CN204592911U - A kind of semi-conductor illumination module - Google Patents

Abstract

The utility model discloses a kind of semi-conductor illumination module, this semi-conductor illumination module is integrated with all or part of illumination arrangement circuit and illuminating circuit, and covering members has at least hidden illumination arrangement circuit, do not covered in the bright dipping region of illuminating circuit and heat dissipation region corresponding to illuminating circuit, the heat dissipation region making illuminating circuit corresponding directly can contact the assembly section of heat abstractor.The utility model solves existing semi-conductor illumination module by above technical scheme and installs inconvenient and that radiating effect is not good problem.

Description

A kind of semi-conductor illumination module

Technical field

The utility model relates to lighting field, particularly relates to a kind of semi-conductor illumination module.

Background technology

Existing semi-conductor illumination module has following characteristics:

One, illuminating circuit (comprising at least one semiconductor luminous chip) is separated with illumination arrangement circuit (comprise and driving and control circuit) and arranges, namely illumination arrangement circuit is arranged on outside housing, is electrically connected by wire with the illuminating circuit in housing.Under this structure, illuminating circuit, illumination arrangement circuit need to carry out independent installation respectively, but also need wiring between, make troubles on the one hand to installation procedure, are separated setting on the other hand and also improve holistic cost;

Two, not often contact heat radiation between illuminating circuit with radiator, but across one deck housing or heat transfer piece.This radiating mode poor effect.

Utility model content

The utility model provides a kind of semi-conductor illumination module, solves existing semi-conductor illumination module and installs inconvenient and that radiating effect is not good problem.

For solving the problems of the technologies described above, the utility model by the following technical solutions:

A kind of semi-conductor illumination module, comprising:

First carrier module, comprises the first supporting body and the first electronic unit group; Described first supporting body has the first fitting surface and the first radiating surface that oppositely arrange, described first fitting surface is equipped with described first electronic unit group, described first electronic unit group is all or part of in illumination arrangement circuit, and described illumination arrangement circuit comprises driving and control circuit; Described first supporting body also have the input group and output group that are electrically connected with described first electronic unit group;

Second carrier module, comprises the second supporting body and illuminating circuit, and described illuminating circuit comprises at least one semiconductor luminous chip, and described second supporting body has the second fitting surface and the second radiating surface that oppositely arrange; Described second fitting surface is equipped with described illuminating circuit; Described second supporting body also has the energization input group be electrically connected with described illuminating circuit; The energization input group of described second supporting body and the output group of described first supporting body are electrically connected; Described first supporting body is positioned at below described second supporting body and is fixedly installed, in the same way, and the second radiating surface of the first fitting surface of described first supporting body and described second supporting body partly overlaps for first fitting surface of described first supporting body and the second fitting surface of described second supporting body;

Covering members, for hiding in described first carrier module and the second carrier module, except all or part of region except heat dissipation region corresponding with illuminating circuit on the bright dipping region of described illuminating circuit and described second radiating surface; At least hide described first electronic unit group; And described covering members has the cover-up surface and outer surface that oppositely arrange, being oppositely arranged with described first fitting surface, described second fitting surface at least partially of described cover-up surface; The heat dissipation region that on described second radiating surface, illuminating circuit is corresponding is for contacting the assembly section of heat abstractor.

In certain embodiments, described first supporting body has the hollow suitable with described heat dissipation region, and described heat dissipation region is from described hollow to exposing outside.

In certain embodiments, the electric connection position of the energization input group of described second supporting body and the output group of described first supporting body is: the overlapping region of the first fitting surface of described first supporting body and the second radiating surface of described second supporting body.

In certain embodiments, described covering members has suitable with the bright dipping region of described illuminating circuit and for placing reflector or lens region.

In certain embodiments, described semi-conductor illumination module also comprises wire group or terminals subgroup; When comprising described wire group, the input group on described wire group and described first supporting body is electrically connected, for by the input group access external circuit on described first supporting body; When comprising described terminals subgroup, described terminals subgroup is arranged on described first supporting body, for by the input group on described first supporting body and the pluggable electric connection of outer lead group.

In certain embodiments, at least one in described first supporting body, the second supporting body and covering members also has at least one department of assembly, for realizing the external mounting of described semi-conductor illumination module.Preferably, described department of assembly is also for accessing external circuit by the input group on described first supporting body.

In certain embodiments, at least one in described first supporting body and covering members having at least one first location structure, another one having suitable with the first location structure and for matching second location structure of relative position of described first supporting body of incompatible restriction and covering members with the first location structure.

In certain embodiments, described semi-conductor illumination module also comprises separation module; Described separation module comprises the 3rd supporting body and is assemblied in the second electronic unit group on described 3rd supporting body; Described second electronic unit group is the part in described illumination arrangement circuit; Described 3rd supporting body also have the input group and output group that are electrically connected with described second electronic unit group; Output group on described 3rd supporting body and the input group on described first supporting body are electrically connected; Input group on described 3rd supporting body is connected with external power source end.

