CN204102872U - Wafer cutting and positioning device - Google Patents
Wafer cutting and positioning device Download PDFInfo
- Publication number
- CN204102872U CN204102872U CN201420427210.4U CN201420427210U CN204102872U CN 204102872 U CN204102872 U CN 204102872U CN 201420427210 U CN201420427210 U CN 201420427210U CN 204102872 U CN204102872 U CN 204102872U
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- Prior art keywords
- wafer
- device body
- positioning device
- wafer cutting
- axis moving
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- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The utility model discloses a kind of wafer cutting and positioning device, this wafer cutting and positioning device comprises device body, control assembly, CCD detection architecture, be installed in the linear movement structural mechanism matched on described device body and with described CCD detection architecture, be installed in the vacuum suction structure on described linear movement mechanism, described vacuum suction structure comprises and is installed in that described linear movement is structural inhales flat vacuum ceramic sucker for carrying out described wafer, described linear movement structure can relative to device body along X, Y-axis moves around, described vacuum ceramic sucker can do circular-rotation relative to device body.The position that this wafer cutting and positioning device operating efficiency is high, accurately can adjust all directions of wafer to be cut, precision are high, fully automatic operation, and accurately locate the position of wafer cutting, the chip wafer cut out is even, attractive in appearance.
Description
Technical field
The utility model relates to wafer manufacturing technical field, particularly relates to a kind of wafer cutting and positioning device.
Background technology
Along with the extensive use of Si semiconductor integrated circuit, Si semiconductor integrated circuit all will use chip wafer, traditional wafer cutting technique, be all that the manual diamond tool that adopts cuts, lack wafer cutting positioning equipment, cutting position during wafer cutting cannot accurate assurance, the chip wafer cut out width is apart larger, uneven, be easy to damage chip wafer, inefficiency.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of wafer cutting and positioning device, and this wafer cutting and positioning device can prepare to set the cutting position of wafer, makes the chip wafer that cuts out even, attractive in appearance.
For solving the problems of the technologies described above, the wafer cutting and positioning device that the utility model provides comprises device body, be placed in the control assembly in described device body, be installed in the CCD detection architecture for detecting the cutting position of described wafer on described device body, be installed in the linear movement mechanism matched on described device body and with described CCD detection architecture, be installed in the vacuum suction structure on described linear movement mechanism, described vacuum suction structure comprises being installed in, and described linear movement mechanism inhales flat vacuum ceramic sucker for carrying out described wafer, described linear movement mechanism can relative to device body along X, Y-axis moves around, described vacuum ceramic sucker can do circular-rotation relative to device body.
Preferably, described CCD detection architecture comprises the CCD camera be installed on described device body, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
Preferably, described linear movement mechanism comprises the X-axis moving structure be installed on described device body, the Y-axis moving structure be installed on described X-axis moving structure, described vacuum ceramic sucker are installed on described Y-axis moving structure, described X-axis moving structure comprises the first screw mandrel, the first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, and described Y-axis moving structure comprises the second screw mandrel, the second screw rodb base and the second drive motors for driving described second screw mandrel to rotate.
Preferably, described X-axis moving structure also comprises the first grating scale of the movement position for determining described vacuum cup be installed on described first screw mandrel, and described Y-axis moving structure also comprises the second grating scale of the movement position for determining described vacuum cup be installed on described second screw mandrel.
Preferably, described vacuum suction structure also comprises at least two rotating partss for fixing described wafer being installed in described vacuum ceramic sucker lateral surface, is placed in the inner and vacuum generator linked together with described vacuum ceramic sucker of described device body.
Preferably, described control assembly comprises: display module, for the performance parameter of described wafer cutting and positioning device is passed through interface display; And/or key-press module, carry out work for handling wafer cutting and positioning device.
