CN204629865U - 双单元移动式冷风机 - Google Patents
双单元移动式冷风机 Download PDFInfo
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Abstract
一种双单元移动式冷风机,包括带有进风口和出风口的壳体及作为水槽的底座,出风口设置在壳体的前部,进风口设置在壳体的后部,壳体内设有湿帘装置,底座的底部设有用于移动的滚轮,其特征在于:所述壳体内设有二组上下布置的冷风单元,壳体内设有电路板及对应的控制开关,每组冷风单元包括一风机以及一前面板,风机安装在前面板的出风口处,二块前面板之间通过前连接件连接固定。设有二组冷风单元,可以根据需要开启一个或二个同时运行,生产时可以采用原先单个冷风机的模具,不仅加工方便,还降低了投资成本;二个单元通过连接件上下叠加,美观且组装方便。本实用新型结构合理、使用方便、实用性强,可以适合多种面积不同的场所使用。
Description
技术领域
本实用新型涉及冷风机技术领域,具体涉及一种双单元移动式冷风机。
背景技术
冷风机分为制冷工业冷风机及家用冷风机,工业冷风机一般用于冷库、冷链物流制冷环境中,家用冷风机又叫水冷空调,是一种集降温、换气、防尘、除味于一身的蒸发式降温换气机组。冷风机除了可以让企业车间、公共场所、商业娱乐场合带来新鲜空气和降低温度之外,还有一个重要特点——节能、环保!它是一款全新无压缩机、无冷媒、无铜管的环保产品,主要部件核心——蒸发式湿帘(多层波纹纤维叠合物)及1.1KW的主电机,是传统中央空调耗电1/8,具有节能、环保、运行成本低、降温效果好的特点。
现有的冷风机一般应用在面积较大的场所,因此冷风机安装后一般是固定不移动的,目前,为了使冷风机能够应用于更多的场所,也出现了移动式冷风机,如专利号为CN201320230670.3的中国实用新型专利《一种移动式净化冷风机》,包括带有进风口和出风口的壳体,在进风口处设有引风机,壳体内部设有空气过滤组件,其特征在于,壳体底部安装有移动轮,在壳体内还设有湿帘***;所述湿帘***包括:布置在进风口和空气过滤组件之间的湿帘纸;处在湿帘纸下方的水箱;处在湿帘纸上方的布水管;连通在水箱和布水管之间的水泵。这种冷风机可以方便移动,但是它跟传统的冷风机一样是一个单元的,如果场地面积大的话,一个冷风机不能满足降温的需要,而设置二个冷风机势必增加成本,因此有必要设计出一款双单元的冷风机来满足市场的需要。
发明内容
本实用新型所要解决的技术问题是针对上述的技术现状而提供一种结构合理实用、具有二组冷风单元结构的双单元移动式冷风机。
本实用新型解决上述技术问题所采用的技术方案为:一种双单元移动式冷风机,包括带有进风口和出风口的壳体及作为水槽的底座,出风口设置在壳体的前部,进风口设置在壳体的后部,壳体内设有湿帘装置,底座的底部设有用于移动的滚轮,其特征在于:所述壳体内设有二组上下布置的冷风单元,壳体内设有电路板及对应的控制开关,每组冷风单元包括一风机以及一前面板,风机安装在前面板的出风口处,二块前面板之间通过前连接件连接固定。
作为改进,所述壳体主要是由前面板、后面板、左右侧板及上盖组装起来的长方体结构,二组冷风单元上下叠合设置在壳体内,风机为相同的二个,前面板也为相同的上下二块,前面板的内壁上凸设有供风机安装的圆形的安装腔。
进一步改进,所述前连接件为与前面板的上下两端相配合的条形结构,前连接件的内壁下端设有若干卡槽,连接件的内壁上端设有若干卡条,前面板的上端布设有与卡槽配合的卡块,前面板的下端设有与卡条配合的卡口,二块前面板通过前连接件上下叠加连接在一起。
再改进,所述卡槽后壁上开有供螺钉通过的槽口,卡块中设置了螺钉孔,再用螺钉连接。
再改进,所述前面板是由风机安装板、垫板以及百叶框罩通过螺钉组装而成,风机安装板的四角边缘设有连接孔,垫板上设有对应的通孔,百叶框罩上设有对应的沉孔,通过螺钉将百叶框罩、垫板与风机安装板连接在一起。
作为改进,所述后面板也分为上下二块,每块后面板上设有格栅状的进风口,在左右侧板的后侧中部架设有供后面板卡入的后连接件。
作为改进,所述底座的上表面设有供壳体对合的内凹的边沿,前面板中的下方一块、后面板的下方一块和左右侧板分别对应设置在边沿上,边沿的左右两侧设有连接柱,左右侧板的底部设有对应的连接孔,通过螺钉将左右侧板与底座连接固定。
进一步改进,所述湿帘装置包括湿帘纸,湿帘纸垂直设置在后面板内壁对应于进风口的位置,底座内对应于湿帘纸的位置设有积水盘,积水盘的中部设有向下凹的漏水孔,水槽内水泵通过水管和湿帘纸上方的上分水器连接。
再改进,所述湿帘纸也分成对应上下两组,在上下两组的湿帘纸之间设置了隔板,隔板兼作下分水器。
最后,所述底座的上端前侧设有注水部,在底座上方、前面板下端对应于注水部的位置设有一可滑动开启闭合的注水盖板。
与现有技术相比,本实用新型的优点在于:设有二组冷风单元,可以根据需要开启一个或二个同时运行,生产时可以采用大部分原先单个冷风机的模具,不仅加工方便,还降低了投资成本;二个冷风单元通过连接件上下叠加,结构合理且组装方便。本实用新型结构合理、使用方便、实用性强,可以适合多种面积不同的场所使用。
附图说明
图1为本实用新型的结构立体示意图;
图2为本实用新型的分解图;
图3为本实用新型中二个前面板拼接后的结构示意图;
图4为图3的分解图;
图5是图4中冷风单元的分解图,
图6是本实用新型的内部结构局部示意图;
图7是图4的局部放大图。
具体实施方式
以下结合附图实施例对本实用新型作进一步详细描述。
