CN204153516U - Light fixture - Google Patents

Light fixture Download PDF

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Publication number
CN204153516U
CN204153516U CN201420585228.7U CN201420585228U CN204153516U CN 204153516 U CN204153516 U CN 204153516U CN 201420585228 U CN201420585228 U CN 201420585228U CN 204153516 U CN204153516 U CN 204153516U
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CN
China
Prior art keywords
radiation body
insulating radiation
solder portion
heat dissipation
bonding pad
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Withdrawn - After Issue
Application number
CN201420585228.7U
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Chinese (zh)
Inventor
蔡明波
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DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd
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DONGGUAN CHIMING ELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201420585228.7U priority Critical patent/CN204153516U/en
Application granted granted Critical
Publication of CN204153516U publication Critical patent/CN204153516U/en
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of light fixture, comprise insulating radiation body, conducting probe, heat dissipation bonding pad and luminescence unit, conducting probe is placed through insulating radiation body along the fore-and-aft direction of insulating radiation body, the rear end of conducting probe is revealed in the rear end of insulating radiation body and forms the conduction Plug Division with the outside electrical grafting of supply socket, the front end of conducting probe is revealed in the front end of insulating radiation body and forms the first conductive solder portion, heat dissipation bonding pad is located at the front end of insulating radiation body, and conducting probe and heat dissipation bonding pad all with insulating radiation body by integral forming, the rear end of luminescence unit has the second conductive solder portion and heat radiation weld part, second conductive solder portion is welded in the first conductive solder portion, heat radiation weld part is welded in heat dissipation bonding pad.Thus make light fixture easy assembling disassembling of the present utility model, exothermic temperature compared with low, conducting channel short circuit, volume is little, structure is simple and production cost is low advantage can be prevented.

Description

Light fixture
Technical field
The utility model relates to field of lighting devices, particularly relates to a kind of light fixture.
Background technology
Along with the fast development of economic life, energy-output ratio is more and more huger, energy-conserving and environment-protective technology is more and more subject to people's attention, and wherein, electricity-saving lamp field develops very fast, the electricity-saving lamp of various kind emerges in an endless stream, in recent years, along with the fast development of science and technology, illuminating LED lamp achieves significant progress at cost, aspect of performance, compared with traditional lighting apparatus, the long service life of modern LED, the start-up time short and energy-efficient performance advantage such as good has more advantage.
As everyone knows, the structure of many LED illumination device is in the market all with the multiple miniature LED of form welded and installed of contacting on wiring board or aluminium base, and the electrode of LED is connected with power end by conductive electric wire, namely, after existing LED illumination device forms finished product, LED can not partial disassembly, if have in use procedure part LED occur damage can not luminous and have influence on illumination effect time, then cannot change separately the LED damaged, and need to change whole LED illuminating source, thus increase maintenance cost and the difficulty of LED illumination device replacing, the side's of maintenance method needs skill and the equipment of specialty, be not suitable for popularizing.
Moreover with the fast development of work LED science and technology, on market, many LED more and more tend to miniaturized, and particularly high-powered LED lamp is also tending towards miniaturized.For high-powered LED lamp, the use power in unit are is increasing, and the heat produced is larger; For guaranteeing that high-powered LED lamp can reliable and stable run, the heat of generation must be drained in time, preventing from causing temperature too high because heat is cumulative, and affecting the actual life of LED.In order to solve the problem of quick heat radiating, general LED is all equipped with heat dissipation metal parts, but when LED uses, because the thermal conductivity of heat dissipation metal parts is larger, cause the temperature of heat dissipation metal parts higher, thus making its exothermic temperature in radiation processes too high, the service life of the LED not only made shortens, and can cause adverse influence to other parts near it.And, because heat dissipation metal parts are easy to the conductive electric wire touching LED, when the temperature of heat dissipation metal parts is too high, be easy to the insulated hull on conductive electric wire surface is melted, cause heat dissipation metal components conductive, even cause the short circuit of conducting wire, thus easily cause security incident, well can not reach the safety standard of LED industry.Moreover in order to ensure that the temperature of metal thermal component can not be too high, a lot of large often by the Volume design of heat dissipation metal parts, occupy a large amount of spaces.
And also there is complex structure and need the artificial of at substantial and fund cost to carry out the shortcoming of production and processing in existing LED.
