CN204314009U - Automobile-used from Bonding pressure sensor - Google Patents
Automobile-used from Bonding pressure sensor Download PDFInfo
- Publication number
- CN204314009U CN204314009U CN201420762878.4U CN201420762878U CN204314009U CN 204314009 U CN204314009 U CN 204314009U CN 201420762878 U CN201420762878 U CN 201420762878U CN 204314009 U CN204314009 U CN 204314009U
- Authority
- CN
- China
- Prior art keywords
- pressure sensor
- pcb board
- base plate
- core base
- automobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model relates to a kind of pressure transducer, specifically a kind of automobile-used from Bonding pressure sensor, comprises the housing of rubber ring, pcb board, silicon pressure sensor module, core base plate, integrated electrical interface.The utility model is suitable for the information source making Auto Electronic Controlled System.Sensor is connected by air admission hole with tested air chamber or tracheae, is connected by the DIN72585 interface on housing with external circuit.Air chamber or endotracheal air pressure change are by feeding back to external circuit after the silicon pressure sensor module by signal process of sensor.The utility model is the gas pressure sensor of a kind of high sensitivity, high reliability, and has that sensor integration degree is high, volume is little, low cost, is convenient to produce in enormous quantities and the advantage of output signal standard.
Description
Technical field
The utility model relates to a kind of sensor technology, is specifically related to a kind of automobile-used from Bonding pressure sensor.
Background technology
Vehicular pressure sensor is as one of the information source of Auto Electronic Controlled System, and being the critical component of Auto Electronic Controlled System, is also one of core content of technical field of automotive electronics research.Vehicular pressure sensor is mainly used in monitoring and the sensing of gas, oil pressure in air inlet, braking, oil circuit, vehicle body security system on automobile.Due to Vehicular pressure sensor work under bad environment (operating ambient temperature-20 DEG C ~ 80 DEG C, vibration (acceleration 30g), impact (acceleration 50g), moist (100%RH) and steam, salt fog, corrosion and greasy filth and pollute), so its measuring accuracy and reliability must be ensured.
Vehicular pressure sensor adopted mechanical pressure sensors originally usually, electronic formula car sensor begin one's study abroad to solve the automatic control problem of engine from 20 century 70s, afterwards along with to the pursuit of automobile in performances such as power, safe, comfortable, environmental protection and the designing technique along with pressure-sensing device, integrated technology, micromachining technology and the constantly development consuming process, electronic type Vehicular pressure sensor is used and Auto Electronic Controlled System more and more.Existing Vehicular pressure sensor is due to inadequate to the research of basic technology and process industry, and the reliability of sensor is poor, and precision is not high.Particularly this year is along with growth in the living standard, and the use amount of automobile gets more and more, and needs a large amount of pressure transducers.
Summary of the invention
The purpose of this utility model overcomes the deficiencies in the prior art, provides a kind of automobile-used from Bonding pressure sensor.
Automobile-used from Bonding pressure sensor, it is characterized in that comprising left rubber ring, left pcb board, left silicon pressure sensor module, right rubber ring, right pcb board, right silicon pressure sensor module, core base plate, housing; Left rubber ring is fixed between left pcb board and core base plate, left pcb board is fixed on core base plate, left silicon pressure sensor module is fixedly welded on below left pcb board by contact pin, right rubber ring is fixed between right pcb board and core base plate, right pcb board is fixed on core base plate, right silicon pressure sensor module is fixedly welded on below right pcb board by contact pin, and core base plate is arranged in housing.
The automobile-used core base plate from Bonding pressure sensor is aluminium alloy core base plate, and housing is plastic casing.
The automobile-used left pcb board from Bonding pressure sensor or right pcb board and core base plate form a cavity jointly.
Automobile-usedly on the core base plate of Bonding pressure sensor, be also provided with air admission hole, air admission hole is communicated with cavity and tested air chamber.
Automobile-usedly on the housing of Bonding pressure sensor, be also provided with web member, web member is DIN72585 interface.
The automobile-used left pcb board from Bonding pressure sensor or right pcb board are also provided with electrical cable and are connected with the interface on housing.
The automobile-used left silicon pressure sensor module from Bonding pressure sensor or right silicon pressure sensor module are made up of pressure sensor chip and signal condition chip.
The utility model is the gas pressure sensor of a high sensitivity, high reliability.For the working environment that pressure transducer is severe, what the core base plate of sensor adopted is aluminum alloy materials, has that density is low, intensity is high and erosion-resisting feature.DIN72585 interface on housing is AN connector, has versatility and advantage easy for installation, can widespread use.The silicon pressure sensor module that sensor adopts the signal processing circuit of pressure sensor chip and the integration packaging encapsulated by micromachining technology to form.This silicon pressure sensor module has stable performance, form factor is little and reliability is high feature.The utility model feature is that sensor integration degree is high, volume is little, low cost, be convenient to produce in enormous quantities and outputting standard letter.
Accompanying drawing explanation
Fig. 1 is the automobile-used core base arrangement principle schematic from Bonding pressure sensor;
Fig. 2 is the automobile-used front view from Bonding pressure sensor;
Fig. 3 is pressure sensor module typical application circuit figure;
In figure, left rubber ring 1, left pcb board 2, left silicon pressure sensor module 3, right rubber ring 4, right pcb board 5, right silicon pressure sensor module 6, core base plate 7, housing 8.
Embodiment
As shown in Figure 1, 2, automobile-usedly left rubber ring 1, left pcb board 2, left silicon pressure sensor module 3, right rubber ring 4, right pcb board 5, right silicon pressure sensor module 6, core base plate 7, housing 8 is comprised from Bonding pressure sensor; Left rubber ring 1 is fixed between left pcb board 2 and core base plate 7, left pcb board 2 is fixed on core base plate 7, left silicon pressure sensor module 3 is fixedly welded on below left pcb board 2 by contact pin, right rubber ring 4 is fixed between right pcb board 5 and core base plate 7, right pcb board 5 is fixed on core base plate 7, right silicon pressure sensor module 6 is fixedly welded on below right pcb board 5 by contact pin, and core base plate 7 is arranged in housing 8.Air pressure when the air pressure in tested air chamber raises in cavity raises simultaneously, when there being gas pressure in pressure sensor chip, pressure sensor chip can produce a little voltage signal, then exports by the conditioning of signal condition chip the larger voltage signal that is proportional to air pressure.This signal is exported by the electrical cable on PCB.
Core base plate 7 is aluminium alloy core base plates, has that density is low, intensity is high and erosion-resisting feature; Housing 8 is plastic casing, has that cost is low, durable, quality is light and erosion-resisting advantage, is applicable to the rugged surroundings that Vehicular pressure sensor uses.
As shown in Figure 1, left pcb board 2 or right pcb board 5 form a cavity jointly with core base plate 7, place left silicon pressure sensor module 4 or right silicon pressure sensor module 8 in cavity.
As shown in Figure 1, core base plate 7 is also provided with air admission hole, air admission hole is communicated with cavity and tested air chamber, and the position of air admission hole is immediately below silicon pressure sensor module.
As shown in Figure 1-2, housing 8 is also provided with web member, web member is DIN72585 interface, and DIN72585 interface is standard component, and the scope that can be suitable for is wide, and is convenient to install.
As shown in Figure 1, left pcb board 2 or right pcb board 5 are also provided with electrical cable and are connected with the interface on housing 7, and left pcb board 2 or right pcb board 5 are in sealed environment, prevent dust from entering, and affect the stability of circuit.
As shown in Figure 3, left silicon pressure sensor module 4 or right silicon pressure sensor module 8 are made up of pressure sensor chip and signal condition chip.The built-in silicon matrix connected in resistance bridge mode of pressure sensor chip.When pressure acted on diaphragm, silicon diaphragm can produce distortion, and pressure is larger, the resistance of the strain resistor on diaphragm will change under this pressure effect, the silicon diaphragm strain resistor balance that sensor connects in resistance bridge mode is broken, when the input end of electric bridge inputs certain voltage or electric current, just signal voltage or the marking current of respective change can be obtained at bridge output, because signal is fainter for this reason, therefore adopt signal condition chip to carry out signal to amplify and temperature compensation, to export after linear compensation.
The operating voltage of pressure transducer is 5VDC
5%; Maximum rated current is 30mA; Peak point current: 115mA (t≤16 μ s); Working temperature :-40 DEG C-+80 DEG C; Actuating medium: air; Range: 0-12bar; Just taste voltage: 1V; Sensitivity: 250mV/bar; Nonlinearity :≤
0.3%Fs; Delayed :≤
0.2%Fs.
Claims (7)
1. automobile-used from a Bonding pressure sensor, it is characterized in that comprising left rubber ring (1), left pcb board (2), left silicon pressure sensor module (3), right rubber ring (4), right pcb board (5), right silicon pressure sensor module (6), core base plate (7), housing (8); Left rubber ring (1) is fixed between left pcb board (2) and core base plate (7), left pcb board (2) is fixed on core base plate (7), left silicon pressure sensor module (3) is fixedly welded on below left pcb board (2) by contact pin, right rubber ring (4) is fixed between right pcb board (5) and core base plate (7), right pcb board (5) is fixed on core base plate (7), right silicon pressure sensor module (6) is fixedly welded on below right pcb board (5) by contact pin, and core base plate (7) is arranged in housing (8).
2. one according to claim 1 is automobile-used from Bonding pressure sensor, and it is characterized in that described core base plate (7) is aluminium alloy core base plate, housing (8) is plastic casing.
3. one according to claim 1 is automobile-used from Bonding pressure sensor, it is characterized in that described left pcb board (2) or right pcb board (5) form a cavity jointly with core base plate (7).
4. one according to claim 1 is automobile-used from Bonding pressure sensor, it is characterized in that described core base plate (7) is also provided with air admission hole, and air admission hole is communicated with cavity and tested air chamber.
5. one according to claim 1 is automobile-used from Bonding pressure sensor, it is characterized in that described housing (8) is also provided with web member, and web member is DIN72585 interface.
6. one according to claim 1 is automobile-used from Bonding pressure sensor, it is characterized in that described left pcb board (2) or right pcb board (5) are also provided with electrical cable and are connected with the interface on housing (7).
7. one according to claim 1 is automobile-used from Bonding pressure sensor, it is characterized in that described left silicon pressure sensor module (4) or right silicon pressure sensor module (8) are made up of pressure sensor chip and signal condition chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420762878.4U CN204314009U (en) | 2014-12-08 | 2014-12-08 | Automobile-used from Bonding pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420762878.4U CN204314009U (en) | 2014-12-08 | 2014-12-08 | Automobile-used from Bonding pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204314009U true CN204314009U (en) | 2015-05-06 |
Family
ID=53136316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420762878.4U Expired - Fee Related CN204314009U (en) | 2014-12-08 | 2014-12-08 | Automobile-used from Bonding pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204314009U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607250A (en) * | 2016-07-11 | 2018-01-19 | 美特科技(苏州)有限公司 | A kind of air pressure measuring equipment and air pressure method for measurement |
-
2014
- 2014-12-08 CN CN201420762878.4U patent/CN204314009U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607250A (en) * | 2016-07-11 | 2018-01-19 | 美特科技(苏州)有限公司 | A kind of air pressure measuring equipment and air pressure method for measurement |
| CN107607250B (en) * | 2016-07-11 | 2020-04-10 | 美特科技(苏州)有限公司 | Air pressure measuring device and air pressure measuring method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |