CN204377245U - A kind of multi-layer flexible circuit board - Google Patents
A kind of multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN204377245U CN204377245U CN201520088793.7U CN201520088793U CN204377245U CN 204377245 U CN204377245 U CN 204377245U CN 201520088793 U CN201520088793 U CN 201520088793U CN 204377245 U CN204377245 U CN 204377245U
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- tack coat
- insulating barrier
- rigid insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The purpose of this utility model is to provide a kind of multi-layer flexible circuit board, comprise Copper Foil A layer, Copper Foil B layer, Copper Foil C layer and Copper Foil D layer, insulating barrier A is provided with between described Copper Foil A layer and Copper Foil B layer, be provided with tack coat A between described Copper Foil A layer and insulating barrier A, between Copper Foil B layer and insulating barrier A, this has tack coat a; Insulating barrier B is provided with between Copper Foil B layer and Copper Foil C layer, between Copper Foil B layer and insulating barrier B, this has tack coat B, tack coat b is provided with between Copper Foil C layer and insulating barrier B, insulating barrier C is provided with between Copper Foil C layer and Copper Foil D layer, be provided with tack coat C between described Copper Foil C and insulating barrier C, between described Copper Foil D layer and insulating barrier C, be provided with tack coat c; Described Copper Foil D layer connects rigid insulation layers B outward, and described rigid insulation layers B is the apertured rigidity fragment composition of fracture.The utility model adopts the rigid insulation structure of multi-layer flexible circuit board, possesses flexibility and has certain hardness simultaneously, improve the supporting role of circuit board.
Description
Technical field
The utility model belongs to solar energy circuit board manufacturing area, particularly a kind of multi-layer flexible circuit board.
Background technology
Multi-layer flexible circuit board is that the one made for base material with polyimides or polyester film has height reliability, excellent flexible printed circuit.Have the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.The advantage of multilayer circuit board: packaging density is high, volume is little, quality is light, because high density assembling, line between parts (comprising parts) reduce, thus add reliability; Can wiring layers be increased, then increase design flexibility; Also can the impedance of forming circuit, can be formed and there is certain high speed transmission circuit, can initialization circuit, electro-magnetic screen layer, metal core layer also can be installed and meet function and the demands such as special heat is heat insulation; Easy for installation, reliability is high.
The shortcoming (defective) of multi-layer PCB board: cost is high, the cycle is long; Need the high reliability method of inspection.Multilayer printed circuit is the product in electronic technology, multi-functional, high-speed, small size Large Copacity direction.Along with the development of electronic technology, the particularly extensive use of extensive and very lagre scale integrated circuit (VLSIC), there is microgroove in quick, high accuracy, high number change direction that multilayer printed circuit density is higher.
Multilayer circuit board can prepare the large product of volume low capacity, but body compared with little, capacity is large, heat production is many is also present situation, so multi-layer flexible circuit board heat radiation is more scabrous problem.How to carry out improving in multi-layer flexible circuit board structure and improve the key that its radiating efficiency is research and development at present.
Utility model content
The purpose of this utility model is to provide a kind of multi-layer flexible circuit board, as required multi-layer flexible circuit board structure can be carried out improvement and improve its bending degree, expand the scope of application of product.
For realizing above object, the technical solution of the utility model is:
A kind of multi-layer flexible circuit board, comprise Copper Foil A layer, Copper Foil B layer, Copper Foil C layer and Copper Foil D layer successively, be provided with insulating barrier A between described Copper Foil A layer and Copper Foil B layer, be provided with tack coat A between described Copper Foil A layer and insulating barrier A, between Copper Foil B layer and insulating barrier A, be provided with tack coat a; Insulating barrier B is provided with between Copper Foil B layer and Copper Foil C layer, tack coat B is provided with between Copper Foil B layer and insulating barrier B, tack coat b is provided with between Copper Foil C layer and insulating barrier B, insulating barrier C is provided with between Copper Foil C layer and Copper Foil D layer, be provided with tack coat C between described Copper Foil C and insulating barrier C, between described Copper Foil D layer and insulating barrier C, be provided with tack coat c; Described Copper Foil D layer connects rigid insulation layers B outward, and described rigid insulation layers B is the apertured rigidity fragment composition of fracture, and the gap between rigidity fragment is 0.01-0.05mm, is provided with tack coat D between described Copper Foil D layer and rigid insulation layers B.
Described Copper Foil A layer outwards connects rigid insulation layers A, described rigid insulation Rotating fields is identical with rigid insulation layers B, for the apertured rigidity fragment composition that ruptures, the gap between rigidity fragment is 0.01-0.05mm, is also provided with tack coat E between described Copper Foil A layer and rigid insulation layers B.
Described rigid insulation layers A bonds diaphragm A, is provided with tack coat between rigid insulation layers A and diaphragm A.
Described rigid insulation layers B bonds diaphragm B, is provided with tack coat between rigid insulation layers B and diaphragm B.
The length of described rigidity fragment is 2-20mm.
Described Copper Foil A layer is provided with through wires hole between Copper Foil D layer, and described through wires hole runs through Copper Foil A layer, tack coat A, insulating barrier A, tack coat a, Copper Foil B layer, tack coat B, insulating barrier B, tack coat b, Copper Foil C layer, tack coat C, insulating barrier C, tack coat c and Copper Foil D layer successively.
The diameter of described through wires hole is 0.2-0.8mm.
The thickness of described Copper Foil A layer, Copper Foil B layer, Copper Foil C layer and Copper Foil D layer is 0.02-0.5mm.
The thickness of described rigid insulation layers B is 0.01-0.2mm.
The beneficial effects of the utility model are:
1, add the rigid insulation structure of multi-layer flexible circuit board, while possessing flexibility, there is certain hardness, improve the supporting role of circuit board.
2, the rigid insulation layers of the utility model employing is due to the structure in gap, makes the possibility reduction that flexible PCB occurs to rupture in bending process.
3, comprising multilayer circuit board, improve capacity, is again flexible PCB, and its bent performance reduces usage space, the range of application of raising.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the utility model reality;
In figure: 1, Copper Foil A layer; 2, Copper Foil B layer; 3, Copper Foil C layer; 4, Copper Foil D layer; 5, insulating barrier A; 6, insulating barrier B; 7, insulating barrier C; 8, diaphragm B; 9, diaphragm A; 10, tack coat A; 11, tack coat a; 12, tack coat B; 13, tack coat b; 14 tack coat C; 15, tack coat c; 16, tack coat D; 17, through wires hole; 18, rigid insulation layers B; 19, rigid insulation layers A; 20, tack coat E; 21, tack coat.
Embodiment
Further illustrate a kind of execution mode of the present utility model with reference to the accompanying drawings.
Embodiment 1: with reference to figure 1:
A kind of multi-layer flexible circuit board, comprise Copper Foil A layer 1, Copper Foil B layer 2, Copper Foil C layer 3 and Copper Foil D layer 4 successively, insulating barrier A5 is provided with between described Copper Foil A layer 1 and Copper Foil B layer 2, be provided with tack coat A10 between described Copper Foil A layer 1 and insulating barrier A5, between Copper Foil B layer 2 and insulating barrier A5, this has tack coat a11; Insulating barrier B6 is provided with between Copper Foil B layer 2 and Copper Foil C layer 3, between Copper Foil B layer 2 and insulating barrier B6, this has tack coat B12, tack coat b13 is provided with between Copper Foil C layer 3 and insulating barrier B6, insulating barrier C7 is provided with between Copper Foil C layer 3 and Copper Foil D layer 4, be provided with tack coat C14 between described Copper Foil C3 and insulating barrier C7, between described Copper Foil D layer 4 and insulating barrier C7, be provided with tack coat c15; Described Copper Foil D layer 4 is outer connects rigid insulation layers B18, and described rigid insulation layers B18 is the apertured rigidity fragment composition of fracture, and the gap between rigidity fragment is 0.01-0.05mm, is provided with tack coat D16 between described Copper Foil D layer 4 and rigid insulation layers B18.