Therefore, be badly in need of wanting a kind of light fixture to overcome above-mentioned defect.
Utility model content
The purpose of this utility model be to provide a kind of easy assembling disassembling, exothermic temperature compared with low, conducting channel short circuit, volume is little, structure is simple and production cost is low light fixture can be prevented.
For achieving the above object, the utility model provides a kind of light fixture, comprise insulating radiation body, conducting probe, heat dissipation bonding pad and luminescence unit, described conducting probe is placed through described insulating radiation body along the fore-and-aft direction of described insulating radiation body, the rear end of described conducting probe is revealed in the rear end of described insulating radiation body and forms the conduction Plug Division with the outside electrical grafting of supply socket, the front end of described conducting probe is revealed in the front end of described insulating radiation body and forms the first conductive solder portion, described heat dissipation bonding pad is located at the front end of insulating radiation body, and described conducting probe and heat dissipation bonding pad all with described insulating radiation body by integral forming, the rear end of described luminescence unit has the second conductive solder portion and heat radiation weld part, described second conductive solder portion is welded in described first conductive solder portion, described heat radiation weld part is welded in described heat dissipation bonding pad.
Preferably, described insulating radiation body is coated on described conducting probe and heat dissipation bonding pad by injection moulding.
Preferably, described insulating radiation body is made up of graphite or Ceramic Composite heat sink material, and described insulating radiation body is coated on described conducting probe and heat dissipation bonding pad by injection moulding.
Preferably, described second conductive solder portion laminating is welded in described first conductive solder portion.
Preferably, described heat radiation weld part laminating is welded in described heat dissipation bonding pad.
Preferably, the front end of described insulating radiation body has an installed surface, described first conductive solder portion is planar structure, described heat dissipation bonding pad front end is formed with heatsink welding junction, described first conductive solder portion and heatsink welding junction are all revealed in described installed surface, and described first conductive solder portion, heatsink welding junction and installed surface are positioned at same plane; Described second conductive solder portion is planar structure, and described heat radiation weld part is planar structure, and described second conductive solder portion and heat radiation welding position are in same plane; Described second conductive solder portion laminating is welded in described first conductive solder portion, and described heat radiation weld part laminating is welded in described heatsink welding junction.
Preferably, the rear end of described insulating radiation body offers along the fore-and-aft direction of described insulating radiation body the grafting groove coordinated with described supply socket grafting, and described conduction plugging position is in described grafting groove.
Preferably, the bottom of described grafting groove offers heat radiation groove along the fore-and-aft direction of described insulating radiation body.
Preferably, described light fixture also comprises the transmissive mirror for changing lighting effect and irradiating angle, and described transmissive mirror is located at the front end of described insulating radiation body and luminescence unit described in shade.
Preferably, the sidepiece between described insulating radiation body rear and front end has multiple to fin extraradial and arranged spaced apart, is formed with the flow-guiding channel that the fore-and-aft direction along insulating radiation body is arranged described in adjacent two between fin.
Compared with prior art, because the conducting probe of light fixture of the present utility model is placed through insulating radiation body along the fore-and-aft direction of insulating radiation body, the rear end of conducting probe is revealed in the rear end of insulating radiation body and forms the conduction Plug Division with the outside electrical grafting of supply socket, make light fixture of the present utility model conveniently can install or remove supply socket in outside, replacement operation is simple and convenient; The front end of conducting probe is revealed in the front end of insulating radiation body and forms the first conductive solder portion, heat dissipation bonding pad is located at the front end of insulating radiation body, and conducting probe and heat dissipation bonding pad all with insulating radiation body by integral forming, make conducting probe and heat dissipation bonding pad solid and reliable be located at insulating body, simple and compact for structure; The rear end of luminescence unit has the second conductive solder portion and heat radiation weld part, second conductive solder portion is welded in the first conductive solder portion, achieve luminescence unit directly and the electric connection of conducting probe, and connect without the need to the conductive electric wire outside plus, structure is more simple, reduce difficulty of processing, save artificial, production cost is greatly reduced; Heat radiation weld part is welded in heat dissipation bonding pad, makes luminescence unit more stablely can firmly be installed on insulating radiation body.On the one hand, due to the insulating effect of insulating radiation body, make to be placed through between the conducting probe in insulating radiation body and can not be electrically connected, thus prevent conducting channel to be short-circuited, use reliably safer, thus better reach the safety standard of industry.On the other hand, the syndeton of heat dissipation bonding pad is welded in by heat radiation weld part, the heat conduction that can better be produced by luminescence unit is to heat dissipation bonding pad, thermal conductivity due to heat dissipation bonding pad is greater than the thermal conductivity of insulating radiation body, thus the heat that luminescence unit is produced can be temporary in heat dissipation bonding pad again through insulation radiator distribute, make the temperature of temperature lower than heat dissipation bonding pad of insulating radiation body, thus while the exothermic temperature making insulating radiation body keep lower, heat can be distributed timely again, luminescence unit and heat dissipation bonding pad is avoided to be in higher temperature, thus ensured the service life of luminescence unit, and can not can cause adverse influence to other neighbouring parts, and when keeping same exothermic temperature, the volume of insulating radiation body can be less relative to the volume of metallic heat dissipating part, thus the volume of insulating radiation body can be designed less, also the overall volume of light fixture of the present utility model is made also to reduce further.
