CN204067345U - A kind of novel rectifying device TO-220 framework - Google Patents
A kind of novel rectifying device TO-220 framework Download PDFInfo
- Publication number
- CN204067345U CN204067345U CN201420489935.6U CN201420489935U CN204067345U CN 204067345 U CN204067345 U CN 204067345U CN 201420489935 U CN201420489935 U CN 201420489935U CN 204067345 U CN204067345 U CN 204067345U
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- China
- Prior art keywords
- wire
- lead
- wire jumper
- die substrate
- upper side
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37011—Shape comprising apertures or cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/37147—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Forging (AREA)
Abstract
The utility model relates to rectifying device framework, is specifically related to a kind of novel rectifying device TO-220 framework.It comprises upper side frame, lower frame, chip and wire jumper, the lead-in wire that three vertical is had in upper side frame, upper side frame is connected by middle leads with lower frame, middle leads lower end connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with pin plate mesophase spherule, chip lower end is welded on die substrate, die substrate upper end is connected with middle leads, wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.Advantage is that simplicity of design is ingenious, and adopt " Y " shape wire jumper to weld by quick position, and the lead-in wire once completing both sides is connected with chip, convenient to operation, rational in infrastructure compact, production and processing cost reduces, and product quality improves greatly.
Description
Technical field
The utility model relates to rectifying device framework, is specifically related to a kind of novel rectifying device TO-220 framework.
Background technology
Traditional rectifying device TO-220 frame is that intermediate chip upper end is connected with lead-in wire, adopt " one " shape wire jumper that chip upper end is connected with the lead-in wire of both sides, need welding aligned position twice, take a lot of work because the very little not easily manual operation of workpiece is time-consuming like this, need artificial adjustment " one " shape jumper location completely, increase the amount of labour, and at the bottom of operating efficiency, welding quality is bad, does not meet designing requirement.
Summary of the invention
In order to solve foregoing invention problem, the utility model proposes a kind of novel rectifying device TO-220 framework, simplicity of design, easy to operate, save production cost, greatly accelerate production efficiency, and conforming product rate improves greatly.
In order to reach foregoing invention object, the utility model proposes technical scheme:
A kind of novel rectifying device TO-220 framework, it comprises upper side frame, lower frame, chip and wire jumper, three vertical lead-in wires are designed with in upper side frame, upper side frame is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame is connected by middle leads with lower frame, middle leads lower end bending part connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.
Described upper side frame and lower frame are that the forging and stamping of copper metal material are integrally formed.
Described wire jumper is " Y " shape wire jumper, integrally formed by the forging and stamping of copper metal material.
Described lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described pin plate is oblong-shaped plate, and centre has slotted eye, slotted eye is a large semi-circular groove composition below a horizontal strip groove centre.
Described several lateral connection of novel rectifying device TO-220 framework form a framing together.
The utility model has the advantages that simplicity of design, ingenious, adopt " Y " shape wire jumper to weld by quick position, and the lead-in wire once completing both sides is connected with chip, convenient to operation, rational in infrastructure compact, production and processing cost reduces, and product quality improves greatly.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Fig. 2 is wire jumper vertical view of the present utility model.
Fig. 3 is wire jumper end view of the present utility model.
Embodiment
In order to further illustrate the utility model, introduce below in conjunction with Figure of description:
With reference to accompanying drawing 1, a kind of novel rectifying device TO-220 framework, it comprises upper side frame 1, lower frame 2, chip 3 and wire jumper 4, three vertical lead-in wires are designed with in upper side frame 1, upper side frame 1 is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame 1 is connected by middle leads with lower frame 2, middle leads lower end bending part connects lower frame 2 upper end, lower frame 2 comprises die substrate 5 and pin plate 6, die substrate 5 lower end is connected with one section of 1/3 position in the middle of pin plate 6, chip 3 lower end is welded on die substrate 5, in the middle of die substrate 5 upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper 4 is " Y " shape wire jumpers, wire jumper 4 is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip 3 upper end, the butt welding of two lead-in wire difference above of wire jumper 4 connects the lead-in wire of the both sides in upper side frame.
Described upper side frame 1 and lower frame 2 are that the forging and stamping of copper metal material are integrally formed.
Described wire jumper 4 is " Y " shape wire jumpers, integrally formed by the forging and stamping of copper metal material.
Described lower frame 2 comprises die substrate 5 and pin plate 6, die substrate 5 lower end is connected with one section of 1/3 position in the middle of pin plate 6, chip 4 lower end is welded on die substrate 5, in the middle of die substrate 5 upper end, 1/3 position is connected with the bending part of middle leads, described pin plate 6 is oblong-shaped plates, and centre has slotted eye, slotted eye below horizontal strip groove 7 centre is that a large semi-circular groove 8 forms.
Described several lateral connection of novel rectifying device TO-220 framework form a framing together.
the utility model be first by copper sheet by forging and stamping one-shot forming, form upper frame of the present utility model and underframe, then chips welding on die substrate, then pass through handlethe leftover bits and pieces of " Y " shape wire jumper is welded on chip upper end, and two pin above of " Y " shape wire jumper are welded on the both sides lead-in wire in upper side frame, and convenient to operation, welding effect is safe and reliable, substantially increases operating efficiency.
Claims (5)
1. a novel rectifying device TO-220 framework, it is characterized in that it comprises upper side frame, lower frame, chip and wire jumper, three vertical lead-in wires are designed with in upper side frame, upper side frame is stretched out in three lead-in wire one end, and the lead-in wire downward bending of centre, upper side frame is connected by middle leads with lower frame, middle leads lower end bending part connects lower frame upper end, lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described wire jumper is " Y " shape wire jumper, wire jumper is just divided into two lead-in wires and below a lead-in wire above, wire jumper lower end wire bonds is in chip upper end, the butt welding of two lead-in wire difference above of wire jumper connects the lead-in wire of the both sides in upper side frame.
2. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described upper side frame and lower frame are that the forging and stamping of copper metal material are integrally formed.
3. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described wire jumper is " Y " shape wire jumper, integrally formed by the forging and stamping of copper metal material.
4. a kind of novel rectifying device TO-220 framework according to claim 1, it is characterized in that described lower frame comprises die substrate and pin plate, die substrate lower end is connected with one section of 1/3 position in the middle of pin plate, chip lower end is welded on die substrate, in the middle of die substrate upper end, 1/3 position is connected with the bending part of middle leads, described pin plate is oblong-shaped plate, and centre has slotted eye, and slotted eye is a large semi-circular groove composition below a horizontal strip groove centre.
5. a kind of novel rectifying device TO-220 framework according to claim 1, is characterized in that described several lateral connection of novel rectifying device TO-220 framework form a framing together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420489935.6U CN204067345U (en) | 2014-08-28 | 2014-08-28 | A kind of novel rectifying device TO-220 framework |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420489935.6U CN204067345U (en) | 2014-08-28 | 2014-08-28 | A kind of novel rectifying device TO-220 framework |
Publications (1)
Publication Number | Publication Date |
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CN204067345U true CN204067345U (en) | 2014-12-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420489935.6U Expired - Fee Related CN204067345U (en) | 2014-08-28 | 2014-08-28 | A kind of novel rectifying device TO-220 framework |
Country Status (1)
Country | Link |
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CN (1) | CN204067345U (en) |
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2014
- 2014-08-28 CN CN201420489935.6U patent/CN204067345U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20190828 |