In certain embodiments, described covering members comprises upper casing; Described upper casing has the hollow suitable with the bright dipping region of described illuminating circuit, and the bright dipping region of described illuminating circuit is from the hollow of described upper casing to exposing outside.

Or described covering members comprises suitable upper casing and lower casing; Described upper casing has the hollow suitable with the bright dipping region of described illuminating circuit, and the bright dipping region of described illuminating circuit is from the hollow of described upper casing to exposing outside; Described lower casing has the hollow suitable with described heat dissipation region, and described heat dissipation region is from the hollow of described lower casing to exposing outside.

The semi-conductor illumination module that the utility model provides, has following technique effect:

What one, be equipped with in illumination arrangement circuit on the first fitting surface of the first supporting body is all or part of, second fitting surface of the second supporting body is equipped with illuminating circuit, achieve the integrated setting of all or part of illumination arrangement circuit and illuminating circuit, the separation plan of establishment compared to existing technology, be convenient to install, and saved holistic cost.

Two, the second fitting surface of the second supporting body and the first same direction of fitting surface of the first supporting body are arranged, also be that the illumination arrangement circuit on the first fitting surface and the illuminating circuit on the second fitting surface are arranged in the same way, because illumination arrangement circuit, illuminating circuit all have certain altitude, need to occupy certain space, both arrange in the same way and space can be allowed to be re-used, utilize finish space fully, reduce overall dimensions.

Three, there is covering members, the illumination arrangement circuit avoided on the first fitting surface is outside exposed, and heat dissipation region corresponding for illuminating circuit on the second radiating surface does not cover in by this covering members, the heat dissipation region making illuminating circuit corresponding directly can contact the assembly section of heat abstractor, across the scheme that housing or heat transfer piece dispel the heat compared to existing technology, obvious better heat-radiation effect.

Accompanying drawing explanation

The stereogram of the semi-conductor illumination module that Fig. 1 provides for the utility model one embodiment;

Fig. 2 is the stereogram of another angle of semi-conductor illumination module shown in Fig. 1;

Fig. 3 is Fig. 1, the sectional view of semi-conductor illumination module shown in 2;

The stereogram of the semi-conductor illumination module that Fig. 4 provides for another embodiment of the utility model;

Fig. 5 is the sectional view of semi-conductor illumination module shown in Fig. 4;

The schematic diagram of the heat abstractor that Fig. 6 provides for the utility model one embodiment;

The stereogram of the semi-conductor illumination module that Fig. 7 provides for another embodiment of the utility model;

Fig. 8 is the sectional view of semi-conductor illumination module shown in Fig. 7;

The stereogram of the semi-conductor illumination module that Fig. 9 provides for another embodiment of the utility model;

Figure 10 is the stereogram of another angle of semi-conductor illumination module shown in Fig. 9;

Figure 11 is Fig. 9, the sectional view of semi-conductor illumination module shown in 10.

Detailed description of the invention

General plotting of the present utility model is, provides a kind of semi-conductor illumination module, and this semi-conductor illumination module at least comprises:

First carrier module, comprises the first supporting body and the first electronic unit group; Described first supporting body has the first fitting surface and the first radiating surface that oppositely arrange, described first fitting surface is equipped with described first electronic unit group, described first electronic unit group is all or part of in illumination arrangement circuit, and described illumination arrangement circuit comprises driving and control circuit; Described first supporting body also have the input group and output group that are electrically connected with described first electronic unit group;

Second carrier module, comprises the second supporting body and illuminating circuit, and described illuminating circuit comprises at least one semiconductor luminous chip, and described second supporting body has the second fitting surface and the second radiating surface that oppositely arrange; Described second fitting surface is equipped with described illuminating circuit; Described second supporting body also has the energization input group be electrically connected with described illuminating circuit; The energization input group of described second supporting body and the output group of described first supporting body are electrically connected; Second fitting surface of described second supporting body and the first fitting surface of described first supporting body are arranged in the same way;

Covering members, for hiding in described first carrier module and the second carrier module, except all or part of region except heat dissipation region corresponding with illuminating circuit on the bright dipping region of described illuminating circuit and described second radiating surface; At least hide described first electronic unit group; And covering members has the cover-up surface and outer surface that oppositely arrange, being oppositely arranged with described first fitting surface, described second fitting surface at least partially of described cover-up surface.

Being oppositely arranged with described first fitting surface, described second fitting surface at least partially of described cover-up surface, refers to cover-up surface at least partially, with the first fitting surface, the second fitting surface towards relative.

Above-mentioned semi-conductor illumination module, has at least these two regions of heat dissipation region corresponding with illuminating circuit on the bright dipping region of illuminating circuit, the second radiating surface to expose.The object making the overseas dew in the output optical zone of illuminating circuit is in order to bright dipping, makes the object that heat dissipation region corresponding with illuminating circuit on the second radiating surface exposes be install to this heat dissipation region be contacted with the assembly section of heat abstractor, to improve radiating effect.And the first radiating surface can covered covering, also can not covered covering, if covered covering, be then installed on the assembly section of heat abstractor across covering members, in this case, the part be interposed between the first radiating surface and heat abstractor can adopt heat sink material; If the first radiating surface does not have covered covering, also expose, then the first radiating surface can contact with the assembly section of heat abstractor, further improves radiating effect.

