CN204080159U - A kind of anti-plating leakage electrolytic plating pool - Google Patents
A kind of anti-plating leakage electrolytic plating pool Download PDFInfo
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- CN204080159U CN204080159U CN201420371027.7U CN201420371027U CN204080159U CN 204080159 U CN204080159 U CN 204080159U CN 201420371027 U CN201420371027 U CN 201420371027U CN 204080159 U CN204080159 U CN 204080159U
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- electrolytic plating
- injection pipe
- pool
- plating pool
- electroplate liquid
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Abstract
The utility model relates to a kind of anti-plating leakage electrolytic plating pool, to electrolytic plating pool, a mixed flow jet apparatus is set, described mixed flow jet apparatus comprises at least one group of injection pipe be arranged on bottom electrolytic plating pool, injection pipe is evenly provided with some groups of nozzles, also comprise one be arranged on the liquid outlet of electrolytic plating pool side bottom and connect the pipeline of nozzle and liquid outlet, and the lift pump between nozzle and liquid outlet on pipeline.The utility model has the advantage of: the utility model electrolytic plating pool has abandoned traditional pneumatic blending and negative electrode swings the device stirred, mixed flow jet apparatus is provided with bottom a solution pond, electroplate liquid is made to form convection current by mixed flow jet apparatus, thus the electroplate liquid in whole electrolytic plating pool is fully stirred, metallic cation in electroplate liquid is uniformly distributed, and the hydrogen that is deposited in negative electrode can be allowed to remove with the flowing of liquid, thus avoid plating leakage or blackout.
Description
Technical field
The utility model relates to a kind of electrolytic plating pool, especially a kind of anti-plating leakage electrolytic plating pool.
Background technology
The purposes of electroplating technology is very many, mainly comprise protection against corrosion, protected decoration, resistance to wear and electrical property, at present, plating is mainly carried out in electrolytic plating pool, plated body is set to negative electrode, then logical direct current is electroplated, effect at that time in order to electroplate then needs to keep certain condition, mainly comprise current density, electroplating site, stirring condition, current waveform, bath temperature, plating solution pH value and plating solution proportion, the effect wherein usually stirred is better, electroplating efficiency is higher, traditional alr mode has air, the alr modes such as negative electrode swing, but there is a common shortcoming in these alr modes: during plating, planar products down time, the hydrogen having negative electrode to produce easily is gathered in the top of product and can not gets rid of in time, then this place not easily deposited plating layer, this place's plating leakage or blackout can be caused, therefore a kind of electrolytic plating pool that hydrogen can be avoided to assemble plating leakage or the blackout caused must just be developed, the same or analogous device with the utility model is not found through retrieval.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of electrolytic plating pool that hydrogen can be avoided to assemble plating leakage or the blackout caused.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of anti-plating leakage electrolytic plating pool, and its innovative point is: electrolytic plating pool is provided with a mixed flow jet apparatus,
Described mixed flow jet apparatus comprises at least one group of injection pipe be arranged on bottom electrolytic plating pool, often organizes the injection pipe that injection pipe comprises pair of parallel setting, injection pipe is evenly provided with some nozzles,
Described mixed flow jet apparatus also comprises an electroplate liquid external circulation line, and one end of this electroplate liquid external circulation line is communicated with injection pipe, and the other end is communicated with the liquid outlet be arranged on bottom electrolytic plating pool, and the recycle pump between injection pipe and liquid outlet on pipeline;
Electroplate liquid in described electrolytic plating pool forms an electroplate liquid outer circulation loop by electroplate liquid external circulation line, recycle pump, injection pipe, nozzle successively.
Further, the described nozzle with organizing on two injection pipes all tilts upward and is symmetrical arranged.
Further, the acute angle of described nozzle and horizontal plane angle is 64 ~ 68 degree.
Further, on described same injection pipe, the spacing of adjacent nozzle is 22cm to 28cm.
The utility model has the advantage of: 1. the utility model electrolytic plating pool has abandoned the device of traditional pneumatic blending and negative electrode swing stirring, mixed flow jet apparatus is provided with bottom a solution pond, electroplate liquid is made to form convection current by mixed flow jet apparatus, thus the electroplate liquid in whole electrolytic plating pool is fully stirred, metallic cation in electroplate liquid is uniformly distributed, and the hydrogen that is deposited in negative electrode can be allowed to remove with the flowing of liquid, thus avoid plating leakage or blackout.