Accompanying drawing explanation
Fig. 1 is the solid combination schematic diagram of light fixture of the present utility model.
Fig. 2 is the schematic diagram that Fig. 1 is in another visual angle.
Fig. 3 is the decomposing schematic representation of light fixture of the present utility model.
Fig. 4 is the schematic diagram under another decomposing state of light fixture of the present utility model.
Fig. 5 is the schematic diagram that Fig. 4 is in another visual angle.
Fig. 6 is the front view after light fixture of the present utility model removes transmissive mirror and luminescence unit.
Fig. 7 is the rearview after light fixture of the present utility model removes transmissive mirror and luminescence unit.
Fig. 8 is the solid combination schematic diagram of the LED illumination device being provided with light fixture of the present utility model.
Detailed description of the invention
In order to describe technology contents of the present utility model, structural feature in detail, accompanying drawing is coordinated to be described further below in conjunction with embodiment.
Refer to Fig. 1 to Fig. 7, light fixture 100 of the present utility model comprises insulating radiation body 10, conducting probe 20, heat dissipation bonding pad 30 and luminescence unit 40, conducting probe 20 is placed through insulating radiation body 10 along the fore-and-aft direction of insulating radiation body 10, the rear end of conducting probe 20 is revealed in the rear end of insulating radiation body 10 and forms the conduction Plug Division 21 with the outside electrical grafting of supply socket (not shown), make light fixture 100 of the present utility model conveniently to install or remove in supply socket, replacement operation is simple and convenient, the front end of conducting probe 20 is revealed in the front end of insulating radiation body 10 and forms the first conductive solder portion 22, heat dissipation bonding pad 30 is located at the front end of insulating radiation body 10, and conducting probe 20 and heat dissipation bonding pad 30 are all one-body molded with insulating radiation body 10, make conducting probe 20 and heat dissipation bonding pad 30 solid and reliable be located at insulating body, simple and compact for structure, the rear end of luminescence unit 40 has the second conductive solder portion 41 and heat radiation weld part 42, namely the second conductive solder portion 41 is that the negative electrode of respectively selfluminous cell 40 and anode are drawn, second conductive solder portion 41 is welded in the first conductive solder portion 22, the the second conductive solder portion 41 realizing being connected to luminescence unit 40 negative electrode is electrically connected at the corresponding conducting probe 20 for negative electrode conduction, the the second conductive solder portion 41 being connected to luminescence unit 40 anode is electrically connected at the corresponding conducting probe 20 for anode conducting, thus achieve luminescence unit 40 directly and the electric connection of conducting probe 20, and connect without the need to the conductive electric wire outside plus, structure is more simple, reduce difficulty of processing, save artificial, production cost is greatly reduced, heat radiation weld part 42 is welded in heat dissipation bonding pad 30, luminescence unit 40 is made more stablely can be firmly installed on insulating radiation body 10, and the power supply of the negative electrode of luminescence unit 40 and anode and outside can be connected by conducting probe 20.On the one hand, due to the insulating effect of insulating radiation body 10, make to be placed through between the conducting probe 20 in insulating radiation body 10 and can not be electrically connected, thus prevent conducting channel to be short-circuited, use reliably safer.On the other hand, the syndeton of heat dissipation bonding pad 30 is welded in by heat radiation weld part 42, the heat conduction that can better be produced by luminescence unit 40 is to heat dissipation bonding pad 30, metal guide heating rate due to heat dissipation bonding pad 30 is greater than the insulator thermal conductivity of insulating radiation body 10, thus the heat that luminescence unit 40 is produced can be temporary in heat dissipation bonding pad 30 again through insulation radiator 10 distribute, make the temperature of insulating radiation body 10 lower than the temperature of heat dissipation bonding pad 30, thus while the exothermic temperature making insulating radiation body 10 keep lower, heat can be distributed timely again, luminescence unit 40 and heat dissipation bonding pad 30 is avoided to be in higher temperature, thus ensured the service life of luminescence unit 40, and can not can cause adverse influence to other neighbouring parts, and when keeping same exothermic temperature, the volume of insulating radiation body 10 can be less relative to the volume of metallic heat dissipating part, thus the volume of insulating radiation body 10 can be designed less, also the overall volume of light fixture 100 of the present utility model is made also to reduce further.Particularly, as follows:
Wherein, insulating radiation body 10 is coated on conducting probe 20 and heat dissipation bonding pad 30 by injection moulding, to realize conducting probe 20 and all integrated with insulating radiation body 10 structure of heat dissipation bonding pad 30, convenient processing, and make conducting probe 20 and heat dissipation bonding pad 30 more solid and reliable be located at heat dissipation bonding pad 30.More excellently be, in the present embodiment, insulating radiation body 10 is made up of graphite, namely be graphite heat, insulating radiation body 10 is coated on conducting probe 20 and heat dissipation bonding pad 30 by injection moulding, insulating radiation body 10 can realize the insulating effect between conducting probe 20, heat on heat dissipation bonding pad 30 can be distributed timely again, structure is more simple, but, the material type that insulating radiation body 10 is specifically selected is not as limit, other can also be selected flexibly to have the material type of said function effect according to concrete user demand, for example, in other embodiments, insulating radiation body 10 can also be made up of Ceramic Composite heat sink material, also the insulating effect between conducting probe 20 can be realized, and the heat on heat dissipation bonding pad 30 is distributed timely, do not repeat them here.
Comparatively the superior, in the present embodiment, the laminating of second conductive solder portion 41 is welded in the first conductive solder portion 22, the laminating of heat radiation weld part 42 is welded in heat dissipation bonding pad 30, on the one hand, make the syndeton in the second conductive solder and the first conductive solder portion 22 and the weld part 42 of dispelling the heat more solid and reliable with the syndeton of heat dissipation bonding pad 30; On the other hand, considerably increase the contact area in the second conductive solder and the first conductive solder portion 22 and the contact area of dispel the heat weld part 42 and heat dissipation bonding pad 30, thus be more conducive to luminescence unit 40 produced heat is conducted to heat dissipation bonding pad 30 or conducting probe 20 faster, make luminescence unit 40 be held in lower problem, contribute to the service life extending luminescence unit 40.Particularly, in the present embodiment, the front end of insulating radiation body 10 has an installed surface 11, first conductive solder portion 22 is in planar structure, heat dissipation bonding pad 30 front end is formed with heatsink welding junction 31, first conductive solder portion 22 and heatsink welding junction 31 is all revealed in installed surface 11, and the first conductive solder portion 22, heatsink welding junction 31 and installed surface 11 are positioned at same plane, namely heat dissipation bonding pad 30 is embedded in insulating radiation body 10 and only heatsink welding junction 31 is revealed in installed surface 11, and structure is more rationally compact, more excellently be, the left and right sides of heat dissipation bonding pad 30 all has symmetrical containing groove 32, and each containing groove 32 is equipped with a conducting probe 20, between the cell wall of conducting probe 20 and containing groove 32 fill by the material of insulating radiation body 10, to separate conducting probe 20 and heat dissipation bonding pad 30, thus ensure the insulation of conducting probe 20 and heat dissipation bonding pad 30, prevent to be electrically connected between conducting probe 20, and layout structure is more reasonable, but the concrete structure of heat dissipation bonding pad 30 and conducting probe 20 structure is specifically set not as limit, can also according to concrete user demand flexible design.Second conductive solder portion 41 is in planar structure, heat radiation weld part 42 is in planar structure, and the second conductive solder portion 41 is positioned at same plane with heat radiation weld part 42, and, in the present embodiment, the end face of luminescence unit 40 rear end is also be positioned at same plane with the second conductive solder portion 41 and the weld part 42 that dispels the heat; It should be noted that in the present embodiment, the second conductive solder portion 41 is identical with the shape in the face contacted with each other in the first conductive solder portion 22, and heat radiation weld part 42 is also identical with the shape in the face contacted with each other of heatsink welding junction 31; Thus better make the laminating of the second conductive solder portion 41 be welded in the first conductive solder portion 22 and heat radiation weld part 42 is fitted to be welded in heatsink welding junction 31, welding operation is more convenient, and makes the syndeton of laminating welding more stable firmly.
