CN204430556U - A kind of multiple beam recombination laser impacts micro forming processing unit (plant) - Google Patents
A kind of multiple beam recombination laser impacts micro forming processing unit (plant) Download PDFInfo
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- CN204430556U CN204430556U CN201420867360.7U CN201420867360U CN204430556U CN 204430556 U CN204430556 U CN 204430556U CN 201420867360 U CN201420867360 U CN 201420867360U CN 204430556 U CN204430556 U CN 204430556U
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Abstract
The utility model provides a kind of multiple beam recombination laser and impacts micro forming processing unit (plant), comprises the first laser instrument exporting shock wave laser beam, the second laser exporting continuous laser beam or chip with long pulse width laser bundle, Compound Machining head and processing head driving mechanism; Compound Machining head comprises annular tube wall, upper cover plate, lower cover, the one 45 degree of speculum, the 2 45 degree of speculum, the 3 45 degree of speculum, the 4 45 degree of speculum, reflective focus lamp, condenser lens and protective glass.The utility model have employed the mode of multiple beam recombination laser shock wave micro forming, continuous laser beam first heats peripheral region, micro forming position, also be heated to slightly lower temperature by heat transfer with micro forming regional location simultaneously, therefore under the laser-impact wave pressure effect with peripheral region pre-heat effect, micro forming hole is darker, namely the working (machining) efficiency of equal pulsed laser energy is higher, is conducive to the lifting of micro forming working (machining) efficiency when pulse laser beam carries out shock wave.
Description
Technical field
The utility model belongs to field of laser processing, is specifically related to a kind of multiple beam recombination laser and impacts micro forming processing unit (plant).
Background technology
As far back as the sixties in 20th century, related researcher finds, when laser pulse irradiation is at solid material surface, Reciprocity of Laser & Materials produces the phenomenon of shock wave.The mechanics effect of induced with laser shock wave is just progressively applied to field of engineering technology subsequently, as the laser impact intensified process of material surface, namely utilizes the shock wave of induced with laser, improves the performances such as the antifatigue of material, wearing and tearing and stress corrosion; And laser spallation sends out the detection of coating interface bond strength, produce the characteristic of tension when namely utilizing the shock wave of induced with laser to reflect at different materials combination interface place, detect the bond strength of coating and matrix.
Along with going deep into and development of studying laser blast wave mechanics effect and luminous power coupled relation, open up a brand-new manufacture and manufacture field one manufactures Theory and technology based on the luminous power of the mechanics effect of laser, be with a wide range of applications in defense and commercial industry, as laser impact forming, laser impact intensified, laser-impact eliminate harmful residual stress, laser-impact surface micro-fabrication, laser-impact high-pressure synthesis, laser spallation detection etc.Wherein, laser-impact surface micro-fabrication is also known as laser blast wave micro forming, and it utilizes the shock wave of induced with laser as plastic force source, makes metal blank that the technology of micro-plastic deformation occur, being a kind of brand-new quick forming method, is also an important applied field of laser shocking processing technology.
Laser blast wave micro forming is a kind of development in recent years modernization processing method faster.But, laser blast wave micro forming of the prior art is subject to the restriction of some shortcomings, because laser blast wave is to the high speed and high pressure punching press behavior of its moulding effect microcell, during the metal material making working plasticity poor, micro forming pit edge part occurs to impact micro-crack even skin breakage splashing, and cause micro forming crudy difference and be difficult to control, the pulsed laser energy simultaneously requires very high, often need multiple-pulse overlap to impact and could meet micro forming requirement, working (machining) efficiency is not high.
Utility model content
The utility model, for above-mentioned the deficiencies in the prior art, provides that a kind of working (machining) efficiency is higher, the better multiple beam recombination laser of crudy impacts micro forming processing unit (plant).
The utility model is achieved by the following technical solution:
A kind of multiple beam recombination laser impacts micro forming processing unit (plant), it is characterized in that, comprising the first laser instrument for exporting shock wave laser beam, for exporting the second laser of continuous laser beam or chip with long pulse width laser bundle, Compound Machining head and processing head driving mechanism;
Described Compound Machining head is hollow sleeve tubular, is arranged on processing head driving mechanism, drives it around own axes integral-rotation by processing head driving mechanism;
Described Compound Machining head comprises annular tube wall, upper cover plate, lower cover, the one 45 degree of speculum, the 2 45 degree of speculum, the 3 45 degree of speculum, the 4 45 degree of speculum, reflective focus lamp, condenser lens and protective glass;
The sidewall of described annular tube wall offers the first laser entrance port penetrating annular tube wall, the outer surface of described first laser entrance port is provided with the coated glass that can pass through shock wave laser beam; The shock wave laser beam transparent coated glass that described first laser instrument exports enters into annular tube wall inside via the first laser entrance port;
Described reflective focus lamp is arranged on the inner surface of annular tube wall by a lens gripper and a position adjusting mechanism, and described position adjusting mechanism makes reflective focus lamp can move along horizontal direction;
Upper cover plate and lower cover are arranged on the two ends up and down of annular tube wall respectively, are closed by the inner chamber of annular tube wall; The center of described upper cover plate offers the second laser entrance port penetrating upper cover plate;
Described one 45 degree of speculum is arranged on the lower surface of upper cover plate by a lens gripper and a position adjusting mechanism, the reflecting surface of the one 45 degree of speculum is corresponding with the position of the second laser entrance port; Described position adjusting mechanism makes the one 45 degree of speculum can move along horizontal direction; Described 2 45 degree of speculum is fixedly mounted on the lower surface of upper cover plate by a lens gripper;
The reflecting surface of described 4 45 degree of speculum is corresponding with the position of the first laser entrance port; Described 4 45 degree of speculum is fixed on installing rack, and described installing rack stretches out and is fixed on external rack outside the second laser entrance port, and the 4 45 degree of speculum and installing rack are independent of the rotary motion of Compound Machining head;
The center of described lower cover offers the loophole penetrating lower cover, offers printing opacity annular groove between loophole and the outward flange of lower cover, and described loophole and printing opacity annular groove are all provided with protective glass; Described 3 45 degree of speculum and condenser lens are fixedly mounted on the upper surface of described lower cover by a lens gripper;
The shock wave laser beam transparent first laser entrance port that the installation position of described first laser entrance port, the 4 45 degree of speculum, condenser lens and protective glass should make the first laser instrument launch incides the 4 45 degree of speculum in the horizontal direction, after the turnover of the 4 45 degree of speculum, the vertical gravity direction in downward edge enters to inject condenser lens, after the focusing of condenser lens, what incide the shock wave template of surface of the work through protective glass treats in shock zone;
Described second laser entrance port, one 45 degree of speculum, 2 45 degree of speculum, the continuous laser beam that the installation position of the 3 45 degree of speculum and reflective focus lamp should make second laser launch or chip with long pulse width laser bundle, the one 45 degree of speculum is incided along vertical gravity direction through the second laser entrance port, after the turnover of the one 45 degree of speculum, enter to inject the 2 45 degree of speculum in the horizontal direction, after the turnover of the 2 45 degree of speculum, the vertical gravity direction in downward edge enters to inject the 3 45 degree of speculum, after the turnover of the 3 45 degree of speculum, enter to inject reflective focus lamp in the horizontal direction, through the reflection of reflective focus lamp with after focusing on, export the non-percussion region of the shock wave template of surface of the work to.
The utility model has following beneficial effect:
1, the utility model have employed the mode of multiple beam recombination laser shock wave micro forming, continuous laser beam first heats peripheral region, micro forming position, its temperature is made to increase (but keeping below fusing point), also be heated to slightly lower temperature by heat transfer with micro forming regional location simultaneously, well-known ferrous materials temperature raises then resistance of deformation and reduces, plasticity increases, more be conducive to its pressure forming, therefore under the laser-impact wave pressure effect with peripheral region pre-heat effect, micro forming hole is darker, in other words with even depth micro forming hole needed for pulsed laser energy lower, namely the working (machining) efficiency of equal pulsed laser energy is higher, be conducive to the lifting of micro forming working (machining) efficiency when pulse laser beam carries out shock wave.
2, adopt continuous laser beam first to heat peripheral region, micro forming position in the utility model, make its temperature increase, resistance of deformation declines, and plasticity increases; Micro forming regional location is also heated simultaneously, and plasticity improves greatly, makes more not easily near micro forming hole, seminess to occur when micro forming, can significantly promote micro forming crudy.
3, the Compound Machining head in the utility model can integral-rotation, and Compound Machining head is dispelled the heat better, be more conducive to forming air-flow protection layer near Compound Machining head protection mirror, protective glass is not easily dirty.
4, in the utility model, reflective focus lamp can move radially in the horizontal direction, by mobile reflective focus lamp, the focus relative position of each laser beam can be regulated, coordinate the rotation of Compound Machining head, the micro forming hole of different-diameter can be realized, this regulative mode is more more flexible than the mode of existing conventional laser impact micro forming merely by spot diameter of focusing, and accommodation is wider.
5, the compact conformation of the utility model device, is easy to dismounting calibration.
Accompanying drawing explanation
Fig. 1 is the structural representation that multiple beam recombination laser described in the utility model impacts micro forming processing unit (plant).
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in more detail.
As shown in Figure 1, the utility model provides a kind of multiple beam recombination laser and impacts micro forming processing unit (plant), comprises the first laser instrument for exporting shock wave laser beam, for exporting continuous laser beam or the second laser of long pulse wide (pulse width millisecond magnitude and more than) pulse laser beam, Compound Machining head and processing head driving mechanism;
Described Compound Machining head is hollow sleeve tubular, is arranged on processing head driving mechanism, drives it around own axes (in figure shown in dotted line) integral-rotation by processing head driving mechanism; Wherein, processing head driving mechanism can be realized by mechanisms such as main shaft of numerical control machine tool, and Compound Machining head is connected with the main shaft of Digit Control Machine Tool by conventional broaching tool structure or mounting support structure.
Described Compound Machining head comprises annular tube wall 1, upper cover plate 2, lower cover the 3, the 1 degree of speculum the 4, the 2 45 degree of speculum the 5, the 3 45 degree of speculum the 6, the 4 45 degree of speculum 7, reflective focus lamp 8, condenser lens 9 and protective glass 10;
The sidewall of described annular tube wall 1 offers the first laser entrance port 11 penetrating annular tube wall 1, the outer surface of described first laser entrance port 11 is provided with the coated glass that can pass through shock wave laser beam; It is inner that the shock wave laser beam transparent coated glass that described first laser instrument exports enters into annular tube wall 1 via the first laser entrance port 11; Described reflective focus lamp 8 is arranged on the inner surface of annular tube wall 1 by a lens gripper and a position adjusting mechanism, and described position adjusting mechanism makes reflective focus lamp 8 can move along horizontal direction; Wherein, position adjusting mechanism can be realized by the mechanism such as adjusting bolt, ball-screw.
Upper cover plate 2 and lower cover 3 are arranged on the two ends up and down of annular tube wall 1 respectively, are closed by the inner chamber of annular tube wall 1; The center of described upper cover plate 2 offers the second laser entrance port 21 penetrating upper cover plate 2;
Described one 45 degree of speculum 4 is arranged on the lower surface of upper cover plate 2 by a lens gripper and a position adjusting mechanism, the reflecting surface of the one 45 degree of speculum 4 is corresponding with the position of the second laser entrance port 21; Described position adjusting mechanism makes the one 45 degree of speculum 4 can move along horizontal direction; Described 2 45 degree of speculum 5 is fixedly mounted on the lower surface of upper cover plate 2 by a lens gripper;
The reflecting surface of described 4 45 degree of speculum 7 is corresponding with the position of the first laser entrance port 11; Described 4 45 degree of speculum 7 is fixed on installing rack 14, and described installing rack 14 stretches out and is fixed on external rack outside the second laser entrance port 21, the 4 45 degree of speculum 7 and the rotary motion of installing rack 14 independent of Compound Machining head; Namely the 4 45 degree of speculum 7 does not move along with the rotary motion of Compound Machining head with installing rack 14, and they remain transfixion.Wherein, the material requirements of installing rack 14 is can transmission continuous laser beam and chip with long pulse width laser bundle.
The center of described lower cover 3 offers the loophole penetrating lower cover 3, offers printing opacity annular groove between the outward flange of loophole and lower cover 3, and described loophole and printing opacity annular groove are all provided with protective glass 10; Described 3 45 degree of speculum 6 and condenser lens 9 are fixedly mounted on the upper surface of described lower cover 3 by a lens gripper;
The shock wave laser beam transparent first laser entrance port 11 that the installation position of described first laser entrance port the 11, the 4 45 degree of speculum 7, condenser lens 9 and protective glass 10 should make the first laser instrument launch incides the 4 45 degree of speculum 7 in the horizontal direction, after the turnover of the 4 45 degree of speculum 7, the vertical gravity direction in downward edge enters to inject condenser lens 9, after the focusing of condenser lens 9, what incide the shock wave template 12 on workpiece 13 surface through protective glass 10 treats in shock zone; The trend of shock wave laser beam as shown in the chain-dotted line in Fig. 1 (last focused beam advances light path perpendicular to surface of the work, and beam center axis and a Compound Machining integrally rotated central axes).
Wherein, shock wave template 12 is an indispensable part in the processing of laser blast wave micro forming, the entirety of shock wave template 12 is flat glass, the laser beam that its transmissive first laser instrument and second laser are launched, in the specific region of shock wave template 12 with the side on workpiece to be processed surface, scribble the coating (as pitch-dark etc.) absorbing shock wave laser beam, this specific region is called treats shock zone; Other do not have cated position to be non-percussion region; Treat that the arrangement figure in shock zone and non-percussion region designs according to micro forming figure, namely treat that shock zone is exactly the pit areas needing micro forming.
Because the 4 45 degree of speculum 7 maintains static, do not rotate with the rotation of Compound Machining head, therefore, the swing circle of Compound Machining head and the launching time of shock wave laser beam are also without the need to coordinating, any moment launching shock ripple laser beam, all can impinge perpendicularly on the 4 45 degree of speculum 7.
Described second laser entrance port 21, one 45 degree of speculum 4, 2 45 degree of speculum 5, the continuous laser beam that the installation position of the 3 45 degree of speculum 6 and reflective focus lamp 8 should make second laser launch or chip with long pulse width laser bundle (also referred to as heat treatment laser beam), the one 45 degree of speculum 4 is incided along vertical gravity direction through the second laser entrance port 21, after the turnover of the one 45 degree of speculum 4, enter to inject the 2 45 degree of speculum 5 in the horizontal direction, after the turnover of the 2 45 degree of speculum 5, the vertical gravity direction in downward edge enters to inject the 3 45 degree of speculum 6, after the turnover of the 3 45 degree of speculum 6, enter to inject reflective focus lamp 8 in the horizontal direction, through the reflection of reflective focus lamp 8 with after focusing on, export the non-percussion region of the shock wave template 12 on workpiece 13 surface to.The trend of heat treatment laser beam is as shown in the double dot dash line in Fig. 1.
When adopting said apparatus to carry out multiple beam recombination laser shock wave micro forming, export two bundle laser, i.e. shock wave laser beam and heat treatment laser beams.Shock wave laser beam is the pulse laser beam of high-peak power, for laser blast wave micro forming; Heat treatment laser beam is the wide pulse laser beam of continuous laser beam or long pulse, for heating micro forming peripheral region.The mode of this multiple beam compound is conducive to the lifting of micro forming working (machining) efficiency when pulse laser beam carries out shock wave and crudy.
Claims (1)
1. a multiple beam recombination laser impacts micro forming processing unit (plant), it is characterized in that, comprising the first laser instrument for exporting shock wave laser beam, for exporting the second laser of continuous laser beam or chip with long pulse width laser bundle, Compound Machining head and processing head driving mechanism;
Described Compound Machining head is hollow sleeve tubular, is arranged on processing head driving mechanism, drives it around own axes integral-rotation by processing head driving mechanism;
Described Compound Machining head comprises annular tube wall (1), upper cover plate (2), lower cover (3), the one 45 degree of speculum (4), the 2 45 degree of speculum (5), the 3 45 degree of speculum (6), the 4 45 degree of speculum (7), reflective focus lamp (8), condenser lens (9) and protective glass (10);
The sidewall of described annular tube wall (1) offers the first laser entrance port (11) penetrating annular tube wall (1), the outer surface of described first laser entrance port (11) is provided with the coated glass that can pass through shock wave laser beam; It is inner that the shock wave laser beam transparent coated glass that described first laser instrument exports enters into annular tube wall (1) via the first laser entrance port (11);
Described reflective focus lamp (8) is arranged on the inner surface of annular tube wall (1) by a lens gripper and a position adjusting mechanism, and described position adjusting mechanism makes reflective focus lamp (8) can move along horizontal direction;
Upper cover plate (2) and lower cover (3) are arranged on the two ends up and down of annular tube wall (1) respectively, are closed by the inner chamber of annular tube wall (1); The center of described upper cover plate (2) offers the second laser entrance port (21) penetrating upper cover plate (2);
Described one 45 degree of speculum (4) is arranged on the lower surface of upper cover plate (2) by a lens gripper and a position adjusting mechanism, the reflecting surface of the one 45 degree of speculum (4) is corresponding with the position of the second laser entrance port (21); Described position adjusting mechanism makes the one 45 degree of speculum (4) can move along horizontal direction; Described 2 45 degree of speculum (5) is fixedly mounted on the lower surface of upper cover plate (2) by a lens gripper;
The reflecting surface of described 4 45 degree of speculum (7) is corresponding with the position of the first laser entrance port (11); Described 4 45 degree of speculum (7) is fixed on installing rack (14), described installing rack (14) stretches out and is fixed on external rack outside the second laser entrance port (21), the 4 45 degree of speculum (7) and the rotary motion of installing rack (14) independent of Compound Machining head;
The center of described lower cover (3) offers the loophole penetrating lower cover (3), offer printing opacity annular groove between the outward flange of loophole and lower cover (3), described loophole and printing opacity annular groove are all provided with protective glass (10); Described 3 45 degree of speculum (6) and condenser lens (9) are fixedly mounted on the upper surface of described lower cover (3) by a lens gripper;
Described first laser entrance port (11), 4 45 degree of speculum (7), the shock wave laser beam transparent first laser entrance port (11) that the installation position of condenser lens (9) and protective glass (10) should make the first laser instrument launch incides the 4 45 degree of speculum (7) in the horizontal direction, after the turnover of the 4 45 degree of speculum (7), the vertical gravity direction in downward edge enters to inject condenser lens (9), after the focusing of condenser lens (9), through protective glass (10) incide workpiece (13) surface shock wave template (12) treat in shock zone,
Described second laser entrance port (21), one 45 degree of speculum (4), 2 45 degree of speculum (5), the continuous laser beam that the installation position of the 3 45 degree of speculum (6) and reflective focus lamp (8) should make second laser launch or chip with long pulse width laser bundle, the one 45 degree of speculum (4) is incided along vertical gravity direction through the second laser entrance port (21), after the turnover of the one 45 degree of speculum (4), enter to inject the 2 45 degree of speculum (5) in the horizontal direction, after the turnover of the 2 45 degree of speculum (5), the vertical gravity direction in downward edge enters to inject the 3 45 degree of speculum (6), after the turnover of the 3 45 degree of speculum (6), enter to inject reflective focus lamp (8) in the horizontal direction, through the reflection of reflective focus lamp (8) with after focusing on, export the non-percussion region of the shock wave template (12) on workpiece (13) surface to.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107790881A (en) * | 2017-09-28 | 2018-03-13 | 安徽工业大学 | A kind of metal sandwich boards laser welding machinery formula pressue device and application method |
| CN109454345A (en) * | 2018-12-19 | 2019-03-12 | 黑龙江科技大学 | The method that micropore auxiliary laser punches special fixture and carries out capillary processing |
| CN110756989A (en) * | 2019-11-20 | 2020-02-07 | 南理工泰兴智能制造研究院有限公司 | Laser shock wave micro-modeling processing device with preheated rotating light beam |
| CN112538566A (en) * | 2020-11-25 | 2021-03-23 | 中国科学院宁波材料技术与工程研究所 | Laser shock peening system |
| CN117464209A (en) * | 2023-11-17 | 2024-01-30 | 海目星激光科技集团股份有限公司 | Battery welding device and method |
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2014
- 2014-12-28 CN CN201420867360.7U patent/CN204430556U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107790881A (en) * | 2017-09-28 | 2018-03-13 | 安徽工业大学 | A kind of metal sandwich boards laser welding machinery formula pressue device and application method |
| CN109454345A (en) * | 2018-12-19 | 2019-03-12 | 黑龙江科技大学 | The method that micropore auxiliary laser punches special fixture and carries out capillary processing |
| CN110756989A (en) * | 2019-11-20 | 2020-02-07 | 南理工泰兴智能制造研究院有限公司 | Laser shock wave micro-modeling processing device with preheated rotating light beam |
| CN112538566A (en) * | 2020-11-25 | 2021-03-23 | 中国科学院宁波材料技术与工程研究所 | Laser shock peening system |
| CN117464209A (en) * | 2023-11-17 | 2024-01-30 | 海目星激光科技集团股份有限公司 | Battery welding device and method |
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