CN204157211U - A kind of for receiving/the end-face heat sinking device of emitting module - Google Patents

A kind of for receiving/the end-face heat sinking device of emitting module Download PDF

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Publication number
CN204157211U
CN204157211U CN201420683691.5U CN201420683691U CN204157211U CN 204157211 U CN204157211 U CN 204157211U CN 201420683691 U CN201420683691 U CN 201420683691U CN 204157211 U CN204157211 U CN 204157211U
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China
Prior art keywords
heat
semi
circular recesses
assembly
end cap
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Expired - Fee Related
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CN201420683691.5U
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Chinese (zh)
Inventor
陈宇
高瞻
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Beijing Institute of Radio Measurement
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Beijing Institute of Radio Measurement
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to a kind of end-face heat sinking device for T/R assembly, and comprise module box body, T/R assembly thermal source, heat pipe, heat sinking back-plate and heat radiation end cap, T/R assembly thermal source is positioned at module box body; The back side of module box body and the position corresponding with T/R assembly thermal source offers the first semi-circular recesses; Heat sinking back-plate offers the second semi-circular recesses, described second semi-circular recesses is corresponding with described first semi-circular recesses position to be arranged, and forms circular channel after the two docking; Described heat pipe is positioned at described circular channel and extends to the end face of described T/R assembly, with described circular channel close contact; Described heat sinking back-plate is connected with described heat radiation end cap.This device by heat from thermal source be delivered to be positioned at its back side heat pipe one end by the super conductivity of heat pipe, end face heat being moved T/R assembly dispels the heat, end face existing space is utilized to dispel the heat, substantially reduce the area that thermal source and cold junction are fitted, be conducive to the multiple-layer stacked arrangement of T/R assembly in the confined space.

Description

A kind of for receiving/the end-face heat sinking device of emitting module
Technical field
The utility model relates to a kind of end-face heat sinking device for receiving/launching (T/R) assembly, electronic component tie point technical field of heat dissipation.
Background technology
Electronic equipment thermal control design refers to that the heat dissipation element of electronic equipment and complete machine or system adopt suitable cooling technology and structural design, to control their temperature rise, thus ensures that electronic equipment or system normally, reliably work.
Common T/R assembly radiating mode is for being generally: (1), at thermal source back installation of heat radiator, this structure is only applicable to the larger situation of axial installing space; (2) T/R assembly thermal source place and cold junction are fitted, as thermal source disperse time, then need the area of fitting with cold junction excessive, limited chassis space can not be made full use of.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of end-face heat sinking device for T/R assembly, overcome in prior art at thermal source back installation of heat radiator, installation control is limited, or the area that thermal source and cold junction are fitted is excessive, can not make full use of the defect of limited chassis space.
The technical scheme that the utility model solves the problems of the technologies described above is as follows: a kind of end-face heat sinking device for T/R assembly, comprises module box body, T/R assembly thermal source, heat pipe, heat sinking back-plate and heat radiation end cap,
Described T/R assembly thermal source is positioned at module box body; The back side of described module box body and the position corresponding with described T/R assembly thermal source offers the first semi-circular recesses, described first semi-circular recesses extends to the end face of described T/R assembly;
Described heat sinking back-plate offers the second semi-circular recesses, described second semi-circular recesses is corresponding with described first semi-circular recesses position to be arranged, and forms circular channel after the two docking;
Described heat pipe is positioned at described circular channel and extends to the end face of described T/R assembly, with described circular channel close contact; Described heat sinking back-plate is connected with described heat radiation end cap.
The beneficial effects of the utility model are: heat is delivered to the heat pipe one end at its back side and the distance between thermal source and heat pipe is very near from thermal source, heat does not almost lose in transmittance process, by super conductivity and the carrying characteristic of heat pipe, end face heat being moved T/R assembly dispels the heat, heat is passed in box body, end face existing space is utilized to dispel the heat, substantially reduce the area that thermal source and cold junction are fitted, be conducive to the multiple-layer stacked arrangement of T/R assembly in the confined space.
On the basis of technique scheme, the utility model can also do following improvement.
As mentioned above for an end-face heat sinking device for T/R assembly, further, the first semi-circular recesses is more than 2 that are parallel to each other.
A kind of end-face heat sinking device for T/R assembly as mentioned above, further, described heat radiation end cap comprises the end cap that to dispel the heat on first, second time heat radiation end cap, described second time heat radiation end cap cross section is L-type, the side of described second time heat radiation end cap one end is connected with described heat sinking back-plate, and the opposite side of dispel the heat on described first end cap side and the end cap that dispels the heat for second time is screwed, and the end cap opposite side that dispels the heat on described first is connected with described module box body;
Dispel the heat on described first end cap and second time heat radiation end cap inner side respectively correspondence be provided with and described first semi-circular recesses, orthogonal 3rd semi-circular recesses of the second semi-circular recesses, the 4th semi-circular recesses, the 3rd semi-circular recesses is connected by deep-slotted chip breaker with the first semi-circular recesses; 4th semi-circular recesses is connected by deep-slotted chip breaker with the second semi-circular recesses;
Described heat pipe is fillet bend pipe, and the heat pipe extending to the end face of described T/R assembly is closely positioned at the 3rd semi-circular recesses and docks with the 4th semi-circular recesses the circular channel formed.
The beneficial effect of above-mentioned further scheme is adopted to be: because heat pipe is fillet bend pipe, the end face of T/R assembly is provided with to dispel the heat on first end cap and second time heat radiation end cap, inner side is provided with heat pipe, improves the end-face heat sinking efficiency of T/R assembly, and can take full advantage of chassis space.
As mentioned above for an end-face heat sinking device for T/R assembly, further, described heat sinking back-plate and the described end cap that dispels the heat for second time are integrally formed.
The beneficial effect of above-mentioned further scheme is adopted to be: T/R assembly can be made more simple and convenient when assembling.
Accompanying drawing explanation
Fig. 1 is the plane perspective structural representation of a kind of end-face heat sinking device for T/R assembly of the utility model;
Fig. 2 is the A direction view of Fig. 1;
Fig. 3 is that a kind of end-face heat sinking device for T/R assembly of the utility model disassembles schematic diagram.
In accompanying drawing, the list of parts representated by each label is as follows:
1, T/R assembly thermal source, 2, heat pipe, 3, heat radiation end cap, 4, module box body, 5, heat sinking back-plate, the 6, second semi-circular recesses, the 7, the 4th semi-circular recesses.
Embodiment
Be described principle of the present utility model and feature below in conjunction with accompanying drawing, example, only for explaining the utility model, is not intended to limit scope of the present utility model.
As shown in Figure 1 to Figure 3, a kind of end-face heat sinking device for T/R assembly of the utility model, comprises module box body 4, T/R assembly thermal source 1, heat pipe 2, heat sinking back-plate 5 and heat radiation end cap 3,
Described T/R assembly thermal source 1 is positioned at module box body 4; The back side of described module the box body 4 and position corresponding with described T/R assembly thermal source offers the first semi-circular recesses, described first semi-circular recesses extends to the end face of described T/R assembly and vertical with the end face of described T/R assembly;
Described heat sinking back-plate 5 offers the second semi-circular recesses 6, described second semi-circular recesses 6 is corresponding with described first semi-circular recesses position to be arranged, and forms circular channel after the two docking;
Described heat pipe 2 is positioned at described circular channel and extends to the end face of described T/R assembly, with described circular channel close contact.
Described heat radiation end cap 3 comprises the end cap 31 that to dispel the heat on first, second time heat radiation end cap 32, described second time heat radiation end cap cross section is L-type, the side of described second time heat radiation end cap one end is connected with described heat sinking back-plate, the opposite side of end cap side and the end cap that dispels the heat for second time of dispelling the heat on described first is screwed, and the end cap opposite side that dispels the heat on described first is connected with described module box body;
Dispel the heat on described first inside end cap and be provided with orthogonal 3rd semi-circular recesses with described first semi-circular recesses; The inner side of described second time heat radiation end cap is provided with four semi-circular recesses 7 orthogonal with described second semi-circular recesses 6; 3rd semi-circular recesses is connected by deep-slotted chip breaker with the first semi-circular recesses; 4th semi-circular recesses 7 is connected by deep-slotted chip breaker with the second semi-circular recesses 6; 3rd semi-circular recesses, the 4th semi-circular recesses 7 position correspondence are arranged.
Described heat pipe 2 is fillet bend pipe, and the heat pipe extending to the end face of described T/R assembly is closely positioned at the 3rd semi-circular recesses and docks with the 4th semi-circular recesses the circular channel formed.
Described heat sinking back-plate 5 is integrally formed with the described end cap 32 that dispels the heat for second time.
It is inner that the utility model thermal source 1 is arranged on module box body 4, by the first semi-circular recesses processed at module box body 4 back side (immediately below thermal source 1), coordinate with the second semi-circular recesses that heat sinking back-plate is processed, heat pipe 2 is embedded in module box body 1, with screw fastening, make heat pipe 3 and module box body 4 close contact, heat is derived module box body 4.During T/R component operation, heat is delivered to heat pipe 2 one end, below from thermal source 1, then by the carrying characteristic of heat pipe, heat is moved stack face 3 and dispels the heat.
Thermal source 1 is delivered in the process of heat pipe 2, and because heat pipe 2 is immediately below thermal source 1, the two spacing is very near, so heat does not almost lose in transmittance process; According to the super conductivity properties of heat pipe 2, heat can transmit at a distance in heat pipe, and the temperature difference only 2 ~ 3 degrees Celsius, finally, in whole transmittance process, heat, in 4 ~ 5 degree Celsius range, effectively passes by the temperature difference in module box body.Adopting this end-face heat sinking mode under the prerequisite that ensure that heat radiation, utilize module box body end face 3 to dispel the heat, take full advantage of chassis space, making T/R assembly have more flexibility when assembling.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.

