CN204554464U - LED silk and LED lamp - Google Patents
LED silk and LED lamp Download PDFInfo
- Publication number
- CN204554464U CN204554464U CN201520280771.0U CN201520280771U CN204554464U CN 204554464 U CN204554464 U CN 204554464U CN 201520280771 U CN201520280771 U CN 201520280771U CN 204554464 U CN204554464 U CN 204554464U
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- CN
- China
- Prior art keywords
- led
- heat
- substrate
- led silk
- silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses a kind of LED silk, comprising: spiral helicine substrate, and at least two are fixedly installed on the LED chip on substrate, are separately positioned on the electrode at substrate two ends, and wherein at least one electrode is connected with the end of substrate by insulating part.The utility model further discloses a kind of LED lamp, comprise shell, heat-conducting mechanism, lamp body, lamp holder, driving mechanism, LED silk, heat-conducting mechanism is divided into installation portion and connecting portion, LED silk is fixed on installation portion, and connecting portion is arranged between installation portion and lamp body for transferring heat between.Compared to prior art, when LED silk of the present utility model is arranged on light fixture, spot welding number of times is few, can improving production efficiency and product yield, light stereovision is strong, effectively reduces and dazzles light, LED lamp is provided with heat-conducting mechanism, filament is arranged on heat-conducting mechanism, and heat-conducting effect is better than inert gas, can increase the service life of light fixture, and eliminate the operation of filling row's inert gas, can improving production efficiency and product yield.
Description
Technical field
The utility model relates to technical field of semiconductor illumination, is specifically related to a kind of spiral LED silk and uses the LED lamp of this LED silk.
Background technology
LED silk is the light-emitting component of LED bulb.Existing LED silk is strip, and include filament support, hard substrate is (as sapphire, glass, pottery etc.), some LED chip are arranged on hard substrate, connected successively by gold thread between LED chip and realize electrically conducting, LED silk surrounding is enclosed with fluorescent glue.
Existing LED lamp adopts 2 or 4 LED silk serial or parallel connections together usually, Glass lamp stem stem surrounding is welded on by spot-welding technology, then by filling in glass bulb that exhaust air technique is encapsulated in containing inertia heat-conducting gas, install driving and lamp holder thus form complete bulb, after switching on power, carry out luminescence.
The major defect of prior art is:
1. when strip LED silk being arranged on Glass lamp stem stem surrounding, spot welding number of times is more, is generally four times or eight times, and production efficiency is low, and fraction defective is high;
2. use inert gas heat conduction, fill exhaust air technique more complicated, production efficiency is low, and fraction defective is high;
3. the light stereovision of whole lamp is not strong, and dazzle is more serious.
Utility model content
The purpose of this utility model is to provide a kind of LED silk and LED lamp.
For realizing above-mentioned utility model object, the utility model adopts following technical scheme:
A kind of LED silk, described LED silk comprises: spiral helicine substrate, at least two LED chip be fixedly installed on the substrate, be separately positioned on the electrode at described substrate two ends, wherein at least one electrode is connected by the end of insulating part with described substrate, be electrically connected by conducting objects successively between described LED chip, two the described LED chip being positioned at two ends are electrically connected with described electrode one_to_one corresponding by conducting objects.
Technical scheme as the utility model improves further: described substrate is made by flexible heat-conducting.
Technical scheme as the utility model improves further: described substrate is for copper is silver-plated or made by iron nickel plating thin plate.
Technical scheme as the utility model improves further: described substrate is cone helical form or cylinder helical form.
Technical scheme as the utility model improves further: the side that described substrate is provided with LED chip is provided with reflector layer on the surface.
A kind of LED lamp, comprise shell, heat-conducting mechanism, lamp body, lamp holder, driving mechanism, and the LED silk in claim 1 to 5 described in any one, described heat-conducting mechanism is divided into installation portion and connecting portion, described LED silk is fixed on described installation portion, and described connecting portion is arranged between described installation portion and described lamp body for transferring heat between.
