CN204047011U - A kind of power supply fin - Google Patents
A kind of power supply fin Download PDFInfo
- Publication number
- CN204047011U CN204047011U CN201420506609.1U CN201420506609U CN204047011U CN 204047011 U CN204047011 U CN 204047011U CN 201420506609 U CN201420506609 U CN 201420506609U CN 204047011 U CN204047011 U CN 204047011U
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- CN
- China
- Prior art keywords
- fin
- heat sink
- power supply
- sink body
- processed
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- Withdrawn - After Issue
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of power supply fin, comprise the heat sink body of integrated punching bending, described heat sink body is double-deck radiator structure, it is characterized in that: the top of this heat sink body is processed with the fin like structures being beneficial to heat radiation, and end downward bending be processed with the welding pin of both sides with short slot, bottom is processed with the syndeton for fixed electronic element.The utility model, by heat sink body is made double-deck radiator structure, adds the area of dissipation of fin, improves heat conduction, radiating effect; By arranging syndeton in bottom, making electronic component to be mounted on fin and become more efficient and convenient; Be provided with dead slot by the both sides in welding pin, the welding of fin become and is more prone to.
Description
Technical field
The utility model relates to a kind of fin, particularly relates to the fin of the ultra-thin driving power of a kind of LED.
Background technology
Owing to incorporating a large amount of electronic components on circuit board, during work, can amount of heat be discharged, cause circuit board temperature to raise, but the too high job stability that can affect electronic component of temperatures at localized regions.Especially, LED drive power industry develop rapidly in recent years, along with doing of complete machine power is large, the caloric value of power drives internal transistor (metal-oxide-semiconductor) also becomes large thereupon, thus bring heat dissipation problem to whole product, particularly ultra-thin LED driving power, because of its be highly restricted, inner space is limited, heat dissipation problem is particularly in the urgent need to address.
Common radiating mode is finned on circuit boards, is absorbed fast, and is passed by heat by its radiating surface, thus reach cooling-down effect by the heat of fin by circuit board.But, existing fin existence is highly higher, area of dissipation is little and the problems such as serious wasted by fin manufactured materials, in addition, on circuit boards the comparatively large and assembling of taking up space be inconvenient to need lock screw and nut or rivet to install, cause installing that limitation is comparatively large and adaptability is bad.
Utility model content
The technical problems to be solved in the utility model is the present situation for prior art, provide a kind of area of dissipation large, assemble efficient and convenient, adaptability good, good heat dissipation effect, highly moderate, be convenient to weld and stock utilization is high and be convenient to the power supply fin processed.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of power supply fin, comprise the heat sink body of integrated punching bending, described heat sink body is double-deck radiator structure, it is characterized in that: the top of this heat sink body is processed with the fin like structures being beneficial to heat radiation, and end downward bending be processed with the welding pin of both sides with short slot, bottom is processed with the syndeton for fixed electronic element.
As improvement, described syndeton comprises and has flexible metal holder through punching press bending forming, the front end of this metal holder is provided with guiding flanging, in using, sprung metal clip can provide contact when it blocks transistor, make transistor AND gate fin reliable contacts, thus reduce the thermal resistance between contact-making surface.In addition, described two bottom sides is provided with positioning convex point, can the relative position of limit transistor by positioning convex point, prevents it to be subjected to displacement.When installation transistor, transistor is exerted oneself to block can complete assembling once squeezing one, and whole installation process does not need screw to fix simultaneously, makes whole installation process safely, efficiently, fast.
Improve, described syndeton comprises a stamping forming flanging bore, is provided with internal thread in this flanging bore again.As the another kind of form of described syndeton, achieve transistor locking mounting means on a heat sink by screw.
Improve, described fin like structures is made up of in indenting symmetrical fin some again, by being symmetrical arranged indenting radiating fin at top, being conducive to the disturbance and the area of dissipation that increase air, thus increasing heat dispersion.
Improve, described heat sink body is the double-deck radiator structure of an afterbody in the bending of " U " type, and double-deck radiator structure adopts " U " type, after only needing punching press to complete, then carries out bending, and is convenient to processing again.
Compared with prior art, owing to the utility model has the advantage of: heat sink body adopted integrated punching wrap direction shaping, be conducive to punching production identity, reduce raw-material waste, greatly improve utilization rate of raw materials and production efficiency and safety simultaneously; In addition, by heat sink body is made double-deck radiator structure, make heat flow path become roomy smoothness on the one hand, add the area of dissipation of fin on the other hand, be conducive to improve heat conduction, radiating effect; By arranging syndeton in bottom, make electronic component become more efficient and convenient according to fin; Be provided with dead slot by the both sides in welding pin, make the heat passage of pin become narrow, be the heat-conducting effect reducing pin with regard to people like this, achieve the object of artificial rapid welding.
Accompanying drawing explanation
Fig. 1 is the structural representation of fin in the utility model;
Fig. 2 is the front view of fin in Fig. 1;
Fig. 3 is the right view of fin in Fig. 1;
Fig. 4 is the upward view of fin in Fig. 1;
Fig. 5 is the installation exploded view adopting the first syndeton transistor in the utility model;
Fig. 6 is the scheme of installation adopting the first syndeton fin in the utility model;
Fig. 7 is the scheme of installation adopting the second syndeton fin in the utility model;
Fig. 8 is the structural representation (without bending) in the utility model after fin punch forming.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
As shown in Fig. 1 to 8, power supply fin in this enforcement, comprise heat sink body 1, this heat sink body 1 adopts rectangular brass sheet material to form through integrated punching bending process, be conducive to punching production identity, reduce raw-material waste, greatly improve utilization rate of raw materials and production efficiency and safety simultaneously; In addition, this heat sink body 1 is overall in " several " character form structure after punching press bending, the wherein top 11 of heat sink body 1 upwards U-shaped bending, end 13 is downwards in L-type bending, achieve double-deck heat-removal modalities like this, make heat flow path become roomy smoothness on the one hand, add the area of dissipation of fin on the other hand, be conducive to improve heat conduction, radiating effect.This heat sink body 1 primarily of top 11, be provided with for the syndeton of fixed crystal pipe 2 bottom 12 and be provided with welding pin 13a the end 13 be fixed on circuit board 3 form by fin.
Wherein, top 11 is provided with the radiating fin 11a symmetrical in interlocking of some, is conducive to the disturbance and the area of dissipation that increase air, thus increases heat dispersion.
The syndeton of above-mentioned bottom 12 can adopt two kinds of forms.The first form is that this syndeton comprises and has flexible metal holder 12a through punching press bending forming, and the front end of this metal holder 12a is provided with guiding flanging 12b, in addition, is provided with positioning convex point 12c in both sides, bottom 12.Wherein, this sprung metal clip 12a can provide contact when it blocks transistor 2, makes transistor 2 and fin reliable contacts, thus reduces the thermal resistance between contact-making surface; This positioning convex point 12c can the relative position of limit transistor 2, prevents it to be subjected to displacement.When installation transistor 2, as shown in Figure 5, transistor 2 is exerted oneself to block can complete assembling once squeezing one, and whole installation process does not need spiral shell surely to fix simultaneously, makes whole installation process safely, efficiently, fast.Fin adopts metal holder 12a to install the mode of transistor 2, and after its installation, structural representation as shown in Figure 6.
The second form of above-mentioned floor structure is that this syndeton comprises a stamping forming flanging bore 12d, is provided with internal thread in this flanging bore 12d, when installing transistor 2, locks on a heat sink, as shown in Figure 7 by screw 4 by transistor 2.
In addition, due to when welding pin 13a is welded on circuit board, the heat of welding pin 13a will to be conducted to rapidly on fin thus be caused welding the increase of difficulty.This is a test to the technical merit of welder, require that the temperature that it must raise electric iron while welding makes the rising of fin bulk temperature could realize welding, but the too high meeting of temperature damages components and parts, cause production efficiency low, weld time is partially long simultaneously.By arranging dead slot 13b in above-mentioned welding pin 13a both sides, make the heat passage drawing welding foot 13a become narrow, the heat-conducting effect of so artificial reduction pin achieves the object of artificial rapid welding.
Transistor 2 is connected the welding of the welding pin on a heat sink and on fin 13a on circuit board 3 after, then the pin on transistor 2 is also welded on circuit board 3, finally achieves the installation of fin on circuit board 3.
The foregoing is only preferred implementation of the present utility model; it should be pointed out that for the ordinary skill in the art, under the prerequisite not departing from principle of the present utility model; can also make various deformation and improvement, this also should be considered as protection range of the present utility model.
Claims (6)
1. a power supply fin, comprise the heat sink body of integrated punching bending, described heat sink body is double-deck radiator structure, it is characterized in that: the top of this heat sink body is processed with the fin like structures being beneficial to heat radiation, and end downward bending be processed with the welding pin of both sides with short slot, bottom is processed with the syndeton for fixed electronic element.
2. power supply fin according to claim 1, is characterized in that: described syndeton comprises and has flexible metal holder through punching press bending forming, and the front end of this metal holder is provided with guiding flanging.
3. power supply fin according to claim 2, is characterized in that: described two bottom sides is provided with positioning convex point.
4. power supply fin according to claim 1, is characterized in that: described syndeton comprises a stamping forming flanging bore, is provided with internal thread in this flanging bore.
5. the power supply fin according to any one of Claims 1-4, is characterized in that: described fin like structures is made up of in indenting symmetrical fin some.
6. the power supply fin according to any one of Claims 1-4, is characterized in that: described heat sink body is the double-deck radiator structure of an afterbody in the bending of " U " type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420506609.1U CN204047011U (en) | 2014-09-03 | 2014-09-03 | A kind of power supply fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420506609.1U CN204047011U (en) | 2014-09-03 | 2014-09-03 | A kind of power supply fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204047011U true CN204047011U (en) | 2014-12-24 |
Family
ID=52247626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420506609.1U Withdrawn - After Issue CN204047011U (en) | 2014-09-03 | 2014-09-03 | A kind of power supply fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204047011U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105324018A (en) * | 2015-12-05 | 2016-02-10 | 重庆元创自动化设备有限公司 | Special heat-dissipating device for integrated circuits |
| CN105376998A (en) * | 2015-11-19 | 2016-03-02 | 重庆盛镁镁业有限公司 | Clamped aluminum alloy heat sink with elastic clip |
-
2014
- 2014-09-03 CN CN201420506609.1U patent/CN204047011U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376998A (en) * | 2015-11-19 | 2016-03-02 | 重庆盛镁镁业有限公司 | Clamped aluminum alloy heat sink with elastic clip |
| CN105376998B (en) * | 2015-11-19 | 2018-04-13 | 重庆华万伦电器有限公司 | The clipping aluminum alloy heat sink of elastic clip |
| CN105324018A (en) * | 2015-12-05 | 2016-02-10 | 重庆元创自动化设备有限公司 | Special heat-dissipating device for integrated circuits |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141224 Effective date of abandoning: 20150807 |
|
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |