CN204593313U - A kind of LED metal base printed circuit board heat abstractor - Google Patents
A kind of LED metal base printed circuit board heat abstractor Download PDFInfo
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- CN204593313U CN204593313U CN201520274243.4U CN201520274243U CN204593313U CN 204593313 U CN204593313 U CN 204593313U CN 201520274243 U CN201520274243 U CN 201520274243U CN 204593313 U CN204593313 U CN 204593313U
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Abstract
A kind of LED metal base printed circuit board heat abstractor, comprise metal base printed circuit board and the heat radiating metal body of surface mount LED chip, it is characterized in that: the metal base printed circuit board of described surface mount LED chip is in copper foil layer upper surface attachment LED chip, its cross section is trapezoidal shape, described heat radiating metal body has the U-shaped groove on band riveting limit, the metal base printed circuit board riveting of described surface mount LED chip is in the U-shaped groove of described heat radiating metal body, the metal-based layer of the metal base printed circuit board of surface mount LED chip and described heat radiating metal body U-shaped groove floor are fitted tightly.
Description
Technical field
The utility model belongs to light emitting diode LED lighting field, particularly the heat dissipation technology of LED metal base printed circuit board.
Background technology
In order to be conducive to the heat radiation of illuminating LED chip, always LED chip is welded on the printed circuit board of metal substrate.Usual use two kinds of methods strengthen the heat radiation of LED chip, and a kind of is the area strengthening metal base printed circuit board, and another kind is arranged on additional radiator by metal base printed circuit board.The be welded cross section of bar shaped printed circuit board (PCB) of multiple LED chip of traditional paster is all rectangle, and is inserted in the way to insert in the groove on cooling base, and then is installed on the framework of lighting.In order to reduce the thermal resistance between the heat conduction base of metal base printed circuit board bar bottom surface and cooling base, normal use heat-conducting cream or other coating, or with screw, metal base printed circuit board bar is fixed on cooling base again.But, always untight with the contact between the LED printed circuit board strip in the groove of inserted mode insertion pedestal and cooling base, larger thermal resistance can reduce the radiating effect of LED, and causes the drawback of the cost increase adopting the volume of larger metal base printed circuit board area and larger cooling base to bring.
Utility model content
Technical problem to be solved in the utility model makes the LED chip be arranged on metal base printed circuit board bar obtain better heat dispersion.
A kind of LED metal base printed circuit board heat abstractor, comprise metal base printed circuit board and the heat radiating metal body of surface mount LED chip, it is characterized in that: the metal base printed circuit board of described surface mount LED chip is in copper foil layer upper surface attachment LED chip, its cross section is trapezoidal shape, described heat radiating metal body has the U-shaped groove on band riveting limit, the metal base printed circuit board riveting of described surface mount LED chip is in the U-shaped groove of described heat radiating metal body, the metal-based layer of the metal base printed circuit board of surface mount LED chip and described heat radiating metal body U-shaped groove floor are fitted tightly.
The metal base printed circuit board of described surface mount LED chip is stripe board, cross section is trapezoidal shape, first waist inclined-plane and the angle α between the second waist inclined-plane and vertical plane are 12 ° to 15 °, copper foil layer surface mount LED chip, and bottom surface is metal base printed circuit board metal-based layer.
U-shaped groove first side on described heat radiating metal body is identical with the angle between vertical plane and the angle α between printed circuit board waist inclined-plane and vertical plane, U-shaped groove second side is vertical with U-shaped groove floor before riveting, the riveting limit that U-shaped groove second side top has one to raise up, U-shaped groove second side is vertical with U-shaped groove floor before riveting, coincide after riveting with metal base printed circuit board second waist inclined-plane.
Described metal base printed circuit board preferably adopts aluminum-base printed circuit board.
Described heat radiating metal body preferably adopts extruded aluminium section.
The utility model proposes a kind of LED metal base printed circuit board heat abstractor, the trapezoid cross section Metal Substrate strip printed circuit board of surface mount LED chip, riveting is in the shape radiator in dovetail groove, its remarkable advantage is: because of the close contact through riveting between the heat-conducting metal basic unit of the metal base printed circuit board bar of surface mount LED chip and heat radiating metal section bar, thus thermal resistance is reduced to minimum, be conducive to the heat radiation of LED chip; Adopt riveting technique during installation, speed is fast, and work efficiency is high; The consumption of metal base printed circuit board material can be reduced, reduce cost.
