CN204067345U - A kind of novel rectifying device TO-220 framework - Google Patents

A kind of novel rectifying device TO-220 framework Download PDF

Info

Publication number
CN204067345U
CN204067345U CN201420489935.6U CN201420489935U CN204067345U CN 204067345 U CN204067345 U CN 204067345U CN 201420489935 U CN201420489935 U CN 201420489935U CN 204067345 U CN204067345 U CN 204067345U
Authority
CN
China
Prior art keywords
wire
lead
wire jumper
die substrate
upper side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420489935.6U
Other languages
Chinese (zh)
Inventor
石友玲
江玉华
徐柏林
王俊
刘海花
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG HORNBY ELECTRONIC CO Ltd
Original Assignee
NANTONG HORNBY ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTONG HORNBY ELECTRONIC CO Ltd filed Critical NANTONG HORNBY ELECTRONIC CO Ltd
Priority to CN201420489935.6U priority Critical patent/CN204067345U/en
Application granted granted Critical
Publication of CN204067345U publication Critical patent/CN204067345U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Forging (AREA)

Abstract

The utility model relates to rectifying device framework, is specifically related to a kind of novel rectifying device TO-220 framework.It comprises upper side frame, lower frame, chip and wire jumper, the lead-in wire that three vertical is had in upper side frame, upper side frame is connected by middle leads with lower frame, middle leads lower end connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with pin plate mesophase spherule, chip lower end is welded on die substrate, die substrate upper end is connected with middle leads, wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.Advantage is that simplicity of design is ingenious, and adopt " Y " shape wire jumper to weld by quick position, and the lead-in wire once completing both sides is connected with chip, convenient to operation, rational in infrastructure compact, production and processing cost reduces, and product quality improves greatly.

Description

A kind of novel rectifying device TO-220 framework
Technical field
The utility model relates to rectifying device framework, is specifically related to a kind of novel rectifying device TO-220 framework.
Background technology
Traditional rectifying device TO-220 frame is that intermediate chip upper end is connected with lead-in wire, adopt " one " shape wire jumper that chip upper end is connected with the lead-in wire of both sides, need welding aligned position twice, take a lot of work because the very little not easily manual operation of workpiece is time-consuming like this, need artificial adjustment " one " shape jumper location completely, increase the amount of labour, and at the bottom of operating efficiency, welding quality is bad, does not meet designing requirement.
Summary of the invention
In order to solve foregoing invention problem, the utility model proposes a kind of novel rectifying device TO-220 framework, simplicity of design, easy to operate, save production cost, greatly accelerate production efficiency, and conforming product rate improves greatly.
In order to reach foregoing invention object, the utility model proposes technical scheme:
A kind of novel rectifying device TO-220 framework, it comprises upper side frame, lower frame, chip and wire jumper, three vertical lead-in wires are designed with in upper side frame, upper side frame is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame is connected by middle leads with lower frame, middle leads lower end bending part connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.
Described upper side frame and lower frame are that the forging and stamping of copper metal material are integrally formed.
Described wire jumper is " Y " shape wire jumper, integrally formed by the forging and stamping of copper metal material.
Described lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described pin plate is oblong-shaped plate, and centre has slotted eye, slotted eye is a large semi-circular groove composition below a horizontal strip groove centre.
Described several lateral connection of novel rectifying device TO-220 framework form a framing together.
The utility model has the advantages that simplicity of design, ingenious, adopt " Y " shape wire jumper to weld by quick position, and the lead-in wire once completing both sides is connected with chip, convenient to operation, rational in infrastructure compact, production and processing cost reduces, and product quality improves greatly.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Fig. 2 is wire jumper vertical view of the present utility model.
Fig. 3 is wire jumper end view of the present utility model.
Embodiment
In order to further illustrate the utility model, introduce below in conjunction with Figure of description:
With reference to accompanying drawing 1, a kind of novel rectifying device TO-220 framework, it comprises upper side frame 1, lower frame 2, chip 3 and wire jumper 4, three vertical lead-in wires are designed with in upper side frame 1, upper side frame 1 is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame 1 is connected by middle leads with lower frame 2, middle leads lower end bending part connects lower frame 2 upper end, lower frame 2 comprises die substrate 5 and pin plate 6, die substrate 5 lower end is connected with one section of 1/3 position in the middle of pin plate 6, chip 3 lower end is welded on die substrate 5, in the middle of die substrate 5 upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper 4 is " Y " shape wire jumpers, wire jumper 4 is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip 3 upper end, the butt welding of two lead-in wire difference above of wire jumper 4 connects the lead-in wire of the both sides in upper side frame.
Described upper side frame 1 and lower frame 2 are that the forging and stamping of copper metal material are integrally formed.
Described wire jumper 4 is " Y " shape wire jumpers, integrally formed by the forging and stamping of copper metal material.
Described lower frame 2 comprises die substrate 5 and pin plate 6, die substrate 5 lower end is connected with one section of 1/3 position in the middle of pin plate 6, chip 4 lower end is welded on die substrate 5, in the middle of die substrate 5 upper end, 1/3 position is connected with the bending part of middle leads, described pin plate 6 is oblong-shaped plates, and centre has slotted eye, slotted eye below horizontal strip groove 7 centre is that a large semi-circular groove 8 forms.
Described several lateral connection of novel rectifying device TO-220 framework form a framing together.
the utility model be first by copper sheet by forging and stamping one-shot forming, form upper frame of the present utility model and underframe, then chips welding on die substrate, then pass through handlethe leftover bits and pieces of " Y " shape wire jumper is welded on chip upper end, and two pin above of " Y " shape wire jumper are welded on the both sides lead-in wire in upper side frame, and convenient to operation, welding effect is safe and reliable, substantially increases operating efficiency.

Claims (5)

1. a novel rectifying device TO-220 framework, it is characterized in that it comprises upper side frame, lower frame, chip and wire jumper, three vertical lead-in wires are designed with in upper side frame, upper side frame is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame is connected by middle leads with lower frame, middle leads lower end bending part connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.
2. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described upper side frame and lower frame are that the forging and stamping of copper metal material are integrally formed.
3. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described wire jumper is " Y " shape wire jumper, integrally formed by the forging and stamping of copper metal material.
4. a kind of novel rectifying device TO-220 framework according to claim 1, it is characterized in that described lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described pin plate is oblong-shaped plate, and centre has slotted eye, and slotted eye is a large semi-circular groove composition below a horizontal strip groove centre.
5. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described several lateral connection of novel rectifying device TO-220 framework form a framing together.
CN201420489935.6U 2014-08-28 2014-08-28 A kind of novel rectifying device TO-220 framework Expired - Fee Related CN204067345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420489935.6U CN204067345U (en) 2014-08-28 2014-08-28 A kind of novel rectifying device TO-220 framework

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420489935.6U CN204067345U (en) 2014-08-28 2014-08-28 A kind of novel rectifying device TO-220 framework

Publications (1)

Publication Number Publication Date
CN204067345U true CN204067345U (en) 2014-12-31

Family

ID=52208800

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420489935.6U Expired - Fee Related CN204067345U (en) 2014-08-28 2014-08-28 A kind of novel rectifying device TO-220 framework

Country Status (1)

Country Link
CN (1) CN204067345U (en)

Similar Documents

Publication Publication Date Title
CN103085271A (en) Thermal radiation welding machine of automobile instrument
CN201644696U (en) Multi-point rivet-sharing fixture
CN204067345U (en) A kind of novel rectifying device TO-220 framework
CN102873143A (en) Radiating tube bending device
CN203077619U (en) Automobile instrument panel heat radiation welding machine
CN203343649U (en) Pressing mechanism of lithium battery laser-beam welding machine
CN204209292U (en) A kind of building aluminum alloy pattern plate welding equipment
CN206250155U (en) One kind overlapping lead frame amendment tool
CN103331526A (en) Shoe electrode for lithium battery laser welder
CN204885149U (en) Lead wire frame construction of rectifier bridge
CN204294772U (en) A kind of U-shaped support punching and blanking bends composite die
CN202780326U (en) Light emitting diode (LED) spot welding jig
CN203222858U (en) High-strength water tank
CN202867456U (en) Pressing device of refrigerating evaporator
CN207308765U (en) Door of elevator corner is without riveting connecting mold
CN203649698U (en) Auto lighting welding mechanism of double welding head auto lighting welding machine
CN204122494U (en) Concetrated pipe drawing process units
CN205096374U (en) Upper and lower casing joint stamping die of silencer
CN203495478U (en) Distribution box welding tool
CN204277282U (en) A kind of chip assembly welding tooling
CN203390521U (en) Blind hole plate clamp for diode press fitting
CN106140972A (en) A kind of special drawing die processing rail brackets
CN204792776U (en) ITO220 frame
CN204564937U (en) The special drawing die of processing rail brackets
CN203384901U (en) Press-fitting fastening type LED lamp disc

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141231

Termination date: 20190828