CN204222162U - Carrier band extrusion molding dies assembly - Google Patents
Carrier band extrusion molding dies assembly Download PDFInfo
- Publication number
- CN204222162U CN204222162U CN201420644506.1U CN201420644506U CN204222162U CN 204222162 U CN204222162 U CN 204222162U CN 201420644506 U CN201420644506 U CN 201420644506U CN 204222162 U CN204222162 U CN 204222162U
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- Prior art keywords
- carrier band
- extrusion molding
- molding dies
- mold
- heating film
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- Moulds For Moulding Plastics Or The Like (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of carrier band extrusion molding dies assembly, it comprising bed die that mold and this mold match, being arranged on the carrier band raw material between mold and bed die and the heating film assembly for heating carrier band raw material, because the size of carrier band carrys out management and control by die size, thus carrier band size is more stable, intensity is better simultaneously.
Description
Technical field
The utility model relates to a kind of die assembly, particularly relates to a kind of carrier band extrusion molding dies assembly.
Background technology
Current most carrier band utilizes blowing moulding fabrication techniques to form, blowing moulding is also called hollow molding or blow molding, utilize gas pressure to make the thermoplastic closed in mould be blown into the forming method of hollow product, for the manufacture of hollow product, it is a kind of conventional plastic working method.The advantages such as the mould of blowing moulding only has die, and it is lower that it has equipment manufacturing cost, and adaptability is stronger, but unstable once run into air pressure, there is after carrier band can be caused shaping bubble, thus cause insufficient strength, or the shortcoming such as dimensional discrepancy is larger.
Utility model content
The purpose of this utility model is for above-mentioned defect of the prior art, and provide a kind of carrier band extrusion molding dies assembly, the size of carrier band carrys out management and control by die size, thus carrier band size is more stable, and intensity is better simultaneously.
For realizing above-mentioned utility model object, the utility model have employed following technical scheme: a kind of carrier band extrusion molding dies assembly, and it comprising bed die that mold and this mold match, being arranged on the carrier band raw material between mold and bed die and the heating film assembly for heating carrier band raw material.
In addition, the utility model also provides following attached technical scheme:
Described mold is die.
Described bed die is punch.
Described carrier band raw material is selected from the wherein one in paper material, composite polyethylene material, makrolon material, polystyrene material and acronitrile-butadiene-styrene copolymer resins material.
Described heating film assembly comprises heating film and lower heating film, and described carrier band raw material is between upper heating film and lower heating film.
Described heating film assembly is aluminium film.
Compared to prior art, advantage of the present utility model is: disclose a kind of carrier band extrusion molding dies assembly, what it adopted is the mutual extrusion technique of mold and bed die, thus make carrier band raw material according to the shape of upper and lower mould, because the size of carrier band carrys out management and control by die size, thus carrier band size is more stable, intensity is better simultaneously.
Accompanying drawing explanation
Fig. 1 is the exploded view of carrier band extrusion molding dies assembly.
Fig. 2 is carrier band extrusion molding dies component operation schematic diagram.
Detailed description of the invention
Below in conjunction with preferred embodiment and accompanying drawing thereof, technical solutions of the utility model are further non-limitingly described in detail.
Shown in Fig. 1 is the critical piece of carrier band extrusion molding dies assembly, and this die assembly is mainly used in carrying out physical impact to raw material, thus feed change shape, is that raw material is formed and matches with mold shape.Found out by diagram, this die assembly comprising bed die 2 that mold 1 and this mold 1 match, being arranged on the carrier band raw material 3 between mold 1 and bed die 2 and the heating film assembly 4 for heating carrier band raw material 3.Wherein, mold 1 is die, in order to outer surface or the projection surface of shaping carrier band; Bed die 2 is punch, in order to inner surface or the recess surface of shaping carrier band; Carrier band raw material 3 is selected from the wherein one in paper material, composite polyethylene material, makrolon material, polystyrene material and acronitrile-butadiene-styrene copolymer resins material; Heating film assembly 4 is aluminium film, and it comprises heating film 41 and lower heating film 42, carrier band raw material 3 between this upper and lower heating film 41,42, make heating evenly.In the present embodiment, carrier band raw material 3 is composite polyethylene material.
The shape of mold 1 and bed die 2 can change according to the shape of required carrier band, in the present embodiment, the workbench 22 that bed die 2 comprises mold base 21 and is arranged on mold base 21, this workbench 22 is provided with 4 the first trapezoid boss 221 and 3 the first trapezoidal grooves 222; Mold 1 has a forming cavity 11, is provided with 3 the second trapezoid boss 111 and 4 the second trapezoidal grooves 112 in this forming cavity 11.First trapezoid boss 221 and the second trapezoidal groove 112 connect mutually, and the first trapezoidal groove 222 and the second trapezoid boss 111 connect mutually.
With reference to Fig. 2, during work, mold 1 maintains static, bed die 2 moves, and mutually connects according to the first trapezoid boss 221 and the second trapezoidal groove 112 principle mutually connected with the first trapezoidal groove 222 and the second trapezoid boss 111 and dock, simultaneously, heating film assembly 4 pairs of carrier band raw materials 3 heat, in order to softening carrier band raw material 3, make it more easily be extruded distortion, carrier band raw material 3 forms elementary carrier band after extruding.Extruded due to the shaping employing of carrier band, the size of carrier band carrys out management and control by die size, thus carrier band size is more stable, and intensity is better simultaneously.
It is to be noted; above-mentioned preferred embodiment is only and technical conceive of the present utility model and feature is described; its object is to person skilled in the art can be understood content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection domain of the present utility model.
Claims (6)
1. a carrier band extrusion molding dies assembly, is characterized in that it bed die comprising mold and this mold and match, being arranged on the carrier band raw material between mold and bed die and the heating film assembly for heating carrier band raw material.
2. carrier band extrusion molding dies assembly according to claim 1, is characterized in that: described mold is die.
3. carrier band extrusion molding dies assembly according to claim 1, is characterized in that: described bed die is punch.
4. carrier band extrusion molding dies assembly according to claim 1, is characterized in that: described carrier band raw material is selected from the wherein one in paper material, composite polyethylene material, makrolon material, polystyrene material and acronitrile-butadiene-styrene copolymer resins material.
5. carrier band extrusion molding dies assembly according to claim 1, is characterized in that: described heating film assembly comprises heating film and lower heating film, and described carrier band raw material is between upper heating film and lower heating film.
6. carrier band extrusion molding dies assembly according to claim 1, is characterized in that: described heating film assembly is aluminium film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420644506.1U CN204222162U (en) | 2014-10-31 | 2014-10-31 | Carrier band extrusion molding dies assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420644506.1U CN204222162U (en) | 2014-10-31 | 2014-10-31 | Carrier band extrusion molding dies assembly |
Publications (1)
Publication Number | Publication Date |
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CN204222162U true CN204222162U (en) | 2015-03-25 |
Family
ID=52920295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420644506.1U Active CN204222162U (en) | 2014-10-31 | 2014-10-31 | Carrier band extrusion molding dies assembly |
Country Status (1)
Country | Link |
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CN (1) | CN204222162U (en) |
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2014
- 2014-10-31 CN CN201420644506.1U patent/CN204222162U/en active Active
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