ore deposit level.
Embodiment three
Introduce a kind of electronic apparatus that the utility model embodiment provides in detail.
With reference to Fig. 3, show the structural representation of a kind of electronic apparatus of the utility model, specifically comprise the chip heat radiator 303 that the chip on shell 301, printed circuit board (PCB) 302, described printed circuit board (PCB) adopts.
Each embodiment in this specification all adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar part mutually see.
Above ore deposit machine and electronic equipment are dug to a kind of chip heat radiator provided by the utility model, virtual digit coin, be described in detail, apply specific case herein to set forth principle of the present utility model and execution mode, the explanation of above embodiment just understands method of the present utility model and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (9)
1. a chip heat radiator, it is characterized in that, comprise: be welded on the chip in printed circuit board (PCB) front, the first radiator and the second radiator, described first radiator is connected with chip top and dispels the heat, and described second radiator is connected with described printed circuit back and chip bottom corresponding part and dispels the heat.
2. device according to claim 1, is characterized in that, described first radiator and or the second radiator are heat radiation gear piece.
3. device according to claim 1, is characterized in that, described first radiator and the mode that chip top connects are that the bonding or screw of heat-conducting glue is twisted and connect.
4. device according to claim 1, is characterized in that, described second radiator and the mode that described printed circuit back and chip bottom corresponding part connect for weld or heat-conducting glue bonding.
5. device according to claim 2, is characterized in that, described first radiator and or the second radiator adopt the good metal or metal alloy of thermal conductivity to make.
6. virtual digit coin digs an ore deposit machine, it is characterized in that, comprises cabinet, is positioned at the control board of cabinet inside, the operation board be connected with control board and for being the chip heat radiator on operation board described in the arbitrary claim of the claim 1 to 5 of chip cooling.
7. virtual digit coin according to claim 6 digs ore deposit machine, it is characterized in that, described operation board is one or more.
8. the virtual digit coin according to claim 6 or 7 digs ore deposit machine, it is characterized in that, described virtual digit coin digs ore deposit machine and also comprises electric fan, and described electric fan is positioned at cabinet both sides.
9. an electronic equipment, is characterized in that, comprises the chip on shell, printed circuit board (PCB), described printed circuit board (PCB) and the chip heat radiator described in the arbitrary claim of claim 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520353408.7U CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520353408.7U CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204668293U true CN204668293U (en) | 2015-09-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520353408.7U Ceased CN204668293U (en) | 2015-05-27 | 2015-05-27 | Chip heat radiator, virtual digit coin dig ore deposit machine and electronic equipment |
Country Status (1)
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| CN (1) | CN204668293U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
| CN108323114A (en) * | 2018-02-14 | 2018-07-24 | 北京比特大陆科技有限公司 | Circuit board with effect of symmetrical heat radiation structure and computing device |
| CN108415320A (en) * | 2018-02-13 | 2018-08-17 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digit coin dig mine machine |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
| WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
| CN110324956A (en) * | 2018-03-30 | 2019-10-11 | 广州市信宏洗衣机械有限公司 | A kind of radiator of multilayer circuit board |
| US11425839B2 (en) | 2017-05-18 | 2022-08-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
-
2015
- 2015-05-27 CN CN201520353408.7U patent/CN204668293U/en not_active Ceased
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11425839B2 (en) | 2017-05-18 | 2022-08-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
| US11882669B2 (en) | 2017-05-18 | 2024-01-23 | Canaan Creative Co., Ltd. | Computational heat dissipation structure, computing device comprising same, mine |
| WO2019072161A1 (en) * | 2017-10-10 | 2019-04-18 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
| US11152278B2 (en) | 2017-10-10 | 2021-10-19 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
| CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
| CN108415320A (en) * | 2018-02-13 | 2018-08-17 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digit coin dig mine machine |
| CN108415320B (en) * | 2018-02-13 | 2021-06-29 | 深圳比特微电子科技有限公司 | Power supply circuit, circuit board and virtual digital coin ore digging machine |
| CN108323114A (en) * | 2018-02-14 | 2018-07-24 | 北京比特大陆科技有限公司 | Circuit board with effect of symmetrical heat radiation structure and computing device |
| CN108323114B (en) * | 2018-02-14 | 2024-06-25 | 北京比特大陆科技有限公司 | Circuit board with symmetrical heat dissipation structure and computing equipment |
| WO2019179259A1 (en) * | 2018-03-21 | 2019-09-26 | Bitmain Technologies Inc. | Chip heat dissipating structure, chip structure, circuit board, and computing device |
| CN110324956B (en) * | 2018-03-30 | 2022-05-20 | 广州市信宏洗衣机械有限公司 | Heat radiator for multilayer circuit board |
| CN110324956A (en) * | 2018-03-30 | 2019-10-11 | 广州市信宏洗衣机械有限公司 | A kind of radiator of multilayer circuit board |
| CN108594975B (en) * | 2018-07-12 | 2023-11-21 | 常州天能博智能***科技有限公司 | Operation board card heat radiation structure |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能***科技有限公司 | A kind of operation board radiator structure |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161216 Address after: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital 2 Patentee after: Zhan Ketuan Address before: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee before: BEIJING BITMAIN TECHNOLOGY CO., LTD. |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital 2 Patentee before: Zhan Ketuan |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170510 Address after: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital three layer 301 Patentee after: Feng Feng Technology (Beijing) Co., Ltd. Address before: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee before: BEIJING BITMAIN TECHNOLOGY CO., LTD. |
|
| CB03 | Change of inventor or designer information |
Inventor after: Zhan Ketuan Inventor after: Jiang Zhengxin Inventor after: Cheng Wenjie Inventor after: Liu Jinsuo Inventor before: Zhan Ketuan Inventor before: Jiang Zhengxin Inventor before: Cheng Wenjie Inventor before: Liu Jinsuo Inventor before: Zhong Rui |
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| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170911 Address after: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital three layer 301 Patentee before: Feng Feng Technology (Beijing) Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20180724 Decision number of declaring invalidation: 36685 Granted publication date: 20150923 |
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| IW01 | Full invalidation of patent right |