CN204464275U - A kind of sealing device of New LED filament - Google Patents
A kind of sealing device of New LED filament Download PDFInfo
- Publication number
- CN204464275U CN204464275U CN201520097864.XU CN201520097864U CN204464275U CN 204464275 U CN204464275 U CN 204464275U CN 201520097864 U CN201520097864 U CN 201520097864U CN 204464275 U CN204464275 U CN 204464275U
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- flip
- fluorescence
- fluorescence ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a kind of New LED filament sealing device, comprise the fluorescence ceramics support being printed on circuit, substrate, flip LED chips, described fluorescence ceramics support is yellow, described yellow fluorescence ceramic wavelength is 590nm-560nm, flip-chip is placed on substrate, substrate and flip-chip, fluorescence ceramics support is connected by silver paste, at flip LED chips applied atop fluorescent glue, support is done with there being the fluorescence ceramics of circuit, flip-chip does light source, can be implemented in chip and make a glue just above, the back side does not then need a glue, bonding wire is not needed between chip and chip, and the distance message circuit between chip and chip determines, elongation that can be suitable, thus reduce a number of LED chip, reduce cost, fluorescence ceramics support and LED flip chip are melted by silver paste and connect in addition, silver paste conductive coefficient is high, perfect heat-dissipating, the utility model structure is simple, reasonable in design, workable, be worthy to be popularized.
Description
Technical field
The utility model relates to a kind of lighting device, particularly relates to a kind of sealing device of New LED filament.
Background technology
The positive cartridge chip of LED is traditionally used in filament encapsulation, and its filament support is transparent rack, and its filament support does not have circuit, is connected between chip with chip by weldering gold thread at chip both positive and negative polarity.
The filament that positive cartridge chip is made, maximum fraction defective appears on weldering gold thread, gold thread easily breaks, the loop height more than 0.4 of chip gold thread, the silica gel needing 0.6mm thick just can cover, fluorescent material and silica gel consumption large, if colour temperature be not required for client cannot heavy industry, current LED silk sapphire does support, then be fixed on sapphire with positive cartridge chip elargol, after baking, bonding wire dot fluorescent powder, there is following shortcoming and defect in this kind of device, 1) fluorescent material point is to sapphire front and reverse side, easy generation overflows blue light in side, blue light is caused to injure, reverse side dot fluorescent powder, increase cost 2) just need bonding wire between cartridge chip, the distance of chip and chip can not exceed certain distance, otherwise the gold thread of chip and chip subsides, fraction defective increases, 3) positive cartridge chip elargol is fixed on support, elargol conductive coefficient only has 5W/mk, dispel the heat bad.
Utility model content
In order to solve the technical problem of above-mentioned existence, the utility model provides a kind of sealing device of New LED filament, and concrete technical scheme is:
A kind of sealing device of New LED filament, it is characterized in that: comprise the fluorescence ceramics support being printed on circuit, substrate, flip LED chips, described fluorescence ceramics support is yellow, described yellow fluorescence ceramic wavelength is 590nm-560nm, the described two ends fusing being printed on the fluorescence ceramics support of circuit has silver paste, the top and bottom of described substrate are provided with row or multiple row pad or solder joint, several flip LED chips upside-down mountings are between two pads or solder joint, metal electrode is provided with in substrate both sides, the both positive and negative polarity of described metal electrode is arranged on the bottom surface of substrate, the gap of the substrate between two pads or solder joint is printed with fluorescence membrane, at flip LED chips applied atop fluorescent glue, described fluorescent glue is made up of fluorescent material and silica gel, metal electrode on described substrate is melted in the silver paste on described fluorescence ceramics support two ends.
The utility model compared with prior art has following technique effect: the utility model does support with there being the fluorescence ceramics of circuit, flip-chip does light source, can be implemented in chip and make a glue just above, the back side does not then need a glue, bonding wire is not needed between chip and chip, and the distance message circuit between chip and chip determines, elongation that can be suitable, thus reduce a number of LED chip, reduce cost, fluorescence ceramics support and LED flip chip are melted by silver paste and connect in addition, silver paste conductive coefficient is high, perfect heat-dissipating, the utility model structure is simple, reasonable in design, workable, be worthy to be popularized.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the utility model internal structure schematic diagram.
Embodiment
Below by specific embodiment 1,2, and 1,2 pair of the technical solution of the utility model is described in further detail by reference to the accompanying drawings.
Embodiment, as accompanying drawing 1, shown in 2, a kind of sealing device of New LED filament, comprise the fluorescence ceramics support 1 being printed on circuit, substrate 2, flip LED chips 3, described fluorescence ceramics support 1 is yellow, described yellow fluorescence ceramic wavelength is 590nm-560nm, the described two ends fusing being printed on the fluorescence ceramics support of circuit has silver paste 4, the top and bottom of described substrate are provided with row or multiple row pad or solder joint 5, flip LED chips 3 upside-down mounting is between two pads or solder joint 5, metal electrode 6 is provided with in substrate 2 both sides, the both positive and negative polarity of described metal electrode 6 is arranged on the bottom surface of substrate, the gap of the substrate 2 between two pads or solder joint 5 is printed with fluorescence membrane 7, at flip LED chips 3 applied atop fluorescent glue 8, described fluorescent glue 8 is made up of fluorescent material and silica gel, metal electrode on described substrate is melted in the silver paste 4 on described fluorescence ceramics support two ends.
Support is done with there being the fluorescence ceramics of circuit, flip-chip does light source, and can be implemented in chip and make a glue just above, the back side does not then need a glue, bonding wire is not needed between chip and chip, and the distance between chip and chip can determine with circuit, elongation that can be suitable, thus the number reducing LED chip, reduce cost, fluorescence ceramics support and LED flip chip are melted by silver paste and connect in addition, and silver paste conductive coefficient is high, perfect heat-dissipating.
The above; be only this practicality preferably embodiment; but the utility model protection range is not limited thereto, is equal to according to the technical solution of the utility model and inventive concept thereof and replaces or change, all should be encompassed within protection range of the present utility model.
Claims (1)
1. the sealing device of a New LED filament, it is characterized in that: comprise the fluorescence ceramics support being printed on circuit, substrate, flip LED chips, described fluorescence ceramics support is yellow, described yellow fluorescence ceramic wavelength is 590nm-560nm, the described two ends fusing being printed on the fluorescence ceramics support of circuit has silver paste, the top and bottom of described substrate are provided with row or multiple row pad or solder joint, several flip LED chips upside-down mountings are between two pads or solder joint, metal electrode is provided with in substrate both sides, the both positive and negative polarity of described metal electrode is arranged on the bottom surface of substrate, the gap of the substrate between two pads or solder joint is printed with fluorescence membrane, at flip LED chips applied atop fluorescent glue, described fluorescent glue is made up of fluorescent material and silica gel, metal electrode on described substrate is melted in the silver paste on described fluorescence ceramics support two ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520097864.XU CN204464275U (en) | 2015-02-11 | 2015-02-11 | A kind of sealing device of New LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520097864.XU CN204464275U (en) | 2015-02-11 | 2015-02-11 | A kind of sealing device of New LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204464275U true CN204464275U (en) | 2015-07-08 |
Family
ID=53671123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520097864.XU Expired - Fee Related CN204464275U (en) | 2015-02-11 | 2015-02-11 | A kind of sealing device of New LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204464275U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417691A (en) * | 2018-04-18 | 2018-08-17 | 东莞市恩瑞精密电子有限公司 | Linear light source preparation method |
| CN108855800A (en) * | 2018-08-27 | 2018-11-23 | 广东华辉煌光电科技有限公司 | A kind of dispenser of the bottom plate and application of the dispensing bottom plate |
| CN109686728A (en) * | 2018-12-28 | 2019-04-26 | 苏州工业园区客临和鑫电器有限公司 | A kind of no substrate package flexibility filament and its packaging method |
-
2015
- 2015-02-11 CN CN201520097864.XU patent/CN204464275U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417691A (en) * | 2018-04-18 | 2018-08-17 | 东莞市恩瑞精密电子有限公司 | Linear light source preparation method |
| CN108855800A (en) * | 2018-08-27 | 2018-11-23 | 广东华辉煌光电科技有限公司 | A kind of dispenser of the bottom plate and application of the dispensing bottom plate |
| CN109686728A (en) * | 2018-12-28 | 2019-04-26 | 苏州工业园区客临和鑫电器有限公司 | A kind of no substrate package flexibility filament and its packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204083927U (en) | A kind of chip upside-down mounting type LED daylight lamp | |
| CN203983324U (en) | A kind of LED integrated optical source that adopts the encapsulation of upside-down mounting blue chip | |
| CN102723423B (en) | Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device | |
| CN103400833A (en) | Led module and manufacturing method thereof | |
| CN204464275U (en) | A kind of sealing device of New LED filament | |
| CN102032483A (en) | Light-emitting diode (LED) plane light source | |
| CN103824906A (en) | LED (light-emitting diode) encapsulating method and LED device | |
| CN106764560B (en) | Manufacturing method of LED lamp | |
| CN204179105U (en) | A kind of circuit base plate with equilibrium stress | |
| CN206480621U (en) | A kind of LED chip inverted structure | |
| CN106058021A (en) | Chip-scale package luminescence apparatus and manufacturing method thereof | |
| CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
| CN205028918U (en) | LED support and LED packaging body | |
| CN205335288U (en) | No tin cream flip -chip LED filament | |
| CN203351666U (en) | Led module | |
| CN203871372U (en) | LED light source | |
| CN206419687U (en) | A kind of Novel LED light | |
| CN204088362U (en) | A kind of chip upside-down mounting type LED silk | |
| CN106352260B (en) | Power supply photoelectricity module is gone without gold thread White-light LED chip using high pressure | |
| CN202352671U (en) | Light-emitting diode (LED) packaging structure | |
| CN202268386U (en) | LED (Light Emitting Diode) packaging structure | |
| CN205919161U (en) | Adopt de -electrification source photovoltaic module of no gold thread white light LED chip of high pressure | |
| CN205960028U (en) | Chip scale package illuminator | |
| CN103137824A (en) | White light light-emitting diode device and encapsulation method without gold thread | |
| CN203800085U (en) | Bar-shaped LED all-direction light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20160211 |