如图1~7所示,本实施例的双单元移动式冷风机,包括带有出风口15和进风口16的壳体1及作为水槽的底座2,出风口15设置在壳体1的前部,进风口16设置在壳体1的后部,壳体1内设有湿帘装置和上下二组的冷风单元,壳体1内设有电路板及对应的控制开关,二组的冷风单元可以独立工作,也可以联合起来工作,这可以通过电路来实现,是常规知识,每组冷风单元包括一风机8以及用于安装风机8的前面板11,前面板11为上下二块连接而成,风机8通过支架安装在前面板11内的出风口15处,二块上下前面板11之间通过前连接件6连接固定;壳体1主要是由二块前面板11、二块后面板12、左右侧板13及上盖14组装起来的长方体结构,二组冷风单元上下叠合设置在壳体1内,风机8为相同的二个,前面板11也为相同的上下二块,前面板11是由风机安装板110、垫板100以及百叶框罩10通过螺钉组装而成,风机安装板110的内壁上凸设有供风机8安装的圆形的安装腔111,垫板100上设有对应的圆形镂空1002,百叶框罩10上设有带有格栅状的出风口15,里面有导风的格栅,风机安装板110的四角边缘设有连接孔1101,垫板100上设有对应的通孔1001,百叶框罩10上设有对应的沉孔101,通过螺钉将百叶框罩、垫板与风机安装板110连接在一起,设置百叶框罩10可以起到导风作用,使冷风可以吹到更广阔空间,同时也起到安全防护作用;前连接件6为与前面板11的上下两端相配合的条形结构,前连接件6的内壁下端设有若干卡槽61,卡槽61后壁上开有供螺钉通过的槽口,前连接件6的内壁上端设有若干卡条62,下前面板的风机安装板110的上端布设有与卡槽61配合的卡块112,卡块112中设置螺钉孔,上前面板的风机安装板110的下端设有与卡条62配合的卡口113,这样通过前连接件6结合螺钉将二块上下前面板11连接在一起;后面板12也分为上下二块,每块后面板12上设有格栅状的进风口16,在左右侧板13的后侧中部架设有供后面板12卡入的后连接件7;底座2的上表面设有供壳体1对合的内凹的边沿,前面板11中的下方一块、后面板12的下方一块和左右侧板13分别对应设置在边沿上,边沿的左右两侧设有连接柱23,左右侧板13的底部设有对应的连接孔131,通过螺钉将左右侧板13与底座2连接固定,二块后面板12卡入后连接件7后通过螺钉与左右侧板13的后端相连接,而二块前面板11通过前连接件6叠加后分别与左右侧板13的前端螺钉连接固定;湿帘装置包括湿帘纸9、以及设置在底座2内的水泵,湿帘纸9垂直设置在后面板12的内壁对应于进风口16的位置,水泵设置在底座2内位于湿帘纸9的下方,水泵上设有水管与湿帘纸9上的上分水器9a连接,底座2内对应于湿帘纸9的位置设有积水盘21,积水盘21的中部设有向下凹的漏水孔211,湿帘纸9也分成对应上下两组,在上下两组的湿帘纸之间设置了隔板9b,隔板9b是向后逐步倾斜的,隔板前部有挡水条,使隔板兼作下分水器,隔板通过螺钉和两侧的侧板连接固定,下分水器和上分水器一样表面分布有液体导流道,起到引导分布效果,由于隔板设置也有效防止上组湿帘纸内的液体被下风机吹走,底座2的上端前侧设有注水部22,在底座2上方、前面板11下端对应于注水部22的位置设有一可滑动开启闭合的注水盖板221;底座2的底部左右两侧分别设置有用于安装滚轮3的安装架4,滚轮3为四个,分别安装在二个安装架4的底部前后位置,这样就可以根据需要将冷风机方便地移动位置。
冷风机工作时,底座2水槽中的水通过水泵经水管被抽上,通过分水器将湿帘纸浸透,经风机8吹入的热空气与湿帘纸充分接触,进行热量交换后通过湿帘纸降温的空气从出风口15吹出,由于设有二组冷风单元,可以根据场地的面积大小进行选择使用一组或二组同时使用,非常方便,而且由于二组冷风单元尺寸相同,生产时可以采用原先单个冷风机的部分模具,不仅加工方便,还降低了投资成本。
Claims (10)
1.一种双单元移动式冷风机,包括带有进风口和出风口的壳体及作为水槽的底座,出风口设置在壳体的前部,进风口设置在壳体的后部,壳体内设有湿帘装置,底座的底部设有用于移动的滚轮,其特征在于:所述壳体内设有二组上下布置的冷风单元,壳体内设有电路板及对应的控制开关,每组冷风单元包括一风机以及一前面板,风机安装在前面板的出风口处,二块前面板之间通过前连接件连接固定。
2.根据权利要求1所述的双单元移动式冷风机,其特征在于:所述壳体主要是由前面板、后面板、左右侧板及上盖组装起来的长方体结构,二组冷风单元上下叠合设置在壳体内,风机为相同的二个,前面板也为相同的上下二块,前面板的内壁上凸设有供风机安装的圆形的安装腔。
3.根据权利要求2所述的双单元移动式冷风机,其特征在于:所述前连接件为与前面板的上下两端相配合的条形结构,前连接件的内壁下端设有若干卡槽,连接件的内壁上端设有若干卡条,前面板的上端布设有与卡槽配合的卡块,前面板的下端设有与卡条配合的卡口,二块前面板通过前连接件上下叠加连接在一起。
4.根据权利要求3所述的双单元移动式冷风机,其特征在于:所述卡槽后壁上开有供螺钉通过的槽口,卡块中设置了螺钉孔,再用螺钉连接。
5.根据权利要求3所述的双单元移动式冷风机,其特征在于:所述前面板是由风机安装板、垫板以及百叶框罩通过螺钉组装而成,风机安装板的四角边缘设有连接孔,垫板上设有对应的通孔,百叶框罩上设有对应的沉孔,通过螺钉将百叶框罩、垫板与风机安装板连接在一起。
6.根据权利要求2所述的双单元移动式冷风机,其特征在于:所述后面板也分为上下二块,每块后面板上设有格栅状的进风口,在左右侧板的后侧中部架设有供后面板卡入的后连接件。
7.根据权利要求1至6任一权利要求所述的双单元移动式冷风机,其特征在于:所述底座的上表面设有供壳体对合的内凹的边沿,前面板中的下方一块、后面板的下方一块和左右侧板分别对应设置在边沿上,边沿的左右两侧设有连接柱,左右侧板的底部设有对应的连接孔,通过螺钉将左右侧板与底座连接固定。
8.根据权利要求7所述的双单元移动式冷风机,其特征在于:所述湿帘装置包括湿帘纸,湿帘纸垂直设置在后面板内壁对应于进风口的位置,底座内对应于湿帘纸的位置设有积水盘,积水盘的中部设有向下凹的漏水孔,水槽内水泵通过水管和湿帘纸上方的上分水器连接。
9.根据权利要求8所述的双单元移动式冷风机,其特征在于:所述湿帘纸也分成对应上下两组,在上下两组的湿帘纸之间设置了隔板,隔板兼作下分水器。
10.根据权利要求9所述的双单元移动式冷风机,其特征在于:所述底座的上端前侧设有注水部,在底座上方、前面板下端对应于注水部的位置设有一可滑动开启闭合的注水盖板。
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US11967488B2 (en) | 2013-02-01 | 2024-04-23 | Asm Ip Holding B.V. | Method for treatment of deposition reactor |
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US11742189B2 (en) | 2015-03-12 | 2023-08-29 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US11956977B2 (en) | 2015-12-29 | 2024-04-09 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
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US11749562B2 (en) | 2016-07-08 | 2023-09-05 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US11694892B2 (en) | 2016-07-28 | 2023-07-04 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11610775B2 (en) | 2016-07-28 | 2023-03-21 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
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US11396702B2 (en) | 2016-11-15 | 2022-07-26 | Asm Ip Holding B.V. | Gas supply unit and substrate processing apparatus including the gas supply unit |
US11851755B2 (en) | 2016-12-15 | 2023-12-26 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
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US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US11410851B2 (en) | 2017-02-15 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
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US11848200B2 (en) | 2017-05-08 | 2023-12-19 | Asm Ip Holding B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US12040200B2 (en) | 2017-06-20 | 2024-07-16 | Asm Ip Holding B.V. | Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus |
US11976361B2 (en) | 2017-06-28 | 2024-05-07 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US11695054B2 (en) | 2017-07-18 | 2023-07-04 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11802338B2 (en) | 2017-07-26 | 2023-10-31 | Asm Ip Holding B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US11587821B2 (en) | 2017-08-08 | 2023-02-21 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11417545B2 (en) | 2017-08-08 | 2022-08-16 | Asm Ip Holding B.V. | Radiation shield |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11581220B2 (en) | 2017-08-30 | 2023-02-14 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11387120B2 (en) | 2017-09-28 | 2022-07-12 | Asm Ip Holding B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US12033861B2 (en) | 2017-10-05 | 2024-07-09 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US12040184B2 (en) | 2017-10-30 | 2024-07-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
CN111344522B (zh) * | 2017-11-27 | 2022-04-12 | 阿斯莫Ip控股公司 | 包括洁净迷你环境的装置 |
US11682572B2 (en) | 2017-11-27 | 2023-06-20 | Asm Ip Holdings B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
CN111344522A (zh) * | 2017-11-27 | 2020-06-26 | 阿斯莫Ip控股公司 | 包括洁净迷你环境的装置 |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US11501973B2 (en) | 2018-01-16 | 2022-11-15 | Asm Ip Holding B.V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US11972944B2 (en) | 2018-01-19 | 2024-04-30 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11393690B2 (en) | 2018-01-19 | 2022-07-19 | Asm Ip Holding B.V. | Deposition method |
US11735414B2 (en) | 2018-02-06 | 2023-08-22 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11387106B2 (en) | 2018-02-14 | 2022-07-12 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11482418B2 (en) | 2018-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Substrate processing method and apparatus |
US11939673B2 (en) | 2018-02-23 | 2024-03-26 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11398382B2 (en) | 2018-03-27 | 2022-07-26 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US12020938B2 (en) | 2018-03-27 | 2024-06-25 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US12025484B2 (en) | 2018-05-08 | 2024-07-02 | Asm Ip Holding B.V. | Thin film forming method |
CN108548258B (zh) * | 2018-05-16 | 2024-03-08 | 广东美的环境电器制造有限公司 | 冷风扇 |
CN108548258A (zh) * | 2018-05-16 | 2018-09-18 | 广东美的环境电器制造有限公司 | 冷风扇 |
US11908733B2 (en) | 2018-05-28 | 2024-02-20 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11361990B2 (en) | 2018-05-28 | 2022-06-14 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11296189B2 (en) | 2018-06-21 | 2022-04-05 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US11530483B2 (en) | 2018-06-21 | 2022-12-20 | Asm Ip Holding B.V. | Substrate processing system |
US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11814715B2 (en) | 2018-06-27 | 2023-11-14 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11952658B2 (en) | 2018-06-27 | 2024-04-09 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11923190B2 (en) | 2018-07-03 | 2024-03-05 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11646197B2 (en) | 2018-07-03 | 2023-05-09 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
CN109000352A (zh) * | 2018-08-03 | 2018-12-14 | 珠海格力电器股份有限公司 | 风道模块、设有其的风道结构及空调 |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11274369B2 (en) | 2018-09-11 | 2022-03-15 | Asm Ip Holding B.V. | Thin film deposition method |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11885023B2 (en) | 2018-10-01 | 2024-01-30 | Asm Ip Holding B.V. | Substrate retaining apparatus, system including the apparatus, and method of using same |
US11414760B2 (en) | 2018-10-08 | 2022-08-16 | Asm Ip Holding B.V. | Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same |
US11664199B2 (en) | 2018-10-19 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11735445B2 (en) | 2018-10-31 | 2023-08-22 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11499226B2 (en) | 2018-11-02 | 2022-11-15 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11866823B2 (en) | 2018-11-02 | 2024-01-09 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11798999B2 (en) | 2018-11-16 | 2023-10-24 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US11411088B2 (en) | 2018-11-16 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11488819B2 (en) | 2018-12-04 | 2022-11-01 | Asm Ip Holding B.V. | Method of cleaning substrate processing apparatus |