Described Copper Foil A layer 1 outwards connects rigid insulation layers A19, described rigid insulation Rotating fields is identical with rigid insulation layers B18, for the apertured rigidity fragment composition that ruptures, the gap between rigidity fragment is 0.01-0.05mm, is also provided with tack coat E20 between described Copper Foil A layer and rigid insulation layers B18.
Described rigid insulation layers A19 bonds diaphragm A9, is provided with tack coat 21 between rigid insulation layers A19 and diaphragm A9.
Described rigid insulation layers B18 bonds diaphragm B8, is provided with tack coat 21 between rigid insulation layers B18 and diaphragm B8.
The length of described rigidity fragment is 2-20mm.
Described Copper Foil A layer is provided with through wires hole 17 between Copper Foil D layer, and described through wires hole 17 runs through Copper Foil A layer 1, tack coat A10, insulating barrier A5, tack coat a11, Copper Foil B layer 2, tack coat B12, insulating barrier B6, tack coat b13, Copper Foil C layer 3, tack coat C14, insulating barrier C7, tack coat c15 and Copper Foil D layer 4 successively.
The diameter of described through wires hole 7 is 0.2-0.8mm.
The thickness of described Copper Foil A layer 1, Copper Foil B layer 2, Copper Foil C layer 3 and Copper Foil D layer 4 is 0.02-0.5mm.
The thickness of described rigid insulation layers B18 is 0.01-0.2mm.
The above not imposes any restrictions technical scope of the present utility model, all above embodiment is done according to the utility model technical spirit any amendment, equivalent variations and modification, all still belong in the scope of the technical solution of the utility model.
Claims (9)
1. a multi-layer flexible circuit board, comprise Copper Foil A layer, Copper Foil B layer, Copper Foil C layer and Copper Foil D layer successively, be provided with insulating barrier A between described Copper Foil A layer and Copper Foil B layer, be provided with tack coat A between described Copper Foil A layer and insulating barrier A, between Copper Foil B layer and insulating barrier A, be provided with tack coat a; Insulating barrier B is provided with between Copper Foil B layer and Copper Foil C layer, tack coat B is provided with between Copper Foil B layer and insulating barrier B, tack coat b is provided with between Copper Foil C layer and insulating barrier B, insulating barrier C is provided with between Copper Foil C layer and Copper Foil D layer, be provided with tack coat C between described Copper Foil C and insulating barrier C, between described Copper Foil D layer and insulating barrier C, be provided with tack coat c; It is characterized in that: described Copper Foil D layer connects rigid insulation layers B outward, described rigid insulation layers B is the apertured rigidity fragment composition of fracture, and the gap between rigidity fragment is 0.01-0.05mm, is provided with tack coat D between described Copper Foil D layer and rigid insulation layers B.
2. multi-layer flexible circuit board according to claim 1, it is characterized in that: described Copper Foil A layer outwards connects rigid insulation layers A, described rigid insulation Rotating fields is identical with rigid insulation layers B, for the apertured rigidity fragment composition that ruptures, gap between rigidity fragment is 0.01-0.05mm, is also provided with tack coat E between described Copper Foil A layer and rigid insulation layers B.
3. multi-layer flexible circuit board according to claim 2, is characterized in that: described rigid insulation layers A bonds diaphragm A, is provided with tack coat between rigid insulation layers A and diaphragm A.
4. multi-layer flexible circuit board according to claim 1, is characterized in that: described rigid insulation layers B bonds diaphragm B, is provided with tack coat between rigid insulation layers B and diaphragm B.
