CN204315551U - Metal sealing glass-ceramic compound sealing structure - Google Patents
Metal sealing glass-ceramic compound sealing structure Download PDFInfo
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- CN204315551U CN204315551U CN201420800263.6U CN201420800263U CN204315551U CN 204315551 U CN204315551 U CN 204315551U CN 201420800263 U CN201420800263 U CN 201420800263U CN 204315551 U CN204315551 U CN 204315551U
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Abstract
The utility model discloses a kind of metal sealing glass-ceramic compound sealing structure, it comprises metal shell matrix, described metal shell matrix is provided with fairlead, lead-in wire is connected with in fairlead, be provided with seal glass in gap between lead-in wire and metal shell matrix and form glass sealing district, a side or two sides in glass sealing district are provided with ceramic support around described lead-in wire.The utility model, by being added in metal-glass sealing structure by ceramic insulating material, achieves the lifting of high voltage performance.The utility model adds ceramic support at the glass head seal areas outside of routine, makes pottery and glass can form reliable sealing-in.Aluminium oxide ceramics supports, and not only can increase insulation distance, and facilitate the location of glass, and prevent glass from trickling, avoid simultaneously directly to contact with graphite jig bring be stained with graphite problem, improve the insulation property of shell.
Description
Technical field
the utility model relates to the level Hermetic Package shell field of electronic component module, is a kind of metal sealing glass-ceramic compound sealing structure.
Background technology
In airtight Electronic Packaging metal shell design specification, generally promote high voltage performance by increasing insulation distance design.But consider lead spacing requirement, unrestrictedly can not increase insulation distance.Meanwhile, need the reliability requirement considering sealing, and all there is design limit in sealing-in aperture and thickness of glass.Traditional metal-glass encapsulating structure, can meet high pressure resistant requirement to a certain extent.But because glass wall thickness is limited, the withstand voltage that conventional metal-glass encapsulating structure can realize also is limited.
Summary of the invention
the utility model, by being added in metal-glass sealing structure by ceramic insulating material, obtains a kind of metal sealing glass-ceramic compound sealing structure, thus achieves the lifting of high voltage performance.
Metal sealing glass-ceramic compound sealing structure of the present utility model, comprise metal shell matrix, described metal shell matrix is provided with fairlead, lead-in wire is connected with in fairlead, be provided with seal glass in gap between described lead-in wire and metal shell matrix and form glass sealing district, a side or two sides in described glass sealing district are provided with ceramic support around described lead-in wire.
The width of described ceramic support is less than fairlead diameter.
Described ceramic support can be the rule such as circular, square, square type, polygon, star or irregular shape.Be preferably the circle of rule.
Described fairlead diameter 1-3mm, diameter wire 0.4-0.6mm, ceramic support thickness 0.3-0.8mm.Ceramic support can be aluminium oxide, zirconia or aluminium nitride.
The encapsulating method of metal sealing glass-ceramic compound sealing structure of the present utility model, comprises the steps:
(1) by metal shell matrix, to go between in chain type atmosphere furnace and under nitrogen atmosphere protection, to add steam, in 800-850 degree Celsius of pre-oxidation treatment;
(2) lead-in wire of the metal shell matrix of pre-oxidation, pre-oxidation, bead and pottery are assembled into one by graphite jig, are sent in the high temperature chain type atmosphere furnace of 900-940 degree Celsius to carry out sintering and melt formation hermetic seal system mutually;
(3) oxide layer of metal shell matrix and lead-in wire is removed in pickling;
For ensureing that the insulation distance of better pin and housing under hydrogen atmosphere protects, can not add steam, in 800-820 degree Celsius of ceramic soldering feet in chain type atmosphere furnace; Finally can carry out plating by customer requirement to housing and lead-in wire, as modes such as gold-plated, the housing nickel plating of going between.
The embedding of ceramic insulating material in the utility model, improves dielectric surface state, decreases the possibility that glass surface directly contacts conducting medium; Meanwhile, the possibility that glass leak occurs is decreased, because of under identical diameter wire prerequisite, the increase of glass external diameter can promote high voltage performance, but, simultaneously, the difficulty of glass-to-metal sealing technique can increase, and external diameter increases, and occurs that the possibility of glass leak also can increase.
The utility model adds ceramic support at the glass head seal areas outside of routine, pottery is oxide, glass also mainly the oxide such as silica, sodium oxide molybdena composition, at high temperature, there is mutual chemical reaction between oxide, therefore pottery and glass can form reliable sealing-in.Aluminium oxide ceramics supports, and not only can increase insulation distance, and facilitate the location of glass, and prevent glass from trickling, avoid simultaneously directly to contact with graphite jig bring be stained with graphite problem, improve the insulation property of shell.
Accompanying drawing explanation
Fig. 1 is isolated amplifier package casing sectional structure schematic diagram;
Fig. 2 is structure for amplifying schematic diagram in a-quadrant in Fig. 1.
Embodiment
As shown in Figure 1 and Figure 2, the utility model is for a isolated amplifier package casing, it comprises metal shell matrix 3, metal shell matrix 3 is provided with fairlead (Φ D=2.00mm), lead-in wire 1(Φ d=0.56mm is connected with) in fairlead, be provided with seal glass 2 in gap between described lead-in wire 1 and metal shell matrix 3 and form glass sealing district, a side or two sides in described glass sealing district are provided with by the ceramic support 4 of ceramic material around described lead-in wire 1.This ceramic support 4 is the circle of rule, and its diameter is less than fairlead diameter.Ceramic support thickness 0.5mm.Ceramic support can be aluminium oxide, zirconia or aluminium nitride.
The encapsulating method of metal sealing glass-ceramic compound sealing structure of the present utility model, adopt following step: (1) by metal shell matrix, to go between in chain type atmosphere furnace and under nitrogen atmosphere protection, add steam, in 800-850 degree Celsius of pre-oxidation treatment;
(2) lead-in wire of the metal shell matrix of pre-oxidation, pre-oxidation, bead and pottery are assembled into one by graphite jig, are sent in the high temperature chain type atmosphere furnace of 900-940 degree Celsius to carry out sintering and melt formation hermetic seal system mutually;
(3) oxide layer of metal shell matrix and lead-in wire is removed in pickling;
For ensure better insulation distance can in chain type atmosphere furnace and hydrogen atmosphere protection under, do not add steam, in 800-820 degree Celsius of ceramic soldering feet 5; Finally can carry out plating by customer requirement to housing and lead-in wire, as modes such as gold-plated, the housing nickel plating of going between.
The chassis adopted in above-mentioned execution mode of the present utility model is integrated Milling Machining formula structure, through Preliminary Experiment demonstration, and the novel dielectric voltage withstand performance greatly improving shell of this utilitarian design: initial scheme is withstand voltage DC1600V; Existing scheme is withstand voltage AC2000-2800V, DC2800-3500V.But the utility model is not limited to this kind of chassis processing mode, but be applicable to the multiple processing mode of one punching structure or two body braze-welded structures etc.Meanwhile, during chassis structure design, in order to the requirement for height that the satisfied requirement for height meeting internal components assembling is assembled together with under device simultaneously, bottom chassis cavity, sagging trench design can be done, can be used for placing capacitor.
Claims (4)
1. metal sealing glass-ceramic compound sealing structure, comprise metal shell matrix, described metal shell matrix is provided with fairlead, lead-in wire is connected with in fairlead, be provided with seal glass in gap between described lead-in wire and metal shell matrix and form glass sealing district, it is characterized in that, a side or two sides in described glass sealing district are provided with ceramic support around described lead-in wire.
2. metal sealing glass-ceramic compound sealing structure as claimed in claim 1, it is characterized in that, the width of described ceramic support is less than fairlead diameter.
3. metal sealing glass-ceramic compound sealing structure as claimed in claim 1 or 2, is characterized in that, described ceramic support is circular or polygon.
4. metal sealing glass-ceramic compound sealing structure as claimed in claim 1, is characterized in that, described fairlead diameter 1-3mm, diameter wire 0.4-0.6mm, ceramic support thickness 0.3-0.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420800263.6U CN204315551U (en) | 2014-12-18 | 2014-12-18 | Metal sealing glass-ceramic compound sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420800263.6U CN204315551U (en) | 2014-12-18 | 2014-12-18 | Metal sealing glass-ceramic compound sealing structure |
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| Publication Number | Publication Date |
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| CN204315551U true CN204315551U (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420800263.6U Active CN204315551U (en) | 2014-12-18 | 2014-12-18 | Metal sealing glass-ceramic compound sealing structure |
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| CN (1) | CN204315551U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465539A (en) * | 2014-12-18 | 2015-03-25 | 中国电子科技集团公司第四十三研究所 | Glass-ceramic composite sealing structure for metal sealing and sealing method |
| WO2022218332A1 (en) * | 2021-04-14 | 2022-10-20 | 福建欧中电子有限公司 | Glass-packaged ceramic feed-through filter and preparation method therefor |
-
2014
- 2014-12-18 CN CN201420800263.6U patent/CN204315551U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465539A (en) * | 2014-12-18 | 2015-03-25 | 中国电子科技集团公司第四十三研究所 | Glass-ceramic composite sealing structure for metal sealing and sealing method |
| CN104465539B (en) * | 2014-12-18 | 2017-11-21 | 中国电子科技集团公司第四十三研究所 | Metal sealing glass ceramics compound sealing structure and encapsulating method |
| WO2022218332A1 (en) * | 2021-04-14 | 2022-10-20 | 福建欧中电子有限公司 | Glass-packaged ceramic feed-through filter and preparation method therefor |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170515 Address after: Acacia road 230088 Hefei city high tech Zone Anhui province No. 19 Patentee after: Hefei Shengda Electronic Technology Industrial Co. Ltd. Address before: Acacia road 230088 Hefei city high tech Zone Anhui province No. 19 Patentee before: No. 43 Research Institute of China Electronics Technology Group Corporation |