2. nozzle between two to and the correlation that forms an angle, electroplate liquid can be allowed better to form convection current.
Accompanying drawing explanation
Fig. 1 is the side-looking structural representation of the anti-plating leakage electrolytic plating pool of the utility model.
Fig. 2 is the vertical view of the anti-plating leakage electrolytic plating pool of the utility model.
Embodiment
The anti-plating leakage electrolytic plating pool of one as shown in Fig. 1 to 2, comprises plating tank and mixed flow jet apparatus.
Mixed flow jet apparatus comprises at least one group of injection pipe 1 be arranged on bottom electrolytic plating pool, often organizes the injection pipe 1 that injection pipe 1 comprises pair of parallel setting, injection pipe 1 is evenly provided with some nozzles 2; Mixed flow jet apparatus also comprises an electroplate liquid external circulation line, and one end of this electroplate liquid external circulation line is communicated with injection pipe 1, and the other end is communicated with the liquid outlet be arranged on bottom electrolytic plating pool, and the recycle pump 4 between injection pipe and liquid outlet on pipeline; Electroplate liquid in electrolytic plating pool forms an electroplate liquid outer circulation loop by electroplate liquid external circulation line 3, recycle pump 4, injection pipe 1, nozzle 2 successively.
All tilt upward with the nozzle 2 on group two injection pipes and be symmetrical arranged, nozzle 2 is 64 ~ 68 degree with the acute angle of horizontal plane angle, on described same injection pipe 1, the spacing of adjacent nozzle 2 is 22cm to 28cm, in the present embodiment angle be 66 degree, spacing between adjacent nozzle when being 25cm mixed flow effect best.
Its principle of work is: when electrolytic plating pool energising starts to electroplate, open the lift pump 4 of mixed flow jet apparatus, electroplate liquid is allowed finally to spray from nozzle 2 from the promotion of liquid outlet by lift pump 4, because nozzle 2 is all one group of corresponding setting between two, electroplate liquid can be made to form convection current, finally fully can stir electroplate liquid, improve electroplating efficiency.
Claims (4)
1. an anti-plating leakage electrolytic plating pool, is characterized in that: electrolytic plating pool is provided with a mixed flow jet apparatus;
Described mixed flow jet apparatus comprises at least one group of injection pipe be arranged on bottom electrolytic plating pool, often organizes the injection pipe that injection pipe comprises pair of parallel setting, injection pipe is evenly provided with some nozzles;
Described mixed flow jet apparatus also comprises an electroplate liquid external circulation line, and one end of this electroplate liquid external circulation line is communicated with injection pipe, and the other end is communicated with the liquid outlet be arranged on bottom electrolytic plating pool, and the recycle pump between injection pipe and liquid outlet on pipeline;
Electroplate liquid in described electrolytic plating pool forms an electroplate liquid outer circulation loop by electroplate liquid external circulation line, recycle pump, injection pipe, nozzle successively.
2. the anti-plating leakage electrolytic plating pool of one according to claim 1, is characterized in that: the described nozzle with organizing on two injection pipes all tilts upward and is symmetrical arranged.
3. the anti-plating leakage electrolytic plating pool of one according to claim 2, is characterized in that: the acute angle of described nozzle and horizontal plane angle is 64 ~ 68 degree.
4. the anti-plating leakage electrolytic plating pool of one according to claim 2, is characterized in that: on described same injection pipe, the spacing of adjacent nozzle is 22cm to 28cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420371027.7U CN204080159U (en) | 2014-07-07 | 2014-07-07 | A kind of anti-plating leakage electrolytic plating pool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420371027.7U CN204080159U (en) | 2014-07-07 | 2014-07-07 | A kind of anti-plating leakage electrolytic plating pool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204080159U true CN204080159U (en) | 2015-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420371027.7U Active CN204080159U (en) | 2014-07-07 | 2014-07-07 | A kind of anti-plating leakage electrolytic plating pool |
Country Status (1)
| Country | Link |
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| CN (1) | CN204080159U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112853434A (en) * | 2020-12-21 | 2021-05-28 | 温州佳宝电镀设备有限公司 | Electroplating pool with stirring structure |
-
2014
- 2014-07-07 CN CN201420371027.7U patent/CN204080159U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112853434A (en) * | 2020-12-21 | 2021-05-28 | 温州佳宝电镀设备有限公司 | Electroplating pool with stirring structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |