CN204518216U - For the aluminium foil copper facing substrate of flexible circuit board - Google Patents
For the aluminium foil copper facing substrate of flexible circuit board Download PDFInfo
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- CN204518216U CN204518216U CN201520216062.6U CN201520216062U CN204518216U CN 204518216 U CN204518216 U CN 204518216U CN 201520216062 U CN201520216062 U CN 201520216062U CN 204518216 U CN204518216 U CN 204518216U
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- aluminium foil
- adhesive layer
- copper
- facing substrate
- dielectric film
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Abstract
The utility model discloses a kind of aluminium foil copper facing substrate for flexible circuit board, this aluminium foil copper facing substrate comprises dielectric film, adhesive layer, aluminium foil and copper plate, aluminium foil passes through adhesive layer then in insulating film surface, copper plate is plated on described aluminium foil surface, the thickness of dielectric film is 5 μm-200 μm, the thickness of adhesive layer is 5 μm-50 μm, the thickness of aluminium foil is 5 μm-200 μm, the thickness of copper plate is 1 μm-5 μm, can make monolithic aluminium foil copper facing substrate or double-sided aluminum foil copper facing substrate as required.The utility model adopts aluminium foil to instead of part Copper Foil, not only reduce cost, also improve heat conductivility and reflecting properties, and substrate surface is Copper Foil, aluminium foil is not only prevented to be oxidized, also add weldability, the utility model has high flexibility, high-termal conductivity, high reflective and low cost, is easy to the advantages such as production.
Description
Technical field
The utility model relates to a kind of copper clad laminate, is specifically related to a kind of high flexibility substrate for flexible circuit board.
Background technology
The progress of information, communication industry has driven the high speed development of microelectronics industry, flexible print wiring (FPC) arises at the historic moment and obtains fast development, is widely used in fields such as smart mobile phone, notebook computer, panel computer, LCDs, car lights.Current electronic system is towards compact, high-fire resistance, multi-functional, densification, high reliability and the future development of low cost, and therefore selecting of substrate just becomes very important influencing factor.At present, substrate major part is copper clad laminate, also has some for the aluminium base of LED.
Aluminium, because of thermal conductivity, light weight, the reflectivity of its excellence, flexibility has been widely used in electronic material.Aluminium has high reverse--bias degree, and quality is soft, ductility is good, has argenteous gloss, low cost and other advantages.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of aluminium foil copper facing substrate being applicable to flexible circuit board, the aluminium foil copper facing substrate that the utility model is used for flexible circuit board adopts aluminium foil to instead of part Copper Foil, not only reduce cost, also improve heat conductivility and reflecting properties, and substrate surface is Copper Foil, aluminium foil is not only prevented to be oxidized, also add weldability, the aluminium foil copper facing substrate being applicable to flexible circuit board of the present utility model has high flexibility, high-termal conductivity, high reflective and low cost, is easy to the advantages such as production.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of aluminium foil copper facing substrate for flexible circuit board, comprise dielectric film, adhesive layer, aluminium foil and copper plate, described aluminium foil passes through described adhesive layer then in described insulating film surface, described copper plate is plated on described aluminium foil surface, the thickness of described dielectric film is 5 μm-200 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Say further, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Say further, described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.
Furthermore, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Say further, described copper plate is the one in electro-coppering or sputter copper.
The utility model provides two kinds of aluminium foil copper facing board structures meeting above-mentioned utility model and conceive below to solve its technical problem:
The first aluminium foil copper facing board structure: one side aluminium foil copper facing substrate, and be made up of one deck dielectric film, one deck adhesive layer, one deck aluminium foil and one deck copper plate four layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.
The second aluminium foil copper facing board structure: double-sided aluminum foil copper facing substrate, be made up of one deck dielectric film, two-layer adhesive layer, two-layer aluminium foil and two-layer copper plate seven layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.
The beneficial effects of the utility model are: the aluminium foil copper facing substrate for flexible circuit board of the present utility model comprises dielectric film, adhesive layer, aluminium foil and copper plate, aluminium foil passes through adhesive layer then in insulating film surface, copper plate is plated on aluminium foil surface, aluminium foil copper facing substrate of the present utility model adopts aluminium foil to instead of part Copper Foil, not only reduce cost, also due to reflectivity and the thermal conductivity of aluminium foil excellence, the copper clad laminate making the utility model more conventional improves heat conductivility and reflecting properties; And substrate surface is Copper Foil, not only prevents aluminium foil to be oxidized, also add weldability; The utility model, owing to adopting dielectric film pressing aluminium foil, has high flexibility; Due to the reflectivity of aluminium foil excellence, the flexible circuit board of production can be used for the fields such as auto lamp; The aluminum foil substrate that the utility model adopts dielectric film pressing aluminium foil to produce, again at its copper coating, technique achieves simplification, be conducive to cost-saving and improve yield, cost has price advantage, and adjust dielectric film, adhesive and aluminium foil layer thickness in the scope that can specify if necessary in the utility model, to have excellent radiating effect, adhesive layer can also add heat radiation powder to promote heat conductivility further simultaneously.
Accompanying drawing explanation
Fig. 1 is one side aluminium foil copper facing board structure schematic diagram of the present utility model;
Fig. 2 is double-sided aluminum foil copper facing board structure schematic diagram of the present utility model.
Embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, under the category do not disclosed departing from the utility model, can give different modifications and change.
Embodiment: a kind of one side aluminium foil copper facing substrate for flexible circuit board, as shown in Figure 1, be made up of one deck dielectric film 104, one deck adhesive layer 103, one deck aluminium foil 102 and one deck copper plate 101 4 layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.The thickness of described dielectric film is 5 μm-200 μm, and the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Wherein, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.In order to increase the heat conductivility of adhesive layer, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Described copper plate is the one in electro-coppering or sputter copper.