In above-mentioned semi-conductor illumination module, the first supporting body and the second supporting body can adopt different materials to make.

First supporting body can be pcb board, and the one side of pcb board is the first fitting surface, and opposing face is the first radiating surface, and each between the first fitting surface and the first radiating surface is the side of the first supporting body.The input group that first supporting body is electrically connected with the first electronic unit group comprises at least one input, and each input can be arranged on the first fitting surface, the first radiating surface or arbitrary side.The output group that first supporting body is electrically connected with the first electronic unit group comprises at least one output, and each output can be arranged on the first fitting surface, the first radiating surface or arbitrary side.Preferably, the input group the first supporting body is electrically connected with the first electronic unit group and output group are all arranged on the first fitting surface.

Second supporting body can be ceramic substrate, silicon material substrate, aluminum substrate etc.The one side of substrate is the second fitting surface, and opposing face is the second radiating surface, and each between the second fitting surface and the second radiating surface is the side of the second supporting body.The energization input group that second supporting body is electrically connected with illuminating circuit comprises at least one energization input, and each energization input can be arranged on the second fitting surface, the second radiating surface or arbitrary side.

Illuminating circuit can comprise a semiconductor luminous chip, or comprise two, plural semiconductor luminous chip, the light that each semiconductor luminous chip sends under the driving and control of illumination arrangement circuit can be the shades of colours such as white light, blue light, ruddiness, gold-tinted, for the semiconductor luminous chip emitted white light, can comprise the light emitting diode that can inspire blue light and be coated in the yellow fluorescent powder encapsulated layer on this light emitting diode, the blue light that this light emitting diode sends mixes with yellow fluorescent powder and produces white light.Can series, parallel or mixing connection between semiconductor luminous chip in illuminating circuit.

The energization input group of the second supporting body and the output group of the first supporting body are by being electrically connected with at least one under type: weld, grafting, to be spirally connected and clamping.

In above-mentioned semi-conductor illumination module, the position relationship of the first supporting body and the second supporting body is:

The first position relationship, the first supporting body is positioned at below the second supporting body and is fixedly installed, and the second radiating surface of the first fitting surface of the first supporting body and the second supporting body partly overlaps.

Under this structure, in order to make full use of space, also in order to make overall structure compacter, preferably, the first supporting body has the suitable hollow of the heat dissipation region corresponding with illuminating circuit on the second radiating surface, and this heat dissipation region is from this hollow to exposing outside.Namely the second supporting body is positioned at the top of the zone line of the first supporting body, and this zone line of the first supporting body is empty, and the heat dissipation region on the second radiating surface of the second supporting body exposes from the zone line of this sky.

Under this structure, also because the first fitting surface of the first supporting body and the second radiating surface of the second supporting body partly overlap, preferably, the energization input group of the second supporting body and the output group of the first supporting body, be electrically connected in the overlapping region of the first fitting surface and the second radiating surface.Be electrically connected in overlapping region, more firmly.

The implementation be electrically connected in overlapping region has multiple, comprises with at least one under type: welding, grafting, be spirally connected and clamping.Preferably, in this overlapping region, the energization input group of the second supporting body and the output group of the first supporting body, be electrically connected by reflow soldering process.

Under the inspiration of the first position relationship, can also prolong and bear multiple position relationship, including, but not limited to following cited second and third, four kinds of position relationships:

The second position relationship, the first supporting body is positioned at above the second supporting body and is fixedly installed, and the second fitting surface of the first radiating surface of the first supporting body and the second supporting body partly overlaps.

Under this structure, in order to make full use of space, also in order to make overall structure compacter, preferably, the first supporting body has the hollow suitable with the bright dipping region of illuminating circuit, and the bright dipping region of this illuminating circuit is from this hollow to exposing outside.Namely the second supporting body is positioned at the below of the zone line of the first supporting body, and in the first supporting body, this zone line is empty, and on the second supporting body, the bright dipping region of illuminating circuit is exposed from the zone line of this sky.

Under this structure, also because the first radiating surface of the first supporting body and the second fitting surface of the second supporting body partly overlap, preferably, the energization input group of the second supporting body and the output group of the first supporting body, be electrically connected in the overlapping region of this first radiating surface and the second fitting surface.Be electrically connected in overlapping region, more firmly.

The implementation be electrically connected in overlapping region has multiple, comprises with at least one under type: welding, grafting, be spirally connected and clamping.Preferably, in this overlapping region, the energization input group of the second supporting body and the output group of the first supporting body, be electrically connected by reflow soldering process.

The third position relationship, at least one side of the first supporting body and at least one side of the second supporting body, the thickness direction of the first supporting body, the second supporting body is oppositely arranged.

Compare first two structure, under this structure, second supporting body does not need overlapping with the first supporting body, and the first fitting surface and the second fitting surface can at same planes or not at same plane, and the first radiating surface and the second radiating surface also can at same planes or not at same plane.

In order to make full use of space, also in order to make overall structure compacter, preferably, the first supporting body has the hollow suitable with the second supporting body, and the heat dissipation region on the second fitting surface on the bright dipping region of illuminating circuit and the second radiating surface is from this hollow to exposing outside; Namely the zone line of the first supporting body is empty, and the second supporting body is positioned at the zone line of this sky, and the first supporting body is around the second supporting body.

In order to make full use of space, also in order to make overall structure compacter, preferably, at least one side of the first supporting body and at least one side of the second supporting body, all or part of laminating on the thickness direction of the first supporting body, the second supporting body.

4th kind of position relationship, the supporting body structure that the first supporting body and the second supporting body are formed in one.Under this structure, the first supporting body and the second supporting body are formed in one structure physically, for convenience of description, are logically divided into the first supporting body and the second supporting body.

Under this structure, the first fitting surface and the second fitting surface can at same planes or not at same plane, and the first radiating surface and the second radiating surface also can at same planes or not at same plane.Preferably, the second supporting body is positioned at the zone line of this integrated formed structure, and the first supporting body is around the second supporting body.

In above-mentioned semi-conductor illumination module, can further include wire group or terminals subgroup;

When comprising wire group, input group on this wire group and the first supporting body is electrically connected, and for by the input group access external circuit on the first supporting body, this external circuit can be the part in isolated illumination arrangement circuit, also can be power supply, or other equipment.This wire group comprises at least one wire, and one end of each wire in this wire group is fixedly installed on the first supporting body, and be electrically connected with at least one input on the first supporting body, the other end extends outside semi-conductor illumination module, is convenient to connect external circuit; Further, one end of each wire in this wire group can be fixedly installed on the first fitting surface of the first supporting body, is conveniently electrically connected with the same input be arranged on the first fitting surface.

When comprising terminals subgroup, this terminals subgroup is arranged on the first supporting body, for by the input group on the first supporting body and the pluggable electric connection of outer lead group.Terminals subgroup comprises at least one binding post, a binding post can be set for each root outer lead, also can many outer leads with a binding post, each binding post is after insertion outer lead, at least one input on this outer lead inserted and the first supporting body is electrically connected, after extracting outer lead, disconnect and being correspondingly electrically connected; Such as, binding post is designed to the form that button adds cable-through hole, when a button is depressed, the outer lead in cable-through hole can be extracted, after extracting the outer lead in cable-through hole, push-button reset, fixes automatically when outer lead being inserted cable-through hole, and is electrically connected by least one input on this outer lead and the first supporting body, if covering members has covered in the region at terminals subgroup place, then through hole is set at the respective regions of covering members, to expose button, is convenient to user and presses.

In above-mentioned semi-conductor illumination module, at least one in the first supporting body, the second supporting body and covering members can also have at least one department of assembly, for realizing the external mounting of semi-conductor illumination module.Such as at least one in semi-conductor illumination module and following device is assembled: heat abstractor, reflector, lens, pedestal.Department of assembly can be screw thread, buckle, through hole and/or rope, the external devices of optionally assembling and determining, and is mainly used in first supporting body at its place, the second supporting body or covering members and external devices to fixedly mount.Preferably, this department of assembly is also for accessing external circuit by the input group on the first supporting body, such as department of assembly is the screw thread on covering members, screw thread is provided with two conducting terminals, one of them can be electrically connected with the input group on the first supporting body, another can be electrically connected with external circuit, after this department of assembly's precession is had the pedestal of suitable screw thread by the mode by rotating, and pedestal one termination 220V voltage; And for example, department of assembly is provided with the passage can crossing line, and the input group on the first supporting body and the connection wire of external circuit pass from this passage.

In above-mentioned semi-conductor illumination module, at least one in first supporting body and covering members can also having at least one first location structure, another one having suitable with the first location structure and for matching second location structure of relative position of incompatible restriction first supporting body and covering members with the first location structure.Such as, the one in the first location structure, the second location structure is protruding, and another one is the groove suitable with this projection or through hole; Or be both protruding, the zone line of one of them projection is provided with groove, another is protruding suitable with this groove.First location structure, the second location structure can fix the relative position of the first supporting body and covering members after matching and installing, and stop and both relative movement should occur.

Being fixedly connected with by removably between the two arbitrarily in the first supporting body, the second supporting body, covering members, such as, fix installation by screw.

In above-mentioned semi-conductor illumination module, covering members can have suitable with the bright dipping region of illuminating circuit and for placing reflector or lens region, and this region can be arranged on the outer surface of covering members.The setting in this region can avoid reflector or lens to be directly installed on the second fitting surface or the first fitting surface, improves performance.

In above-mentioned semi-conductor illumination module, a kind of structure of covering members can be:

Comprise suitable upper casing and lower casing, the cover-up surface of the cover-up surface of upper casing and the cover-up surface composition covering members of lower casing, the outer surface of the outer surface of upper casing and the outer surface composition covering members of lower casing.Can fixedly mount between upper casing and lower casing or removably is installed, upper casing has the hollow suitable with the bright dipping region of illuminating circuit, and the bright dipping region of this illuminating circuit is from the hollow of upper casing to exposing outside; Lower casing has the suitable hollow of the heat dissipation region corresponding with illuminating circuit on the second radiating surface, and this heat dissipation region is from the hollow of lower casing to exposing outside.

Upper casing can also have suitable with the bright dipping region of illuminating circuit and for placing reflector or lens region further.

The heat dissipation region that the outer surface of lower casing is corresponding with illuminating circuit on the second radiating surface can be at grade; Or this heat dissipation region indent is in the outer surface of lower casing; Or this heat dissipation region outwardly convex is in the outer surface of lower casing.

Lower casing can adopt insulating materials, can play safety guarantee like this; Lower casing can adopt heat sink material, because lower casing contacts with the assembly section of heat abstractor, therefore adopts the lower casing energy improving radiating effect of heat sink material.More optimizedly, lower casing adopts the material not only having insulated but also dispelled the heat.

When lower casing adopt heat sink material time, lower casing can with the first cooling surface contacts; Or semi-conductor illumination module also comprises heat transfer piece, heat transfer piece is arranged between lower casing and the first radiating surface, and with lower casing, the first cooling surface contacts.For the first radiating surface, no matter be that directly contact adopts the lower casing of heat sink material, or adopt the lower casing of heat sink material by heat transfer piece contact, good heat sinking function can be realized.

In above-mentioned semi-conductor illumination module, the another kind of structure of covering members can be: only include upper casing, and do not have lower casing, and this upper casing has the cover-up surface and outer surface that oppositely arrange, being oppositely arranged with the first fitting surface and the second fitting surface at least partially of cover-up surface.Upper casing can be installed on the first supporting body or the second supporting body with fixed installation or dismountable mounting means, and upper casing has the hollow suitable with the bright dipping region of illuminating circuit, and the bright dipping region of this illuminating circuit is from the hollow of this upper casing to exposing outside; Owing to not having lower casing, the heat dissipation region that on the first radiating surface, the second radiating surface, illuminating circuit is corresponding, also to exposing outside, can contact the assembly section of heat abstractor, has preferably radiating effect.Upper casing can also have suitable with the bright dipping region of illuminating circuit and for placing reflector or lens region further.

Above-mentioned semi-conductor illumination module can further include separation module; Separation module comprises the 3rd supporting body and is assemblied in the second electronic unit group on the 3rd supporting body; Second electronic unit group is the part in illumination arrangement circuit; 3rd supporting body also have the input group and output group that are electrically connected with the second electronic unit group; Output group on 3rd supporting body and the input group on the first supporting body are electrically connected; Input group on 3rd supporting body is connected with external power source end.

The semi-conductor illumination module that the utility model provides can be applied in light fixture, this light fixture can also comprise: heat abstractor, heat abstractor has assembly section, at least corresponding with illuminating circuit on the second radiating surface in the above-mentioned semi-conductor illumination module heat dissipation region in assembly section contacts, and the heat Quick diffusing of the device contacted with its assembly section can be gone out by heat abstractor.

Above-mentioned light fixture can further include reflector or lens; The light that illuminating circuit in semi-conductor illumination module sends through its bright dipping region, and this reflector or lens injection.This light fixture is such as Down lamp.

Or above-mentioned light fixture can further include lamp holder and lampshade; The light that illuminating circuit in semi-conductor illumination module wherein sends is through its bright dipping region and the injection of this lampshade.This light fixture is such as bulb lamp.

Below by detailed description of the invention by reference to the accompanying drawings, the semi-conductor illumination module that the utility model provides is described in further detail.

Fig. 1,2,3 semi-conductor illumination modules provided for an embodiment, comprising: the first carrier module, the second carrier module and covering members, wherein,

First carrier module comprises the first supporting body 11 and the first electronic unit group 12; First supporting body 11 has the first fitting surface 111 and the first radiating surface (not shown) oppositely arranged, and each side between the first fitting surface 111 and the first radiating surface; It is all or part of in illumination arrangement circuit that first fitting surface 111 is equipped with the first electronic unit group 12, first electronic unit group 12, and illumination arrangement circuit comprises driving and control circuit; First supporting body 11 also have the input group (not shown) and output group (not shown) that are electrically connected with the first electronic unit group 12, in the present embodiment, the input group (not shown) on the first supporting body 11 and output group (not shown) are all arranged on the first fitting surface 111;

Second carrier module comprises the second supporting body 21 and illuminating circuit (not shown), and in the present embodiment, illuminating circuit comprises a semiconductor luminous chip, and the second supporting body 21 has the second fitting surface and the second radiating surface 212 that oppositely arrange; Second fitting surface is equipped with illuminating circuit, and illuminating circuit has light-emitting zone 221; Second supporting body 21 also has the energization input group (not shown) be electrically connected with illuminating circuit, in the present embodiment, this energization input group is arranged on the second fitting surface;