Claims (4)

1. for an end-face heat sinking device for T/R assembly, it is characterized in that, comprise module box body, T/R assembly thermal source, heat pipe, heat sinking back-plate and heat radiation end cap,
Described T/R assembly thermal source is positioned at module box body; The back side of described module box body and the position corresponding with described T/R assembly thermal source offers the first semi-circular recesses, described first semi-circular recesses extends to the end face of described T/R assembly;
Described heat sinking back-plate offers the second semi-circular recesses, described second semi-circular recesses is corresponding with described first semi-circular recesses position to be arranged, and forms circular channel after the two docking;
Described heat pipe is positioned at described circular channel and extends to the end face of described T/R assembly, with described circular channel close contact; Described heat sinking back-plate is connected with described heat radiation end cap.
2. a kind of end-face heat sinking device for T/R assembly according to claim 1, it is characterized in that, the first semi-circular recesses is more than 2 that are parallel to each other.
3. a kind of end-face heat sinking device for T/R assembly according to claim 1, it is characterized in that, described heat radiation end cap comprises the end cap that to dispel the heat on first, second time heat radiation end cap, described second time heat radiation end cap cross section is L-type, the side of described second time heat radiation end cap one end is connected with described heat sinking back-plate, and the opposite side of dispel the heat on described first end cap side and the end cap that dispels the heat for second time is screwed, and the end cap opposite side that dispels the heat on described first is connected with described module box body;
Dispel the heat on described first end cap and second time heat radiation end cap inner side respectively correspondence be provided with and described first semi-circular recesses, orthogonal 3rd semi-circular recesses of the second semi-circular recesses, the 4th semi-circular recesses, the 3rd semi-circular recesses is connected by deep-slotted chip breaker with the first semi-circular recesses; 4th semi-circular recesses is connected by deep-slotted chip breaker with the second semi-circular recesses;
Described heat pipe is fillet bend pipe, and the heat pipe extending to the end face of described T/R assembly is closely positioned at the 3rd semi-circular recesses and docks with the 4th semi-circular recesses the circular channel formed.
4. a kind of end-face heat sinking device for T/R assembly according to claim 3, it is characterized in that, described heat sinking back-plate and the described end cap that dispels the heat for second time are integrally formed.
CN201420683691.5U 2014-11-14 2014-11-14 A kind of for receiving/the end-face heat sinking device of emitting module Expired - Fee Related CN204157211U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420683691.5U CN204157211U (en) 2014-11-14 2014-11-14 A kind of for receiving/the end-face heat sinking device of emitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420683691.5U CN204157211U (en) 2014-11-14 2014-11-14 A kind of for receiving/the end-face heat sinking device of emitting module

Publications (1)

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CN204157211U true CN204157211U (en) 2015-02-11

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107509365A (en) * 2017-08-25 2017-12-22 北京无线电测量研究所 A kind of Ultrathin microwave component and heat-pipe radiating apparatus
CN107567266A (en) * 2017-10-25 2018-01-09 北京无线电测量研究所 The cooling system and antenna of a kind of antenna

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107509365A (en) * 2017-08-25 2017-12-22 北京无线电测量研究所 A kind of Ultrathin microwave component and heat-pipe radiating apparatus
CN107509365B (en) * 2017-08-25 2020-07-10 北京无线电测量研究所 Ultrathin microwave assembly and heat pipe radiating device
CN107567266A (en) * 2017-10-25 2018-01-09 北京无线电测量研究所 The cooling system and antenna of a kind of antenna

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150211

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