Embodiment 1: at thickness be 25um dielectric film on coating thickness be the adhesive layer of 15um, through short time prebake conditions, then pressing aluminium foil, the pressure given by the gap between roller and roller, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, at aluminum foil substrate copper coating, form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modified epoxy glue.
Embodiment 2: at thickness be 12.5um dielectric film on coating thickness be the heat-conducting glue adhensive layer of 13um, through short time prebake conditions, the aluminium foil that pressing 15um is thick again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, at aluminum foil substrate copper coating, form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modification heat-conduction epoxy resin glue.
Embodiment 3: at thickness be 25um dielectric film on coating thickness be the adhesive layer of 15um, through short time prebake conditions, pressing thickness is the aluminium foil of copper facing of 18 μm again, by the pressure that the gap between roller and roller give, the aluminium foil surface of dielectric film and copper facing aluminium foil passes through middle adhesive layer close adhesion, to form aluminium foil copper facing substrate; Then, toast this aluminium foil copper facing substrate, resin bed is solidified; Form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modification heat-conduction epoxy resin glue.
Embodiment: a kind of double-sided aluminum foil copper facing substrate for flexible circuit board, as shown in Figure 2, be made up of one deck dielectric film 104, two-layer adhesive layer 103, two-layer aluminium foil 102 and two-layer copper plate 101 7 layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.The thickness of described dielectric film is 5 μm-200 μm, and the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Wherein, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.In order to increase the heat conductivility of adhesive layer, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Described copper plate is the one in electro-coppering or sputter copper.
Embodiment 4: at thickness be 12.5um dielectric film on coating thickness be the thermal paste adhensive layer of 13um, through short time prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form one side aluminum foil substrate; Then, on the insulation film face of this one side aluminum foil substrate, coating thickness is the thermal paste adhensive layer of 13um again, through short time prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, make dielectric film and aluminium foil by middle adhesive layer close adhesion, form double-sided aluminum foil substrate; Then, toast this double-sided aluminum foil substrate, resin bed is solidified; Finally, in the copper facing of double-sided aluminum foil substrate surface, form final double-sided aluminum foil copper facing substrate.Wherein adhesive layer can be self-control modification heat radiation epoxide-resin glue.
Embodiment 5: the dielectric film that a 25um is provided, in one surface, coating thickness is the adhesive layer of 15um, through short time prebake conditions, pressing thickness is the aluminium foil of copper facing of 18 μm again, by the pressure that the gap between roller and roller give, the aluminium foil surface of dielectric film and copper facing aluminium foil, by middle adhesive layer close adhesion, forms one side aluminium foil copper facing substrate; Then, in dielectric film another on the surface coating thickness be the adhesive layer of 15um, through short time prebake conditions, the aluminium foil of copper facing of pressing 18 μm again, by the pressure that the gap between roller and roller give, make the aluminium foil surface of dielectric film and copper facing aluminium foil by middle adhesive layer close adhesion, form double-sided aluminum foil copper facing substrate; Then, toast this double-sided aluminum foil copper facing substrate, resin bed is solidified; Finally, final double-sided aluminum foil copper facing substrate is formed.
The bounce Experimental Comparison of the copper clad laminate of aluminium foil copper facing substrate of the present utility model and prior art is as shown in table 1 below:
Table 1:
By the bounce experimental data recorded in table 1, can prove that aluminium foil copper facing substrate of the present utility model has preferably flexibility.
Claims (7)
1. the aluminium foil copper facing substrate for flexible circuit board, it is characterized in that: comprise dielectric film, adhesive layer, aluminium foil and copper plate, described aluminium foil passes through described adhesive layer then in described insulating film surface, described copper plate is plated on described aluminium foil surface, the thickness of described dielectric film is 5 μm-200 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
2., as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
3. as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described adhesive layer is the one in epoxy resin adhesive layer, acrylic acid series adhesive layer, poly-silica system adhesive layer, phenolic resins system adhesive layer and polyurethane system adhesive layer.
4., as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described adhesive layer is heat-conducting glue adhensive layer.
5. as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described copper plate is the one in electro-coppering or sputter copper.
6. the aluminium foil copper facing substrate for flexible circuit board according to any one of claim 1 to 5, it is characterized in that: described aluminium foil copper facing substrate is one side aluminium foil copper facing substrate, and be made up of one deck dielectric film, one deck adhesive layer, one deck aluminium foil and one deck copper plate four layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.
7. the aluminium foil copper facing substrate for flexible circuit board according to any one of claim 1 to 5, it is characterized in that: described aluminium foil copper facing substrate is double-sided aluminum foil copper facing substrate, and be made up of one deck dielectric film, two-layer adhesive layer, two-layer aluminium foil and two-layer copper plate seven layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520216062.6U CN204518216U (en) | 2015-04-10 | 2015-04-10 | For the aluminium foil copper facing substrate of flexible circuit board |
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| CN201520216062.6U CN204518216U (en) | 2015-04-10 | 2015-04-10 | For the aluminium foil copper facing substrate of flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
-
2015
- 2015-04-10 CN CN201520216062.6U patent/CN204518216U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN115384139A (en) * | 2022-09-20 | 2022-11-25 | 天长市京发铝业有限公司 | Aluminum-based aluminum-clad metal plate for electronic circuit and preparation method thereof |
| CN115384139B (en) * | 2022-09-20 | 2024-01-02 | 天长市京发铝业有限公司 | Aluminum-based aluminum-coated metal plate for electronic circuit and preparation method thereof |
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