CN204335134U - For the printed circuit board (PCB) of mobile device - Google Patents
For the printed circuit board (PCB) of mobile device Download PDFInfo
- Publication number
- CN204335134U CN204335134U CN201420376136.8U CN201420376136U CN204335134U CN 204335134 U CN204335134 U CN 204335134U CN 201420376136 U CN201420376136 U CN 201420376136U CN 204335134 U CN204335134 U CN 204335134U
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- printed circuit
- steel disc
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 22
- 239000010959 steel Substances 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 3
- 239000006071 cream Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of printed circuit board (PCB) for mobile device, described printed circuit board (PCB) is provided with earth connection, described printed circuit board (PCB) is provided with steel disc, described steel disc has junction to be welded, described junction to be welded is coated with one deck nickel, between the junction described to be welded of nickel plating place and the earth connection of described printed circuit board (PCB), passes through tin welding.Compared with prior art, the utility model adopts tin to connect steel disc and earth connection, greatly reduces conduction impedance, and improves the stability of conduction.
Description
Technical field
The utility model designs a kind of printed circuit board (PCB), particularly relates to a kind of printed circuit board (PCB) for mobile device.
Background technology
Flexible PCB is the printed circuit that a kind of flexible insulating substrate is made.It can freely fold, bending and winding, and can not damage inner lead after bearing the dynamic bending of up to a million times, therefore can move and put arbitrarily in limited three dimensions.Based on these advantages, flexible PCB is generally used in mobile device.
In existing application, refer to shown in Fig. 1, the earth connection on flexible PCB 2 is connected conducting by conducting resinl 3 with steel disc 1, steel disc again with the metal shell conducting of mobile device, thus be grounded the grounding function of line.But, when using conducting resinl to connect flexible PCB and steel disc, because conducting resinl mainly conducts electricity by the conductive ion be entrained in wherein, conduction impedance is very unstable, conduction impedance between earth connection and steel disc is between 1-100 Europe, and the mobile device that much performance is higher requires that the conduction impedance between earth connection and steel disc must be less than 10 Europe, therefore existing printed circuit board (PCB) can not satisfy the demands.
Therefore, be necessary to provide a kind of new printed circuit board (PCB) to solve the problems referred to above.
Utility model content
The purpose of this utility model is to provide a kind of conduction impedance low and the stable printed circuit board (PCB) for mobile device of electric conductivity.
To achieve these goals, the technical scheme that adopts of the utility model is as follows:
A kind of printed circuit board (PCB) for mobile device, described printed circuit board (PCB) is provided with earth connection, described printed circuit board (PCB) is provided with steel disc, described steel disc has junction to be welded, described junction to be welded is coated with one deck nickel, between the junction described to be welded of nickel plating place and the earth connection of described printed circuit board (PCB), passes through tin welding.
Preferably, described tin is any one in tin silk, glass putty or tin cream.
Preferably, described printed circuit board (PCB) comprises flexible PCB.
Compared with prior art, the beneficial effect that the utility model is used for the printed circuit board (PCB) of mobile device is: adopt tin to connect steel disc and earth connection, greatly reduce conduction impedance, and improve the stability of conduction.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing flexible PCB;
Fig. 2 is structural representation of the present utility model.
Embodiment
Below in conjunction with specific embodiment, the utility model is described further.
Refer to shown in Fig. 2, the printed circuit board (PCB) 2 of the utility model mobile device is provided with earth connection (not shown), described printed circuit board (PCB) is provided with steel disc 1, described steel disc 1 has junction to be welded, described junction to be welded is coated with one deck nickel 4, and the junction described to be welded of nickel plating place is welded by tin 5 with between the earth connection of described printed circuit board (PCB) 2.In present embodiment, described printed circuit board (PCB) 2 is flexible PCB, and in other embodiments, printed circuit board (PCB) 2 also can be the circuit board of other kinds.
Due to described steel disc 1 being difficult to directly go up tin 5, described steel disc 1 plates nickel dam 4, then weld with using tin 5 between earth connection at nickel dam 4, thus realize conducting between steel disc 1 and earth connection, and conduction impedance is less than 10 Europe, electric conductivity is more stable.
During use, described tin 5 can adopt in tin silk, glass putty or tin cream any one.
When embody rule, when prior art adopts conducting resinl 3 to connect flexible PCB and steel disc 1, need to attach conducting resinl 3 on whole of steel disc 1 surface, and when adopting tin 5 to connect flexible PCB and steel disc 1, only need tin 5 on the subregion on steel disc 1 surface, can save time, cost-saving.
Schematically above be described the utility model and execution mode thereof, this description does not have restricted, and also just one of the execution mode of the present utility model shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the utility model and creating aim, design the frame mode similar to this technical scheme and embodiment without creationary, protection range of the present utility model all should be belonged to.
Claims (3)
1. the printed circuit board (PCB) for mobile device, described printed circuit board (PCB) is provided with earth connection, described printed circuit board (PCB) is provided with steel disc, it is characterized in that: described steel disc has junction to be welded, described junction to be welded is coated with one deck nickel, by tin welding between the junction described to be welded of nickel plating place and the earth connection of described printed circuit board (PCB), the area of described nickel dam equals the area of described junction to be welded, and the area of described nickel dam is greater than the area of described tin.
2. as claimed in claim 1 for the printed circuit board (PCB) of mobile device, it is characterized in that: described tin is any one in tin silk, glass putty or tin cream.
3., as claimed in claim 1 for the printed circuit board (PCB) of mobile device, it is characterized in that: described printed circuit board (PCB) comprises flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420376136.8U CN204335134U (en) | 2014-07-09 | 2014-07-09 | For the printed circuit board (PCB) of mobile device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420376136.8U CN204335134U (en) | 2014-07-09 | 2014-07-09 | For the printed circuit board (PCB) of mobile device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335134U true CN204335134U (en) | 2015-05-13 |
Family
ID=53171438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420376136.8U Expired - Lifetime CN204335134U (en) | 2014-07-09 | 2014-07-09 | For the printed circuit board (PCB) of mobile device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335134U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135080A (en) * | 2018-01-13 | 2018-06-08 | 蚌埠华特科技有限公司 | A kind of steel disc tin filling ground connection technique |
-
2014
- 2014-07-09 CN CN201420376136.8U patent/CN204335134U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135080A (en) * | 2018-01-13 | 2018-06-08 | 蚌埠华特科技有限公司 | A kind of steel disc tin filling ground connection technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |