CN204248570U - A kind of lapping device - Google Patents
A kind of lapping device Download PDFInfo
- Publication number
- CN204248570U CN204248570U CN201420748030.6U CN201420748030U CN204248570U CN 204248570 U CN204248570 U CN 204248570U CN 201420748030 U CN201420748030 U CN 201420748030U CN 204248570 U CN204248570 U CN 204248570U
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- China
- Prior art keywords
- lapping device
- projection
- grinding head
- grinding
- ccd sensor
- Prior art date
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- Expired - Fee Related
Links
- 238000000227 grinding Methods 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 abstract description 8
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 238000003801 milling Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model provides a kind of lapping device, for the projection on grinding base plate surface, solve in prior art and need to repeat grinding to projection, cause the problem that milling time is long, comprise: body, ccd sensor and grinding head, wherein: ccd sensor is connected to described body, for measuring the height of the projection of the substrate surface below grinding head; Grinding head is connected to body, and the measurement result according to ccd sensor is ground projection.The utility model uses ccd sensor to replace proximity sensor, can the height of Real-Time Monitoring substrate surface projection, controls the degree of grinding accurately, avoids repeating to survey high step, save the activity duration.
Description
Technical field
The utility model relates to substrate and repairs field, refers to the lapping device for removing substrate surface projection especially.
Background technology
At present, TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-LCD) is with the main flow that it has high image quality, the high and low consumed power of space availability ratio, the many merits such as radiationless become market.Colored filter is as the critical piece in TFT-LCD, and its quality directly affects final display effect.In the production process of colored filter, the surface of substrate easily produces projection, the projection that the surface of substrate produces plays the effect of optical defect.Therefore, for improving the image quality of display, the projection of substrate surface must be removed.Therefore, in production line, repair substrate surface defects by lapping device, it is very necessary that the repairing efficiency improving substrate becomes.
As shown in Figure 1, in prior art, lapping device comprises grinding head 1, lapping tape 2, first sensor 3 and the second sensor 4, during actual repairing, first measure protruding height by first sensor 3, operator records height of projection according to first sensor 3 and sets amount of grinding, grinding head 1 declines and starts grinding, the chip that simultaneous grinding produces is glued by lapping tape 2, after having ground, is measured repair rear protruding height by the second sensor 4.Then return repetition above-mentioned steps carry out regrind as do not reached specification, until grinding reaches specification.
But after grinding completes, if substrate does not reach specification, may repeat grinding to same projection, its time is longer, and the whole chips produced when lapping tape 2 can not glue grinding, causes the problem of repairing metacoxal plate surface irregularity.
Utility model content
For the deficiencies in the prior art, the utility model proposes a kind of lapping device, duplicate measurements substrate surface height of projection can be avoided, save the activity duration.
The technical solution of the utility model is achieved in that
A kind of lapping device, for grinding base plate surface, comprises body, ccd sensor and grinding head, wherein:
Ccd sensor is connected to body, for measuring the height of the projection of the substrate surface below grinding head;
Grinding head is connected to body, and the measurement result according to ccd sensor is ground projection.
Preferably, also comprise aspiration channel, the lower port of described aspiration channel is for sucking the chip of grinding generation.
Preferably, the bottom of described aspiration channel tilts near the direction of grinding head.
Preferably, described aspiration channel is multiple, and the lower port of multiple aspiration channel is arranged in around grinding head.
Preferably, described aspiration channel is the loop pipe around described grinding head.
Preferably, also comprise induced-draught fan, described induced-draught fan is connected with the upper end of aspiration channel.
Preferably, also comprise the light source be connected with body, for being radiated at the projection of the substrate surface below grinding head.
Preferably, described light source is white light source.
Preferably, the luminescent device of described light source is light emitting diode.
Preferably, described light source and described ccd sensor are oppositely arranged in described body both sides.
The utility model is by regulating the position of ccd sensor, the top-to-bottom of ccd sensor to substrate is focused on, judge height of projection by ccd sensor at the medium-altitude variable quantity of focusing scanning process and determine amount of grinding, thus control grinding head declines and starts grinding, in the process of grinding, ccd sensor can real-time monitor the height of substrate surface projection, controls the degree of grinding accurately, avoid repeating to survey high step, save the activity duration.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of lapping device in prior art;
Fig. 2 is the structural representation of the lapping device of the utility model embodiment;
In figure:
1, grinding head; 2, lapping tape; 3, first sensor; 4, the second sensor; 5, workbench; 6, substrate; 7, protruding; 8, ccd sensor; 9, light source; 10, aspiration channel; 11, lower port; 12, body.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment; technical scheme in the utility model embodiment is removed, intactly described; obviously; described embodiment is only the utility model part embodiment; instead of whole embodiments; based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Unless otherwise defined, technical term used herein or scientific terminology should be in field belonging to the utility model the ordinary meaning that the personage with general technical ability understands." first ", " second " that use in the utility model patent application specification and claims and similar word do not represent any order, quantity or importance, and are only used to distinguish different parts.Equally, the similar word such as " ", " " or " being somebody's turn to do " does not represent that quantity limits yet, but represents to there is at least one." to comprise " or the similar word such as " comprising " means to occur that element before this word or object contain the element or object that appear at this word presented hereinafter and equivalent, and do not get rid of other elements or object." on ", D score, etc. only for representing relative position relation, when be described object absolute position change after, then this relative position relation also may correspondingly change." connection " is not limited to concrete type of attachment, can be direct connection, also can be indirect connection, can be non-removable connection, also can be dismountable connection, and can be electric or signal connection, also can be machinery or physical connection.
As shown in Figure 2, the lapping device of the present embodiment comprises: body 12, CCD (Charge-coupled Device, charge coupled cell) sensor 8 and grinding head 1, ccd sensor 8 is connected to body 12, for measuring the height of the projection 7 on substrate 6 surface below grinding head 1, the position of ccd sensor 8 can be finely tuned up and down; Grinding head 1 is connected to body 12, in the present embodiment, grinding head 1 has the lapped face of the projection 7 for grinding base plate 6 surface, in process of lapping, grinding head 1 can apply pressure to protruding 7 in vertical direction, and the measurement result according to ccd sensor 8 is ground protruding 7.
Substrate 6 can be colored filter, certainly according to actual needs, also can be other similar devices needing flat surface.
The operation principle that ccd sensor measures height of projection is:
As shown in Figure 2, operation principle of the present utility model is:
In the process of grinding protruding 7, first substrate 6 is fixed on workbench 5, alternatively, can fix for physics clamp mechanism such as suction, or other appropriate method moves to avoid substrate 6.For simplicity's sake, the present embodiment these fixing means not shown.
The position of up-down adjustment ccd sensor 8, to make the top-to-bottom of ccd sensor 8 pairs of substrates 6 focus on, ccd sensor 8 simulates the 3-D view of protruding 7 and periphery according to the result of scanning, judge protruding 7 height by ccd sensor 8 at the medium-altitude variable quantity of focusing scanning process and determine amount of grinding, grinding head 1 declines according to the result measured and starts grinding, in the process of grinding, ccd sensor 8 can real-time monitor the height of substrate 6 rat 7, control the degree of grinding accurately, avoid repeating to survey high step, save the activity duration.
In a kind of way of example, the lapping device of the present embodiment also comprises aspiration channel 10, aspiration channel 10 is the tubular structure of hollow, the lower port 11 of aspiration channel 10 is for sucking the chip of grinding generation, the bottom of aspiration channel 10 tilts near the direction of grinding head 1, wherein, aspiration channel 10 can be multiple, the lower port 11 of multiple aspiration channel 10 is arranged in around grinding head 1, wherein, the equal and opposite in direction of lower port 11, symmetrical centered by grinding head 1, can ensure that the chip that lower port 11 sucks is even, when adsorbing, the chip on whole substrate 6 surface can be adsorbed completely.
In the present embodiment, the number of aspiration channel 10 is 2 but is not limited to 2, and is symmetricly set on the both sides of grinding head 1, and in the utility model, the quantity of aspiration channel 10 and position are not limited to quantity that the present embodiment provides and position.
In another embodiment, aspiration channel 10 can be the loop pipe around grinding head 1, is convenient to all be siphoned away by the chip of generation in time when grinding.
The present embodiment does not specifically limit the shape of aspiration channel 10, can according to need of production sets itself.
Preferably, lapping device also comprises unshowned induced-draught fan in Fig. 2, induced-draught fan is connected with the upper end of aspiration channel 10, for providing the attraction of attracting debris, the chip produced in process of lapping is all siphoned away by the attraction generated by induced-draught fan, and absorption affinity can regulate and control, thus make absorption even, convenient.
Further, lapping device also comprises the light source 9 be connected with body 10, light source 9 and ccd sensor 8 are oppositely arranged in body 12 both sides, for being radiated at the projection 7 on substrate 6 surface below grinding head 1, make ccd sensor 8 receive the light reflected back from protruding 7, be convenient to ccd sensor 8 and focus on protruding 7.
Preferably, in order to increase lighting effect, light source 9 can be white light source, but is not only limited to white light source, and the luminescent device of light source can be such as light emitting diode.
The utility model uses ccd sensor 8 to replace proximity sensor, can the height of Real-Time Monitoring substrate 6 Superficial Foreign Body, controls the degree of grinding accurately, avoids repeating to survey high step, save the activity duration.
Obviously, those skilled in the art double utility model can carry out various change and modification and does not depart from spirit and scope of the present utility model.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies, then the utility model is also intended to comprise these change and modification.
Claims (10)
1. a lapping device, for the projection on grinding base plate surface, is characterized in that, comprises body, ccd sensor and grinding head, wherein:
Described ccd sensor is connected to described body, for measuring the height of the projection of the described substrate surface below described grinding head;
Described grinding head is connected to described body, and the measurement result according to described ccd sensor is ground described projection.
2. lapping device as claimed in claim 1, is characterized in that, also comprise aspiration channel, and the lower port of described aspiration channel is for sucking the chip of grinding generation.
3. lapping device as claimed in claim 2, it is characterized in that, the bottom of described aspiration channel tilts near the direction of described grinding head.
4. lapping device as claimed in claim 2, it is characterized in that, described aspiration channel is multiple, and the lower port of described multiple aspiration channel is arranged in around described grinding head.
5. lapping device as claimed in claim 2, it is characterized in that, described aspiration channel is the loop pipe around described grinding head.
6. lapping device as claimed in claim 2, it is characterized in that, also comprise induced-draught fan, described induced-draught fan is connected with the upper end of described aspiration channel.
7. lapping device as claimed in claim 1, is characterized in that, also comprise the light source be connected with described body, for being radiated at the projection of the described substrate surface below described grinding head.
8. lapping device as claimed in claim 7, it is characterized in that, described light source is white light source.
9. lapping device as claimed in claim 8, it is characterized in that, the luminescent device of described light source is light emitting diode.
10. lapping device as claimed in claim 7, it is characterized in that, described light source and described ccd sensor are oppositely arranged in described body both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420748030.6U CN204248570U (en) | 2014-12-02 | 2014-12-02 | A kind of lapping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420748030.6U CN204248570U (en) | 2014-12-02 | 2014-12-02 | A kind of lapping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204248570U true CN204248570U (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420748030.6U Expired - Fee Related CN204248570U (en) | 2014-12-02 | 2014-12-02 | A kind of lapping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204248570U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104849211A (en) * | 2015-05-27 | 2015-08-19 | 深圳市常兴技术股份有限公司 | Detecting method for diamond thickening degree on electroplating abrasive tool surface |
| CN106680288A (en) * | 2017-01-03 | 2017-05-17 | 京东方科技集团股份有限公司 | Grinding equipment and grinding method |
| WO2019169653A1 (en) * | 2018-03-05 | 2019-09-12 | 惠科股份有限公司 | Repair apparatus control method and repair apparatus |
| CN112993091A (en) * | 2020-06-29 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Repair device and repair method |
-
2014
- 2014-12-02 CN CN201420748030.6U patent/CN204248570U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104849211A (en) * | 2015-05-27 | 2015-08-19 | 深圳市常兴技术股份有限公司 | Detecting method for diamond thickening degree on electroplating abrasive tool surface |
| CN104849211B (en) * | 2015-05-27 | 2017-11-17 | 深圳市常兴技术股份有限公司 | Electroplate the detection method that abrasive surface diamond thickeies degree |
| CN106680288A (en) * | 2017-01-03 | 2017-05-17 | 京东方科技集团股份有限公司 | Grinding equipment and grinding method |
| WO2019169653A1 (en) * | 2018-03-05 | 2019-09-12 | 惠科股份有限公司 | Repair apparatus control method and repair apparatus |
| CN112993091A (en) * | 2020-06-29 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Repair device and repair method |
| CN112993091B (en) * | 2020-06-29 | 2022-05-31 | 重庆康佳光电技术研究院有限公司 | Repair device and repair method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 |