Moreover, in order to coordinate the grafting of conduction Plug Division 21 and outside supply socket, the rear end of insulating radiation body 10 offers along the fore-and-aft direction of insulating radiation body 10 the grafting groove 12 coordinated with supply socket grafting, conduction Plug Division 21 is positioned at grafting groove 12, thus make the conduction Plug Division 21 on conducting probe 20 can be hidden in grafting groove 12, when conduction Plug Division 21 is electrically plugged in outside supply socket, can prevent from touching conducting probe 20, thus prevent from getting an electric shock, use reliably safer.More excellent, the bottom of grafting groove 12 offers heat radiation groove 13 along the fore-and-aft direction of insulating radiation body 10, is more conducive to the heat radiation of insulating radiation body 10.
Moreover, light fixture 100 of the present utility model also comprises the transmissive mirror 50 for changing lighting effect and irradiating angle, transmissive mirror 50 is located at the front end of insulating radiation body 10 and shade luminescence unit 40, namely can according to different user demands, change different transmissive mirror 50, utilize transmissive mirror 50 pairs of lighting effects and irradiating angle to regulate, to reach required lighting effect and irradiating angle, use more convenient.Specifically, in the present embodiment, the direction of the front end rearward end of insulating radiation body 10 offers multiple mounting groove 16, and mounting groove 16 is tilted towards the middle part of insulating radiation body 10 by the direction of front end to the rear end of insulating radiation body 10, transmissive mirror 50 is provided with the fixing grafting cylinder 51 of grafting corresponding with each mounting groove 16, insert in corresponding mounting groove 16 by grafting cylinder 51, and under the conflict effect being obliquely installed structure at mounting groove 16, make transmissive mirror 50 solid and reliable be installed on insulating radiation body 10, make the mounting structure of transmissive mirror 50 more solid and reliable, and, mounting groove 16 is more excellent in be along the circumferential direction uniformly distributed in installed surface 11, corresponding grafting cylinder 51 is also uniformly distributed in transmissive mirror 50 along same circumferencial direction, structure is more reasonable, but, transmissive mirror 50 is located at the concrete structure of insulating radiation body 10 not as limit, can also according to concrete service condition flexible design, do not repeat them here.
Moreover, sidepiece between insulating radiation body 10 rear and front end has multiple to fin 14 extraradial and arranged spaced apart, fin 14 is more excellent in be along the circumferential direction uniformly distributed, structure is more reasonable, be formed with the flow-guiding channel 15 that the fore-and-aft direction along insulating radiation body 10 is arranged between adjacent two fin 14, to facilitate, heat distributed.And in the present embodiment, the sidepiece periphery between insulating radiation body 10 rear and front end also has a mounting groove 16, and the outer end of each fin 14 is all connected to mounting groove 16, make fin 14 to arrange structure more solid and reliable.More excellently be, in the present embodiment, the thickness of fin 14 by the direction of front end to the rear end of insulating radiation body 10 by thick thinning gradually, the width of retrograde passage is also broadened by narrow gradually by the direction of front end to the rear end of insulating radiation body 10, heat is better rearward conducted by flow-guiding channel 15 distribute, and, fin 14 all bends towards same circumferencial direction, thus while the contact area ensureing fin 14 and air, greatly reduce the space shared by fin 14, make taking up room of insulating radiation body 10 less, structure is more rationally compact, but the concrete structure of fin 14 and flow-guiding channel 15 is not as limit, can also flexible design according to specific circumstances, do not repeat them here.It should be noted that, in the present embodiment, all fin 14 on the sidepiece between insulating radiation body 10 rear and front end surround a circle-shaped structure jointly, but not as limit, flexible design can also become other shape and structure according to concrete user demand, not repeat them here.
The person of meriting attention, as shown in figure Fig. 8, light fixture 100 of the present utility model can be miniature LED lamp, and namely luminescence unit 40 is LED, but, luminescence unit 40 specifically select type not as limit; The lamp plate 60 of LED illumination device 200 arranges multiple supply socket, the corresponding grafting of light fixture 100 of the present utility model is installed on supply socket, when there being one or more light fixture 100 to damage can not luminous time, only need change the light fixture 100 wherein damaged, and without the need to changing whole LED luminaire, and replacement operation is simple and convenient, the operation and maintenance cost of LED illumination device 200 is reduced greatly.But the embody rule field of light fixture 100 of the present utility model, not as limit, does not repeat them here.
The person of meriting attention, light fixture 100 of the present utility model can be designed so that by high voltage source or low-tension supply according to concrete service condition, and the driver (not shown) that can arrange on insulating radiation body 10 for driving and ensure luminescence unit 40 normal luminous, structure is more rationally compact, namely can according to concrete user demand flexible design, do not repeat them here.
By reference to the accompanying drawings, the heat radiation operation principle of light fixture 100 of the present utility model is elaborated, the heat that luminescence unit 40 produces conducts on heat dissipation bonding pad 30 through heat radiation weld part 42, metal guide heating rate due to heat dissipation bonding pad 30 is greater than the insulator thermal conductivity of insulating radiation body 10, namely, the heat that luminescence unit 40 is produced can be temporary in heat dissipation bonding pad 30 and distribute through insulation radiator 10, make the temperature of insulating radiation body 10 lower than the temperature of heat dissipation bonding pad 30, thus while the exothermic temperature making insulating radiation body 10 keep lower, heat can be distributed timely again, luminescence unit 40 and heat dissipation bonding pad 30 is avoided to be in higher temperature, thus ensured the service life of luminescence unit 40, and can not can cause adverse influence to other neighbouring parts.
Compared with prior art, because the conducting probe 20 of light fixture 100 of the present utility model is placed through insulating radiation body 10 along the fore-and-aft direction of insulating radiation body 10, the rear end of conducting probe 20 is revealed in the rear end of insulating radiation body 10 and forms the conduction Plug Division 21 with the outside electrical grafting of supply socket, make light fixture 100 of the present utility model conveniently can install or remove supply socket in outside, replacement operation is simple and convenient; The front end of conducting probe 20 is revealed in the front end of insulating radiation body 10 and forms the first conductive solder portion 22, heat dissipation bonding pad 30 is located at the front end of insulating radiation body 10, and conducting probe 20 and heat dissipation bonding pad 30 are all one-body molded with insulating radiation body 10, make conducting probe 20 and heat dissipation bonding pad 30 solid and reliable be located at insulating body, simple and compact for structure; The rear end of luminescence unit 40 has the second conductive solder portion 41 and heat radiation weld part 42, second conductive solder portion 41 is welded in the first conductive solder portion 22, achieve luminescence unit 40 directly and the electric connection of conducting probe 20, and connect without the need to the conductive electric wire outside plus, structure is more simple, reduce difficulty of processing, save artificial, production cost is greatly reduced; Heat radiation weld part 42 is welded in heat dissipation bonding pad 30, makes luminescence unit 40 more stablely can firmly be installed on insulating radiation body 10.On the one hand, due to the insulating effect of insulating radiation body 10, make to be placed through between the conducting probe 20 in insulating radiation body 10 and can not be electrically connected, thus prevent conducting channel to be short-circuited, use reliably safer, thus better reach the safety standard of industry.On the other hand, the syndeton of heat dissipation bonding pad 30 is welded in by heat radiation weld part 42, the heat conduction that can better be produced by luminescence unit 40 is to heat dissipation bonding pad 30, thermal conductivity due to heat dissipation bonding pad 30 is greater than the thermal conductivity of insulating radiation body 10, thus the heat that luminescence unit 40 is produced can be temporary in heat dissipation bonding pad 30 again through insulation radiator 10 distribute, make the temperature of insulating radiation body 10 lower than the temperature of heat dissipation bonding pad 30, thus while the exothermic temperature making insulating radiation body 10 keep lower, heat can be distributed timely again, luminescence unit 40 and heat dissipation bonding pad 30 is avoided to be in higher temperature, thus ensured the service life of luminescence unit 40, and can not can cause adverse influence to other neighbouring parts, and when keeping same exothermic temperature, the volume of insulating radiation body 10 can be less relative to the volume of metallic heat dissipating part, thus the volume of insulating radiation body 10 can be designed less, also the overall volume of light fixture 100 of the present utility model is made also to reduce further.
