CN204333003U - A kind of support - Google Patents
A kind of support Download PDFInfo
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- CN204333003U CN204333003U CN201420746029.XU CN201420746029U CN204333003U CN 204333003 U CN204333003 U CN 204333003U CN 201420746029 U CN201420746029 U CN 201420746029U CN 204333003 U CN204333003 U CN 204333003U
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- metallic support
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Abstract
The utility model discloses a kind of support, it relates to LED support technical field.It comprises the first plastic cement, electrode pin, the coat of metal, metallic support electrode wire welding area, bonding wire region coating, chip, second plastic cement, gold thread, chip rest area and pad, the periphery of chip is provided with metallic support electrode wire welding area, chip is arranged on chip rest area, bonding wire region coating is provided with between chip rest area and metallic support electrode wire welding area, metallic support electrode wire welding area and chip soldering are connected to gold thread, metallic support electrode wire welding area be provided with the second plastic cement between both sides and rack body up and down, periphery, metallic support electrode wire welding area is provided with the coat of metal, rack body is provided with the first plastic cement, the both sides of rack body are provided with electrode pin, the bottom of rack body is provided with pad.The utility model saves gold thread consumption, expands lighting angle, reduces the consumption of fluorescent material and glue, and heat dispersion is better, and cost is lower.
Description
Technical field
The utility model relates to LED support technical field, be specifically related to a kind of support.
Background technology
Luminous efficiency is high owing to having for LED device, little power consumption, the feature such as pollution-free, just be widely used in the fields such as TV backlight, advertisement sign, picture and text showing, decorative lighting, along with reaching its maturity of LED technology, some problems of LED also come out simultaneously, for example: the lighting angle of gold thread price and consumption problem, junction temperature problem, LED makes that brightness is low, fluorescent material and glue quantity problem make the cost of LED increase, based on this, design a kind of support or necessary.
Summary of the invention
For the deficiency that prior art exists, the utility model object is to provide a kind of support, and structure is simple, reasonable in design, saves gold thread consumption, expand lighting angle, reduces the consumption of fluorescent material and glue, and heat dispersion is better, and cost is lower.
To achieve these goals, the utility model realizes by the following technical solutions: a kind of support, comprise the first plastic cement, electrode pin, the coat of metal, metallic support electrode wire welding area, bonding wire region coating, chip, second plastic cement, gold thread, chip rest area and pad, the periphery of chip is provided with metallic support electrode wire welding area, chip is arranged on chip rest area, bonding wire region coating is provided with between chip rest area and metallic support electrode wire welding area, metallic support electrode wire welding area and chip soldering are connected to gold thread, metallic support electrode wire welding area be provided with the second plastic cement between both sides and rack body up and down, periphery, metallic support electrode wire welding area is provided with the coat of metal, rack body is provided with the first plastic cement, the both sides of rack body are provided with electrode pin, the bottom of rack body is provided with pad.
As preferably, the height of described metallic support electrode wire welding area higher than chip, during bonding wire, the height radian of gold thread all can reduce relatively, bracing wire distance also can correspondingly shorten, and save gold thread, and the structure of this encirclement chip makes to have certain corrosion-resistant effect during packing colloid.
As preferably, described pad is connected with chip by crystal-bonding adhesive, and form straight-line heat radiation, heat dispersion is better.
The beneficial effects of the utility model: 1, save gold thread consumption;
2, by the improvement of support, chip cooling area is increased, from simple bottom heat radiation, be increased to bottom surface and surrounding heat radiation, be conducive to heat radiation to a certain extent;
3, the lighting angle of expanded stent, by reducing the distance of chip and colloid surface, to increase lighting angle, improves the brightness of chip;
4, relatively conventional LED mode, adopts the packing forms of this kind of support, can well reduce the consumption of fluorescent material and glue;
5, to a certain extent insulation blocking effect is played to chip and gold thread, thus promote the anti-oxidant of lamp pearl, decay resistance.
Accompanying drawing explanation
The utility model is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is planar structure schematic diagram of the present utility model;
Fig. 2 is the rearview of Fig. 1;
Fig. 3 is perspective view of the present utility model.
Embodiment
The technological means realized for making the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the utility model further.
With reference to Fig. 1-3, this embodiment is by the following technical solutions: a kind of support, comprise the first plastic cement 1, electrode pin 2, the coat of metal 3, metallic support electrode wire welding area 4, bonding wire region coating 5, chip 6, second plastic cement 7, gold thread 8, chip rest area 9 and pad 10, the periphery of chip 6 is provided with metallic support electrode wire welding area 4, chip 6 is arranged on chip rest area 9, bonding wire region coating 5 is provided with between chip rest area 9 and metallic support electrode wire welding area 4, metallic support electrode wire welding area 4 and chip 6 are welded with gold thread 8, metallic support electrode wire welding area 4 be provided with the second plastic cement 7 up and down between both sides and rack body, periphery, metallic support electrode wire welding area 4 is provided with the coat of metal 3, rack body is provided with the first plastic cement 1, the both sides of rack body are provided with electrode pin 2, the bottom of rack body is provided with pad 10.
It should be noted that the height of described metallic support electrode wire welding area 4 is higher than chip 6, general cradling function district bottom metal is plane, and metallic support electrode wire welding area 4 is designed to protruding structure of surrounding chip 6 three effects:
(1) save gold thread: this structure is because metallic support electrode wire welding area 4 is higher than chip 6, and during bonding wire, the height radian of gold thread 6 all can reduce relatively, bracing wire distance also can correspondingly shorten, and plays the object of saving gold thread.
(2) play a protective role to chip and gold thread: 1. when encapsulating, chip and colloid are thoroughly sealed in the inside by colloid part branch, thus play certain protective effect;
2. metal bump surrounds the structure of chip, and when packing colloid and support occur that space is peeled off, ring surrounds the moisture that structure can stop the external world to a certain extent, and corrosive gas etc. are to the corrosion of gold thread and chip.
(3) heat radiation of chip 6 is conducive to: metal surrounds the structure of chip, the relative packaging plastic of heat dispersion of metal will be got well, when LED works, metallic member absorbs and distributes the heat of chip 6 surrounding, this function is better than conventional stent, only have the radiating mode of chip bottom contacting metal, thus reach reduction temperature, promote the effect in LED life-span.
This embodiment bonding wire region coating 5 can comparatively to be tried one's best polishing by the coat of metal 3, reduces polishing area, plays the effect reduced costs; Second plastic cement 7 plays the effect separated by stent electrode; Pad 10 is directly linked together by crystal-bonding adhesive with chip 6, forms straight-line and dispels the heat.
This embodiment, by the saving of gold thread, fluorescent material, glue quantity, plays the effect reduced costs, not only promotes chip brightness, increase luminescent stand angle, also improve chip cooling situation, have further lifting to the useful life of LED lamp bead, there is market application foreground widely.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof
.
Claims (3)
1. a support, it is characterized in that, comprise the first plastic cement (1), electrode pin (2), the coat of metal (3), metallic support electrode wire welding area (4), bonding wire region coating (5), chip (6), second plastic cement (7), gold thread (8), chip rest area (9) and pad (10), the periphery of chip (6) is provided with metallic support electrode wire welding area (4), chip (6) is arranged on chip rest area (9), bonding wire region coating (5) is provided with between chip rest area (9) and metallic support electrode wire welding area (4), metallic support electrode wire welding area (4) and chip (6) are welded with gold thread (8), metallic support electrode wire welding area (4) be provided with the second plastic cement (7) up and down between both sides and rack body, metallic support electrode wire welding area (4) periphery is provided with the coat of metal (3), rack body is provided with the first plastic cement (1), the both sides of rack body are provided with electrode pin (2), the bottom of rack body is provided with pad (10).
2. a kind of support according to claim 1, is characterized in that, the height of described metallic support electrode wire welding area (4) is higher than chip (6).
3. a kind of support according to claim 1, is characterized in that, described pad (10) is connected with chip (6) by crystal-bonding adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746029.XU CN204333003U (en) | 2014-12-03 | 2014-12-03 | A kind of support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420746029.XU CN204333003U (en) | 2014-12-03 | 2014-12-03 | A kind of support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204333003U true CN204333003U (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420746029.XU Active CN204333003U (en) | 2014-12-03 | 2014-12-03 | A kind of support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204333003U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834514A (en) * | 2020-07-23 | 2020-10-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Bracket type infrared transmitting tube with ultra-large half-intensity angle and manufacturing method thereof |
-
2014
- 2014-12-03 CN CN201420746029.XU patent/CN204333003U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834514A (en) * | 2020-07-23 | 2020-10-27 | 中国振华集团永光电子有限公司（国营第八七三厂） | Bracket type infrared transmitting tube with ultra-large half-intensity angle and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee after: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee before: Shenzhen Smalite Optoelectronics Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170316 Address after: 330000 Jiangxi Airport Economic Zone, small and medium enterprises in the first floor of Industrial Park Office Patentee after: Jiangxi Hongli photoelectric Co., Ltd. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee before: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. |