CN204484449U - A kind of heat sink - Google Patents
A kind of heat sink Download PDFInfo
- Publication number
- CN204484449U CN204484449U CN201420858305.1U CN201420858305U CN204484449U CN 204484449 U CN204484449 U CN 204484449U CN 201420858305 U CN201420858305 U CN 201420858305U CN 204484449 U CN204484449 U CN 204484449U
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- temperature
- module
- control terminal
- mcu chip
- heat sink
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Abstract
This utility model provides a kind of heat sink, comprise control terminal, be electrically connected at the temperature monitoring module of described control terminal and be electrically connected at the temperature adjustment module of described temperature monitoring module, described control terminal comprises control module, described temperature monitoring module comprises MCU chip and is electrically connected at the first temperature probe of described MCU chip, described temperature adjustment module comprises the refrigerator and temperature change device that are electrically connected at described MCU chip, described refrigerator comprises fin and cooling piece, the hot side of described cooling piece is located at by described fin, described temperature becomes the huyashi-chuuka (cold chinese-style noodles) that described cooling piece is located at by device.The temperature that described first temperature probe gathers human body oxter sends temperature data to control terminal by MCU chip process, when temperature value is more than the first temperature preset value, described control terminal sends to report to the police and control described refrigerator and starts, described temperature change device cools under the work of described cooling piece to be taken away hyperpyrexia human body temperature, to reach to the object of body temperature lowering.
Description
Technical field
This utility model relates to technical field of medical instruments, particularly a kind of heat sink.
Background technology
Human body is had a fever, and especially child's fever, it is a risk that injure brain, needs the very first time to carry out cooling protection to brain.At present, the Physical temperature-lowering product that can be worn at human body head use has, ice bag and Medical cooling equipment two kinds.The former, do not have thermostatic control function, and chilling temperature can not adjust, easy cold injury skin; The latter, although have refrigeration and constant temperature cold compress function, but it is a main equipment, whole system, by refrigeration source (compressor or semiconductor refrigerating), water tank, water pump and circulation waterway etc., price is all tens thousand of unit, only supplies hospital's major disease as opened the Clinical practice such as cranium, open chest surgery.These two kinds of products, all can not popularize use because of their reasons different separately.Therefore, develop one to be suitable for family and to use the device with body temperature monitoring and automatic adjustment chilling temperature to be the problem of eager needs solution at present.
Utility model content
In order to overcome above-mentioned technical problem, this utility model provides a kind of heat sink having body temperature monitoring and automatically adjust temperature.
This utility model is achieved in that a kind of heat sink, comprise control terminal, be electrically connected at the temperature monitoring module of described control terminal and be electrically connected at the temperature adjustment module of described temperature monitoring module, described control terminal comprises control module, described temperature monitoring module comprises MCU chip and is electrically connected at the first temperature probe of described MCU chip, described temperature adjustment module comprises the refrigerator and temperature change device that are electrically connected at described MCU chip, described refrigerator comprises fin and cooling piece, the hot side of described cooling piece is located at by described fin, described temperature becomes the huyashi-chuuka (cold chinese-style noodles) that described cooling piece is located at by device,
Described first temperature probe gathers human body auxillary temperature by sending temperature data after MCU chip process to described control terminal, described control module receives described temperature data and judges whether described measured temperature value is greater than the first preset temperature value, when measured temperature value is greater than described first preset temperature value, described control module sending controling instruction controls the startup of described refrigerator to described MCU chip, described temperature becomes device and cools under described cooling piece work, to reach to the object of body temperature lowering.
Further, described control terminal is provided with the first transceiver module be connected with described control module, and described temperature monitoring module is provided with the second transceiver module be connected with described MCU chip, and described first transceiver module is connected with described second transceiver module radio communication.
Further, described temperature adjustment module is provided with the second temperature probe being electrically connected at described MCU chip;
Described second temperature probe becomes the temperature of device for gathering temperature and sends temperature data to described control terminal by MCU chip process, described control module receives described temperature data and judges whether described measured temperature value is less than the second preset temperature value, if measured temperature value is less than the second preset temperature value, described control module sending controling instruction controls described refrigerator to described MCU chip and quits work.
Further, described control terminal is provided with input module, processing module and display module, and described input module, processing module are electrically connected with described control module respectively, and described display module and described processing module are electrically connected;
Described input module is for inputting described first preset temperature value and the second preset temperature value and sending to described control module, and described processing module is used for carrying out process to the temperature value that described first temperature probe is surveyed and obtains observed temperature curve and export to described display module showing.
Further, described control terminal is provided with alarm module;
When the temperature value that the first temperature probe is surveyed exceedes described first preset temperature value, described control module controls described alarm module and gives a warning.
Further, described temperature adjustment module also comprises shell, and described housing exterior is provided with thin cotton.
Further, described temperature monitoring module also comprises disk, establishes pcb board in described disk, and described MCU chip is located at pcb board, and described side wall of outer shell and described disk sidewall are equipped with connection jaws.
Further, described housing exterior is provided with wearing.
Further, described temperature change device is made up of phase-change material.
Further, described control terminal is smart mobile phone or panel computer.
The beneficial effects of the utility model: this utility model provides a kind of heat sink having body temperature monitoring and automatically adjust temperature, the temperature signal that described first temperature probe gathers human body oxter sends to control terminal by MCU chip process, when temperature value is more than the first temperature preset value, described control terminal sends to report to the police and control described refrigerator and starts, described temperature becomes device and cools under the work of described cooling piece, to reach to the object of body temperature lowering.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical solution of the utility model, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained from these accompanying drawings.
Fig. 1 is the structural schematic block diagram of a kind of heat sink first of this utility model embodiment;
Fig. 2 is the structural schematic block diagram of a kind of heat sink second of this utility model embodiment;
Fig. 3 is the structural schematic block diagram of a kind of heat sink of this utility model the 3rd embodiment;
Fig. 4 is the structural schematic block diagram of a kind of heat sink of this utility model the 4th embodiment;
Fig. 5 is the three-dimensional structure diagram of the temperature adjustment module of a kind of heat sink of this utility model;
Fig. 6 is the structure chart except decapsidate of the temperature adjustment module of a kind of heat sink of this utility model;
Fig. 7 is the three-dimensional structure diagram of the temperature monitoring module of a kind of heat sink of this utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described.The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite not departing from this utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Shown in figure 1, shown in Fig. 6, Fig. 1 is the structural schematic block diagram of a kind of heat sink first of this utility model embodiment, and Fig. 6 is the structure chart except decapsidate of the temperature adjustment module of a kind of heat sink of this utility model.This device comprises control terminal 1, be electrically connected at the temperature monitoring module 2 of described control terminal 1 and be connected to the temperature adjustment module 3 of described temperature monitoring module 2 by data wire, described control terminal 1 comprises control module 11, described temperature monitoring module 2 comprises MCU chip 21 and is electrically connected at the first temperature probe 22 of described MCU chip 21, described temperature adjustment module 3 comprises the refrigerator 31 and temperature change device 32 that are electrically connected at described MCU chip 21, described refrigerator comprises fin 311 and cooling piece 312, the hot side of described cooling piece 312 is located at by described fin 311, described temperature becomes the huyashi-chuuka (cold chinese-style noodles) that described cooling piece 312 is located at by device 32.
During use, under described first temperature probe 22 is put in human body axil, described temperature adjustment module 3 is worn over forehead, described first temperature probe 22 gathers human body auxillary temperature and processes rear transmission temperature data to described control terminal 1 by MCU chip 21, described control module 11 receives described temperature data and judges whether described measured temperature value is greater than the first preset temperature value, when measured temperature value is greater than described first preset temperature value, described control module 11 sending controling instruction controls described refrigerator 31 to described MCU chip 21 and starts, temperature becomes device 32 and forms the temperature difference by the huyashi-chuuka (cold chinese-style noodles) of cooling piece 312, temperature becomes device 32 and undergoes phase transition, another kind of state is become from the first state, such as become solid by liquid, suck and store a large amount of cold energy, then the cold energy of suction is passed to human body, namely the human body forehead temperature of having a high fever is taken away, to reach to body temperature lowering object.This technical scheme is with prior art part of emulating the advanced mutually: 1. control terminal moment monitor's temperature, can Timeliness coverage temperature anomaly; 2. control terminal controls refrigerator and starts and make temperature become device cooling thus the human body temperature of having a high fever be taken away, and has refrigeration and the function of constant temperature cold compress, meanwhile, it is simple to operate, volume is little, is convenient for carrying.
Described control terminal 1 is provided with the first transceiver module be connected with described control module 1, and described temperature monitoring module 2 is provided with the second transceiver module be connected with described MCU chip 21, and described first transceiver module is connected with described second transceiver module radio communication.Shown in figure 2, Fig. 3, Fig. 4, Fig. 2, Fig. 3, Fig. 4 are the structural schematic block diagram of the embodiment of a kind of heat sink of this utility model.First bluetooth transceiver module 111, wifi communication module 112, first ultrasonic transceiver module 113 are referred to as the first transceiver module, second bluetooth transceiver module 211, the 2nd wifi communication module 212, second ultrasonic transceiver module 213 are referred to as the second transceiver module, and namely control terminal 1 and temperature monitoring module 2 can pass through the communication connection of bluetooth, wifi or ultrasonic wireless.
In this utility model, described control terminal 1 is also connected by data wire with temperature monitoring module 2.
Shown in figure 6, described temperature adjustment module 3 is provided with the second temperature probe 33 being electrically connected at described MCU chip 21.Described second temperature probe 33 becomes the temperature of device 32 for gathering temperature and processes transmission temperature data to described control terminal 1 by MCU chip 21, described control module 11 receives described temperature data and judges whether described measured temperature value is less than the second preset temperature value, if measured temperature value is less than the second preset temperature value, described control module 11 sending controling instruction controls described refrigerator 31 to described MCU chip 21 and quits work.This technical scheme is compared with prior art, and advanced part is, has dual safety protection, and while constant temperature cold compress, monitoring temperature becomes the temperature of device, avoids temperature to become device 32 constant temperature and declines, cold injury skin.
Described control terminal 1 is provided with input module 12, processing module 13 and display module 14, and described input module 12, processing module 13 are electrically connected with described control module 1 respectively, and described display module 14 is electrically connected with described processing module 13; Described input module 12 is for inputting described first preset temperature value and the second preset temperature value and sending to described control module 11, and described processing module 13 is carried out process for the temperature value surveyed described first temperature probe and obtained observed temperature curve and export to described display module 14 showing.User is when serviceability temperature adjustment module 3 is lowered the temperature, temperature curve on observable display module 14, thus know whether this cool-down method works, and cooling-down effect is how, and the change of illness state of observable patient taking appropriate measures, in case the state of an illness of patient worsens further.
Described control terminal 1 is provided with alarm module 15, and when the temperature value that the first temperature probe 22 is surveyed exceedes described first preset temperature value, described control module 11 controls described alarm module 15 and gives a warning, and user can Timeliness coverage abnormal body temperature.
Shown in figure 5, Fig. 5 is the three-dimensional structure diagram of the temperature adjustment module of a kind of heat sink of this utility model.Described temperature adjustment module 3 also comprises shell 34, described housing exterior is provided with thin cotton 35, and described shell 34 outside is provided with wearing 36, can temperature adjustment module 3 be worn in head during serviceability temperature adjustment module 3, shell 34 contacts with people's forehead across thin cotton 35, makes to wear more comfortable.
Shown in figure 7, Fig. 7 is the three-dimensional structure diagram of the temperature monitoring module of a kind of heat sink of this utility model.Described temperature monitoring module 2 also comprises disk 23, establishes pcb board in described disk 23, and described MCU chip 21 is located at pcb board.Temperature monitoring module 2 can be worn on people's shoulder during serviceability temperature monitoring modular 2, the first temperature probe 22 gathers auxillary temperature.
Shown in figure 5, Fig. 7, described shell 34 sidewall and described disk 23 sidewall are equipped with connection jaws 24, and both are electrically connected by data wire.
Described temperature becomes device 32 and is made up of phase-change material.Phase-change material (PCM-Phase Change Material) refers to and varies with temperature and change the material that physical property also can provide latent heat.The process changing physical property is called phase transition process, and at this moment phase-change material will absorb or discharge a large amount of latent heat.Give an example, the non-water of modal phase-change material has not belonged to, and when temperature is low to moderate 0 DEG C, water is become solid-state (freezing) from liquid state; When temperature becomes liquid state (dissolving) higher than water when 0 DEG C from solid-state.Suck in freezing process and store a large amount of cold energy, and in course of dissolution, absorbing a large amount of thermal energy.
Control terminal 1 adopts smart mobile phone or panel computer, installs corresponding application program in smart mobile phone or panel computer, convenient upgrading in the future and also upgrade cost low, but be not limited thereto, control terminal also can adopt controller supporting specially.
Obviously, above-described embodiment of the present utility model is only for this utility model example is clearly described, and is not the restriction to embodiment of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.All do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., within the protection domain that all should be included in this utility model claim.
