CN204216011U - Silicon chip cleaning device - Google Patents
Silicon chip cleaning device Download PDFInfo
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- CN204216011U CN204216011U CN201420618571.7U CN201420618571U CN204216011U CN 204216011 U CN204216011 U CN 204216011U CN 201420618571 U CN201420618571 U CN 201420618571U CN 204216011 U CN204216011 U CN 204216011U
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Abstract
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of silicon chip cleaning device.Silicon chip cleaning device comprises chuck mechanism, process cavity, lower chamber, rotary drive mechanism, nozzle and ventilating mechanisms, and described chuck mechanism is for supporting and fixing silicon chip to be cleaned; Described rotary drive mechanism can drive described chuck mechanism to rotate; Described nozzle sprays cleansing medium to silicon chip surface to be cleaned, treats cleaning silicon chip and cleans.The silicon chip cleaning device that the utility model provides is when cleaning silicon chip, the gas be blown in silicon chip cleaning device by blower fan filtering unit above process cavity, ventilating mechanisms by arranging in lower chamber is discharged, make that the gas in lower chamber is smooth, flow field is good, ensure the cleaning environment around silicon chip, the problem of the silicon chip back side pollution caused because lower chamber internal gas flow is disorderly, flow field is bad can be solved, effectively can promote the quality of Wafer Cleaning and the efficiency of Wafer Cleaning.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of silicon chip cleaning device.
Background technology
Wafer Cleaning is one of most important in semiconductor manufacturing, step the most frequently.Cleaning at present to silicon chip, based on monolithic wet-chemical cleaning, its method is: use chuck mechanism clamping silicon slice rotating, use different spray arms to spray different cleansing mediums at silicon chip surface simultaneously, clean silicon chip; Meanwhile, the process cavity of ring-type is used to collect cleansing medium; Finally, silicon chip is dried by nitrogen or other medium.But the air turbulence when cleaning silicon chip around silicon chip easily cause silicon chip pollution, affect the quality of silicon chip.
Therefore, for above deficiency, need to provide the silicon chip cleaning device that a kind of inside cavity steady air current, flow field are good.
Utility model content
(1) technical problem that will solve
The technical problems to be solved in the utility model is: the problem solving the silicon chip back side pollution caused because of air turbulence in the lower chamber of silicon chip cleaning device in prior art.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides a kind of silicon chip cleaning device, comprising: lower chamber; Chuck mechanism, is positioned at described lower chamber, and described chuck mechanism is for supporting and fixing silicon chip to be cleaned; Rotary drive mechanism, described rotary drive mechanism is annular stator, after its energising and the magnetic field changed between chuck pedestal mover, and drive chuck mechanism rotates; Nozzle, described nozzle sprays cleansing medium to silicon chip surface to be cleaned, cleans silicon chip to be cleaned; It is characterized in that: the inside of described lower chamber is provided with ventilating mechanisms, described ventilating mechanisms is positioned at the downside of described chuck mechanism, and described ventilating mechanisms comprises ventilative cavity and occlusion part, and described ventilative cavity is annular, and the chamber wall on the upside of it is provided with air-vent; Described occlusion part is positioned at the upside of described air-vent and covers described air-vent, and is provided with gap between described occlusion part and ventilative cavity; The chamber wall of described ventilative cavity is also provided with blast pipe, and the upper surface of described blast pipe is higher than the diapire of described ventilative cavity.
Wherein, the diapire diapire of described lower chamber offering the first leakage fluid dram, described ventilative cavity offers the second leakage fluid dram, the cleansing medium entered in lower chamber is discharged by described first leakage fluid dram and/or described second leakage fluid dram.
Wherein, described silicon chip cleaning device also comprises cleansing medium collecting mechanism, and described cleansing medium collecting mechanism is the process cavity of upper end open annular, and described process cavity is provided with multiple.
Particularly, described process cavity is provided with two, is respectively the first cavity and the second cavity, and described second cavity is positioned at the outside of described first cavity, and the outside of described second cavity also offers steam vent.
Preferably, the upper end of described first cavity inner wall is connected with the first guide layer; Outer wall and second guide layer of described first cavity slidably link together; The outer wall of described second cavity spills layer slidably link together with anti-; Described first guide layer, described second guide layer and the described anti-layer that spills are annular taper seat; The described anti-bottom spilling layer and described second guide layer links together, and described first guide layer and the bootable cleansing medium of the second guide layer flow into the first cavity and the second cavity respectively.
Further, described anti-spilling on layer is connected with governor motion, and described governor motion can move up and down.
Wherein, described chuck mechanism comprises: chuck top, chuck bottom, promotion column, claw and chuck base, described claw is used for fixing silicon chip, the upper end of described promotion column is connected with chuck top through chuck bottom, chuck base, and described promotion column can promote chuck top moves up.
Preferably, described silicon chip cleaning device also comprises elevating mechanism, to be arranged in described lower chamber and to be positioned at the downside of described chuck mechanism, described elevating mechanism comprises: elevation driving unit, sliding axle and plate-like mechanism, and the upper end of sliding axle is connected with plate-like mechanism, lower end is connected with elevation driving unit; Described elevation driving unit is positioned at outside described lower chamber, can drive sliding axle and the plate-like mechanism that is connected with sliding axle moves up and down; Described ventilative cavity and described occlusion part are arranged along the circumference of described sliding axle.
Further, described nozzle comprises front nozzle and back side nozzle, and described front nozzle is positioned at the upside of silicon chip to be cleaned, and described front nozzle sprays cleansing medium to front side of silicon wafer, and described back side nozzle sprays cleansing medium to silicon chip back side.
(3) beneficial effect
Technique scheme tool of the present utility model has the following advantages: the silicon chip cleaning device that the utility model provides comprises lower chamber, chuck mechanism, rotary drive mechanism, nozzle and ventilating mechanisms, and described chuck mechanism is for supporting and fixing silicon chip to be cleaned; Described rotary drive mechanism can drive described chuck mechanism to rotate; Described nozzle sprays cleansing medium to silicon chip surface to be cleaned, treats cleaning silicon chip and cleans; When cleaning silicon chip, the gas be blown in silicon chip cleaning device by blower fan filtering unit above process cavity, discharge by gap between the ventilating mechanisms that arranges in lower chamber and each layer of process cavity, make the flow field around silicon chip good, can solve because of inside cavity air turbulence, flow field is bad and the silicon chip back side that causes pollutes, cleans halfway problem, effectively can promote the quality of Wafer Cleaning and the efficiency of Wafer Cleaning.
Accompanying drawing explanation
The advantage of the above-mentioned and/or additional aspect of the utility model will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the sectional structure schematic diagram of the second cavity recovery and rinsing medium of the silicon chip cleaning device described in the utility model embodiment;
Sectional structure schematic diagram when Fig. 2 is the silicon chip cleaning device installation silicon chip described in the utility model embodiment;
Fig. 3 is the sectional structure schematic diagram of the first cavity recovery and rinsing medium of the silicon chip cleaning device described in the utility model embodiment.
Corresponding relation wherein in Fig. 1 to Fig. 3 between Reference numeral and component names is:
1, silicon chip cleaning device, 11, lower chamber, 111, first leakage fluid dram, 112, second leakage fluid dram, 121, chuck top, 122, chuck bottom, 123, promote column, 124, chuck base, 125, claw, 13, annular stator, 141, ventilative cavity, 142, occlusion part, 143, air-vent, 144, blast pipe, 15, process cavity, 151, first cavity, 152, second cavity, 153, first guide layer, 154, second guide layer, 155, prevent spilling layer, 156, governor motion, 161 sliding axles, 162, elevation driving unit, 163, disk-like structure 17, front nozzle, 18, back side nozzle, 19, supporting mechanism, 2, silicon chip.
Embodiment
Set forth a lot of detail in the following description so that fully understand the utility model; but; the utility model can also adopt other to be different from mode described here to implement, and therefore protection range of the present utility model is not by the restriction of following public specific embodiment.
It should be noted that, in description of the present utility model, term " first ", " second " object only for describing, and can not indicate or imply relative importance; Term " multiple " refers to two or more, except as otherwise outside clear stipulaties.Term " installation ", " being connected ", " connection " " to be fixed " etc. and all should be interpreted broadly, and such as, " connection " can be fixedly connected with, and also can be removably connect, or connects integratedly; Can be direct connection, also can be indirectly connected by intermediary.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
As shown in Figure 1 to Figure 3, the utility model provides a kind of silicon chip cleaning device 1 and comprises: comprising: lower chamber 11, chuck mechanism, process cavity 15, nozzle, cleansing medium collecting mechanism and ventilating mechanisms, wherein, chuck mechanism is positioned at described lower chamber 11, and described chuck mechanism is for supporting and fixing silicon chip 2 to be cleaned, described rotary drive mechanism 162 can drive described chuck mechanism to rotate, described nozzle sprays cleansing medium to silicon chip surface, cleans silicon chip 2 to be cleaned, described ventilating mechanisms is positioned at the inside of described lower chamber 11, described ventilating mechanisms is positioned at the downside of described chuck mechanism, described ventilating mechanisms comprises ventilative cavity 141 and occlusion part 142, and described ventilative cavity 141 is annular, and the chamber wall on the upside of it is provided with air-vent 143, described occlusion part 142 is positioned at the upside of described air-vent 143 and covers described air-vent 143, and is provided with gap between described occlusion part 142 and ventilative cavity 141, like this when cleaning silicon chip to be cleaned by the not shown gas be blown in silicon chip cleaning device 1 of the blower fan filtering unit above process cavity 15, the gas flow direction that what the ventilating mechanisms direction of arrow of discharging in Fig. 3 by arranging in lower chamber 11 represented is in silicon chip cleaning device, make the gas in lower chamber 11 smooth, flow field is good, can clean the back side of silicon chip 2 better, can solve because lower chamber 11 internal gas flow is disorderly, silicon chip 2 back side attachment foreign material that flow field is bad and cause, clean halfway problem, effectively can promote the cleaning quality of silicon chip 2, and, the cleansing medium that lower chamber 11 sprays for cleansing medium and the back side nozzle 18 accepting not get rid of into process cavity 15, the occlusion part 142 that ventilating mechanisms is arranged can stop cleansing medium to enter in ventilative cavity 141 by air-vent 143, and the upper surface of blast pipe 144 is higher than the bottom of ventilative cavity 141, air-flow in lower chamber so both can be kept unobstructed, the cleansing medium entered in ventilative cavity 141 can have been avoided again to enter in blast pipe 144 and cause machine to break down.
The diapire diapire of described lower chamber 11 offering the first leakage fluid dram 111, described ventilative cavity 141 offers the second leakage fluid dram 112, and the cleansing medium entering bottom chamber is discharged by described first leakage fluid dram 111 and/or described second leakage fluid dram 112; Particularly, the cleansing medium entered in lower chamber 11 is discharged by the first leakage fluid dram 111, and a small amount of cleansing medium entering ventilative cavity 141 inside is discharged by the second leakage fluid dram 112.
Further, described silicon chip cleaning device 1 also comprises cleansing medium collecting mechanism, described cleansing medium collecting mechanism is the process cavity 15 of upper end open annular, and described process cavity 15 is provided with multiple, owing to needing to use different cleansing mediums when cleaning silicon chip 2, different cleansing mediums can be reclaimed with different process cavities 15, the cleansing medium of such recovery can continue to use, when solving a use process cavity 15 recovery and rinsing medium, different cleansing mediums mixes unrenewable problem, can reduce the cost of cleaning silicon chip 2.
It should be noted that, the top of process cavity 15 is provided with blower fan filtering unit, and blower fan filtering unit can be blown into stable uniform air flow in silicon chip cleaning device 1, to ensure that in process cavity 15 on silicon chip cleaning device 1 and cavity of resorption, air-flow is unobstructed, flow field is good.
Particularly, described process cavity 15 is provided with two, be respectively the first cavity 151 and the second cavity 152, described second cavity 152 is positioned at the outside of described first cavity 151, the outside of described second cavity 152 also offers steam vent (not shown), the gas be blown in process cavity 15 by blower fan filtering unit discharges process cavity 15 by steam vent, thus makes the steady air current in process cavity 15, is convenient to the recovery of process cavity 15 pairs of cleansing mediums.
Wherein, the upper end of described first cavity 151 inwall is connected with the first guide layer 153; Outer wall and second guide layer 154 of described first cavity 151 slidably link together; The outer wall of described second cavity 152 spills layer 155 slidably link together with anti-; Described first guide layer 153, described second guide layer 154 and the described anti-layer 155 that spills are annular taper seat; The described anti-bottom spilling layer 155 and described second guide layer 154 links together, and described first guide layer 153 and the bootable cleansing medium of the second guide layer 154 flow into the first cavity 151 and the second cavity 152 respectively, prevent that spilling layer 155 can prevent cleansing medium from outwards splashing when entering in the second cavity 152.
Further, described anti-spilling on layer 155 is connected with governor motion 156, and described governor motion 156 can move up and down, drive and anti-ly spill layer 155 and the second guide layer 154 moves up and down; Due to, outer wall and second guide layer 154 of the first cavity 151 slidably link together, the outer wall of the second cavity 152 spills layer 155 slidably link together with anti-, governor motion 156 drives anti-layer 155 and the second guide layer 154 of spilling when moving up and down, the second guide layer 154 can be made and prevent that spilling layer 155 is adjusted to correct position, thus realizing using different process cavities to reclaim different cleansing medium objects.
Wherein, described chuck mechanism comprises: chuck top 121, chuck bottom 122, promotion column 123, claw 125 and chuck base 124, described claw 125 is for fixing silicon chip 2, the upper end of described promotion column 123 is connected with chuck top 121 through chuck bottom 122, chuck base 124, and described promotion column 123 can promote chuck top 121 moves up, chuck top 121 and chuck bottom 122 are separated.
It should be noted that, the silicon chip cleaning device 1 that the utility model provides also is provided with supporting mechanism 19, described supporting mechanism is for supporting described annular stator 13 and described process cavity 15.
Particularly, described silicon chip cleaning device 1 also comprises: elevating mechanism, described elevating mechanism comprises: elevation driving unit 162, sliding axle 161 and disk-like structure 163, and the upper end of sliding axle 161 is connected with disk-like structure 163, lower end is connected with elevation driving unit 162; Described elevation driving unit 162 can drive sliding axle 161 and the plate-like mechanism 163 that is connected with sliding axle 161 moves up and down; Described ventilative cavity 141 and described occlusion part 142 are arranged along described sliding axle 161 circumference.
In the present embodiment, elevation driving unit 162 can drive sliding axle 161 and the plate-like mechanism 163 that is connected with sliding axle 161 moves up and down, plate-like mechanism 163 moves up and promotes column 123 and contact to drive and promote column 123 and move up, make promotion column 123 promote chuck top 121 to move up, and then chuck top 121 and chuck bottom 122 are separated, after chuck top 121 rises to the certain position exceeding process cavity 15 top, elevation driving unit 162 stop motion, between the claw 125 now silicon chip 2 being positioned over chuck mechanism, the chuck mechanism of this kind of structure is more convenient when installing silicon chip 2.
Further, described nozzle comprises front nozzle (17) and back side nozzle (18), described front nozzle (17) is positioned at the upside of silicon chip (2) to be cleaned, cleansing medium is sprayed to front side of silicon wafer in described front nozzle (17), and cleansing medium is sprayed to silicon chip back side in described back side nozzle (18).
Below in conjunction with accompanying drawing, the installation process of silicon chip 2 on silicon chip cleaning device 1 is described.
As shown in Figure 2, when silicon chip 2 need be loaded, elevation driving unit 162 drives sliding axle 161 and disk-like structure 163 to move upward, dish assembling structure 163 with promote column 123 and contact rear drive and promote column 123 and move upward simultaneously, and then drive chuck top 121 to move upward, chuck top 121 and chuck bottom 122 are separated.After chuck top 121 rises to and exceeds process cavity 15 top certain position, stop motion, the multiple claws 125 be now distributed on chuck top 121 are in the position away from chuck hub, namely chuck is opened, silicon chip 2 can be positioned between claw 125, complete the installation of silicon chip on silicon chip cleaning device.
After placing silicon chip 2, elevation driving unit 162 drives sliding axle 161 and plate-like mechanism 163 to move downward, chuck mechanism moves down under gravity, chuck top 121 drops to and chuck bottom 122 contact position, now claw 125 is near chuck hub position, multiple claw 125 clamping sides silicon chip 2.Sliding axle 161 and disk-like structure 163 continue to move down, and separate a segment distance (as shown in figures 1 and 3) to disk-like structure 163 and promotion column 123.
In sum, the silicon chip cleaning device that the utility model provides, when cleaning silicon chip, the gas be blown in silicon chip cleaning device by blower fan filtering unit above process cavity, ventilating mechanisms by arranging in lower chamber is discharged, make that the gas in lower chamber is smooth, flow field is good, can clean the back side of silicon chip better, the silicon chip back side caused because lower chamber internal gas flow is disorderly, flow field is bad can be solved adhere to foreign material, clean halfway problem, can effectively promote Wafer Cleaning quality.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, do any amendment, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (9)
1. a silicon chip cleaning device, comprising:
Lower chamber (11);
Chuck mechanism, is positioned at described lower chamber (11), and described chuck mechanism is for supporting and fixing silicon chip (2) to be cleaned;
Rotary drive mechanism, described rotary drive mechanism is annular stator (13), after its energising and the magnetic field changed between chuck pedestal (mover), and drive chuck mechanism rotates;
Nozzle, described nozzle, to silicon chip (2) surface sprinkling cleansing medium to be cleaned, cleans silicon chip (2) to be cleaned; It is characterized in that: the inside of described lower chamber (11) is provided with ventilating mechanisms, described ventilating mechanisms is positioned at the downside of described chuck mechanism, described ventilating mechanisms comprises ventilative cavity (141) and occlusion part (142), described ventilative cavity (141) is annular, the chamber wall on the upside of it is provided with air-vent (143);
Described occlusion part (142) is positioned at the upside of described air-vent (143) and covers described air-vent (143), and is provided with gap between described occlusion part (142) and ventilative cavity (141);
The chamber wall of described ventilative cavity (141) is also provided with blast pipe (144), and the upper surface of described blast pipe (144) is higher than the diapire of described ventilative cavity (141).
2. silicon chip cleaning device according to claim 1, it is characterized in that: the diapire of described lower chamber (11) offers the first leakage fluid dram (111), the diapire of described ventilative cavity (141) offers the second leakage fluid dram (112), and the cleansing medium entered in lower chamber (11) is discharged by described first leakage fluid dram (111) and/or described second leakage fluid dram (112).
3. silicon chip cleaning device according to claim 1, it is characterized in that: also comprise cleansing medium collecting mechanism, described cleansing medium collecting mechanism is the process cavity (15) of upper end open annular, and described process cavity (15) is provided with multiple.
4. silicon chip cleaning device according to claim 3, it is characterized in that: described process cavity (15) is provided with two, be respectively the first cavity (151) and the second cavity (152), described second cavity (152) is positioned at the outside of described first cavity (151), and the outside of described second cavity (152) also offers steam vent.
5. silicon chip cleaning device according to claim 4, is characterized in that: the upper end of described first cavity (151) inwall is connected with the first guide layer (153); Outer wall and second guide layer (154) of described first cavity (151) slidably link together; The outer wall of described second cavity (152) spills layer (155) slidably link together with anti-; Described first guide layer (153), described second guide layer (154) and the described anti-layer (155) that spills are annular taper seat;
The described anti-bottom spilling layer (155) and described second guide layer (154) links together, and described first guide layer (153) and the second guide layer (154) bootable cleansing medium flow into the first cavity (151) and the second cavity (152) respectively.
6. silicon chip cleaning device according to claim 5, is characterized in that: described anti-spilling on layer (155) is connected with governor motion (156), and described governor motion (156) can move up and down.
7. silicon chip cleaning device according to claim 1, it is characterized in that: described chuck mechanism comprises: chuck top (121), chuck bottom (122), promote column (123), claw (125) and chuck base (124), described claw (125) is for fixing silicon chip (2) to be cleaned, the upper end of described promotion column (123) is through chuck bottom (122), chuck base (124) is connected with chuck top (121) afterwards, and described promotion column (123) can promote chuck top (121) moves up.
8. silicon chip cleaning device according to claim 1, it is characterized in that: also comprise elevating mechanism, to be arranged in described lower chamber (11) and to be positioned at the downside of described chuck mechanism, described elevating mechanism comprises: elevation driving unit (162), sliding axle (161) and plate-like mechanism (163), and the upper end of sliding axle (161) is connected with plate-like mechanism (163), lower end is connected with drive unit (162);
Described elevation driving unit (162) is positioned at described lower chamber (11) outward, can drive sliding axle (161) and the plate-like mechanism (163) that is connected with sliding axle (161) moves up and down;
Described ventilative cavity (141) and described occlusion part (142) are arranged along the circumference of described sliding axle (161).
9. silicon chip cleaning device according to claim 9, it is characterized in that: described nozzle comprises front nozzle (17) and back side nozzle (18), described front nozzle (17) is positioned at the upside of silicon chip (2) to be cleaned, cleansing medium is sprayed to front side of silicon wafer in described front nozzle (17), and cleansing medium is sprayed to silicon chip back side in described back side nozzle (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420618571.7U CN204216011U (en) | 2014-10-23 | 2014-10-23 | Silicon chip cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420618571.7U CN204216011U (en) | 2014-10-23 | 2014-10-23 | Silicon chip cleaning device |
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| CN204216011U true CN204216011U (en) | 2015-03-18 |
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| CN201420618571.7U Active CN204216011U (en) | 2014-10-23 | 2014-10-23 | Silicon chip cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106298595A (en) * | 2016-08-29 | 2017-01-04 | 安徽凯达能源科技有限公司 | The acid dip pickle of solar battery sheet |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| WO2018076151A1 (en) * | 2016-10-25 | 2018-05-03 | Acm Research (Shanghai) Inc. | Apparatus and method for wet process on semiconductor substrate |
| CN108091597A (en) * | 2018-01-10 | 2018-05-29 | 苏州聚晶科技有限公司 | A kind of two-sided cleaning machine of silicon chip |
| CN108091607A (en) * | 2018-01-10 | 2018-05-29 | 苏州聚晶科技有限公司 | A kind of self-cleaning silicon wafer turnover mechanism |
| CN114425742A (en) * | 2021-12-29 | 2022-05-03 | 华海清科股份有限公司 | Distributed cleaning device |
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2014
- 2014-10-23 CN CN201420618571.7U patent/CN204216011U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298595A (en) * | 2016-08-29 | 2017-01-04 | 安徽凯达能源科技有限公司 | The acid dip pickle of solar battery sheet |
| WO2018076151A1 (en) * | 2016-10-25 | 2018-05-03 | Acm Research (Shanghai) Inc. | Apparatus and method for wet process on semiconductor substrate |
| US11626297B2 (en) | 2016-10-25 | 2023-04-11 | Acm Research (Shanghai), Inc. | Apparatus and method for wet process on semiconductor substrate |
| CN106783683A (en) * | 2016-12-19 | 2017-05-31 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleans swinging arm device |
| CN106783683B (en) * | 2016-12-19 | 2019-08-09 | 安徽天裕汽车零部件制造有限公司 | A kind of wafer-scanning cleaning swinging arm device |
| CN108091597A (en) * | 2018-01-10 | 2018-05-29 | 苏州聚晶科技有限公司 | A kind of two-sided cleaning machine of silicon chip |
| CN108091607A (en) * | 2018-01-10 | 2018-05-29 | 苏州聚晶科技有限公司 | A kind of self-cleaning silicon wafer turnover mechanism |
| CN108091607B (en) * | 2018-01-10 | 2023-11-21 | 池州海琳服装有限公司 | Self-cleaning type silicon wafer overturning mechanism |
| CN108091597B (en) * | 2018-01-10 | 2023-11-24 | 池州海琳服装有限公司 | Double-sided cleaning machine for silicon wafers |
| CN114425742A (en) * | 2021-12-29 | 2022-05-03 | 华海清科股份有限公司 | Distributed cleaning device |
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