5. multi-layer flexible circuit board according to claim 1, is characterized in that: the length of described rigidity fragment is 2-20mm.
6. multi-layer flexible circuit board according to claim 1, it is characterized in that: described Copper Foil A layer is provided with through wires hole between Copper Foil D layer, described through wires hole runs through Copper Foil A layer, tack coat A, insulating barrier A, tack coat a, Copper Foil B layer, tack coat B, insulating barrier B, tack coat b, Copper Foil C layer, tack coat C, insulating barrier C, tack coat c and Copper Foil D layer successively.
7. according to multi-layer flexible circuit board according to claim 6, it is characterized in that: the diameter of described through wires hole is 0.2-0.8mm.
8. multi-layer flexible circuit board according to claim 1, is characterized in that: the thickness of described Copper Foil A layer, Copper Foil B layer, Copper Foil C layer and Copper Foil D layer is 0.02-0.5mm.
9. multi-layer flexible circuit board according to claim 1, is characterized in that: the thickness of described rigid insulation layers B is 0.01-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520088793.7U CN204377245U (en) | 2015-02-09 | 2015-02-09 | A kind of multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520088793.7U CN204377245U (en) | 2015-02-09 | 2015-02-09 | A kind of multi-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204377245U true CN204377245U (en) | 2015-06-03 |
Family
ID=53333417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520088793.7U Expired - Fee Related CN204377245U (en) | 2015-02-09 | 2015-02-09 | A kind of multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204377245U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017013131A1 (en) * | 2015-07-19 | 2017-01-26 | Acpad Instruments Ug | Musical instruments switch and pad arrangement by means of sensor film |
-
2015
- 2015-02-09 CN CN201520088793.7U patent/CN204377245U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017013131A1 (en) * | 2015-07-19 | 2017-01-26 | Acpad Instruments Ug | Musical instruments switch and pad arrangement by means of sensor film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202941075U (en) | Combined-type graphite heat radiation sheet | |
| CN202652681U (en) | LED three-dimensional circuit board | |
| CN204377245U (en) | A kind of multi-layer flexible circuit board | |
| CN203446104U (en) | Insulating thermal conductive substrate | |
| CN103260345B (en) | A kind of Metal Substrate metal-clad foil plate and preparation method thereof | |
| CN106341941A (en) | Manufacturing method for locally burying copper block and conducting internal-layer lead wire | |
| CN201465622U (en) | Hot melt aluminium foil Nylar structure of FFC wire | |
| CN202996814U (en) | Heat-dissipation type semiconductor packaging structure | |
| CN206212412U (en) | The reinforced flexible PCB of jigsaw | |
| CN201700081U (en) | Polytetrafluoroethylene glass fibre basal plate | |
| CN204707342U (en) | There is the multilayer circuit board of radiating effect | |
| CN103228101A (en) | FR4 circuit board enhanced by high-thermal-conductive nano DLC (diamond-like carbon) coating | |
| CN103152976B (en) | For the ceramic base printed circuit board that LED installs | |
| CN203181411U (en) | FR4 printed circuit board with enhanced highly-heat-conductive nano diamond-like-carbon (DLC) coating | |
| CN210928141U (en) | High-efficient radiating circuit board | |
| CN103442512A (en) | Multi-layer insulating metal substrate circuit board | |
| CN203722921U (en) | Metal based tinsel coated plate | |
| CN206585832U (en) | Pcb board | |
| CN204014268U (en) | A kind of flexibility with effectiveness is covered metal substrate | |
| CN106714443B (en) | High-precision flexible circuit board | |
| CN201336197Y (en) | Composite substrate made of magnetic material | |
| CN211378345U (en) | High-precision single-sided circuit board | |
| CN204634158U (en) | A kind of jointing of LED pcb board | |
| CN203632961U (en) | An antistatic high frequency microwave substrate | |
| CN205071456U (en) | Multilayer circuit plate structure with embedded connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150603 Termination date: 20200209 |