Accompanying drawing explanation
Fig. 1 is the utility model schematic cross-section.
Fig. 2 is the metal base printed circuit board composition diagram of surface mount LED chip.
Fig. 3 is metal base printed circuit board each several part title schematic diagram.
Fig. 4 is trapezoid cross section metal base printed circuit board central plane angle view.
Fig. 5 is the structure chart of heat radiating metal body U-shaped groove.
Fig. 6 is that surface mount has the printed circuit lath of LED chip and the installation of heat radiating metal body and riveting process schematic perspective view.
number in the figure explanation
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Detailed description of the invention
With reference to accompanying drawing, specific implementation method of the present utility model is described further.
A kind of LED metal base printed circuit board of the utility model heat abstractor, comprises metal base printed circuit board (1) and the heat radiating metal body (2) of surface mount LED chip.
The metal base printed circuit board (1) of described surface mount LED chip is at copper foil layer (123) upper surface attachment LED chip (11), its cross section is trapezoidal shape, described heat radiating metal body (2) has the U-shaped groove (20) of band riveting limit (25), metal base printed circuit board (1) riveting of described surface mount LED chip, in the U-shaped groove (20) of described heat radiating metal body, makes the metal-based layer of the metal base printed circuit board of surface mount LED chip (1) (125) and described heat radiating metal body U-shaped groove floor (23) fit tightly.
The metal base printed circuit board (1) of described surface mount LED chip is stripe board, cross section is trapezoidal shape, first waist inclined-plane (121) and the angle α between the second waist inclined-plane (122) and vertical plane are 12 ° to 15 °, copper foil layer (123) surface mount LED chip (11), bottom surface is metal base printed circuit board metal-based layer (125).
U-shaped groove first side (22) on described heat radiating metal body is identical with the angle between vertical plane and the angle α between printed circuit board waist inclined-plane and vertical plane, U-shaped groove second side (24) is vertical with U-shaped groove floor (23) before riveting, the riveting limit (25) that U-shaped groove second side top has one to raise up, U-shaped groove second side is vertical with U-shaped groove floor (23) before riveting, coincide after riveting with metal base printed circuit board second waist inclined-plane (122).
Described metal base printed circuit board (12) preferably adopts aluminum-base printed circuit board.
Described heat radiating metal body (2) preferably adopts extruded aluminium section.
With reference to accompanying drawing 2 and accompanying drawing 3, the printed circuit board (1) of surface mount LED chip be by LED chip (11) surface mount on metal base printed circuit board copper foil layer (123), metal base printed circuit board metal-based layer (125) is the bottom of metal base printed circuit board (1), is metal base printed circuit board thermally conductive insulating layer (124) between metal base printed circuit board copper foil layer (123) and metal base printed circuit board metal-based layer (125).Metal base printed circuit board (12) preferably adopts aluminium base base printed circuit board.
With reference to accompanying drawing 4, the cross section of metal base printed circuit board (12) is trapezoidal shape, trapezoid cross section printed circuit board first waist inclined-plane (121) is identical with the angle (α) between vertical plane with trapezoid cross section printed circuit board second waist inclined-plane (122), is 12 ° to 15 °.
With reference to accompanying drawing 5, heat radiating metal body (2) is the shape according to meeting cooling requirements and extruded arbitrary shape and size, preferably adopts extruded aluminium section.Heat radiating metal body U-shaped groove (20) is by heat radiating metal body groove first side (22), and heat radiating metal body groove floor (23) and heat radiating metal body groove second side (24) connect successively.Heat radiating metal body first upper surface (21) connects with heat radiating metal body groove first side (22).Angle β between heat radiating metal body groove first side (22) and heat radiating metal body groove floor (23) is 70 ° to 80 °, and heat radiating metal body groove second side (24) is vertical with U-shaped groove floor (23).Between heat radiating metal body groove second side (24) and heat radiating metal body second upper surface (26), the riveting limit (25) having to raise up.
Surface mount has the printed circuit lath (1) of LED chip and the installation of heat radiating metal body (2) and riveting process reference accompanying drawing 6.