Claims (10)
1. a heat sink, it is characterized in that, comprise control terminal, be electrically connected at the temperature monitoring module of described control terminal and be electrically connected at the temperature adjustment module of described temperature monitoring module, described control terminal comprises control module, described temperature monitoring module comprises MCU chip and is electrically connected at the first temperature probe of described MCU chip, described temperature adjustment module comprises the refrigerator and temperature change device that are electrically connected at described MCU chip, described refrigerator comprises fin and cooling piece, the hot side of described cooling piece is located at by described fin, described temperature becomes the huyashi-chuuka (cold chinese-style noodles) that described cooling piece is located at by device,
Described first temperature probe gathers human body auxillary temperature by sending temperature data after MCU chip process to described control terminal, described control module receives described temperature data and judges whether temperature data is greater than the first preset temperature value, when temperature data is greater than described first preset temperature value, described control module sending controling instruction controls the startup of described refrigerator to described MCU chip, described temperature becomes device and cools under described cooling piece work, to reach to the object of body temperature lowering.
2. a kind of heat sink according to claim 1, it is characterized in that, described control terminal is provided with the first transceiver module be connected with described control module, described temperature monitoring module is provided with the second transceiver module be connected with described MCU chip, and described first transceiver module is connected with described second transceiver module radio communication.
3. a kind of heat sink according to claim 1, is characterized in that, described temperature adjustment module is provided with the second temperature probe being electrically connected at described MCU chip;
Described second temperature probe becomes the temperature of device for gathering temperature and sends temperature data to described control terminal by MCU chip process, described control module receives described temperature data and judges whether described measured temperature value is less than the second preset temperature value, if measured temperature value is less than the second preset temperature value, described control module sending controling instruction controls described refrigerator to described MCU chip and quits work.
4. a kind of heat sink according to claim 3, it is characterized in that, described control terminal is provided with input module, processing module and display module, and described input module, processing module are electrically connected with described control module respectively, and described display module and described processing module are electrically connected;
Described input module is for inputting described first preset temperature value and the second preset temperature value and sending to described control module, and described processing module is used for carrying out process to the temperature value that described first temperature probe is surveyed and obtains observed temperature curve and export to described display module showing.
5. a kind of heat sink according to claim 4, is characterized in that, described control terminal is provided with alarm module;
When the temperature value that the first temperature probe is surveyed exceedes described first preset temperature value, described control module controls described alarm module and gives a warning.
6. a kind of heat sink according to claim 1, is characterized in that, described temperature adjustment module also comprises shell, and described housing exterior is provided with thin cotton.
7. a kind of heat sink according to claim 6, is characterized in that, described temperature monitoring module also comprises disk, establishes pcb board in described disk, and described MCU chip is located at pcb board, and described side wall of outer shell and described disk sidewall are equipped with connection jaws.
8. a kind of heat sink according to claim 6, is characterized in that, described housing exterior is provided with wearing.
9. a kind of heat sink according to claim 1, is characterized in that, described temperature becomes device and is made up of phase-change material.
10. a kind of heat sink according to claim 1, is characterized in that, described control terminal is smart mobile phone or panel computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420858305.1U CN204484449U (en) | 2014-12-30 | 2014-12-30 | A kind of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420858305.1U CN204484449U (en) | 2014-12-30 | 2014-12-30 | A kind of heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204484449U true CN204484449U (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420858305.1U Expired - Fee Related CN204484449U (en) | 2014-12-30 | 2014-12-30 | A kind of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204484449U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104490372A (en) * | 2014-12-30 | 2015-04-08 | 续嘉 | Cooling device |
| CN105455940A (en) * | 2015-12-21 | 2016-04-06 | 吉林大学 | Temperature-varying comprehensive nursing care system |
| RU168393U1 (en) * | 2016-02-08 | 2017-02-01 | Константин Олегович Осипов | Device for local hypothermia |
-
2014
- 2014-12-30 CN CN201420858305.1U patent/CN204484449U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104490372A (en) * | 2014-12-30 | 2015-04-08 | 续嘉 | Cooling device |
| CN105455940A (en) * | 2015-12-21 | 2016-04-06 | 吉林大学 | Temperature-varying comprehensive nursing care system |
| RU168393U1 (en) * | 2016-02-08 | 2017-02-01 | Константин Олегович Осипов | Device for local hypothermia |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160525 Address after: 518000, Guangdong, Baoan District, Xixiang province Shenzhen Street Community Lok Republic Industrial Road, Mingyue Huadu F block 603 Patentee after: Shenzhen Jia Shun Da Technology Co., Ltd. Address before: Nanshan District Okimura lejing garden in Shenzhen city in Guangdong province 518000 13 603 Patentee before: Xu Jia |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20171230 |
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| CF01 | Termination of patent right due to non-payment of annual fee |