Technical scheme as the utility model improves further: the profile of described installation portion and the mating shapes of described LED silk.
Technical scheme as the utility model improves further: described LED silk is fixed on the outer surface of described installation portion by heat-conducting glue.
Technical scheme as the utility model improves further: described shell is made by glass.
Relative to prior art, technique effect of the present utility model is: when LED silk of the present utility model is arranged on light fixture, spot welding number of times is few, can improving production efficiency and product yield, and light stereovision is strong, effectively reduce and dazzle light, LED lamp is provided with heat-conducting mechanism, and filament is arranged on heat-conducting mechanism, and heat-conducting effect is better than inert gas, decrease light decay, the service life of light fixture can be increased, and eliminate the operation of filling row's inert gas, can improving production efficiency and product yield.
Accompanying drawing explanation
Fig. 1 is the structural representation of cone helical form LED silk;
Fig. 2 is the structural representation of cylinder helical form LED silk;
Fig. 3 is the deployed condition schematic diagram of LED silk;
Fig. 4 is the LED lamp structure schematic diagram being provided with cone helical form LED silk;
Fig. 5 is the LED lamp structure schematic diagram being provided with cylinder helical form LED silk.
Detailed description of the invention
Below with reference to detailed description of the invention shown in the drawings, the utility model is described in detail.But these embodiments do not limit the utility model, the structure that those of ordinary skill in the art makes according to these embodiments, method or conversion functionally are all included in protection domain of the present utility model.
See Fig. 1 to 2, a kind of LED silk 10, comprise: spiral helicine substrate 11, above-mentioned spiral helicine substrate 11 is by the substrate 11(of a strip as shown in Figure 3) shaping forms, substrate 11 specifically can be shaped as cone helical form or cylinder helical form, certain substrate 11 also can be shaped as other three-dimensional helical form, and the utility model is not as limit.
See Fig. 3, LED silk 10 also comprises at least two LED chip 12 be fixedly installed on described substrate 11, be separately positioned on the electrode 13 at described substrate 11 two ends, due to can be used for being shaped as helical form and heat conductivility preferably substrate 11 material mostly be metallic conductor, for avoiding two electrodes 13 all to cause short circuit with substrate 11 conducting, wherein at least one electrode 13 is connected with the end of described substrate 11 by insulating part 14.
Be electrically connected by gold thread 15 successively between described LED chip 12, two the described LED chip 12 being positioned at two ends are electrically connected with described electrode 13 one_to_one corresponding by gold thread 15, thus realize electrically conducting.
Described substrate 11 is for copper is silver-plated or made by iron nickel plating thin plate, also can be made by other flexible heat-conducting, can be even be spliced section by section by hard Heat Conduction Material, certainly, consider the difficulty of manufacturing cost and shaping operation, substrate 11 is preferably flexible material.
In order to promote the luminous efficiency of LED silk 10, the side that described substrate 11 is provided with LED chip 12 is provided with reflector layer on the surface.
In order to enrich the luminous color of LED silk 10, the side that described substrate 11 is provided with LED chip 12 can be coated with the fluorescent adhesive layer of different colours on the surface, fluorescent adhesive layer is not established in described substrate 11 back side, in order to ensure the heat transference efficiency between substrate 11 and heat-conducting mechanism.
See Fig. 4 to 5, a kind of LED lamp 20, comprise shell 21, heat-conducting mechanism, lamp body 23, lamp holder 24, driving mechanism that glass is made, and spiral helicine LED silk 10, lamp body 23 is arranged in the middle of heat-conducting mechanism and lamp holder 24, driving mechanism is arranged on (not shown) in the cavity in lamp body 23, and electrical input and the lamp holder 24 of driving mechanism are electrically connected, and the electric output of driving mechanism and two electrodes 13 of LED silk 10 are electrically connected.
Described heat-conducting mechanism is divided into installation portion 221 and connecting portion 222, described LED silk 10 is fixed on described installation portion 221, described connecting portion 222 is arranged between described installation portion 221 and described lamp body 23 for transferring heat between, heat-conducting mechanism and lamp body 23 are all preferably made by the good pottery of heat conductivility or aluminum alloy materials, certainly, because lamp body 23 is connected with lamp holder 24, lamp holder 24 is electrically connected with city again, so when lamp body 23 aluminium alloy material makes, its outer surface needs coated insulation layer.
Described LED silk 10 is fixed on the outer surface of described installation portion 221 by heat-conducting glue, more fit to make LED silk 10 and heat-conducting mechanism, the profile of described installation portion 221 and the mating shapes of described LED silk 10, such as: when LED silk 10 is cone helical forms, installation portion 221 is cone shape, when LED silk 10 is cylinder helical forms, installation portion 221 is cylindrical shape.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to aforementioned embodiments, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in aforementioned each embodiment, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a LED silk, it is characterized in that, described LED silk comprises: spiral helicine substrate, at least two LED chip be fixedly installed on the substrate, be separately positioned on the electrode at described substrate two ends, wherein at least one electrode is connected by the end of insulating part with described substrate, is electrically connected successively between described LED chip by conducting objects, and two the described LED chip being positioned at two ends are electrically connected with described electrode one_to_one corresponding by conducting objects.
2. LED silk according to claim 1, is characterized in that, described substrate is made by flexible heat-conducting.
3. LED silk according to claim 2, is characterized in that, described substrate is for copper is silver-plated or made by iron nickel plating thin plate.
4. LED silk according to claim 1, is characterized in that, described substrate is cone helical form or cylinder helical form.
5. LED silk according to claim 1, is characterized in that, the side that described substrate is provided with LED chip is provided with reflector layer on the surface.
6. a LED lamp, it is characterized in that, comprise shell, heat-conducting mechanism, lamp body, lamp holder, driving mechanism, and the LED silk in claim 1 to 5 described in any one, described heat-conducting mechanism is divided into installation portion and connecting portion, described LED silk is fixed on described installation portion, and described connecting portion is arranged between described installation portion and described lamp body for transferring heat between.
7. LED lamp according to claim 6, is characterized in that, the profile of described installation portion and the mating shapes of described LED silk.
8. LED lamp according to claim 6, is characterized in that, described LED silk is fixed on the outer surface of described installation portion by heat-conducting glue.
9. LED lamp according to claim 6, is characterized in that, described shell is made by glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520280771.0U CN204554464U (en) | 2015-05-04 | 2015-05-04 | LED silk and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520280771.0U CN204554464U (en) | 2015-05-04 | 2015-05-04 | LED silk and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204554464U true CN204554464U (en) | 2015-08-12 |
Family
ID=53829571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520280771.0U Expired - Fee Related CN204554464U (en) | 2015-05-04 | 2015-05-04 | LED silk and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204554464U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020239655A1 (en) | 2019-05-29 | 2020-12-03 | Signify Holding B.V. | Lighting device comprising a light emitting filament |
| US11906113B2 (en) | 2019-11-11 | 2024-02-20 | Signify Holding B.V. | Spiral LED filament lamp with a cylindrical two-dimensional flexible printed circuit board (PCB) and a method of producing a spiral LED filament with a cyclindrical two-dimensional flexible printed circuit board (PCB) |
-
2015
- 2015-05-04 CN CN201520280771.0U patent/CN204554464U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020239655A1 (en) | 2019-05-29 | 2020-12-03 | Signify Holding B.V. | Lighting device comprising a light emitting filament |
| US11906113B2 (en) | 2019-11-11 | 2024-02-20 | Signify Holding B.V. | Spiral LED filament lamp with a cylindrical two-dimensional flexible printed circuit board (PCB) and a method of producing a spiral LED filament with a cyclindrical two-dimensional flexible printed circuit board (PCB) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20200504 |