The metal base printed circuit board (1) of described surface mount LED chip is inserted the U-shaped groove (20) of heat radiating metal body (2), make printed circuit board metal-based layer (125) and heat radiating metal body groove floor (23) respectively, printed circuit board first waist inclined-plane (121) and heat radiating metal body U-shaped groove first side (22) fit, with riveting limit (25) the downwards riveting of riveting mode by heat radiating metal body U-shaped groove second side (22) top upper lobes, after flat with heat radiating metal body second upper surface (26) riveting, metal base printed circuit board heat-conducting metal basic unit (125) and described heat radiating metal body U-shaped groove floor (23) of described surface mount LED chip fit tightly.
So far, surface mount has the first waist inclined-plane (121) of the printed circuit lath (1) of LED chip and the second waist inclined-plane (122) to be stuck on heat radiating metal body groove first side (22) and groove second side (24), metal base printed circuit board metal-based layer (125) then closely riveted in the groove floor (23) of heat radiating metal body (2), metal base printed circuit board metal-based layer (125) has minimum thermal contact resistance with the groove floor (23) of heat radiating metal body (2), the LED chip of surface mount on metal base printed circuit board obtains good radiating effect by cost far below the extrusion metal section bar of metal base printed circuit board.
In implementation process, being not precluded within surface mount has between printed circuit lath (1) the metal base printed circuit board metal-based layer (125) of LED chip and the groove floor (23) of heat radiating metal body (2) and smears heat-conducting cream or other coating routinely.
Claims (5)
1. a LED metal base printed circuit board heat abstractor, comprise metal base printed circuit board and the heat radiating metal body of surface mount LED chip, it is characterized in that: the metal base printed circuit board of described surface mount LED chip is in copper foil layer upper surface attachment LED chip, its cross section is trapezoidal shape, described heat radiating metal body has the U-shaped groove on band riveting limit, the metal base printed circuit board riveting of described surface mount LED chip is in the U-shaped groove of described heat radiating metal body, the metal-based layer of the metal base printed circuit board of surface mount LED chip and described heat radiating metal body U-shaped groove floor are fitted tightly.
2. by LED metal base printed circuit board heat abstractor described in claim 1, it is characterized in that: the metal base printed circuit board of described surface mount LED chip is stripe board, cross section is trapezoidal shape, first waist inclined-plane and the angle α between the second waist inclined-plane and vertical plane are 12 ° to 15 °, copper foil layer surface mount LED chip, bottom surface is metal base printed circuit board metal-based layer.
3. by LED metal base printed circuit board heat abstractor described in claim 1, it is characterized in that: U-shaped groove first side on described heat radiating metal body is identical with the angle α between metal base printed circuit board waist inclined-plane and vertical plane with the angle between vertical plane, U-shaped groove second side is vertical with U-shaped groove floor before riveting, the riveting limit that U-shaped groove second side top has one to raise up, the riveting limit raised up after riveting and metal base printed circuit board second waist inclined-plane coincide.
4., by LED metal base printed circuit board heat abstractor described in claim 2, it is characterized in that: described metal base printed circuit board preferably adopts aluminum-base printed circuit board.
5., by LED metal base printed circuit board heat abstractor described in claim 3, it is characterized in that: described heat radiating metal body preferably adopts extruded aluminium section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520274243.4U CN204593313U (en) | 2015-04-30 | 2015-04-30 | A kind of LED metal base printed circuit board heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520274243.4U CN204593313U (en) | 2015-04-30 | 2015-04-30 | A kind of LED metal base printed circuit board heat abstractor |
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| Publication Number | Publication Date |
|---|---|
| CN204593313U true CN204593313U (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520274243.4U Active CN204593313U (en) | 2015-04-30 | 2015-04-30 | A kind of LED metal base printed circuit board heat abstractor |
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| CN (1) | CN204593313U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836459A (en) * | 2020-07-21 | 2020-10-27 | 方炜 | High heat dissipation type circuit board |
| CN111986837A (en) * | 2020-07-20 | 2020-11-24 | 番禺得意精密电子工业有限公司 | Electronic substrate, connector assembly and manufacturing method of electronic substrate |
-
2015
- 2015-04-30 CN CN201520274243.4U patent/CN204593313U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111986837A (en) * | 2020-07-20 | 2020-11-24 | 番禺得意精密电子工业有限公司 | Electronic substrate, connector assembly and manufacturing method of electronic substrate |
| CN111986837B (en) * | 2020-07-20 | 2022-05-24 | 番禺得意精密电子工业有限公司 | Electronic substrate, connector assembly and manufacturing method of electronic substrate |
| CN111836459A (en) * | 2020-07-21 | 2020-10-27 | 方炜 | High heat dissipation type circuit board |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |