CN204167316U - A kind of LED light source of thin wall ceramic lens packages - Google Patents
A kind of LED light source of thin wall ceramic lens packages Download PDFInfo
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- CN204167316U CN204167316U CN201420072272.8U CN201420072272U CN204167316U CN 204167316 U CN204167316 U CN 204167316U CN 201420072272 U CN201420072272 U CN 201420072272U CN 204167316 U CN204167316 U CN 204167316U
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Abstract
The utility model provides a kind of LED light source of thin wall ceramic lens packages, comprises LED chip, electrode connection, LED heat radiation substrate, packing material and thin wall ceramic lens.Described thin wall ceramic lens are fixed on substrate, and are all covered by chip, and substrate and ceramic lenses form a hollow cavity, can load packing material during encapsulation.This thin wall ceramic lens thickness is 0.05mm-2mm, and profile can need for hollow hemispheric, hollow semielliptical shape, hollow out square box shaped according to LED light source encapsulation, hollow out rhombus, hollow out dihedral, hollow super-hemispherical or Fresnel Lenses shape etc.The utility model, by adopting the form encapsulated LED light source of thin wall ceramic lens, makes chip light consistent to the light path at each position of lens, effectively can eliminate edge aberration and " five colours " problems such as the yellow limit of LED light source, red limit, green limit; Chip light is completely enclosed within lens simultaneously, effectively can avoids blue evil; Selecting of packing material, the cracking that can effectively prevent pottery from causing because of thermal gradient and increase light efficiency.
Description
Technical field
The utility model relates to ceramic structure field and LED field of luminescent technology, particularly relates to a kind of LED light source of thin wall ceramic lens packages.
Background technology
In recent years, LED ceramic packaging technology is as a kind of new encapsulation technology, transparent ceramic fluorophor is adopted to substitute " fluorescent material+silica gel ", owing to having high thermal conductivity, high-quantum efficiency, anti-look declines, without aging, can substitute fluorescent material, sealing, lamp housing, the unrivaled advantage of the conventional packaging techniques such as low cost and obtaining develops rapidly simultaneously.The well-known mechanism such as Philip Luminleds company, Kyoto Univ Japan is all being engaged in the R&D work of this respect in the world.
But at present, when plain film ceramic phosphor encapsulates as cover plate, often there is serious yellow limit, green limit, red limit, the edge aberration problems such as Lan Bian, and because of " five colours " problem that light composition difference causes in light-emitting area, thus cause quality light source not good, affect the normal use of light source.
Summary of the invention
The utility model is intended to the foregoing problems solving prior art, and provides a kind of LED light source of thin wall ceramic lens packages.
For achieving the above object, the utility model provides a kind of LED light source of thin wall ceramic lens packages, comprises LED chip, electrode connection, LED heat radiation substrate, packing material and thin wall ceramic lens; Described thin wall ceramic lens are fixed on substrate, and are all covered by chip, and substrate and ceramic lenses form a hollow cavity, can load packing material during encapsulation; The thickness of this thin wall ceramic lens different parts is consistent, and thickness range is 0.05mm-2mm; Profile can need for hollow hemispheric, hollow semielliptical shape, hollow out square box shaped, hollow out rhombus, hollow out dihedral, hollow super-hemispherical or Fresnel Lenses shape according to LED light source encapsulation.
Described ceramic lenses, can be the pure transparent body, as aluminium oxide ceramics lens, and yttrium lens, luteium oxide ceramic lenses, scandium oxide ceramic lenses, yttrium-aluminium-garnet ceramic lenses, Luetcium aluminum garnet ceramic lenses etc.; Also can be the transparent phosphor containing the characteristics of luminescence, as rear-earth-doped yttrium lens, rear-earth-doped luteium oxide ceramic lenses, rear-earth-doped scandium oxide ceramic lenses, rear-earth-doped yttrium-aluminium-garnet ceramic lenses, rear-earth-doped Luetcium aluminum garnet ceramic lenses and transition element doped aluminium oxide ceramics lens.
Rare earth element can be the Ce singly mixed, or Ce and Eu, Er, Nd, Pr, Gd, Tb, Sm, Tm, Dy, Yb or Lu one wherein or severally to mix altogether arbitrarily; Rare earth doped total amount is 0.001 to 10wt.%.
The thin-walled lens type pottery obtained can be directly used in LED light source encapsulation, need not cut into slices, grind, the aft-loaded airfoil process such as polishing.
Described LED chip can be single high-power chip, and single small-power chip and many high or low power arrangements of chips combine.
Described chip can be visible ray that wavelength is 400-500nm scope or wavelength is 250-400nm ultraviolet leds.
During encapsulation, ceramic lenses can directly cover on the stent cover on substrate, or is embedded, or is jacket-type, and in LED chip is sealed in, but do not contact with LED chip.
Described packing material can according to actual package needs, filling gel, and oil or other materials, also can not fill.
The utility model, by adopting the form encapsulated LED light source of thin wall ceramic lens, makes chip light consistent to the light path at each position of lens, effectively can eliminate edge aberration and " five colours " problems such as the yellow limit of LED light source, red limit, green limit; Chip light is completely enclosed within lens simultaneously, effectively can avoids blue evil; Selecting of packing material, the cracking that can effectively prevent pottery from causing because of thermal gradient and increase light efficiency.
Accompanying drawing explanation
Fig. 1, Fig. 2 are two kinds of exemplary construction schematic diagrames of the LED light source of the thin wall ceramic lens packages of design.
In figure: thin wall ceramic lens (1); Packing material (2); Chip (3); Heat-radiating substrate (4).
Fig. 3 is the spectral power distribution figure of the white light LEDs of a thin wall ceramic lens packages in design example.
Embodiment
Above content has done sufficient explanation to the utility model, is described further by reference to the accompanying drawings more below to enforcement of the present utility model, but enforcement of the present utility model is not limited thereto.
Consult Fig. 1 to Fig. 2, be only the preferred embodiment of the LED light source of a kind of thin wall ceramic lens packages of the utility model.These thin wall ceramic lens are respectively hollow hemispheric and hollow out square box shaped.
By injection mo(u)lding, dry-pressing formed, gel casting forming, extrusion molding, the thin-walled lens type biscuit of ceramics that injection forming or casting molding processes obtain carries out high temperature sintering, and sintering temperature is at 1000-1900 DEG C, then anneal between 800-1700 DEG C, obtain thin-walled transparent ceramic.Pottery transmitance reaches theoretical transmission, without the need to aft-loaded airfoil process.
A kind of LED light source of thin wall ceramic lens packages in this example, is made up of the electrode connection of one or more LED chip (3), thin wall ceramic lens (1), optional packing material (2), heat-radiating substrate (4) bottom LED chip and periphery.In chip is closed in by thin wall ceramic lens, form a hollow cavity with substrate, interior optional extend oil, silica gel and other materials, also can not fill simultaneously.
Different according to required LED light source type, corresponding ceramic lenses can be adopted to encapsulate, be exemplified below:
1) blue-light LED chip engages can obtain white LED light source with the yellow ceramic lenses of the thick Ce:YAG of 0.05-1.0mm.
2) the yellow ceramic lenses of Ce:YAG that blue-light LED chip and thickness are greater than 1.2mm engages and can obtain yellow light LED light source.
3) blue-light LED chip engages can obtain blue light LED light source with colourless yittrium oxide thin-walled lens.
Fig. 3 is the spectral power distribution figure of the white light LEDs adopting the encapsulation of thin-walled Ce:YAG ceramic lenses, and its performance index are as follows:
Its performance index are as follows:
Light efficiency: 1171m/W
Quantum efficiency: 94.0%
Color rendering index: 83
Colour temperature: 4500K.
Claims (7)
1. a LED light source for thin wall ceramic lens packages, comprises LED chip, electrode connection, LED heat radiation substrate, packing material and thin wall ceramic lens; Described thin wall ceramic lens are fixed on substrate, and are all covered by chip, and substrate and ceramic lenses form a hollow cavity, can load packing material during encapsulation; The thickness of this thin wall ceramic lens different parts is consistent, and thickness range is 0.05mm-2mm; Profile can need for hollow hemispheric, hollow semielliptical shape, hollow out square box shaped, hollow out rhombus, hollow out dihedral, hollow super-hemispherical or Fresnel Lenses shape according to LED light source encapsulation.
2. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, it is characterized in that described ceramic lenses, can be the pure transparent body, as aluminium oxide ceramics lens, yttrium lens, luteium oxide ceramic lenses, scandium oxide ceramic lenses, yttrium-aluminium-garnet ceramic lenses, Luetcium aluminum garnet ceramic lenses etc.; Also can be the transparent phosphor containing the characteristics of luminescence, as rear-earth-doped yttrium lens, rear-earth-doped luteium oxide ceramic lenses, rear-earth-doped scandium oxide ceramic lenses, rear-earth-doped yttrium-aluminium-garnet ceramic lenses, rear-earth-doped Luetcium aluminum garnet ceramic lenses and transition element doped aluminium oxide ceramics lens.
3. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, is characterized in that obtained thin-walled lens type pottery can be directly used in LED light source encapsulation, need not cut into slices, grind, the aft-loaded airfoil process such as polishing.
4. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, is characterized in that described LED chip can be single high-power chip, and single small-power chip and many high or low power arrangements of chips combine.
5. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, is characterized in that described chip can be visible ray that wavelength is 400-500nm scope or wavelength is 250-400nm ultraviolet leds.
6. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, when it is characterized in that encapsulation, ceramic lenses can directly cover on the stent cover on substrate, or be embedded, or be jacket-type, and in LED chip is sealed in, but do not contact with LED chip.
7. the LED light source of a kind of thin wall ceramic lens packages according to claim 1, is characterized in that described packing material can according to actual package needs, filling gel, and oil or other materials, also can not fill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420072272.8U CN204167316U (en) | 2014-02-18 | 2014-02-18 | A kind of LED light source of thin wall ceramic lens packages |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420072272.8U CN204167316U (en) | 2014-02-18 | 2014-02-18 | A kind of LED light source of thin wall ceramic lens packages |
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| CN204167316U true CN204167316U (en) | 2015-02-18 |
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| CN201420072272.8U Expired - Fee Related CN204167316U (en) | 2014-02-18 | 2014-02-18 | A kind of LED light source of thin wall ceramic lens packages |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674225A (en) * | 2016-03-07 | 2016-06-15 | 江苏师范大学 | White LED (Light-Emitting Diode) light source of transparent ceramic fluorescent tube packaged with blue chips on inner wall thereof |
| CN105762143A (en) * | 2016-03-07 | 2016-07-13 | 江苏师范大学 | High-power white-light LED light source based on transparent ceramic fluorescent tube |
| CN106549093A (en) * | 2016-10-25 | 2017-03-29 | 江苏师范大学 | A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material |
| CN109888079A (en) * | 2019-01-22 | 2019-06-14 | 圆融光电科技股份有限公司 | A kind of deep-UV light-emitting diode encapsulation |
| CN113893361A (en) * | 2021-09-29 | 2022-01-07 | 宁波安芯美半导体有限公司 | UVC LED lamp and packaging method thereof |
-
2014
- 2014-02-18 CN CN201420072272.8U patent/CN204167316U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674225A (en) * | 2016-03-07 | 2016-06-15 | 江苏师范大学 | White LED (Light-Emitting Diode) light source of transparent ceramic fluorescent tube packaged with blue chips on inner wall thereof |
| CN105762143A (en) * | 2016-03-07 | 2016-07-13 | 江苏师范大学 | High-power white-light LED light source based on transparent ceramic fluorescent tube |
| CN105674225B (en) * | 2016-03-07 | 2019-12-17 | 江苏师范大学 | White light LED light source of blue light chip packaged on inner wall of transparent ceramic fluorescent tube |
| CN106549093A (en) * | 2016-10-25 | 2017-03-29 | 江苏师范大学 | A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material |
| CN109888079A (en) * | 2019-01-22 | 2019-06-14 | 圆融光电科技股份有限公司 | A kind of deep-UV light-emitting diode encapsulation |
| CN113893361A (en) * | 2021-09-29 | 2022-01-07 | 宁波安芯美半导体有限公司 | UVC LED lamp and packaging method thereof |
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Owner name: SUZHOU DONGGUAN JINGYUAN PHOTOELECTRIC TECHNOLOGY Free format text: FORMER OWNER: ZHANG HONGWEI Effective date: 20150805 |
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Effective date of registration: 20150805 Address after: 215000 Jiangsu Industrial Park, Suzhou, and on the way to science and Technology Park, room 1, No. 249 Patentee after: SUZHOU DONGGUAN JINGYUAN PHOTOELECTRIC SCIENCE & TECHNOLOGY Co.,Ltd. Address before: The Song Dynasty town Suiyang District Shangqiu city Henan province 476123 Song Dong Cun Zhang Tun Cun, No. 233 Patentee before: Zhang Hongwei |
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Effective date of registration: 20170419 Address after: 215122 room D613, new building, No. 18, Exhibition Road, industrial park, Suzhou, Jiangsu, China Patentee after: Suzhou Hui Hong Hong Mstar Technology Ltd. Address before: 215000 Jiangsu Industrial Park, Suzhou, and on the way to science and Technology Park, room 1, No. 249 Patentee before: SUZHOU DONGGUAN JINGYUAN PHOTOELECTRIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20200603 Address after: 523715 Room 201, building 4, No. 95, Jiaoping Road, Tangxia Town, Dongguan City, Guangdong Province Patentee after: Haoyu (Dongguan) management consulting enterprise (limited partnership) Address before: 215122 room D613, new building, No. 18, Exhibition Road, industrial park, Suzhou, Jiangsu, China Patentee before: Suzhou Hui Hong Hong Mstar Technology Ltd. |
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