After adopting said structure, wafer to be cut is placed on vacuum ceramic sucker by described wafer cutting and positioning device, described wafer clamps by each described rotating parts, described vacuum ceramic sucker is moved to suitable position by described X-axis moving structure and Y-axis moving structure, a described CCD camera and the 2nd CCD camera are taken pictures to described wafer, determine the tram that wafer will cut, by the movement of described X-axis moving structure, the position of circular-rotation to described vacuum ceramic sucker of the movement of described Y-axis moving structure and vacuum ceramic sucker itself adjusts, this wafer cutting and positioning device operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model wafer cutting and positioning device;
Fig. 2 is the structural representation of the utility model wafer cutting and positioning device CCD detection architecture;
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only for explaining the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is the structural representation of the utility model wafer cutting and positioning device;
In the present embodiment, wafer cutting and positioning device 10 comprises device body, the control assembly be placed in described device body, be installed on described device body for the cutting position of described wafer is detected CCD detection architecture 11, be installed on described device body and the linear movement mechanism 13 matched with described CCD detection architecture 11, the vacuum suction structure 12 be installed on described linear movement mechanism 13, linear movement mechanism 13 can move around along X, Y-axis relative to device body, and vacuum ceramic sucker 122 can do circular-rotation relative to device body.
Referring again to the structural representation that Fig. 2, Fig. 2 are the utility model wafer cutting and positioning device CCD detection architecture; In the present embodiment, CCD detection architecture 11 comprises the CCD camera be installed on device body, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
Linear movement mechanism 13 comprises the X-axis moving structure 131 be installed on described device body, be installed in the Y-axis moving structure 132 on described X-axis moving structure, vacuum ceramic sucker 122 is installed on described Y-axis moving structure, X-axis moving structure 131 comprises the first screw mandrel, first screw rodb base, the first drive motors rotated for driving the first screw mandrel and the first grating scale being installed in the movement position for determining described vacuum cup on the first screw mandrel, Y-axis moving structure 132 comprises the second screw mandrel, second screw rodb base, for driving the second drive motors that described second screw mandrel rotates and the first grating scale for determining vacuum ceramic sucker 122 movement position be installed on the second screw mandrel.
Vacuum suction structure 12 comprises the rotating parts 121 for fixing wafer being installed in vacuum ceramic sucker 122 lateral surface for carrying out inhaling 122, at least two flat, vacuum ceramic sucker to described wafer be installed on described linear movement mechanism, be placed in device body inner and and the vacuum generator that links together of vacuum ceramic sucker 122, rotating parts 121 number preferential is in the present embodiment four.
Control assembly comprises: display module, for the performance parameter of described wafer cutting and positioning device is passed through interface display; And/or key-press module, carry out work for handling wafer cutting and positioning device.
Wafer to be cut is placed on vacuum ceramic sucker 122 by wafer cutting and positioning device 10, described wafer clamps by each rotating parts 121, vacuum ceramic sucker 122 is moved to suitable position by X-axis moving structure and Y-axis moving structure, one CCD camera and the 2nd CCD camera are taken pictures to described wafer, determine the tram that wafer will cut, by the movement of X-axis moving structure, the position of circular-rotation to described vacuum ceramic sucker 122 of the movement of Y-axis moving structure and vacuum ceramic sucker itself adjusts, this wafer cutting and positioning device 10 operating efficiency is high, accurately can adjust the position of all directions of wafer to be cut, precision is high, fully automatic operation, the position of wafer cutting is accurately located, the chip wafer cut out is even, attractive in appearance.
Should be understood that; these are only preferred embodiment of the present utility model; can not therefore limit the scope of the claims of the present utility model; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (6)
1. wafer cutting and positioning device, it is characterized in that: comprise device body, be placed in the control assembly in described device body, be installed in the CCD detection architecture for detecting the cutting position of described wafer on described device body, be installed in the linear movement mechanism matched on described device body and with described CCD detection architecture, be installed in the vacuum suction structure on described linear movement mechanism, described vacuum suction structure comprises being installed in, and described linear movement mechanism inhales flat vacuum ceramic sucker for carrying out described wafer, described linear movement mechanism can relative to device body along X, Y-axis moves around, described vacuum ceramic sucker can do circular-rotation relative to described device body.
2. wafer cutting and positioning device according to claim 1, it is characterized in that: described CCD detection architecture comprises the CCD camera be installed on described device body, the 2nd CCD camera, being installed in wafer cut point the first light source more clearly for making CCD camera take on a described CCD camera, being installed in the wafer cut point secondary light source more clearly for making CCD camera take on described 2nd CCD camera.
3. wafer cutting and positioning device according to claim 1, it is characterized in that: described linear movement mechanism comprises the X-axis moving structure be installed on described device body, the Y-axis moving structure be installed on described X-axis moving structure, described vacuum ceramic sucker are installed on described Y-axis moving structure, described X-axis moving structure comprises the first screw mandrel, the first screw rodb base and the first drive motors for driving described first screw mandrel to rotate, and described Y-axis moving structure comprises the second screw mandrel, the second screw rodb base and the second drive motors for driving described second screw mandrel to rotate.
4. wafer cutting and positioning device according to claim 3, it is characterized in that: described X-axis moving structure also comprises the grating scale of the movement position for determining described vacuum cup be installed on described first screw mandrel, described Y-axis moving structure also comprises the grating scale of the movement position for determining described vacuum cup be installed on described second screw mandrel.
5. wafer cutting and positioning device according to claim 1, is characterized in that: described vacuum suction structure also comprises at least two rotating partss for fixing described wafer being installed in described vacuum ceramic sucker lateral surface, be placed in the inner and vacuum generator linked together with described vacuum ceramic sucker of described device body.
6. wafer cutting and positioning device according to claim 1, is characterized in that: described control assembly comprises: display module, for the performance parameter of described wafer cutting and positioning device is passed through interface display; And/or key-press module, carry out work for handling wafer cutting and positioning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420427210.4U CN204102872U (en) | 2014-07-30 | 2014-07-30 | Wafer cutting and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420427210.4U CN204102872U (en) | 2014-07-30 | 2014-07-30 | Wafer cutting and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204102872U true CN204102872U (en) | 2015-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420427210.4U Expired - Lifetime CN204102872U (en) | 2014-07-30 | 2014-07-30 | Wafer cutting and positioning device |
Country Status (1)
| Country | Link |
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| CN (1) | CN204102872U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105321863A (en) * | 2014-07-30 | 2016-02-10 | 深圳市韵腾激光科技有限公司 | Wafer cutting positioning device and method |
| CN105583957A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Horizontal monocrystal silicon single-rod squarer |
| CN105583958A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Vertical type single-rod squaring machine for monocrystalline silicon |
| CN108680120A (en) * | 2018-03-27 | 2018-10-19 | 中国建筑材料科学研究总院有限公司 | Ceramet combined electronical assembly adsorbent equipment, system and verticality measuring method |
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
| CN116652978A (en) * | 2023-05-18 | 2023-08-29 | 珠海创智科技有限公司 | Long-stroke taking and feeding device and floating taking robot thereof |
-
2014
- 2014-07-30 CN CN201420427210.4U patent/CN204102872U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105321863A (en) * | 2014-07-30 | 2016-02-10 | 深圳市韵腾激光科技有限公司 | Wafer cutting positioning device and method |
| CN105583957A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Horizontal monocrystal silicon single-rod squarer |
| CN105583958A (en) * | 2016-03-03 | 2016-05-18 | 青岛高测科技股份有限公司 | Vertical type single-rod squaring machine for monocrystalline silicon |
| CN105583958B (en) * | 2016-03-03 | 2017-11-10 | 青岛高测科技股份有限公司 | A kind of vertical single rod excavation machine of monocrystalline silicon |
| CN105583957B (en) * | 2016-03-03 | 2018-01-19 | 青岛高测科技股份有限公司 | A kind of horizontal single rod excavation machine of monocrystalline silicon |
| CN108680120A (en) * | 2018-03-27 | 2018-10-19 | 中国建筑材料科学研究总院有限公司 | Ceramet combined electronical assembly adsorbent equipment, system and verticality measuring method |
| CN109624109A (en) * | 2019-02-20 | 2019-04-16 | 广州安特激光技术有限公司 | A kind of plummer of wafer cutter device |
| CN116652978A (en) * | 2023-05-18 | 2023-08-29 | 珠海创智科技有限公司 | Long-stroke taking and feeding device and floating taking robot thereof |
| CN116652978B (en) * | 2023-05-18 | 2024-03-22 | 珠海创智科技有限公司 | Long-stroke taking and feeding device and floating taking robot thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |