CN204269982U - LCD module and radiator structure thereof - Google Patents
LCD module and radiator structure thereof Download PDFInfo
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- CN204269982U CN204269982U CN201420689417.9U CN201420689417U CN204269982U CN 204269982 U CN204269982 U CN 204269982U CN 201420689417 U CN201420689417 U CN 201420689417U CN 204269982 U CN204269982 U CN 204269982U
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- frame
- heat radiator
- integrated circuit
- lcd module
- radiator
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- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000009434 installation Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 208000012287 Prolapse Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
A kind of radiator structure of LCD module comprises backlight assembly, panel assembly and heat radiator.Backlight assembly comprises the housing with the first frame, and panel assembly comprises panel, flex package substrate, integrated circuit and printed circuit board (PCB), and heat radiator to be removable installed on the first frame and to be attached on integrated circuit.During installation, integrated circuit is mounted on flex package substrate, and one end of flex package substrate is connected with panel, and the other end is connected with printed circuit board (PCB); Because flex package substrate softness is flexible, by flex package substrate along the first frame around folding, integrated circuit is made to expose to the first frame, heat radiator is removably assembled on the first frame, heat radiator is attached on integrated circuit, heat radiator moves along with the movement of backlight assembly together with panel assembly simultaneously, heat radiator all the time can with integrated circuit good contact, even if heat radiator can in time by integrated circuit produce heat be transmitted in surrounding air.A kind of LCD module of this radiator structure of application is also provided.
Description
Technical field
The utility model relates to radiator structure technical field, particularly relates to a kind of LCD module and radiator structure thereof.
Background technology
LCD (Liquid Crystal Display, liquid crystal display) is widely used in the fields such as electronic product, household electrical appliances, automobile, such as, be applied in refrigerator, water heater, learning machine, electronic dictionary, panel computer, the hand-held game machines such as PSP; The liquid crystal display of desktop computer, LCD TV, the messagewindow on fitness equipment; Taxi armchair display below.
Traditional LCD heat radiation normally adopts metal fin to fix on former frame to dispel the heat, but because the metal fin that front frame is arranged can not with IC (the integrated circuit on flex package substrate (COF), integrated circuit) stable contact, causing heat radiation, result is undesirable even lost efficacy, cause heat accumulation not scatter in time, damage the parts of IC and IC periphery.
Utility model content
Based on this, be necessary for the problems referred to above, a kind of LCD module that integrated circuit and heat radiator can be made to stablize contact and radiator structure thereof are provided.
A radiator structure for LCD module, comprising:
Backlight assembly, comprises housing, and described housing has the first frame;
Panel assembly, comprise panel, flex package substrate, integrated circuit and printed circuit board (PCB), described integrated circuit is mounted on described flex package substrate, and one end of described flex package substrate is connected with described panel, and the other end of described flex package substrate is connected with described printed circuit board (PCB); Described housing is for carrying described panel, and described flex package substrate around folding, makes described integrated circuit expose to described first frame along described first frame; And
Heat radiator, be removable installed on described first frame, described heat radiator is attached on described integrated circuit.
Wherein in an embodiment, the surface of described first frame is outstanding is formed with grab, and the end of described heat radiator is arranged on described grab.
Wherein in an embodiment, described heat radiator is provided with hook, hang on described first frame by described hook.
Wherein in an embodiment, described heat radiator offers through hole, the surface of described first frame is given prominence to and is formed with the bur corresponding with described through hole; Or
The surface of described first frame is outstanding is formed with through hole, and the surface of described heat radiator is given prominence to and is formed with the bur corresponding with described through hole.
Wherein in an embodiment, also comprise the first securing member, described heat radiator offers the first fixed orifice, described first frame offers the second fixed orifice, is arranged in successively in described first fixed orifice and described second fixed orifice so that described heat radiator is arranged on described first frame by described first securing member.
Wherein in an embodiment, described heat radiator is formed with projection towards the one side of described integrated circuit is outstanding.
Wherein in an embodiment, described housing also comprises the second frame, the 3rd frame and the 4th frame, and described first frame, the second frame, the 3rd frame and the 4th frame surround closed housing jointly, and described housing is integrated or split type.
Wherein in an embodiment, also comprise front frame, described front frame is arranged on described housing.
Wherein in an embodiment, also comprise the second securing member, frame corresponding with described second frame, the 3rd frame and the 4th frame on described front frame all offers the first pilot hole, described second frame, the 3rd frame and the 4th frame all offer second pilot hole corresponding with described first pilot hole, is arranged in successively in described first pilot hole and the second pilot hole so that described front frame is installed on described housing by described second securing member.
A kind of LCD module, comprising:
Radiator structure as described in above any one;
Described backlight assembly also comprises backboard and blooming piece, and described backboard and described blooming piece to be arranged on described housing and between described panel and described printed circuit board (PCB); And
Leaded light component, is arranged between described panel and described backlight assembly.
The radiator structure of above-mentioned LCD module at least comprises following advantage:
During installation, make integrated circuit be mounted on flex package substrate, one end of flex package substrate is connected with panel, and the other end is connected with printed circuit board (PCB); Because flex package substrate has soft flexible character, so by flex package substrate along the first frame around folding, integrated circuit is made to expose to the first frame, then heat radiator is removably assembled on the first frame, heat radiator is attached on integrated circuit, heat radiator moves along with the movement of backlight assembly together with panel assembly simultaneously, heat radiator all the time can with integrated circuit good contact, even if heat radiator can in time by integrated circuit produce heat be transmitted in surrounding air.
Above-mentioned LCD module because apply above-mentioned radiator structure, therefore also have heat radiator all the time can with integrated circuit good contact, even if the heat of integrated circuit generation can be transmitted to the advantage in surrounding air by heat radiator in time.
Accompanying drawing explanation
Fig. 1 is the structural representation of LCD module in an embodiment;
Fig. 2 is the decomposing schematic representation of LCD module in an embodiment;
Fig. 3 is the assembling schematic diagram at another visual angle of the module of LCD shown in Fig. 2;
Fig. 4 is the side sectional view after the module group assembling of LCD shown in Fig. 2;
Fig. 5 is the structural representation of panel assembly in Fig. 2;
Fig. 6 is that in Fig. 2, heat radiator is arranged at the assembling schematic diagram on the first frame of housing;
Fig. 7 is arranged at the decomposing schematic representation on the first frame of housing for heat radiator shown in Fig. 6;
Fig. 8 is the partial top view of the first frame of housing in Fig. 6;
Fig. 9 is the cut-open view along A-A line in Fig. 8;
Figure 10 is the cut-open view along B-B line in Fig. 8;
Figure 11 is that in another embodiment, heat radiator is arranged at the assembling schematic diagram on the first frame of housing;
Figure 12 is arranged at the decomposing schematic representation on the first frame of housing for heat radiator shown in Figure 11;
Figure 13 is arranged at the side sectional view on the first frame of housing for heat radiator shown in Figure 11;
Figure 14 is again that in an embodiment, heat radiator is arranged at the assembling schematic diagram on the first frame of housing;
Figure 15 is arranged at the side sectional view on the first frame of housing for heat radiator shown in Figure 14.
Embodiment
For enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the utility model.But the utility model can be much different from alternate manner described here to implement, those skilled in the art can when doing similar improvement without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public concrete enforcement.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present utility model understand usually.The object of the term used in instructions of the present utility model herein just in order to describe specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Referring to Fig. 1 to Fig. 4, is the structural representation of LCD module 100 in an embodiment.This LCD module 100 comprises backlight assembly 110, leaded light component 120, panel assembly 130, heat radiator 140 and front frame 150.
Backlight assembly 110 comprises housing 111, backboard 112 and blooming piece 113, and backboard 112 and blooming piece 113 are arranged on housing 111.The material of housing 111 can be plastic cement, and housing 111 can also be used for bearing panel assembly 130.Housing 111 comprises the first frame 1111, second frame 1112, the 3rd frame 1113 and the 4th frame 1114.First frame 1111, second frame 1112, the 3rd frame 1113 and the 4th frame 1114 surround closed housing 111 jointly, and housing 111 can be integrated or split type.During use, the first frame 1111 is positioned at bottom, and the second frame 1112 and the 4th frame 1114 lay respectively at the left and right sides, and the 3rd frame 1113 is positioned at top.
See also Fig. 5, panel assembly 130 comprises panel 131, flex package substrate 132 (Chip ONFPC, COF), integrated circuit 133 (Integrated Circuit, IC) and printed circuit board (PCB) 134 (PrintedCircuit Board, PCB).Panel 131 is liquid crystal panel, and panel 131 is roughly rectangle shape.Integrated circuit 133 is overlapped on flex package substrate 132, and during work, integrated circuit 133 can produce a large amount of heats.One end of flex package substrate 132 is connected with panel 131, and the other end of flex package substrate 132 is connected with printed circuit board (PCB) 134, and flex package substrate 132 has soft flexible character.In Figure 5, the corresponding multiple flex package substrate 132 of a side of panel 131 and multiple integrated circuit 133, the corresponding flex package substrate 132 of each integrated circuit 133.Printed circuit board (PCB) 134 refers to SOURCEPCB specific in present embodiment.
During assembling, flex package substrate 132 around folding, makes integrated circuit 133 expose to the first frame 1111 along the first frame 1111, attaches with heat radiator 140 to facilitate.Through the generally u-shaped shape of flex package substrate 132 after folding, now printed circuit board (PCB) 134 and panel 131 parallel interval are arranged, and backboard 112 and blooming piece 113 are arranged between panel 131 and printed circuit board (PCB) 134.The light that backboard 112 sends, through blooming piece 113, to eliminate the uneven effect of light that not homophase light source brings, also will utilize blooming piece 113 to cover up some optic defects, moire vestige of such as brightness disproportionation etc. simultaneously.Leaded light component 120 is arranged between panel 131 and backlight assembly 110.The light that backboard 112 sends penetrates via panel 131 through leaded light component 120, and the effect of leaded light component 120 is the scattering direction guiding light, is used for improving the brightness of panel 131, and guarantees the homogeneity of panel 131 brightness.
Heat radiator 140 is removable installed on the first frame 1111, and when heat radiator 140 is arranged on the first frame 1111, can be attached on integrated circuit 133, dispels the heat to the heat that integrated circuit 133 produces.Heat radiator 140 can be set according to the concrete heat condition of integrated circuit 133, such as, can a heat radiator 140 be set in the place that integrated circuit 133 heat production is more; Heat radiator 140 then can be omitted in the less place of integrated circuit 133 heat production.Or a heat radiator 140 can be set on each integrated circuit 133.The end of heat radiator can be flat face, also can for having the cascaded surface of lug.
See also Fig. 6 to Figure 10, heat radiator 140 is arranged on the first frame 1111 of housing 111 by hook structure.Heat radiator 140 can be the metal material of good heat dispersion performance.Particularly, the surface of the first frame 1111 is outstanding is formed with grab 1111a, and the end of heat radiator 140 is arranged on grab 1111a, and a slice heat radiator 140 can corresponding two grab 1111a.The structure of grab 1111a is L shape, is used for card to establish two grab 1111a openings of same heat radiator 140 relative, to snap in heat radiator 140.The grab 1111a of L shape is for having orthogonal sidewall 11a and diapire 11b structure, diapire 11b is for supporting heat radiator 140, sidewall 11a is used for preventing heat radiator 140 from moving left and right, up pull heat radiator 140 can disassemble from the first frame 1111, down pressing heat radiator 140 can be assembled to heat radiator 140 on the first frame 1111.Heat radiator 140 is formed with protruding 141 towards the one side of integrated circuit 133 is outstanding, better with what make heat radiator 140 contact with integrated circuit 133, to guarantee the transmission of heat.The quantity of protruding 141 can be different from the exposure level of integrated circuit 133 and arrange according to heat radiator 140.Such as, if heat radiator 140 and integrated circuit 133 need the area that contacts larger, the projection 141 of greater number can be set.
Front frame 150 is arranged on housing 111.Particularly, by the second securing member (not shown), front frame 150 can be installed on housing 111.Frame corresponding with the second frame 112, the 3rd frame 113 and the 4th frame 114 on front frame 150 all offers the first pilot hole (not shown), second frame 112, the 3rd frame 113 and the 4th frame 114 all offer the second pilot hole 1112a corresponding with the first pilot hole (not shown), is arranged in successively in the first pilot hole (not shown) and the second pilot hole 1112a so that front frame 150 is installed on housing 111 by the second securing member (not shown).After front frame 150 installs, heat radiator 140 is subject to the spacing of front frame 150 and cannot prolapse upwards.
Above-mentioned LCD module 100 is because apply above-mentioned radiator structure, and during installation, make integrated circuit 133 be mounted on flex package substrate 132, one end of flex package substrate 132 is connected with panel 131, and the other end is connected with printed circuit board (PCB) 134, because flex package substrate 132 has soft flexible character, so by flex package substrate 132 along the first frame 1111 around folding, flex package substrate 132 after folding is U-shaped, integrated circuit 133 is made to expose to the first frame 1111, then heat radiator 140 is removably assembled on the first frame 1111, heat radiator 140 is attached on integrated circuit 133, heat radiator 140 moves along with the movement of backlight assembly 110 together with panel assembly 130 simultaneously, heat radiator 140 all the time can with integrated circuit 133 good contact, the heat that integrated circuit 133 produces can be transmitted in surrounding air by heat radiator 140 in time in time.
Certainly, in other embodiments, refer to Figure 11 to Figure 13, heat radiator 240 can also be arranged on the first frame 1111 by the form of hook.Particularly, heat radiator 240 arranging hook 241, by linking up with 241, heat radiator 240 being hung on the first frame 1111.Such as, heat radiator 240 arranges two hooks 241 spaced apart, and during assembling, hung on by heat radiator 240 on first frame 1111 and can assemble, taking off heat radiator 240 can unload down from the first frame 1111.Particularly, can also offer through hole 242 on heat radiator 240, the surface of the first frame 1111 is given prominence to and is formed the bur 1111b corresponding with through hole 242.Hung on by heat radiator 340 after on first frame 1111, pressing heat radiator 240 makes bur 1111b be arranged in through hole 242, can prevent heat radiator 240 from coming off from the first frame 1111 easily.Certainly, in other embodiments, bur can also be set on a heat sink, and offer the first through hole on the surface of the first frame, so that heat radiator is firmly hung on the first frame.
Certainly, in other embodiment, refer to Figure 14 to Figure 15, heat radiator 340 can also be assemblied on the first frame 1111 by the mode that securing member is fixing.Particularly, heat radiator 340 is offered the first fixed orifice (figure does not mark), first frame 1111 is offered the second fixed orifice (figure does not mark), is arranged in successively in the first fixed orifice and the second fixed orifice so that heat radiator 340 is arranged on the first frame 1111 by the first securing member 350.When adopting this kind of mode that heat radiator 340 is set, on backboard 112, offer fixed orifice in the lump, the first securing member 350 is screwed in backboard 112, to ensure that heat radiator 340 does not come off easily further.
The above embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a radiator structure for LCD module, is characterized in that, comprising:
Backlight assembly, comprises housing, and described housing has the first frame;
Panel assembly, comprise panel, flex package substrate, integrated circuit and printed circuit board (PCB), described integrated circuit is mounted on described flex package substrate, and one end of described flex package substrate is connected with described panel, and the other end of described flex package substrate is connected with described printed circuit board (PCB); Described housing is for carrying described panel, and described flex package substrate around folding, makes described integrated circuit expose to described first frame along described first frame; And
Heat radiator, be removable installed on described first frame, described heat radiator is attached on described integrated circuit.
2. the radiator structure of LCD module according to claim 1, is characterized in that, the surface of described first frame is outstanding is formed with grab, and the end of described heat radiator is arranged on described grab.
3. the radiator structure of LCD module according to claim 1, is characterized in that, described heat radiator is provided with hook, hang on described first frame by described hook.
4. the radiator structure of LCD module according to claim 3, is characterized in that, described heat radiator offers through hole, and the surface of described first frame is given prominence to and is formed with the bur corresponding with described through hole; Or
The surface of described first frame is outstanding is formed with through hole, and the surface of described heat radiator is given prominence to and is formed with the bur corresponding with described through hole.
5. the radiator structure of LCD module according to claim 1, it is characterized in that, also comprise the first securing member, described heat radiator offers the first fixed orifice, described first frame offers the second fixed orifice, is arranged in successively in described first fixed orifice and described second fixed orifice so that described heat radiator is arranged on described first frame by described first securing member.
6. the radiator structure of LCD module as claimed in any of claims 1 to 5, is characterized in that, described heat radiator is formed with projection towards the one side of described integrated circuit is outstanding.
7. the radiator structure of LCD module according to claim 1, it is characterized in that, described housing also comprises the second frame, the 3rd frame and the 4th frame, described first frame, the second frame, the 3rd frame and the 4th frame surround closed housing jointly, and described housing is integrated or split type.
8. the radiator structure of LCD module according to claim 7, is characterized in that, also comprises front frame, and described front frame is arranged on described housing.
9. the radiator structure of LCD module according to claim 8, it is characterized in that, also comprise the second securing member, frame corresponding with described second frame, the 3rd frame and the 4th frame on described front frame all offers the first pilot hole, described second frame, the 3rd frame and the 4th frame all offer second pilot hole corresponding with described first pilot hole, is arranged in successively in described first pilot hole and the second pilot hole so that described front frame is installed on described housing by described second securing member.
10. a LCD module, is characterized in that, comprising:
Radiator structure as in one of claimed in any of claims 1 to 9;
Described backlight assembly also comprises backboard and blooming piece, and described backboard and described blooming piece to be arranged on described housing and between described panel and described printed circuit board (PCB); And
Leaded light component, is arranged between described panel and described backlight assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689417.9U CN204269982U (en) | 2014-11-14 | 2014-11-14 | LCD module and radiator structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689417.9U CN204269982U (en) | 2014-11-14 | 2014-11-14 | LCD module and radiator structure thereof |
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| Publication Number | Publication Date |
|---|---|
| CN204269982U true CN204269982U (en) | 2015-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420689417.9U Expired - Fee Related CN204269982U (en) | 2014-11-14 | 2014-11-14 | LCD module and radiator structure thereof |
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| Country | Link |
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| CN (1) | CN204269982U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017177848A1 (en) * | 2016-04-13 | 2017-10-19 | 京东方科技集团股份有限公司 | Display module and display device |
| WO2017198090A1 (en) * | 2016-05-17 | 2017-11-23 | 京东方科技集团股份有限公司 | Display device |
| CN108063906A (en) * | 2016-11-07 | 2018-05-22 | 鸿富锦精密工业（深圳）有限公司 | Ultra-thin television |
-
2014
- 2014-11-14 CN CN201420689417.9U patent/CN204269982U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017177848A1 (en) * | 2016-04-13 | 2017-10-19 | 京东方科技集团股份有限公司 | Display module and display device |
| US10444557B2 (en) | 2016-04-13 | 2019-10-15 | Boe Technology Group Co., Ltd. | Display module and display device |
| WO2017198090A1 (en) * | 2016-05-17 | 2017-11-23 | 京东方科技集团股份有限公司 | Display device |
| US10274772B2 (en) | 2016-05-17 | 2019-04-30 | Boe Technology Group Co., Ltd. | Display device |
| CN108063906A (en) * | 2016-11-07 | 2018-05-22 | 鸿富锦精密工业（深圳）有限公司 | Ultra-thin television |
| CN108063906B (en) * | 2016-11-07 | 2020-10-30 | 鸿富锦精密工业（深圳）有限公司 | Ultra-thin television |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Effective date of registration: 20190408 Address after: 518000 9th Floor, D4 Building, International E City, 1001 Zhongshan Garden Road, Xili Street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN TCL NEW TECHNOLOGY Co.,Ltd. Address before: 516006 No. 78 Huifeng 4th Road, Zhongkai High-tech Development Zone, Huizhou City, Guangdong Province Patentee before: TCL Photoelectric Technology (Huizhou) Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 |
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| CF01 | Termination of patent right due to non-payment of annual fee |