US11769670B2 (en) | 2018-12-13 | 2023-09-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
US11658029B2 (en) | 2018-12-14 | 2023-05-23 | Asm Ip Holding B.V. | Method of forming a device structure using selective deposition of gallium nitride and system for same |
US11390946B2 (en) | 2019-01-17 | 2022-07-19 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11959171B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11798834B2 (en) | 2019-02-20 | 2023-10-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11615980B2 (en) | 2019-02-20 | 2023-03-28 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
US11342216B2 (en) | 2019-02-20 | 2022-05-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11629407B2 (en) | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
US11424119B2 (en) | 2019-03-08 | 2022-08-23 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
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US11378337B2 (en) | 2019-03-28 | 2022-07-05 | Asm Ip Holding B.V. | Door opener and substrate processing apparatus provided therewith |
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US11814747B2 (en) | 2019-04-24 | 2023-11-14 | Asm Ip Holding B.V. | Gas-phase reactor system-with a reaction chamber, a solid precursor source vessel, a gas distribution system, and a flange assembly |
US11781221B2 (en) | 2019-05-07 | 2023-10-10 | Asm Ip Holding B.V. | Chemical source vessel with dip tube |
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US11515188B2 (en) | 2019-05-16 | 2022-11-29 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
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US11605528B2 (en) | 2019-07-09 | 2023-03-14 | Asm Ip Holding B.V. | Plasma device using coaxial waveguide, and substrate treatment method |
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US11688603B2 (en) | 2019-07-17 | 2023-06-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium structures |
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US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
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USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
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US11639548B2 (en) | 2019-08-21 | 2023-05-02 | Asm Ip Holding B.V. | Film-forming material mixed-gas forming device and film forming device |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
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US12033849B2 (en) | 2019-08-23 | 2024-07-09 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by PEALD using bis(diethylamino)silane |
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