Above disclosedly be only preferred embodiments of the present utility model, certainly can not limit the interest field of the utility model with this, therefore according to the equivalent variations that the utility model claim is done, still belong to the scope that the utility model is contained.

Claims (10)

1. a light fixture, it is characterized in that, comprise insulating radiation body, conducting probe, heat dissipation bonding pad and luminescence unit, described conducting probe is placed through described insulating radiation body along the fore-and-aft direction of described insulating radiation body, the rear end of described conducting probe is revealed in the rear end of described insulating radiation body and forms the conduction Plug Division with the outside electrical grafting of supply socket, the front end of described conducting probe is revealed in the front end of described insulating radiation body and forms the first conductive solder portion, described heat dissipation bonding pad is located at the front end of insulating radiation body, and described conducting probe and heat dissipation bonding pad all with described insulating radiation body by integral forming, the rear end of described luminescence unit has the second conductive solder portion and heat radiation weld part, described second conductive solder portion is welded in described first conductive solder portion, described heat radiation weld part is welded in described heat dissipation bonding pad.
2. light fixture as claimed in claim 1, it is characterized in that, described insulating radiation body is coated on described conducting probe and heat dissipation bonding pad by injection moulding.
3. light fixture as claimed in claim 1, it is characterized in that, described insulating radiation body is made up of graphite or Ceramic Composite heat sink material, and described insulating radiation body is coated on described conducting probe and heat dissipation bonding pad by injection moulding.
4. light fixture as claimed in claim 1, is characterized in that, described second conductive solder portion laminating is welded in described first conductive solder portion.
5. light fixture as claimed in claim 1, is characterized in that, described heat radiation weld part laminating is welded in described heat dissipation bonding pad.
6. light fixture as claimed in claim 1, it is characterized in that, the front end of described insulating radiation body has an installed surface, described first conductive solder portion is planar structure, described heat dissipation bonding pad front end is formed with heatsink welding junction, described first conductive solder portion and heatsink welding junction are all revealed in described installed surface, and described first conductive solder portion, heatsink welding junction and installed surface are positioned at same plane; Described second conductive solder portion is planar structure, and described heat radiation weld part is planar structure, and described second conductive solder portion and heat radiation welding position are in same plane; Described second conductive solder portion laminating is welded in described first conductive solder portion, and described heat radiation weld part laminating is welded in described heatsink welding junction.
7. light fixture as claimed in claim 1, is characterized in that, the rear end of described insulating radiation body offers along the fore-and-aft direction of described insulating radiation body the grafting groove coordinated with described supply socket grafting, and described conduction plugging position is in described grafting groove.
8. light fixture as claimed in claim 7, is characterized in that, the bottom of described grafting groove offers heat radiation groove along the fore-and-aft direction of described insulating radiation body.
9. light fixture as claimed in claim 1, is characterized in that, also comprising the transmissive mirror for changing lighting effect and irradiating angle, and described transmissive mirror is located at the front end of described insulating radiation body and luminescence unit described in shade.
10. the light fixture as described in any one of claim 1,2 or 3, it is characterized in that, sidepiece between described insulating radiation body rear and front end has multiple to fin extraradial and arranged spaced apart, is formed with the flow-guiding channel that the fore-and-aft direction along insulating radiation body is arranged described in adjacent two between fin.
CN201420585228.7U 2014-10-10 2014-10-10 Light fixture Withdrawn - After Issue CN204153516U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420585228.7U CN204153516U (en) 2014-10-10 2014-10-10 Light fixture

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Application Number Priority Date Filing Date Title
CN201420585228.7U CN204153516U (en) 2014-10-10 2014-10-10 Light fixture

Publications (1)

Publication Number Publication Date
CN204153516U true CN204153516U (en) 2015-02-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420585228.7U Withdrawn - After Issue CN204153516U (en) 2014-10-10 2014-10-10 Light fixture

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104266098A (en) * 2014-10-10 2015-01-07 东莞市驰明电子科技有限公司 Lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104266098A (en) * 2014-10-10 2015-01-07 东莞市驰明电子科技有限公司 Lamp

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