CN204240107U - A kind of high-heat dissipation LED filament bulb lamp - Google Patents
A kind of high-heat dissipation LED filament bulb lamp Download PDFInfo
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- CN204240107U CN204240107U CN201420633627.6U CN201420633627U CN204240107U CN 204240107 U CN204240107 U CN 204240107U CN 201420633627 U CN201420633627 U CN 201420633627U CN 204240107 U CN204240107 U CN 204240107U
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Abstract
The utility model relates to a kind of lighting device, particularly relate to a kind of high-heat dissipation LED filament bulb lamp, comprise lampshade and be arranged on the LED silk in lampshade, a heat radiation rack is embedded with in described lampshade, described heat radiation rack comprises at least one piece of transparent heat sink large substrates, described LED silk is embedded on transparent heat sink large substrates, and the end of described transparent heat sink large substrates is provided with positive electrode and the negative electrode of cooperated with LED filament.The utility model adopts at least one piece of transparent heat sink large substrates composition heat radiation rack, considerably increases thermal capacitance and amasss, the heat that LED silk produces can be derived fast, make it to be made into high-power bulb lamp; This substrate also add area of dissipation; Make its good heat dissipation effect, long service life, this substrate is transparent can also ensure bulb lamp 360 ° of all-round illumination effects simultaneously; And the shape of heat radiation rack can arbitrarily combine, control number of substrates, thus the quantity of LED silk can be controlled.
Description
Technical field
The utility model relates to a kind of lighting device, particularly relates to a kind of high-heat dissipation LED filament bulb lamp.
Background technology
The encapsulation of LED silk is a kind of technological innovation, and the chip of common LED lamp bead to be single voltage be 3.0V is fixed in plastic stent cup, then carries out a rubber seal dress, i.e. PLCC encapsulation.And LED silk is fixed on aluminium base, glass substrate, transparent ceramic base or sapphire substrate by multiple chip-in series, then carry out covering glue or overmold completes.LED silk has the high-tension characteristic of small area analysis, significantly reduces the heating of LED and the cost of driver, has outstanding advantage.
LED silk has outstanding performance, and produce 360 degree of all-round luminescent ball bubbles easily, having the similar form of incandescent lamp and distribution curve flux, is the LED light source of new generation of replacement incandescent lamp truly.And the production technology of bulb lamp is simple, lower cost for material, along with the lifting of LED silk packaging technology, the decline of its cost, the cost of LED silk bulb lamp also will decline rapidly.Present various countries put into effect regulation or the plan of forbidding (prohibiting selling) incandescent lamp in succession, are prohibited selling once the white lamp of below 60W is vehement, and the market demand of LED silk bulb lamp will increase in explosive.
Because current LED silk can only produce low power LEDbulb lamp or candle lamp, such as 4W/6W, be difficult to get the incandescent lamp replacing all power thus comprehensively, this technical bottleneck subject matter can as can be seen from the assembling mode of LED silk lamp, LED silk does not have radiator substantially, the size of main body radiator only has long 38mm, the little substrate of wide 1.5mm, little substrate is connected on a thin Dumet wire, just there is no all the other radiators, go so the heat being difficult to LED to produce is derived, heat is caused all to carry out heat conduction and heat radiation by the convection current of radiation and internal gas.At usual room temperature 25 DEG C, the surface temperature of LED silk has reached 131.3 DEG C, far beyond the junction temperature scope of LED.The life-span of LED silk lamp is difficult to be protected.
Utility model content
The utility model is in order to solve defect and the deficiency of the existence of above-mentioned prior art, provide a kind of thermal capacitance long-pending large, the heat that LED silk produces can be derived fast, area of dissipation is large simultaneously, good heat dissipation effect, long service life, can also ensure the high-heat dissipation LED filament bulb lamp of 360 ° of all-round illumination effects.
The technical solution of the utility model: a kind of high-heat dissipation LED filament bulb lamp, comprise lampshade and be arranged on the LED silk in lampshade, a heat radiation rack is embedded with in described lampshade, described heat radiation rack comprises at least one piece of transparent heat sink large substrates, described LED silk is embedded on transparent heat sink large substrates, and the end of described transparent heat sink large substrates is provided with positive electrode and the negative electrode of cooperated with LED filament.
The utility model adopts at least one piece of transparent heat sink large substrates composition heat radiation rack, considerably increases thermal capacitance and amasss, the heat that LED silk produces can be derived fast, make it to be made into high-power bulb lamp; This substrate also add area of dissipation; Make its good heat dissipation effect, long service life, this substrate is transparent can also ensure bulb lamp 360 ° of all-round illumination effects simultaneously.
Preferably, described LED silk by 28 0.02W 1016 LED chip connect to be embedded and on the little substrate of glass of long 38mm, diameter 1.5mm, to carry out mould top fluorescent glue again encapsulate and form.
The utility model conveniently makes or convenient buying, the LED silk adopted is LED silk conventional on the market, be generally by the LED chip Series Package of 1016 of 28 0.02W at long 38mm, on the glass substrate of diameter 1.5mm, then carry out mould top fluorescent glue and realize.LED silk adopts 10mA electric current to drive, and voltage is 84V, and power is 0.84W, and luminous flux is 100lm, and light efficiency can reach 120lm/W, has outstanding photoelectric properties.The plesiomorphic LEDbulb lamp with incandescent lamp can be produced with LED silk, and realize 360 degree of all-round luminescences.
Preferably, described heat radiation rack is embedded by buckle clamping after on lampshade inwall, and in the quantity of described buckle and heat radiation rack, the quantity of transparent heat sink large substrates matches.
In the utility model, the structure of buckle is the shackle member structure of existing routine, and this kind of structure makes the connection of heat radiation rack and lampshade inwall more solid and reliable, improves the quality of bulb lamp.
Preferably, described heat radiation rack is one piece of transparent heat sink large substrates, and the quantity of described LED silk is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
This kind of structure makes it can control the quantity of LED silk, thus can produce large, medium and small multiple LED silk bulb lamp.
Preferably, described heat radiation rack is triangle column, it is joined end to end by three pieces of transparent heat sink large substrates and forms, and the LED silk quantity on every block transparent heat sink large substrates is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
This kind of structure makes it can control the quantity of LED silk, thus can produce large, medium and small multiple LED silk bulb lamp.
Preferably, described heat radiation rack cross section is in " Y " shape, its by three pieces of transparent heat sink large substrates wherein one end be connected form, angle between every adjacent two boards is 120 degree, LED silk quantity on every block transparent heat sink large substrates is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
This kind of structure makes it can control the quantity of LED silk, thus can produce large, medium and small multiple LED silk bulb lamp.
Preferably, described transparent heat sink large substrates is the one of glass heat radiation large substrates, crystalline ceramics heat radiation large substrates or sapphire heat radiation large substrates kind.
This kind of structure adds the Material selec-tion kind of transparent heat sink large substrates.
The utility model adopts transparent heat sink large substrates composition heat radiation rack, considerably increases thermal capacitance and amasss, and the heat that LED silk produces can be derived fast, makes it to be made into high-power bulb lamp; This substrate also add area of dissipation; Make its good heat dissipation effect, long service life, this substrate is transparent can also ensure bulb lamp 360 ° of all-round illumination effects simultaneously; And the shape of heat radiation rack can arbitrarily combine, control number of substrates, thus the quantity of LED silk can be controlled.
Accompanying drawing explanation
Transparent heat sink large substrates structural representation when Fig. 1 is the vertical spread configuration of LED silk in the utility model;
Fig. 2 is transparent heat sink large substrates structural representation when LED silk oblique arrangement is arranged in the utility model;
Fig. 3 is the structural representation of embodiment 1 in the utility model;
Fig. 4 is the structural representation of embodiment 2 in the utility model;
Fig. 5 is the structural representation of embodiment 3 in the utility model.
1. lampshades in figure, 2. transparent heat sink large substrates, 3.LED filament, 4. positive electrode, 5. negative electrode, 6. buckle.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but is not the restriction to the utility model protection domain.
Embodiment 1
As Figure 1-3, a kind of high-heat dissipation LED filament bulb lamp, the LED silk 3 comprising lampshade 1 and be arranged in lampshade, be embedded with a heat radiation rack in lampshade 1, heat radiation rack is embedded by buckle 6 clamping after on lampshade 1 inwall, and the quantity of buckle 6 is two.Heat radiation rack is one piece of transparent heat sink large substrates 2, and LED silk 3 is embedded on transparent heat sink large substrates 2, and the end of transparent heat sink large substrates 2 is provided with positive electrode 4 and the negative electrode 5 of cooperated with LED filament 3.LED silk 3 by 28 0.02W 1016 LED chip connect to be embedded and on the little substrate of glass of long 38mm, diameter 1.5mm, to carry out mould top fluorescent glue again encapsulate and form.The quantity of LED silk 3 is eight, eight LED silks 3 vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates 2.Transparent heat sink large substrates 2 is glass heat radiation large substrates.
Embodiment 2
As shown in Fig. 1,2 and 4, a kind of high-heat dissipation LED filament bulb lamp, the LED silk 3 comprising lampshade 1 and be arranged in lampshade 1, be embedded with a heat radiation rack in lampshade 1, heat radiation rack is triangle column, and it is joined end to end by three pieces of transparent heat sink large substrates 2 and forms.LED silk 3 is embedded on transparent heat sink large substrates 2, and the end of transparent heat sink large substrates 2 is provided with positive electrode 4 and the negative electrode 5 of cooperated with LED filament 3.LED silk 3 by 28 0.02W 1016 LED chip connect to be embedded and on the little substrate of glass of long 38mm, diameter 1.5mm, to carry out mould top fluorescent glue again encapsulate and form.Heat radiation rack is embedded by buckle 6 clamping after on lampshade 1 inwall, and the quantity of buckle 6 is 3.LED silk 3 quantity on every block transparent heat sink large substrates 2 is eight, eight LED silks 3 vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates 2.Transparent heat sink large substrates 2 is crystalline ceramics heat radiation large substrates.
Embodiment 3
As shown in Fig. 1,2 and 5, a kind of high-heat dissipation LED filament bulb lamp, the LED silk 3 comprising lampshade 1 and be arranged in lampshade 1, a heat radiation rack is embedded with in lampshade 1, heat radiation rack cross section is in " Y " shape, its by three pieces of transparent heat sink large substrates 2 wherein one end be connected form, the angle often between adjacent two pieces of transparent heat sink large substrates 2 is 120 degree.LED silk 3 is embedded on transparent heat sink large substrates 2, and the end of transparent heat sink large substrates 2 is provided with positive electrode 4 and the negative electrode 5 of cooperated with LED filament 3.LED silk 3 by 28 0.02W 1016 LED chip connect to be embedded and on the little substrate of glass of long 38mm, diameter 1.5mm, to carry out mould top fluorescent glue again encapsulate and form.Heat radiation rack is embedded by buckle 6 clamping after on lampshade 1 inwall, and the quantity of buckle 6 is 3.LED silk 3 quantity on every block transparent heat sink large substrates 2 is eight, eight LED silks 3 vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates 2.Transparent heat sink large substrates 2 is sapphire heat radiation large substrates.
The utility model adopts transparent heat sink large substrates composition heat radiation rack, considerably increases thermal capacitance and amasss, and the heat that LED silk produces can be derived fast, makes it to be made into high-power bulb lamp; This substrate also add area of dissipation; Make its good heat dissipation effect, long service life, this substrate is transparent can also ensure bulb lamp 360 ° of all-round illumination effects simultaneously; And the shape of heat radiation rack can arbitrarily combine, control number of substrates, thus the quantity of LED silk can be controlled.
Claims (7)
1. a high-heat dissipation LED filament bulb lamp, comprise lampshade and be arranged on the LED silk in lampshade, it is characterized in that: in described lampshade, be embedded with a heat radiation rack, described heat radiation rack comprises at least one piece of transparent heat sink large substrates, described LED silk is embedded on transparent heat sink large substrates, and the end of described transparent heat sink large substrates is provided with positive electrode and the negative electrode of cooperated with LED filament.
2. a kind of high-heat dissipation LED filament bulb lamp according to claim 1, is characterized in that: described LED silk by 28 0.02W 1016 LED chip connect to be embedded and on the little substrate of glass of long 38mm, diameter 1.5mm, to carry out mould top fluorescent glue again encapsulate and form.
3. a kind of high-heat dissipation LED filament bulb lamp according to claim 2, is characterized in that: described heat radiation rack is embedded by buckle clamping after on lampshade inwall, and in the quantity of described buckle and heat radiation rack, the quantity of transparent heat sink large substrates matches.
4. a kind of high-heat dissipation LED filament bulb lamp according to claim 3, it is characterized in that: described heat radiation rack is one piece of transparent heat sink large substrates, the quantity of described LED silk is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
5. a kind of high-heat dissipation LED filament bulb lamp according to claim 3, it is characterized in that: described heat radiation rack is triangle column, it is joined end to end by three pieces of transparent heat sink large substrates and forms, LED silk quantity on every block transparent heat sink large substrates is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
6. a kind of high-heat dissipation LED filament bulb lamp according to claim 3, it is characterized in that: described heat radiation rack cross section is in " Y " shape, its by three pieces of transparent heat sink large substrates wherein one end be connected form, angle between every adjacent two boards is 120 degree, LED silk quantity on every block transparent heat sink large substrates is eight, eight LED silks vertically or oblique arrangement be arranged on the positive and negative of transparent heat sink large substrates.
7. according to a kind of high-heat dissipation LED filament bulb lamp in claim 4-6 described in any one, it is characterized in that: described transparent heat sink large substrates is the one of glass heat radiation large substrates, crystalline ceramics heat radiation large substrates or sapphire heat radiation large substrates kind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420633627.6U CN204240107U (en) | 2014-10-30 | 2014-10-30 | A kind of high-heat dissipation LED filament bulb lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420633627.6U CN204240107U (en) | 2014-10-30 | 2014-10-30 | A kind of high-heat dissipation LED filament bulb lamp |
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| CN204240107U true CN204240107U (en) | 2015-04-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620170A (en) * | 2019-08-22 | 2019-12-27 | 深圳市艾迪恩科技有限公司 | Packaging substrate for LED lamp strip, packaging structure containing substrate and manufacturing process |
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2014
- 2014-10-30 CN CN201420633627.6U patent/CN204240107U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620170A (en) * | 2019-08-22 | 2019-12-27 | 深圳市艾迪恩科技有限公司 | Packaging substrate for LED lamp strip, packaging structure containing substrate and manufacturing process |
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Effective date of registration: 20160628 Address after: Hangzhou City, Zhejiang province 310000 Binjiang District West Road No. 266 Street Chutian Sheng Group Building 5 floor 1-3 Patentee after: Thinklux (Zhejiang) Lighting Technology Co., Ltd. Address before: Hangzhou City, Zhejiang province 310000 Binjiang District West Road No. 266 Street Chutian Sheng Group No. 5 Building 5 floor Patentee before: HANGZHOU JUNCTION IMP. & EXP. CO., LTD. |