CN204289509U - Quantum dot LED encapsulation structure - Google Patents
Quantum dot LED encapsulation structure Download PDFInfo
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- CN204289509U CN204289509U CN201420708084.XU CN201420708084U CN204289509U CN 204289509 U CN204289509 U CN 204289509U CN 201420708084 U CN201420708084 U CN 201420708084U CN 204289509 U CN204289509 U CN 204289509U
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Abstract
The utility model relates to LED technical field, a kind of quantum dot LED encapsulation structure is provided, comprise support, LED chip, LED fluid sealant and quantum dot encapsulation unit, quantum dot encapsulation unit comprises upper substrate, infrabasal plate, quantum dot between upper substrate and infrabasal plate and infrabasal plate and infrabasal plate is adhered to quantum dot packaging plastic integrally by quantum dot encapsulation, be provided with storage tank inside upper substrate and/or inside infrabasal plate, quantum dot is placed in storage tank.In the utility model, storage tank is set inside upper substrate and/or infrabasal plate to place quantum dot, quantum dot does not take the space between upper substrate and infrabasal plate, using quantum dot packaging plastic to carry out to encapsulate, bonding time, it is very thin that quantum dot packaging plastic can be coated with, and enhances the laminating effect of itself and upper substrate, infrabasal plate, improves the ability that quantum dot LED encapsulation structure intercepts water, oxygen, avoid causing erosion to quantum dot LED, extend the life-span of quantum dot LED.
Description
Technical field
The utility model relates to LED technical field, more particularly, relates to quantum dot LED encapsulation structure.
Background technology
Quantum dot (Quantum Dot), is the nanometer semiconductor structure that conduction band electron, valence band hole and exciton are held onto on three direction in spaces, can be described as again nanocrystalline, is a kind of nano particle be made up of II-VI group or iii-v element.The particle diameter of quantum dot is generally between 1 ~ 10nm, and because electronics and hole are by quantum confinement, continuous print band structure becomes the discrete energy levels structure with molecular characterization, can emitting fluorescence after being excited.
Quantum dot because of crystallite dimension enough little, valence band and conductive strips can rank be discrete state, therefore photoelectric characteristic is unique.The maximum characteristic of quantum dot be can gap, rank with sending out of grain size, crystal grain is larger, and energy gap is less; Crystal grain is less, and energy gap is larger.That is, quantum dot is less, and the wavelength of stimulated luminescence is shorter, and quantum dot is larger, and stimulated luminescence wavelength is longer.
Therefore, quantum dot can produce highly purified different colours light, is applied to display field, has high colour gamut, and colour gamut can reach 100%; Color adjustment is flexible, and the size by changing quanta point material can realize the features such as different colours luminescence.
As shown in Figure 1, described quantum dot LED10 ' is made up of support 11 ', LED chip 12 ', LED fluid sealant 13 ' and quantum dot encapsulation unit 14 ' quantum dot LED structure of the prior art.Described quantum dot encapsulation unit 14 ' comprises top glass substrate 141 ', lower glass substrate 142 ', is positioned at quantum dot 144 ' therebetween and packaging plastic 143 '.But there is certain thickness due to quantum dot 144 ', packaging plastic 143 ' also has certain thickness, causes the laminating effect of itself and glass substrate bad, thus causes the sealing effectiveness of packaging plastic 143 ' bad, external moisture can not be intercepted completely, reduce the useful life of LED.
Utility model content
The purpose of this utility model is to provide quantum dot LED encapsulation structure, is intended to solve the quantum dot LED encapsulation structure sealing effectiveness existed in prior art bad, can not intercepts external moisture completely, the problem that useful life is low.
For solving the problems of the technologies described above, the technical solution of the utility model is: provide a kind of quantum dot LED encapsulation structure, comprise support, LED chip, described LED chip is packaged in the LED fluid sealant on described support and is positioned at the quantum dot encapsulation unit of described cradle top, described quantum dot encapsulation unit comprises upper substrate, infrabasal plate, quantum dot between described upper substrate and described infrabasal plate and described quantum dot is encapsulated and described infrabasal plate and infrabasal plate are adhered to one quantum dot packaging plastic, storage tank is provided with inside described upper substrate and/or inside described infrabasal plate, described quantum dot is placed in described storage tank.
Particularly, a storage tank is provided with inside described upper substrate and/or inside described infrabasal plate.
Further, the cross section of described storage tank is rectangle.
Or, inside described upper substrate and/or be provided with the storage tank at multiple interval inside described infrabasal plate.
Further, described quantum dot packaging plastic is coated on the surrounding of described infrabasal plate or described upper substrate.
Or described quantum dot packaging plastic is coated on inside whole described upper substrate or inside whole described infrabasal plate, and covers described quantum dot.
Particularly, described LED fluid sealant is silica gel or epoxy resin.
Particularly, described quantum dot packaging plastic is epoxy resin.
In the utility model, owing to arranging storage tank to place quantum dot inside upper substrate and/or infrabasal plate, quantum dot does not take the space between upper substrate and infrabasal plate, like this, using quantum dot packaging plastic to carry out to encapsulate, bonding time, it is very thin that quantum dot packaging plastic can be coated with, enhance the laminating effect of itself and upper substrate, infrabasal plate, improve the ability that quantum dot LED encapsulation structure intercepts water, oxygen, avoid causing erosion to quantum dot LED, extend the life-span of quantum dot LED.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of quantum dot LED encapsulation structure in prior art;
Fig. 2 is the cutaway view of the quantum dot LED encapsulation structure embodiment one that the utility model provides;
Fig. 3 is the cutaway view of the quantum dot LED encapsulation structure embodiment two that the utility model provides;
10 '-quantum dot LED; 11 '-support; 12 '-LED chip;
13 '-LED fluid sealant; 14 '-quantum dot encapsulation unit; 141 '-top glass substrate;
142 '-lower glass substrate; 144 '-quantum dot; 143 '-packaging plastic;
10-quantum dot LED encapsulation structure; 11-support; 12-LED chip;
13-LED fluid sealant; 14-quantum dot encapsulation unit; 141-upper substrate;
142-infrabasal plate; 1421-storage tank; 143-quantum dot.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
It should be noted that, when element is called as " being fixed on " or " being arranged at " another element, it can directly on another element or may there is centering elements simultaneously.When an element is called as " being connected to " another element, it can be directly connected to another element or may there is centering elements simultaneously.
Also it should be noted that, the orientation term such as left and right, upper and lower in the present embodiment, is only relative concept or be reference with the normal operating condition of product each other, and should not be regarded as have restrictive.
As shown in Figure 2, the utility model embodiment provides a kind of quantum dot LED encapsulation structure 10, comprises support 11, LED chip 12, LED chip 12 is packaged in the LED fluid sealant 13 on support 11 and is positioned at the quantum dot encapsulation unit 14 at support 11 top.Quantum dot encapsulation unit 14 comprises upper substrate 141, infrabasal plate 142, quantum dot 143 between upper substrate 141 and infrabasal plate 142 and quantum dot packaging plastic (not shown).Wherein, be provided with storage tank 1421 inside infrabasal plate 142, quantum dot 143 is placed in storage tank 1421.Quantum dot 143 is packaged between upper substrate 141 and infrabasal plate 142 by quantum dot packaging plastic, and upper substrate 141 and infrabasal plate 142 are adhered to one.In the present embodiment, owing to arranging storage tank 1421 to place quantum dot 143 inside infrabasal plate 142, quantum dot 143 does not take the space between upper substrate 141 and infrabasal plate 142, like this, using quantum dot packaging plastic to carry out to encapsulate, bonding time, it is very thin that quantum dot packaging plastic can be coated with, enhance the laminating effect of itself and upper substrate 141, infrabasal plate 142, improve the ability that quantum dot LED encapsulation structure intercepts water, oxygen, avoid causing erosion to quantum dot LED, extend the life-span of quantum dot LED.
Particularly, in the present embodiment, inside infrabasal plate 142, be provided with the storage tank 1421 that a cross section is rectangle.Certainly, also can arrange the storage tank 1421 at multiple interval inside infrabasal plate 142, as shown in Figure 3, quantum dot 143 is arranged in each storage tank 1421 respectively.Adopt this structure, even if the quantum dot 143 being positioned at outside storage tank 1421 touches water or oxygen, the quantum dot 143 being positioned at inner side storage tank 1421 li also can effectively completely cut off by the interval between each storage tank 1421, sealing higher grade, can improve the useful life of quantum dot LED further.
Further, quantum dot packaging plastic can be coated on the surrounding of upper substrate 141 or the surrounding of infrabasal plate 142, like this, can meet encapsulation requirement.Certainly, also quantum dot packaging plastic can be coated on inside whole upper substrate 141 and/or inside whole infrabasal plate 142, and cover quantum dot 143, like this, sealing effectiveness is better.
In the present embodiment, LED fluid sealant 13 is silica gel or epoxy resin.Quantum dot packaging plastic is epoxy resin.
Particularly, in the present embodiment, quantum dot 143 comprises the quanta point material of variable grain size.Concretely, be made up of II-VI group or iii-v element, and formed quantum dot restriction effect.Such as II-VI group can be selected, but is not limited to core and the shell of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe composition; Iii-v can be selected, but is not limited to core and the shell of GaN, GaP, GaAs, ALN, AlP, AlAs, InN, InP, InAS, GaNP composition.
Certainly; the position of storage tank 1421 and shape are not limited to above-mentioned two kinds of structures; also can be arranged at inside upper substrate 141; or; inside upper substrate 141 or inside infrabasal plate 142, correspondence position can arrange storage tank 1421 simultaneously, as long as have the space holding quantum dot 143, and does not take the space between upper substrate 141 and infrabasal plate 142; ensureing that quantum dot 143 fits tightly state with upper substrate 141 or infrabasal plate 142, is all in protection range of the present utility model.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (8)
1. a quantum dot LED encapsulation structure, comprise support, LED chip, described LED chip is packaged in the LED fluid sealant on described support and is positioned at the quantum dot encapsulation unit of described cradle top, described quantum dot encapsulation unit comprises upper substrate, infrabasal plate, quantum dot between described upper substrate and described infrabasal plate and described quantum dot is encapsulated and described infrabasal plate and infrabasal plate are adhered to one quantum dot packaging plastic, it is characterized in that: inside described upper substrate and/or inside described infrabasal plate, be provided with storage tank, described quantum dot is placed in described storage tank.
2. quantum dot LED encapsulation structure as claimed in claim 1, is characterized in that: be provided with a storage tank inside described upper substrate and/or inside described infrabasal plate.
3. quantum dot LED encapsulation structure as claimed in claim 2, is characterized in that: the cross section of described storage tank is rectangle.
4. quantum dot LED encapsulation structure as claimed in claim 1, is characterized in that: inside described upper substrate and/or be provided with the storage tank at multiple interval inside described infrabasal plate.
5. the quantum dot LED encapsulation structure as described in claim 2 or 4, is characterized in that: described quantum dot packaging plastic is coated on the surrounding of described infrabasal plate or described upper substrate.
6. the quantum dot LED encapsulation structure as described in claim 2 or 4, is characterized in that: described quantum dot packaging plastic is coated on inside whole described upper substrate or inside whole described infrabasal plate, and covers described quantum dot.
7. quantum dot LED encapsulation structure as claimed in claim 1, is characterized in that: described LED fluid sealant is silica gel or epoxy resin.
8. quantum dot LED encapsulation structure as claimed in claim 1, is characterized in that: described quantum dot packaging plastic is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420708084.XU CN204289509U (en) | 2014-11-20 | 2014-11-20 | Quantum dot LED encapsulation structure |
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| CN201420708084.XU CN204289509U (en) | 2014-11-20 | 2014-11-20 | Quantum dot LED encapsulation structure |
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| CN204289509U true CN204289509U (en) | 2015-04-22 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226166A (en) * | 2015-10-23 | 2016-01-06 | 易美芯光（北京）科技有限公司 | A kind of quantum dot LED structure and method for packing |
| CN105304684A (en) * | 2015-11-18 | 2016-02-03 | 深圳市华星光电技术有限公司 | Color display device and manufacturing method thereof |
| CN106025044A (en) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | Wavelength conversion device, backlight unit, and display device |
| CN106383420A (en) * | 2016-08-31 | 2017-02-08 | 张家港康得新光电材料有限公司 | Quantum dot luminous device and backlight module |
| CN106784238A (en) * | 2016-11-30 | 2017-05-31 | 芜湖聚飞光电科技有限公司 | The preparation method of quantum dot lens-type direct LED backlight |
| CN107565003A (en) * | 2017-07-31 | 2018-01-09 | 深圳市华星光电技术有限公司 | Quantum dot LED encapsulation structure |
| WO2018095131A1 (en) * | 2016-11-22 | 2018-05-31 | 广州视源电子科技股份有限公司 | Quantum dot led |
| CN108258104A (en) * | 2017-12-11 | 2018-07-06 | 温州大学 | A kind of electrostatic preparation method of lead halide caesium fluorescent glass film for mixing manganese |
| CN109001936A (en) * | 2017-06-06 | 2018-12-14 | 群创光电股份有限公司 | Light source module and display equipment |
| WO2020215620A1 (en) * | 2019-04-23 | 2020-10-29 | 深圳市华星光电半导体显示技术有限公司 | Microled display panel |
| CN112164743A (en) * | 2020-09-27 | 2021-01-01 | 深圳Tcl新技术有限公司 | Backlight module and display device |
-
2014
- 2014-11-20 CN CN201420708084.XU patent/CN204289509U/en active Active
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105226166B (en) * | 2015-10-23 | 2017-11-03 | 易美芯光（北京）科技有限公司 | A kind of quantum dot LED structure and method for packing |
| CN105226166A (en) * | 2015-10-23 | 2016-01-06 | 易美芯光（北京）科技有限公司 | A kind of quantum dot LED structure and method for packing |
| CN105304684A (en) * | 2015-11-18 | 2016-02-03 | 深圳市华星光电技术有限公司 | Color display device and manufacturing method thereof |
| CN106025044A (en) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | Wavelength conversion device, backlight unit, and display device |
| CN106383420A (en) * | 2016-08-31 | 2017-02-08 | 张家港康得新光电材料有限公司 | Quantum dot luminous device and backlight module |
| WO2018040780A1 (en) * | 2016-08-31 | 2018-03-08 | 张家港康得新光电材料有限公司 | Quantum dot light-emitting device and backlight module |
| WO2018095131A1 (en) * | 2016-11-22 | 2018-05-31 | 广州视源电子科技股份有限公司 | Quantum dot led |
| CN106784238A (en) * | 2016-11-30 | 2017-05-31 | 芜湖聚飞光电科技有限公司 | The preparation method of quantum dot lens-type direct LED backlight |
| CN109001936A (en) * | 2017-06-06 | 2018-12-14 | 群创光电股份有限公司 | Light source module and display equipment |
| CN107565003A (en) * | 2017-07-31 | 2018-01-09 | 深圳市华星光电技术有限公司 | Quantum dot LED encapsulation structure |
| CN107565003B (en) * | 2017-07-31 | 2019-04-30 | 深圳市华星光电技术有限公司 | Quantum dot LED encapsulation structure |
| CN108258104A (en) * | 2017-12-11 | 2018-07-06 | 温州大学 | A kind of electrostatic preparation method of lead halide caesium fluorescent glass film for mixing manganese |
| WO2020215620A1 (en) * | 2019-04-23 | 2020-10-29 | 深圳市华星光电半导体显示技术有限公司 | Microled display panel |
| CN112164743A (en) * | 2020-09-27 | 2021-01-01 | 深圳Tcl新技术有限公司 | Backlight module and display device |
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