CN204225423U - A kind of board structure - Google Patents

A kind of board structure Download PDF

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Publication number
CN204225423U
CN204225423U CN201420547499.3U CN201420547499U CN204225423U CN 204225423 U CN204225423 U CN 204225423U CN 201420547499 U CN201420547499 U CN 201420547499U CN 204225423 U CN204225423 U CN 204225423U
Authority
CN
China
Prior art keywords
panel
sandwich layer
substrate
edge band
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420547499.3U
Other languages
Chinese (zh)
Inventor
黄�俊
涂登云
蔡国雄
陶晟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangxi Hezhou Hengda Industry Limited by Share Ltd
Original Assignee
HEZHOU HENGDA PANEL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEZHOU HENGDA PANEL Co Ltd filed Critical HEZHOU HENGDA PANEL Co Ltd
Priority to CN201420547499.3U priority Critical patent/CN204225423U/en
Application granted granted Critical
Publication of CN204225423U publication Critical patent/CN204225423U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

Board structure of the present utility model, is fitted with symmetrical layers by above sandwich layer, below, and both sides and side edge band splice with plane structure and formed substrate, and the one side of its substrate is provided with panel; The two sides of preferable substrate is provided with panel; It has symmetrical layers, effectively can improve the stability of plate product, overcome surperficial ripple mark, its sandwich layer and edge band splice the mortise structure replacing prior art with plane structure, bonding strength is more reliable, and technique greatly simplifies, efficiency increases substantially, and cost of production is low.

Description

A kind of board structure
Technical field
Board structure of the present utility model, belongs to a kind of wood-based plate, particularly a kind of solid wooden compound floor.
Background technology
Wood-based plate, as the term suggests, utilize the leftover bits that timber produces in process exactly, add the sheet material that chemical adhesive is made into.Artificial board kind is a lot, and conventional has shaving board, medium-density plate, core-board (lumber core), veneer, plate, decorative panel, Baoli polywood laminate etc. can be ordered.Because they have features different separately, be applied to different furniture manufacturing field.Wood flooring refers to the floor made from timber, domestic product be mainly divided into wooden floor, laminated flooring, solid wooden compound floor, natural landscape floor, bamboo floor and cork flooring etc. woodenly.Artificial board compares with timber, have breadth large, smooth, be out of shape little, surfacing is bright and clean, without advantages such as anisotropy.
Summary of the invention
Board structure of the present utility model, comprise the combination of sandwich layer, edge band, panel, it is characterized in that: it is fitted with symmetrical layers by above sandwich layer, below, both sides and side edge band splice with plane structure and are formed substrate, and the one side of its substrate is provided with panel.The two sides of preferable substrate is provided with panel.
The present invention's beneficial effect is compared with prior art:
1, structure is simple and direct, and applicability is strong;
2, sandwich layer is provided with symmetrical layers, effectively can improve the stability of plate product, overcome surperficial ripple mark;
3, sandwich layer and edge band splice the mortise structure replacing prior art with plane structure, and technique greatly simplifies, and efficiency increases substantially, and cost of production is low.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described, but embodiments of the present invention are not limited thereto.
Fig. 1---plate product schematic front view.
Fig. 2---schematic diagram is looked on a plate product left side.
Fig. 3---dual platen decoration material product schematic front view.
In figure: side edge band (1), (2), sandwich layer (3), symmetrical layers (4), (5), panel (6), (7), side edge band thickness (h1), plate thickness (h2), core layer thickness (h3), plate width (K), side edge band width (K2), (K1).
H2 is in 5-15mm scope, and symmetrical layers (4), (5) thickness are in 2-5mm scope, and sandwich layer (3) thickness h 3 is in 10-15mm scope, and plate width (K) is in 80-500mm scope.
Detailed description of the invention
As Figure 1-3, board structure of the present utility model, its side edge band (1), (2), sandwich layer (3), symmetrical layers (4), (5), panel (6), (7); Can the material of Bian prior art originally complete.
As Figure 1-3, board structure of the present utility model, symmetrical layers (4), (5) are fitted with above its sandwich layer (3), below, both sides and side edge band (1), (2) are spliced with plane structure and are formed substrate, and the one side of its substrate is provided with panel (6).Substrate is provided with panel (7) and namely forms two-sided decorative panel.H2 is in 5-15mm scope, symmetrical layers (4), (5) thickness are in 2-5mm scope, sandwich layer (3) thickness h 3 is in 10-15mm scope, and plate width (K) is in 80-500mm scope, and plate length is in 300-3000mm scope.
As Figure 1-3, board structure of the present utility model, can the material of Bian prior art, manufacture method come.
Current wood flooring sandwich layer and edge band are mortise structure, processed complex, and cost is high.Board structure of the present utility model, for wood flooring product, replace mortise structure with plane structure splicing, technique greatly simplifies, and efficiency increases substantially, and cost of production is low; Sandwich layer is provided with symmetrical layers, effectively can improve the stability of plate product, overcome surperficial ripple mark; Board structure of the present utility model, has structure simple and direct, the advantages such as applicability is strong.

Claims (2)

1. a board structure, comprises the combination of sandwich layer, edge band, panel, it is characterized in that: it is fitted with symmetrical layers by above sandwich layer, below, and both sides and side edge band splice with plane structure and formed substrate, and the one side of its substrate is provided with panel.
2. board structure according to claim 1, is characterized in that: the two sides of described substrate is provided with panel.
CN201420547499.3U 2014-09-23 2014-09-23 A kind of board structure Expired - Fee Related CN204225423U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420547499.3U CN204225423U (en) 2014-09-23 2014-09-23 A kind of board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420547499.3U CN204225423U (en) 2014-09-23 2014-09-23 A kind of board structure

Publications (1)

Publication Number Publication Date
CN204225423U true CN204225423U (en) 2015-03-25

Family

ID=52923536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420547499.3U Expired - Fee Related CN204225423U (en) 2014-09-23 2014-09-23 A kind of board structure

Country Status (1)

Country Link
CN (1) CN204225423U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 542800, the Guangxi Zhuang Autonomous Region, Hezhou, Liantang Town, eight steps, Mei Village

Patentee after: Guangxi Hezhou Hengda Industry Limited by Share Ltd

Address before: 542800, the Guangxi Zhuang Autonomous Region, Hezhou, Liantang Town, eight steps, Mei Village

Patentee before: HEZHOU HENGDA PANEL CO., LTD.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150325

Termination date: 20170923