In the present embodiment, first supporting body 11 is positioned at above the second supporting body 21 and is fixedly installed, and the first supporting body 11 has the hollow 114 suitable with the bright dipping region 221 of illuminating circuit, the bright dipping region 221 of illuminating circuit is from this hollow 114 to exposing outside, in the same way, the first radiating surface of the first supporting body 11 and the second fitting surface of the second supporting body 21 partly overlap for second fitting surface of the second supporting body 21 and the first fitting surface 111 of the first supporting body 11; The energization input group of the second supporting body 21 and the output group of the first supporting body 11, in the overlapping region of the first radiating surface and the second fitting surface, be electrically connected by reflow soldering process;

In the present embodiment, covering members 3 comprises suitable upper casing 31 and lower casing 32, install removably between upper casing 31 and lower casing 32, after upper casing 31 and lower casing 32 close, can hide in the first carrier module and the second carrier module, the Zone Full except the heat dissipation region 2121 that illuminating circuit on the bright dipping region 221 of illuminating circuit and the second radiating surface 212 is corresponding; And upper casing 31 be positioned at cover-up surface (not shown) above the first supporting body 11 and the first fitting surface 111, second fitting surface is oppositely arranged, namely upper casing 31 be positioned at cover-up surface above the first supporting body 11 towards the first fitting surface 111, second fitting surface, the first fitting surface 111, second fitting surface is towards this part cover-up surface of upper casing 31; Upper casing 31 also has the hollow 311 suitable with the bright dipping region 221 of illuminating circuit, the bright dipping region 221 of illuminating circuit is from this hollow 311 to exposing outside, also there is suitable with the bright dipping region 221 of illuminating circuit and for placing reflector region, this region has planar portions 3121 and inclined plane part 3122, suitable with the structure of reflector; Upper casing 31 also has cable-through hole group 313, for accessing outer lead group, lower casing 32 has the hollow 321 suitable with heat dissipation region 2121, the hollow 321 of the present embodiment lower casing 32 is square, heat dissipation region 2121 is from this hollow 321 to exposing outside, and the outer surface of lower casing 32 and heat dissipation region 2121 are at grade, the cover-up surface of lower casing 32 directly contacts with the first radiating surface, and lower casing 32 adopts the material not only insulating but also dispel the heat.

The semi-conductor illumination module that the present embodiment provides, have employed above-mentioned the second position relationship, achieve the integrated setting of the first electronic unit group 12 (all or part of illumination arrangement circuit) and illuminating circuit, and the first same direction of fitting surface 111 of the second fitting surface of the second supporting body 21 and the first supporting body 11 is arranged, and reduces overall dimensions.The more important thing is, the heat dissipation region 2121 that on second radiating surface 212, illuminating circuit is corresponding exposes from the hollow 321 of lower casing 32, and with the outer surface of lower casing 32 at grade, therefore, can directly contact with the assembly section of heat abstractor, realize high efficiency and heat radiation, and the outer surface of lower casing 32 also can directly contact with the assembly section of heat abstractor, because the cover-up surface of lower casing 32 directly contacts with the first radiating surface, and lower casing 32 adopts the material with heat sinking function, therefore, the arrival heat abstractor that the heat of the first radiating surface also can be unimpeded.

Fig. 4, 5 are depicted as the semi-conductor illumination module that another embodiment provides, with Fig. 1, 2, semi-conductor illumination module difference part shown in 3 is: have employed the first position relationship above-mentioned, namely the first supporting body 11 is positioned at below the second supporting body 21 and is fixedly installed, and the second radiating surface 212 of the first fitting surface 111 of the first supporting body 11 and the second supporting body 21 partly overlaps, first supporting body 11, lower casing 32 has the suitable hollow 114 ' of the heat dissipation region 2121 corresponding with illuminating circuit on the second radiating surface 212, hollow 321 ', hollow 114 ' in the present embodiment, hollow 321 ' is circular, this heat dissipation region 2121 is from this hollow 114 ', hollow 321 ' is to exposing outside, the energization input group (not shown) of the second supporting body 21 and the output group (not shown) of the first supporting body 11, in the overlapping region of the first fitting surface 111 and the second radiating surface 212, be electrically connected by reflow soldering process, heat dissipation region 2121 indent is in the outer surface of lower casing 32, the cover-up surface (not shown) be positioned at above the second supporting body 21 of upper casing 31, be oppositely arranged with the first fitting surface 111, second fitting surface, namely upper casing 31 be positioned at cover-up surface above the second supporting body 21 towards the first fitting surface 111, second fitting surface, the first fitting surface 111, second fitting surface is towards this part cover-up surface of upper casing 31.

The semi-conductor illumination module that this embodiment provides, because heat dissipation region 2121 indent is in the outer surface of lower casing 32, in order to realize the contact of the assembly section of heat dissipation region 2121 and heat abstractor, heat abstractor as shown in Figure 6 can be adopted, its assembly section comprises basic portion 01 and lug boss 02, lug boss 02 is positioned at the zone line of basic portion 01, and shape, size, height are suitable with hollow 114 ', hollow 321 ', can from hollow 114 ', hollow 321 ' projection contact with this heat dissipation region 2121, basic portion 01 also can with the exterior surface of lower casing 32.

Fig. 7, 8 are depicted as the semi-conductor illumination module that another embodiment provides, with Fig. 1, 2, 3, 4, semi-conductor illumination module difference part shown in 5 is: have employed the third position relationship above-mentioned, first supporting body 11 has the hollow 114 suitable with the second supporting body 21 ", second supporting body 21 is positioned at this hollow 114 ", first supporting body 11 is around the second supporting body 21, four sides of the first supporting body 11 and four sides of the second supporting body 21, man-to-man at the first supporting body 11, the thickness direction of the second supporting body 21 is fitted, first fitting surface 111 and the second fitting surface 211 are at same plane, first radiating surface 112 and the second radiating surface 212 are at same plane, because the first fitting surface 111 and the second fitting surface 211 are at same plane, energization input group (not shown) on output group (not shown) on first fitting surface 111 and the second fitting surface 211 is electrically connected by various ways, the present embodiment fixes the effect of the first supporting body 11 and the second supporting body 21 in order to make this electric connection to play, the mode of welding signal wiring part 4 is adopted to be electrically connected, the soft wire of welding can also be adopted in other embodiments to be electrically connected, covering members 3 only includes upper casing 31, upper casing 31 is installed on the first supporting body 11, hide on the first fitting surface 111 and the second fitting surface 211, except the Zone Full except the bright dipping region 221 of illuminating circuit, the cover-up surface (not shown) be positioned at above the first fitting surface 111 and the second fitting surface 211 place plane of upper casing 31, with the first fitting surface 111, second fitting surface 211 is oppositely arranged, the i.e. cover-up surface be positioned at above the first fitting surface 111 and the second fitting surface 211 place plane of upper casing 31, towards the first fitting surface 111, second fitting surface 211, first fitting surface 111, second fitting surface 211 is towards this part cover-up surface of upper casing 31, first supporting body 11 also has wire group 113, and the input group on wire group 113 and the first supporting body 11 is electrically connected, for by the input group access external circuit on the first supporting body 11.

The semi-conductor illumination module that this embodiment provides, do not have lower casing, the first radiating surface 112 and the second radiating surface 212 all expose, and the first radiating surface 112 and the second radiating surface 212 are at same plane, therefore, the first radiating surface 112 can contact with the assembly section of heat abstractor with the second radiating surface 212.

Fig. 9, 10, 11 are depicted as the semi-conductor illumination module that another embodiment provides, with Fig. 1, 2, 3, 4, 5, 7, semi-conductor illumination module difference part shown in 8 is: have employed above-mentioned 4th kind of position relationship between the first supporting body 11 and the second supporting body 21, namely the supporting body structure that is formed in one of the first supporting body 11 and the second supporting body 21 (for convenience of description, logically be divided into the first supporting body 11 and the second supporting body 21), second supporting body 21 is positioned at the zone line of this integrated supporting body structure, first supporting body 11 is around the second supporting body 21, and the first fitting surface 111 and the second fitting surface 211 are at same plane, first radiating surface 112 and the second radiating surface 212 are at same plane, the bright dipping region 221 of illuminating circuit and heat dissipation region 2121 are to exposing outside, output group 1112 on first fitting surface 111 and the energization input group 2111 on the second fitting surface 211 are electrically connected by the mode of cabling, covering members 3 only includes upper casing 31, upper casing 31 is installed on the first fitting surface 111, upper casing 31, first supporting body 11, second supporting body 21, the bright dipping region 221 of illuminating circuit is square, upper casing 31 hides on the first fitting surface 111 and the second fitting surface 211, except the Zone Full except the bright dipping region 221 of illuminating circuit, the cover-up surface (not shown) being positioned at integrated supporting body superstructure of upper casing 31, is oppositely arranged with the first fitting surface 111, second fitting surface, upper casing 31 also has terminals subgroup 115, terminals subgroup 115 is arranged on the first supporting body 11, for by the input group (not shown) on the first supporting body 11 and the pluggable electric connection of outer lead group, the respective regions of upper casing 31 is provided with through hole 314, to expose terminals subgroup 115.

The semi-conductor illumination module that this embodiment provides, first supporting body 11 and the second supporting body 21 can be same material, also can be different materials, there is no lower casing, first radiating surface 112 and the second radiating surface 212 all expose, and the first radiating surface 112 and the second radiating surface 212 are at same plane, therefore, the first radiating surface 112 can contact with the assembly section of heat abstractor with the second radiating surface 212.

The utility model achieves the integrated setting of all or part of illumination arrangement circuit and illuminating circuit, and utilize finish space fully, reduce overall dimensions, the heat dissipation region making illuminating circuit corresponding directly can contact the assembly section of heat abstractor, has preferably radiating effect.

Above content is in conjunction with concrete embodiment further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection domain of the present utility model.

Claims (15)

1. a semi-conductor illumination module, is characterized in that, comprising:

First carrier module, comprises the first supporting body and the first electronic unit group; Described first supporting body has the first fitting surface and the first radiating surface that oppositely arrange, described first fitting surface is equipped with described first electronic unit group, described first electronic unit group is all or part of in illumination arrangement circuit, and described illumination arrangement circuit comprises driving and control circuit; Described first supporting body also have the input group and output group that are electrically connected with described first electronic unit group;

Second carrier module, comprises the second supporting body and illuminating circuit, and described illuminating circuit comprises at least one semiconductor luminous chip, and described second supporting body has the second fitting surface and the second radiating surface that oppositely arrange; Described second fitting surface is equipped with described illuminating circuit; Described second supporting body also has the energization input group be electrically connected with described illuminating circuit; The energization input group of described second supporting body and the output group of described first supporting body are electrically connected; Described first supporting body is positioned at below described second supporting body and is fixedly installed, in the same way, and the second radiating surface of the first fitting surface of described first supporting body and described second supporting body partly overlaps for first fitting surface of described first supporting body and the second fitting surface of described second supporting body;

Covering members, for hiding in described first carrier module and the second carrier module, except all or part of region except heat dissipation region corresponding with illuminating circuit on the bright dipping region of described illuminating circuit and described second radiating surface; At least hide described first electronic unit group; And described covering members has the cover-up surface and outer surface that oppositely arrange, being oppositely arranged with described first fitting surface, described second fitting surface at least partially of described cover-up surface; The heat dissipation region that on described second radiating surface, illuminating circuit is corresponding is for contacting the assembly section of heat abstractor.

2. semi-conductor illumination module as claimed in claim 1, it is characterized in that, described first supporting body has the hollow suitable with described heat dissipation region, and described heat dissipation region is from described hollow to exposing outside.

3. semi-conductor illumination module as claimed in claim 1, it is characterized in that, the electric connection position of the energization input group of described second supporting body and the output group of described first supporting body is: the overlapping region of the first fitting surface of described first supporting body and the second radiating surface of described second supporting body.

4. semi-conductor illumination module as claimed in claim 1, it is characterized in that, described covering members has suitable with the bright dipping region of described illuminating circuit and for placing reflector or lens region.

5. semi-conductor illumination module as claimed in claim 1, is characterized in that, also comprise wire group or terminals subgroup; When comprising described wire group, the input group on described wire group and described first supporting body is electrically connected, for by the input group access external circuit on described first supporting body; When comprising described terminals subgroup, described terminals subgroup is arranged on described first supporting body, for by the input group on described first supporting body and the pluggable electric connection of outer lead group.

6. semi-conductor illumination module as claimed in claim 1, is characterized in that at least one in described first supporting body, the second supporting body and covering members also has at least one department of assembly, for realizing the external mounting of described semi-conductor illumination module.

7. semi-conductor illumination module as claimed in claim 6, is characterized in that, described department of assembly is also for accessing external circuit by the input group on described first supporting body.

8. semi-conductor illumination module as claimed in claim 1, it is characterized in that, at least one in described first supporting body and covering members having at least one first location structure, another one having suitable with the first location structure and for matching second location structure of relative position of described first supporting body of incompatible restriction and covering members with the first location structure.

9. semi-conductor illumination module as claimed in claim 1, is characterized in that, also comprise separation module; Described separation module comprises the 3rd supporting body and is assemblied in the second electronic unit group on described 3rd supporting body; Described second electronic unit group is the part in described illumination arrangement circuit; Described 3rd supporting body also have the input group and output group that are electrically connected with described second electronic unit group; Output group on described 3rd supporting body and the input group on described first supporting body are electrically connected; Input group on described 3rd supporting body is connected with external power source end.

10. the semi-conductor illumination module as described in any one of claim 1 to 9, is characterized in that, described covering members comprises upper casing; Described upper casing has the hollow suitable with the bright dipping region of described illuminating circuit, and the bright dipping region of described illuminating circuit is from the hollow of described upper casing to exposing outside.

11. semi-conductor illumination modules as described in any one of claim 1 to 9, it is characterized in that, described covering members comprises suitable upper casing and lower casing; Described upper casing has the hollow suitable with the bright dipping region of described illuminating circuit, and the bright dipping region of described illuminating circuit is from the hollow of described upper casing to exposing outside; Described lower casing has the hollow suitable with described heat dissipation region, and described heat dissipation region is from the hollow of described lower casing to exposing outside.

12. semi-conductor illumination modules as claimed in claim 11, it is characterized in that, the outer surface of described lower casing and described heat dissipation region are at grade; Or described heat dissipation region indent is in the outer surface of described lower casing; Or described heat dissipation region evagination is in the outer surface of described lower casing.

13. semi-conductor illumination modules as claimed in claim 11, is characterized in that, described lower casing adopts insulating materials.

14. semi-conductor illumination modules as claimed in claim 11, is characterized in that, described lower casing adopts heat sink material.

15. semi-conductor illumination modules as claimed in claim 14, is characterized in that, described lower casing and described first cooling surface contacts; Or described semi-conductor illumination module also comprises heat transfer piece, described heat transfer piece is arranged between described lower casing and described first radiating surface, and respectively with described lower casing, described first cooling surface contacts.